Shielding heat dissipation structure and display device

Abstract

The utility model discloses a shielding heat dissipation structure and display equipment relates to computer technical field, wherein, shielding heat dissipation structure and display equipment include shield, radiator and heat conduction department. Among them, the shielding cavity is formed to the inside of shield, to be used for the chip structure of the accommodation, the heat conduction area is formed on the shield, the through hole department is formed on the heat conduction area, to be used to communicate the inside and outside both sides of shielding cavity, the radiator is installed in the shielding heat dissipation structure and display equipment outside the shield corresponding to the heat conduction area, the heat conduction department is filled between the shield and the radiator corresponding to the heat conduction area, and at least part heat conduction department is filled in the through hole department, to be used for connecting the chip structure and the radiator.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, and in particular to a shielded heat dissipation structure and a display device. Background Technology

[0002] As IC (chip) integration becomes increasingly sophisticated, its applications are also evolving. Chips are operating at higher speeds, and their operating frequencies can easily interfere with systems, causing EMI radiation and affecting RF performance. Therefore, shielding is needed to block these interference signals. Furthermore, the increasing power consumption of chips leads to heat generation, necessitating the use of heat sinks for cooling.

[0003] Current shielding and heat dissipation structures typically involve creating a large hole in the shielding cover directly opposite the IC. Thermally conductive silicone is then used to contact the heatsink for heat dissipation. A ring of conductive foam is then applied around the opening to create a shielding effect along with the heatsink. In this structure, the heatsink not only needs to dissipate heat but also acts as the shielding cover, thus requiring grounding. The traditional solution involves manually attaching conductive foam between the heatsink and the chip, and the heatsink must be larger than the shielding cover, which is inefficient and costly. Utility Model Content

[0004] The main purpose of this utility model is to propose a shielding heat dissipation structure and display device, which aims to solve the problems of complex installation process and large material consumption of traditional chip heat dissipation shielding structures, which are not conducive to cost saving.

[0005] To achieve the above objectives, the present invention proposes a shielded heat dissipation structure and a display device, comprising:

[0006] A shielding cover has a shielding cavity formed on its inner side for housing a chip structure. A heat-conducting area is formed on the shielding cover, and a through hole is formed on the heat-conducting area to connect the inner and outer sides of the shielding cavity.

[0007] A heat sink, corresponding to the heat-conducting area, is installed on the outside of the shield; and,

[0008] A heat-conducting portion, corresponding to the heat-conducting region, is filled between the shield and the heat sink, and at least a portion of the heat-conducting portion is filled within the through-hole portion for connecting the chip structure and the heat sink.

[0009] This utility model also includes a display device, the display device comprising a shielding heat dissipation structure, the shielding heat dissipation structure comprising:

[0010] A shielding cover has a shielding cavity formed on its inner side for housing a chip structure. A heat-conducting area is formed on the shielding cover, and a through hole is formed on the heat-conducting area to connect the inner and outer sides of the shielding cavity.

[0011] A heat sink, corresponding to the heat-conducting area, is installed on the outside of the shield; and,

[0012] A heat-conducting portion, corresponding to the heat-conducting region, is filled between the shield and the heat sink, and at least a portion of the heat-conducting portion is filled within the through-hole portion for connecting the chip structure and the heat sink. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0014] Figure 1 A schematic diagram of the overall structure of an embodiment of the shielding and heat dissipation structure provided by this utility model;

[0015] Figure 2 for Figure 1 The schematic diagram of the shielding cover provided in the document;

[0016] Figure 3 For and Figure 1 The diagram shows the structure of a traditional chip shielding and heat dissipation structure, which corresponds to the shielding and heat dissipation structure in the middle.

[0017] Explanation of icon numbers:

[0018] 100. Shielded heat dissipation structure; 1. Shielding cover; 11. Abutting groove; 111. Connecting hole; 112. Shielding cavity; 2. Heat sink; 21. Base plate; 211. Abutting protrusion; 22. Heat dissipation fins; 3. Heat conduction part; 4. Threaded fixing structure; 41. Screw; 42. Threaded mounting part.

[0019] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0021] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0023] As IC (chip) integration becomes increasingly sophisticated, its applications are also evolving. Chips are operating at higher speeds, and their operating frequencies can easily interfere with systems, causing EMI radiation and affecting RF performance. Therefore, shielding is needed to block these interference signals. Furthermore, the increasing power consumption of chips leads to heat generation, necessitating the use of heat sinks for cooling.

[0024] Current shielding and heat dissipation structures typically involve creating a large hole in the shielding cover directly opposite the IC. Thermally conductive silicone is then used to contact the heatsink for heat dissipation. A ring of conductive foam is then applied around the opening to create a shielding effect along with the heatsink. In this structure, the heatsink not only needs to dissipate heat but also acts as the shielding cover, thus requiring grounding. The traditional solution involves manually attaching conductive foam between the heatsink and the chip, and the heatsink must be larger than the shielding cover, which is inefficient and costly.

[0025] For ease of understanding, the shielding and heat dissipation structure of traditional chip structures is shown in the appendix. Figure 3 As shown in the diagram. 7' represents the circuit board structure, 6' the chip structure, 5' the conductive foam, 4' the screw fixing structure, 3' the thermally conductive silicone, 2' the heat sink, and 1' the shielding cover.

[0026] This utility model proposes a shielded heat dissipation structure and a display device 100 to solve the above problems.

[0027] Please see Figures 1 to 2In one embodiment of this utility model, the shielding and heat dissipation structure 100 includes a shielding cover 1, a heat sink 2, and a heat-conducting part 3. The shielding cover 1 has a shielding cavity 112 formed on its inner side to accommodate a chip structure. A heat-conducting region is formed on the shielding cover 1, and a through-hole is formed on the heat-conducting region to connect the inner and outer sides of the shielding cavity 112. The heat sink 2 is installed on the outer side of the shielding cover 1 corresponding to the heat-conducting region. The heat-conducting part 3 fills the space between the shielding cover 1 and the heat sink 2, and at least a portion of the heat-conducting part 3 fills the through-hole to connect the chip structure and the heat sink 2.

[0028] In the above structure, during actual installation, the chip structure is mounted on the circuit board structure, and the shielding cover 1 is placed over the chip structure. The chip structure is located within the relatively sealed shielding cavity 112, and one end of the chip structure is positioned opposite the heat-conducting area. The distance between the heat-conducting area and the chip structure is sufficiently small, thereby effectively conducting the heat generated by the chip structure. The chip structure primarily shields against external interference signals through the shielding cover 1. The heat sink 2 is installed on the outside of the shielding cover 1 and can dissipate heat from the shielding cover 1 through contact heat conduction.

[0029] The heat-conducting part 3, as its name suggests, is a highly efficient heat-conducting structure. It should be noted that the heat-conducting part 3 in this embodiment not only needs to achieve efficient heat transfer but also needs to possess a certain degree of adhesive bonding and fixing ability. During actual installation, the heat-conducting part 3 is first coated onto the heat-conducting area of ​​the shielding cover 1. Then, the heat sink 2 is pressed down onto the heat-conducting area. Under the downward pressure, the heat-conducting part 3 can move partially into the shielding cavity 112 through the through-hole. Simultaneously, the downward pressure allows one end face of the heat-conducting area within the shielding cavity 112 to contact one end of the chip structure. During this process, the heat-conducting part 3 connects the heat sink 2 and one end of the chip structure. In this state, the heat-conducting part 3 can directly transfer the heat generated by the chip structure to the heat sink 2, thereby connecting the chip structure shielding cover 1 and the heat sink 2 into a single structure at the heat-conducting area location, thus simultaneously achieving the installation of the heat sink 2 on the shielding cover 1 structure.

[0030] Furthermore, it should be noted that traditional heat sink installation methods involve screwing the heat sink structure to the circuit board structure at its corners. Since heat sinks are typically mounted on a shield, they need to extend beyond the shield to be securely fixed to the circuit board structure with screws. This installation method results in a larger overall size for the heat sink, and in terms of heat dissipation efficiency, this larger size often leads to overkill.

[0031] By using the solution described in the above embodiments to fix the heat sink 2, the aforementioned problems can be effectively avoided. Specifically, the heat sink 2 is fixedly installed on the heat-conducting area via the heat-conducting part 3, rather than by the aforementioned screws 41. Therefore, while meeting the heat dissipation requirements, the overall size of the heat sink 2 can be set relatively small. In practical applications, this structure helps to improve the compactness of the entire external structure and can effectively save production costs to a certain extent.

[0032] To achieve the aforementioned fixed installation effect, in this embodiment, the heat-conducting part 3 is preferably set as thermally conductive silicone grease, which has a certain fluidity. When used and installed in the above manner, it can perfectly meet the above-mentioned heat conduction effect and fixing requirements.

[0033] It should also be noted that the actual shielding component in the above structure is the shielding cover 1. The through-hole is located in the heat-conducting area to connect the inner and outer sides of the shielding cavity 112. To ensure that the through-hole does not affect the overall shielding effect of the shielding cover 1 on interference signals, the actual opening size of the through-hole must be large enough to effectively block interference signals from passing through, thus achieving the purpose of shielding interference signals. Therefore, the design of the heat sink 2 only needs to meet the IC heat dissipation requirements; grounding of the heat sink 2 during installation is not mandatory. This simplifies the installation of conductive foam and the grounding of the heat sink 2 in traditional installation structures, simplifying production and installation steps and improving actual production efficiency in practical applications.

[0034] In some embodiments, such as Figure 1 As shown, the shielding cover 1 protrudes towards the shielding cavity 112 at the location corresponding to the heat-conducting area to form an abutment groove 11; the through hole is located at the bottom of the abutment groove 11.

[0035] As mentioned above, the actual installation process uses a downward pressure method. To ensure better contact between the heat-conducting area and the chip structure, the shield 1 is designed to protrude towards the shield cavity 112 at the location corresponding to the heat-conducting area. During the downward pressure process, the end of the groove 11 located within the shield cavity 112 will preferentially contact the chip structure, thereby achieving a highly efficient heat conduction effect.

[0036] Furthermore, as described above, the radiator 2 is installed on the heat-conducting area. Considering the fixed installation effect of the radiator 2 on the shield 1, a corresponding adapter structure is provided on the mounting end of the radiator 2 corresponding to the abutment groove 11, for limiting the installation of the radiator 2 in the heat-conducting area.

[0037] Specifically, in some embodiments, such as Figure 1 As shown, one end portion of the radiator 2 protrudes outward to form an abutting protrusion 211; the abutting protrusion 211 is at least partially disposed within the abutting groove 11.

[0038] When actually installing the heat sink 2, firstly, a certain amount of thermal grease is applied to the bottom of the groove 11. Then, the abutment protrusion 211 is aligned with the groove 11 and installed. By squeezing, the thermal grease can flow better from the through hole to one end of the chip structure.

[0039] It is conceivable that the above-described installation structure preferably allows for the adaptation of the mating dimensions of the abutting protrusion 211 and the abutting groove 11. When the abutting protrusion 211 is installed in the second groove, the inner wall of the abutting groove 11 can limit the abutting protrusion 211, thereby ensuring the installation stability of the heat sink 2 on the shielding cover 1 as much as possible after the heat sink 2 is installed.

[0040] In some embodiments, after the abutting protrusion 211 is installed in the abutting groove 11, in order to ensure that the thermally conductive grease can flow well into the shielding cavity 112 due to the downward pressure of the abutting protrusion 211, in this embodiment, as follows: Figure 1 As shown, the abutting protrusion 211 is located at one end within the abutting groove and at least partially covers the through hole.

[0041] During installation, one end of the abutting protrusion 211 should be positioned as high as possible above the through hole. This will allow the thermal grease to flow into the shielding cavity 112 more effectively when the abutting protrusion 211 is installed in the abutting groove 11, thereby promoting better penetration of the thermal grease into the end surface of the chip structure and achieving efficient heat conduction.

[0042] It is conceivable that the abutting protrusion 211 and the abutting groove 11 are respectively a raised structure and a recessed structure. As mentioned above, the dimensions of the two structures are preferably corresponding to each other. However, there is no specific limitation on their specific shape; the abutting groove 11 can be set as a polygonal groove structure or an irregular groove structure. However, considering the limiting installation effect of the abutting protrusion 211 within the abutting groove 11, it is preferable to provide at least one included angle structure within the abutting groove 11 to limit the relative rotation of the abutting protrusion 211 within the abutting groove 11.

[0043] In some embodiments, such as Figure 1 As shown, the radiator 2 includes a base plate 21 and a plurality of heat dissipation fins 22; the abutting protrusion 211 is provided at one end of the base plate 21 away from the plurality of heat dissipation fins 22.

[0044] The specific structure of the radiator 2 is similar to that of a conventional radiator 2, mainly including a base plate 21 and multiple heat dissipation fins 22 perpendicular to the base plate 21. The abutting protrusion 211 is a protruding structural feature on the body of the base plate 21. In the actual production and processing, the two can be integrally formed. The integral structure can effectively improve the overall strength of the entire radiator 2 to a certain extent.

[0045] In some embodiments, such as Figure 2 As shown, in order to allow the thermal grease to flow into the shielding cavity 112 more quickly during actual installation, in this embodiment, the through hole portion includes a plurality of connecting holes 111 located in the thermally conductive area.

[0046] Multiple connection holes 111 are located at the bottom of the abutment groove 11. During actual installation, due to its groove characteristics, the abutment groove 11 can retain a certain amount of thermal grease at its bottom. When the abutment protrusion 211 is installed, the thermal grease can flow simultaneously through multiple connection holes 111 to the surface of the chip structure, further improving the flow effect of the thermal grease during actual installation.

[0047] Furthermore, it is conceivable that even if the connection hole 111 is set to multiple, the actual aperture size of each connection hole 111 must meet the requirements for shielding interference signals, so as to achieve the above-mentioned effect of shielding the entire shielding cover 1 to meet the requirements for shielding interference signals.

[0048] In addition, it can be conceivable that the connecting hole 111 mainly serves to conduct electricity, and its specific cross-sectional shape can be set to a circular or polygonal structure. In this embodiment, there is no specific limitation on the specific cross-sectional shape of the hole.

[0049] In some embodiments, such as Figure 3 As shown, to ensure the uniformity of the thermal grease flow onto the chip structure, in this embodiment, multiple connection holes 111 are evenly spaced in the thermally conductive area.

[0050] The multiple evenly spaced connection holes 111 are preferably set at one end of the chip structure. When the thermal grease moves to the end of the chip structure, it can evenly penetrate onto the end plane, thereby improving the contact heat dissipation effect between the chip structure and the heat sink 2.

[0051] It is conceivable that the spacing between the multiple connecting holes 111 affects the specific number of connecting holes 111. In actual design, the spacing between two adjacent connecting holes 111 can be designed and limited. Based on the flow characteristics of the thermal grease, simulation can be performed to determine the size of the spacing between two adjacent connecting holes 111, so as to ensure the flow effect of the thermal grease as much as possible while satisfying the shielding effect.

[0052] It is conceivable that the aforementioned thermal conductive structure combined with adhesive bonding is a single fixing method, which can meet the needs of chip structures with low to medium power consumption. For some chip structures with higher power consumption, a large heatsink 2 is required for heat dissipation, and relying solely on thermal grease may lead to the heatsink 2 detaching.

[0053] In view of the above problems, in some embodiments, the shielding heat dissipation structure 100 further includes a threaded fixing structure 4, which includes a screw 41 and a threaded mounting part 42 provided on the heat sink 2.

[0054] For high-power, heat-generating chip structures, heat can be mainly conducted through the thermal grease. During installation, the heat sink is mainly fixed to the circuit board structure by the cooperation of screws 41 and threaded mounting parts 42.

[0055] By using the above method to fix the high-power chip structure, firstly, the heat sink 2 does not participate in shielding interference signals, and there is no need to place conductive foam between the shielding cover 1 and the heat sink 2, nor is it necessary to ground the heat sink 2. Therefore, in specific production scenarios, even when applied to high-power chip structures, the above structure can effectively simplify production operations, thereby improving actual production efficiency.

[0056] This solution also includes a display device, which includes a shielding heat dissipation structure 100. The specific structure of the shielding heat dissipation structure 100 is as described in the above embodiments. Since the display device applies all the technical contents of the above embodiments, it has at least all the beneficial effects of the above embodiments, which will not be described in detail here.

[0057] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A shielded heat dissipation structure, characterized in that, include: A shielding cover has a shielding cavity formed on its inner side for housing a chip structure. A heat-conducting area is formed on the shielding cover, and a through hole is formed on the heat-conducting area to connect the inner and outer sides of the shielding cavity. A heat sink is installed on the outside of the shielding cover, corresponding to the heat-conducting area; as well as, A heat-conducting portion, corresponding to the heat-conducting region, is filled between the shield and the heat sink, and at least a portion of the heat-conducting portion is filled within the through-hole portion for connecting the chip structure and the heat sink.

2. The shielding and heat dissipation structure as described in claim 1, characterized in that, The shielding cover protrudes towards the shielding cavity at the location corresponding to the heat-conducting area to form an abutment groove. The through hole is located at the bottom of the abutment groove.

3. The shielding and heat dissipation structure as described in claim 2, characterized in that, One end portion of the radiator protrudes outward to form an abutting protrusion; The abutting protrusion is at least partially located within the abutting groove.

4. The shielding and heat dissipation structure as described in claim 3, characterized in that, The abutting protrusion is located at one end of the abutting groove and at least partially covers the through hole.

5. The shielding and heat dissipation structure as described in claim 3, characterized in that, The radiator includes a base plate and multiple heat dissipation fins; The abutting protrusion is located at one end of the base plate away from the plurality of heat dissipation fins.

6. The shielding and heat dissipation structure as described in claim 1, characterized in that, The through-hole section includes multiple connecting holes located in the heat-conducting area.

7. The shielding and heat dissipation structure as described in claim 6, characterized in that, The multiple connection holes are evenly spaced in the heat-conducting area.

8. The shielding and heat dissipation structure as described in claim 1, characterized in that, The thermally conductive part includes thermally conductive silicone grease.

9. The shielding and heat dissipation structure as described in claim 1, characterized in that, The shielding and heat dissipation structure also includes a threaded fixing structure, which includes screws and a threaded mounting portion provided on the heat sink.

10. A display device, characterized in that, Includes the shielding and heat dissipation structure as described in any one of claims 1-9.

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