Opto-coupler device

CN224670204UActive Publication Date: 2026-08-21XIAN GUOSH ELECTRONICS CO LTD
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Patent Information

Application Number
CN202522133263.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-09
Publication Date
2026-08-21
Estimated Expiration
2035-10-09

AI Technical Summary

Technical Problem

[0004]本发明的目的是为了解决现有技术中存在的缺点,提出光电耦合器件,以解决上述技术方案中光传输性能较差的问题

Benefits of technology

通过光敏三极管芯片和二极管芯片垂直设置,提升了光线利用率和抗干扰能力,同时可控的上下间距和采用导光胶水灌胶填充,在提高光传输能力的同时,突破了平面结构的耐压上限,提高了器件隔离耐压性,增加了器件的使用场景范围。

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Abstract

The application discloses a photoelectric coupling device and relates to the technical field of photoelectric coupling, which comprises a tube shell, a light-receiving mechanism and a light-emitting mechanism are arranged on the upper portion of the tube shell, the light-receiving mechanism comprises a tube base, an anode, a cathode, a collector, an emitter, a tube electrode and a photosensitive triode chip, the light-emitting mechanism comprises a substrate and a light-emitting diode chip, the surface of the tube base is fixedly connected with the tube shell, the pins of the photosensitive triode chip are fixedly connected with the tube base through conductive glue, the substrate is arranged on the upper end of the tube base, the photosensitive triode chip and the diode chip are vertically arranged, the utilization rate of light and the anti-interference capability are improved, meanwhile, the controllable upper and lower spacing and the filling of light-conducting glue are adopted, the light transmission capability is improved, the withstand voltage upper limit of the plane structure is broken through, the device isolation withstand voltage is improved, and the use scene range of the device is increased.
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Description

Technical Field

[0001] This invention relates to the field of optocouplers, and more particularly to optocoupler devices. Background Technology

[0002] An optocoupler drives a light-emitting diode to emit light through an electrical signal on the input side, and the photosensitive tube on the output side receives the light and converts it into an electrical signal. There is no direct electrical connection between the input and output; the signal is transmitted only through light. This prevents high voltage from entering the low voltage side and causing the sensitive element to break down. In addition, the isolation characteristics of the optocoupler can block the transmission of interference signals and prevent the control signal from being distorted. However, traditional optocouplers are planar, with light-emitting diodes and phototransistors arranged horizontally on the substrate. The light is diffused horizontally, causing most of the light to be absorbed by the substrate surface or scattered into irrelevant areas. The transmission efficiency is inherently weak, and the transmission distance cannot be precisely controlled, depending entirely on the spacing of the components on the substrate. This makes it impossible to adjust the isolation withstand voltage of the device, thus limiting the application scenarios of the device.

[0003] Therefore, the present invention provides an optocoupler. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of existing technologies by proposing an optocoupler to address the problem of poor optical transmission performance in the aforementioned technical solutions. To achieve the above objectives, the present invention adopts the following technical solution: a modular partition wall pipeline integrated layout structure, including a pipe shell, with a light-receiving mechanism and a light-emitting mechanism disposed on the upper part of the pipe shell. The light-receiving mechanism includes a pipe seat, an anode, a cathode, a collector, an emitter, an internal electrode, and a phototransistor chip. The light-emitting mechanism includes a substrate and a light-emitting diode chip. The surface of the pipe seat is fixedly connected to the pipe shell. The pins of the phototransistor chip are fixedly connected to the pipe seat through conductive adhesive. The substrate is disposed at the upper end of the pipe seat. The pins of the light-emitting diode chip are fixedly connected to the substrate through conductive adhesive. Light-guiding adhesive is filled between the phototransistor chip and the light-emitting diode chip.

[0005] In a preferred embodiment, the side end of the anode is fixedly connected to the tube seat, and the side end of the cathode is fixedly connected to the tube seat.

[0006] The technical effect of adopting the above-mentioned further solution is that the circuit can be connected by setting up a light-emitting mechanism.

[0007] In a preferred embodiment, the side end of the collector is fixedly connected to the tube socket, and the side end of the emitter is fixedly connected to the tube socket.

[0008] The technical effect of adopting the above-mentioned further solution is that the circuit can be connected by setting up a light-receiving mechanism.

[0009] In a preferred embodiment, the bottom surface of the substrate is gold-plated, and the top surface of the substrate is made of black material.

[0010] The technical effect of adopting the above-mentioned further solution is that it improves the conductivity of the substrate and also provides a certain light-shielding effect.

[0011] In a preferred embodiment, the lower end of the inner electrode is fixedly connected to the tube base, and the lower end of the substrate is fixedly connected to the inner electrode via conductive adhesive.

[0012] The technical effect of adopting the above-mentioned further solution is that the substrate is fixed on the tube seat by setting it up.

[0013] In a preferred embodiment, a rotating shaft is rotatably connected to the side end of the tube shell, a cover plate is fixedly connected to the surface of the rotating shaft, a clamping plate is fixedly connected to the side end of the cover plate, a pull handle is fixedly connected to the end of the clamping plate, and a clamping groove is formed on the surface of the clamping plate.

[0014] The technical effect of adopting the above-mentioned further solution is that by setting up the device, the light-shielding effect is improved, the interference of external stray light is avoided, and the accuracy of the phototransistor chip is reduced.

[0015] In a preferred embodiment, an arc-shaped clamp is fixedly connected to the side end of the tube shell, the surface of the arc-shaped clamp is slidably connected to the clamp plate through a groove, and the surface of the cover plate is provided with ventilation holes.

[0016] The technical effect of adopting the above-mentioned further solution is that the cover plate can be fixed to the surface of the tube shell by means of the setting.

[0017] This invention provides an optocoupler. It has the following advantages: By vertically arranging phototransistor chips and diode chips, the light utilization rate and anti-interference capability are improved. At the same time, the controllable vertical spacing and the use of light guide adhesive for potting not only improve the light transmission capability, but also break through the voltage resistance limit of the planar structure, improve the isolation voltage resistance of the device, and expand the application scenarios of the device.

[0018] By shielding the device with a substrate, heat dissipation and protection are provided, while stray light from the outside is prevented from entering, thus improving the accuracy and reliability of the phototransistor chip. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the optocoupler of the present invention; Figure 2 This is a schematic diagram of the cover plate and related parts of the optocoupler of the present invention; Figure 3 This is a schematic diagram of the anode and related components of the optocoupler of the present invention; Figure 4 This is a schematic diagram of the internal motor and related components of the optocoupler of the present invention; Figure 5 This is a schematic diagram of the substrate and related components of the optocoupler of the present invention.

[0020] Explanation of reference numerals in the attached figures: 1. Tube shell; 2. Tube seat; 3. Anode; 4. Cathode; 5. Collector; 6. Emitter; 7. Internal electrode; 8. Phototransistor chip; 9. Substrate; 10. Light-emitting diode chip; 11. Light guide adhesive; 12. Shaft; 13. Cover plate; 14. Clamping plate; 15. Pull handle; 16. Slot; 17. Arc-shaped clamping head; 18. Vent hole. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example

[0022] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the present invention provides a technical solution: an optocoupler, including a housing 1, with a light-receiving mechanism and a light-emitting mechanism disposed on the upper part of the housing 1. The light-receiving mechanism includes a housing 2, an anode 3, a cathode 4, a collector 5, an emitter 6, an internal electrode 7, and a phototransistor chip 8. The light-emitting mechanism includes a substrate 9 and a light-emitting diode chip 10. The surface of the housing 2 is fixedly connected to the housing 1, so that the housing 2 can be positioned in the same location as the housing 1. The leads of the phototransistor chip 8 are fixedly connected to the housing 2 by conductive adhesive. The substrate 9 is disposed on the upper end of the housing 2, and the leads of the light-emitting diode chip 10 are... The feet are fixedly connected to the substrate 9 with conductive adhesive, so that the light-emitting diode chip 10 can be connected to the circuit through the substrate 9. The space between the phototransistor chip 8 and the light-emitting diode chip 10 is filled with light-guiding adhesive 11. By vertically setting the phototransistor chip 8 and the light-emitting diode chip 10, the vertical light path is replaced with the diffuse light path, which improves the light utilization rate and anti-interference ability. At the same time, the controllable vertical spacing and the use of light-guiding adhesive 11 to fill the gap break through the pressure resistance limit of the planar structure. While improving the light transmission capability, it also improves the isolation pressure resistance of the device and increases the application range of the device.

[0023] like Figures 1-3As shown: the side end of the anode 3 is fixedly connected to the tube seat 2, and the side end of the cathode 4 is fixedly connected to the tube seat 2. The anode 3 and the cathode 4 introduce the circuit into the tube seat 2, so that the light-emitting mechanism can be connected to the circuit.

[0024] like Figures 1-4 As shown: the side end of the collector 5 is fixedly connected to the tube socket 2, and the side end of the emitter 6 is fixedly connected to the tube socket 2. The collector 5 and the emitter 6 introduce the circuit into the tube socket 2, so that the light receiving mechanism can be connected to the circuit.

[0025] like Figures 1-5 As shown: the bottom surface of substrate 9 is gold-plated, and the top surface of substrate 9 is made of black material. The gold plating on the bottom surface improves the conductivity of substrate 9, while the black material on the top surface of substrate 9 provides a certain light-shielding effect, which to some extent prevents light from passing through substrate 9 and interfering with the judgment of phototransistor chip 8.

[0026] like Figures 3-4 As shown: The lower end of the inner electrode 7 is fixedly connected to the tube seat 2. There are two inner electrodes 7. The lower end of the substrate 9 is fixedly connected to the inner electrode 7 through conductive adhesive. The substrate 9 is fixed on the tube seat 2, and the light-emitting diode chip 10 is connected to the anode 3 and the cathode 4 through the inner electrode 7.

[0027] like Figures 2-3 As shown: A rotating shaft 12 is rotatably connected to the side end of the tube shell 1. The tube shell 1 and the rotating shaft 12 are adapted to each other. A cover plate 13 is fixedly connected to the surface of the rotating shaft 12. A clamping plate 14 is fixedly connected to the side end of the cover plate 13. A pull handle 15 is fixedly connected to the end of the clamping plate 14. The clamping plate 14 can be pulled outward through the pull handle 15. A slot 16 is opened on the surface of the clamping plate 14. By setting the cover plate 13 at the upper end of the tube shell 1 to block it, the light-blocking effect of the device is improved, the interference of external stray light is avoided, and the accuracy of the phototransistor chip 8 is reduced.

[0028] like Figures 2-3 As shown: A curved clamp head 17 is fixedly connected to the side end of the tube shell 1. The surface of the curved clamp head 17 is slidably connected to the clamp plate 14 through the clamp groove 16. The surface of the cover plate 13 is provided with a vent hole 18. The vent hole 18 is located on the side of the mounting position of the substrate 9. Through the shielding of the substrate 9, the device can play a certain heat dissipation role while preventing external stray light from entering the interior. When the cover plate 13 is rotated until the clamp plate 14 presses the curved clamp head 17, the clamp plate 14 will be affected by the arc surface of the curved clamp head 17 and rotate a certain angle towards the outside. When the clamp groove 16 is aligned with the curved clamp head 17, it returns to its original shape. Thus, by inserting the curved clamp head 17 into the clamp groove 16, the cover plate 13 is fixed. To unlock the cover plate 13, simply pull the handle 15 outward and flip it.

[0029] Working principle: like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, this optocoupler device mounts a phototransistor chip 8 on a socket 2 and a light-emitting diode chip 10 on a substrate 9. The socket 2 and the substrate 9 are stacked and fixed. By vertically setting the phototransistor chip 8 and the light-emitting diode chip 10, a vertical light path is used to replace the diffuse light path, which improves the light utilization rate and anti-interference ability. At the same time, the controllable vertical spacing and the use of light guide adhesive 11 for potting and filling not only improve the light transmission capability, but also break through the voltage resistance limit of the planar structure, improve the isolation voltage resistance of the device, and increase the application range of the device. When the cover plate 13 is rotated to the point where the clamping plate 14 presses the arc-shaped clamping head 17, the clamping plate 14 will rotate a certain angle due to the influence of the arc surface of the arc-shaped clamping head 17. When the clamping slot 16 is aligned with the arc-shaped clamping head 17, it will return to its original shape, thereby fixing the cover plate 13 by inserting the arc-shaped clamping head 17 into the clamping slot 16. To unlock the cover plate 13, simply pull the handle 15 outward and flip it. Through the shielding of the substrate 9, the device can play a certain heat dissipation role while preventing external stray light from entering the interior, thereby improving the judgment accuracy and reliability of the phototransistor chip 8.

[0030] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the protection scope of the present invention.

Claims

1. An optocoupler, comprising a housing (1), characterized in that, The upper part of the tube shell (1) is provided with a light receiving mechanism and a light emitting mechanism. The light receiving mechanism includes a tube seat (2), an anode (3), a cathode (4), a collector (5), an emitter (6), an internal electrode (7), and a phototransistor chip (8). The light emitting mechanism includes a substrate (9) and a light-emitting diode chip (10). The surface of the tube seat (2) is fixedly connected to the tube shell (1). The pins of the phototransistor chip (8) are fixedly connected to the tube seat (2) through conductive adhesive. The substrate (9) is located at the upper end of the tube seat (2). The pins of the light-emitting diode chip (10) are fixedly connected to the substrate (9) through conductive adhesive. Light-guiding adhesive (11) is filled between the phototransistor chip (8) and the light-emitting diode chip (10).

2. The optocoupler according to claim 1, characterized in that: The side end of the anode (3) is fixedly connected to the tube seat (2), and the side end of the cathode (4) is fixedly connected to the tube seat (2).

3. The optocoupler according to claim 1, characterized in that: The side end of the collector (5) is fixedly connected to the tube seat (2), and the side end of the emitter (6) is fixedly connected to the tube seat (2).

4. The optocoupler according to claim 1, characterized in that: The bottom surface of the substrate (9) is gold-plated, and the top surface of the substrate (9) is made of black material.

5. The optocoupler according to claim 1, characterized in that: The lower end of the inner electrode (7) is fixedly connected to the tube seat (2), and the lower end of the substrate (9) is fixedly connected to the inner electrode (7) through conductive adhesive.

6. The optocoupler according to claim 1, characterized in that: The side end of the shell (1) is rotatably connected to a rotating shaft (12), the surface of the rotating shaft (12) is fixedly connected to a cover plate (13), the side end of the cover plate (13) is fixedly connected to a clamping plate (14), the end of the clamping plate (14) is fixedly connected to a pull handle (15), and the surface of the clamping plate (14) is provided with a clamping groove (16).

7. The optocoupler according to claim 6, characterized in that: The side end of the tube shell (1) is fixedly connected to an arc-shaped clamp (17). The surface of the arc-shaped clamp (17) is slidably connected to the clamp plate (14) through the clamp groove (16). The surface of the cover plate (13) is provided with a vent hole (18).