Light emitting element, display panel, and display device

Abstract

The application provides a light-emitting element, which comprises a light-emitting main body part, a first electrode and a second electrode. The light-emitting main body part comprises a first end surface, a second end surface and a circumferential surface between the first end surface and the second end surface. The first electrode is arranged in a bent manner on the first end surface and the circumferential surface and extends along the circumferential surface to form a first holding part towards the second end surface. The second electrode is arranged in a spaced manner with the first electrode. The second electrode is arranged in a bent manner on the first end surface and the circumferential surface and extends along the circumferential surface to form a second holding part towards the second end surface. The first holding part and the second holding part are pressed by a binding and pressing device to bond the light-emitting element to an array substrate. Therefore, when the light-emitting element is bonded, the pressure applied by the binding and pressing device directly acts on the first electrode and the second electrode, so that the light-emitting main body part is prevented from being damaged, and the yield of the light-emitting element during bonding is improved. The application further provides a display panel and a display device.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a light-emitting element, a display panel having the light-emitting element, and a display device having the display panel. Background Technology

[0002] Micro light-emitting diodes (Micro LEDs) have become a strong contender for next-generation display technology due to their advantages such as self-illumination, high brightness, high contrast, low power consumption, long lifespan, and fast response speed. They can be widely used in display fields such as flat panel displays, spatial displays, augmented reality (AR), virtual reality (VR), wearable devices, and mobile phones.

[0003] Currently, the P-electrode and N-electrode of commonly used micro-LEDs are usually located on the same side of the chip body. During bonding, the micro-LED is bonded to the substrate under pressure and temperature conditions using bonding materials. However, during the bonding process, all the pressure is applied directly to the micro-LED chip body. Therefore, the micro-LED may be damaged by the pressure during this process, leading to bonding failure between the micro-LED and the substrate and affecting the bonding yield of the micro-LED.

[0004] Therefore, how to prevent damage to micro-LEDs during the bonding process, which would affect the bonding yield of micro-LEDs, is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a light-emitting element, a display panel having the light-emitting element, and a display device having the display panel, wherein the pressure applied during the bonding of the light-emitting element acts directly on the electrodes of the light-emitting element, rather than directly on the light-emitting body of the light-emitting element, thereby avoiding the influence of the pressure during the bonding process on the structure of the light-emitting body and improving the yield of the light-emitting element during bonding.

[0006] To address the aforementioned technical problems, this application provides a light-emitting element bonded to an array substrate using a bonding and pressing device. The light-emitting element includes a light-emitting main body, a first electrode, and a second electrode. The light-emitting main body includes a first end face, a second end face, and a peripheral side face located between the first and second end faces. One end of the first electrode is disposed on a portion of the first end face and electrically connected to the light-emitting main body. The first electrode is bent and disposed on the first end face and the peripheral side face, extending along the peripheral side face toward the second end face to form a first abutment portion. One end of the second electrode is disposed on a portion of the first end face, spaced apart from the first electrode, and electrically connected to the light-emitting main body. The second electrode is bent and disposed on the first end face and the peripheral side face, extending along the peripheral side face toward the second end face to form a second abutment portion. The first and second abutment portions are pressed together by the bonding and pressing device to bond the light-emitting element to the array substrate.

[0007] In summary, when the light-emitting element provided in this application is bonded, the bonding pressing device can directly abut against the first abutment portion of the first electrode and the second abutment portion of the second electrode. That is, the pressure applied by the bonding pressing device acts directly on the first electrode and the second electrode, rather than on the light-emitting body, thus avoiding damage to the light-emitting body by the pressure during the bonding process and improving the yield of the light-emitting element during bonding.

[0008] In an exemplary embodiment, the first electrode includes a first connecting portion and a first abutting portion. The first connecting portion is disposed on a portion of the first end face and electrically connected to the light-emitting main body. One end of the first abutting portion is fixedly connected to the first connecting portion and extends along the circumferential side surface toward the second end face until it is flush with the second end face. The second electrode includes a second connecting portion and a second abutting portion. The second connecting portion is disposed on a portion of the first end face and spaced apart from the first connecting portion, and electrically connected to the light-emitting main body. One end of the second abutting portion is fixedly connected to the second connecting portion and extends along the circumferential side surface toward the second end face until it is flush with the second end face.

[0009] In an exemplary embodiment, the first electrode includes a first connecting portion and a first abutting portion. The first connecting portion is disposed on a portion of the first end face and electrically connected to the light-emitting main body. One end of the first abutting portion is fixedly connected to the first connecting portion and extends along the circumferential side surface toward the second end face to protrude from the second end face. The second electrode includes a second connecting portion and a second abutting portion. The second connecting portion is disposed on a portion of the first end face and spaced apart from the first connecting portion, and electrically connected to the light-emitting main body. One end of the second abutting portion is fixedly connected to the second connecting portion and extends along the circumferential side surface toward the second end face to protrude from the second end face.

[0010] In an exemplary embodiment, the light-emitting main body further includes a substrate, a first semiconductor layer, a light-emitting layer, and a second semiconductor layer stacked together, wherein the surface where the light-emitting layer is connected to the first semiconductor layer is configured as a first uneven connection surface; and / or, the surface where the light-emitting layer is connected to the second semiconductor layer is configured as a second uneven connection surface.

[0011] In an exemplary embodiment, the first semiconductor layer includes a first semiconductor structure and a second semiconductor structure stacked together. The first semiconductor structure is disposed on a surface of the substrate, and the second semiconductor structure is disposed on a portion of the surface of the first semiconductor structure facing away from the substrate to form a mounting surface. The light-emitting layer is disposed on the surface of the second semiconductor structure facing away from the first semiconductor structure.

[0012] In an exemplary embodiment, a first connection portion of the first electrode is disposed on a portion of the surface of the second semiconductor layer opposite to the light-emitting layer and is electrically connected to the second semiconductor layer. One end of the first abutment portion is fixedly connected to the first connection portion and extends towards the second end face along the peripheral side surface of the second semiconductor layer, the peripheral side surface of the light-emitting layer, the peripheral side surface of the first semiconductor layer, and the peripheral side surface of the substrate. A second connection portion of the second electrode is disposed on a portion of the mounting surface and is electrically connected to the first semiconductor layer. One end of the second abutment portion is fixedly connected to the second connection portion and extends towards the second end face along the peripheral side surface of the first semiconductor structure and the peripheral side surface of the substrate.

[0013] In an exemplary embodiment, the light-emitting body further includes a current spreading layer, which is disposed on the surface of the second semiconductor layer opposite to the light-emitting layer. The first electrode is electrically connected to the second semiconductor layer through the current spreading layer. The current spreading layer is used to prevent current accumulation near the first electrode.

[0014] Based on the same concept, this application provides a display panel, which includes an array substrate and a plurality of the above-mentioned light-emitting elements. The plurality of light-emitting elements are disposed on one side of the array substrate and electrically connected to the array substrate.

[0015] In an exemplary embodiment, the display panel further includes a plurality of light-shielding portions, with at least one light-shielding portion disposed between two adjacent light-emitting elements, the light-shielding portions being used to prevent mutual interference between the light emitted by adjacent light-emitting elements.

[0016] In summary, the display panel provided in this application includes an array substrate and multiple light-emitting elements. When the light-emitting elements are bonded to the array substrate, the bonding and pressing device can directly abut against the first abutment portion of the first electrode and the second abutment portion of the second electrode. That is, the pressure applied by the bonding and pressing device acts directly on the first electrode and the second electrode, rather than on the light-emitting body, thus avoiding damage to the light-emitting body caused by the pressure during the bonding process, thereby improving the yield of the light-emitting elements during bonding.

[0017] Based on the same concept, this application provides a display device, which includes a housing and the aforementioned display panel. The display panel is disposed within the housing, and the light-emitting side of the display panel is exposed outside the housing.

[0018] In summary, the display device provided in this application includes a housing and a display panel. The display panel includes an array substrate and a plurality of light-emitting elements. When the light-emitting elements are bonded to the array substrate, the bonding and pressing device can directly abut against the first abutment portion of the first electrode and the second abutment portion of the second electrode. That is, the pressure applied by the bonding and pressing device acts directly on the first electrode and the second electrode, rather than on the light-emitting body, thus avoiding damage to the light-emitting body by the pressure during the bonding process and improving the yield of the light-emitting elements during bonding. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the first structure of the light-emitting element disclosed in the first embodiment of this application.

[0021] Figure 2 To be Figure 1The diagram shows a first structure in which the light-emitting element is bonded to the array substrate.

[0022] Figure 3 This is a schematic diagram of the first layer structure of the light-emitting element disclosed in the first embodiment of this application.

[0023] Figure 4 This is a schematic diagram of a second structure of the light-emitting element disclosed in the first embodiment of this application.

[0024] Figure 5 To be Figure 1 The diagram shows a second structure in which the light-emitting element is bonded to the array substrate.

[0025] Figure 6 This is a schematic diagram of the second layer structure of the light-emitting element disclosed in the first embodiment of this application.

[0026] Figure 7 This is a schematic diagram of the layer structure of the display panel disclosed in the second embodiment of this application.

[0027] Figure 8 This is a schematic diagram of the layer structure of the display device disclosed in the third embodiment of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100-Light-emitting element; 10-Light-emitting main body; 20-First electrode; 30-Second electrode; 11-First end face; 12-Second end face; 13-Peripheral side face; 22-First supporting part; 32-Second supporting part; 21-First connecting part; 22-First supporting part; 31-Second connecting part; 32-Second supporting part; 22a-First supporting surface; 32a-Second supporting surface; 14-Substrate; 15-First semiconductor layer; 16-Light-emitting layer; 17-Second semiconductor layer; 18-Current spreading layer; 151-First semiconductor structure; 153-Second semiconductor structure; 154-Mounting surface; 200-Bonding and pressing device; 300-Array substrate; 210-Support member; 220-First pressing member; 230-Second pressing member; 310-Conductive layer; 320-Bonding layer; 400-Display panel; 500-Housing; 600-Display device. Detailed Implementation

[0030] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0031] The following descriptions of the embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments in which this application can be implemented. The component designations used herein, such as "first," "second," etc., are merely for distinguishing the described objects and do not have any sequential or technical meaning. Unless otherwise specified, the terms "connection" and "linkage" used in this application include both direct and indirect connections (linkages). Directional terms used in this application, such as "up," "down," "front," "rear," "left," "right," "inner," "outer," "side," etc., are merely for reference to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of this application, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this application.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order.

[0033] Furthermore, the terms "comprising," "may include," "include," or "may include" as used in this application indicate the presence of the disclosed corresponding functions, operations, elements, etc., and do not limit other one or more additional functions, operations, elements, etc. Additionally, the terms "comprising" or "include" indicate the presence of the corresponding features, numbers, operations, elements, components, or combinations thereof disclosed in the specification, but do not exclude the presence or addition of one or more other features, numbers, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusion. Furthermore, when describing embodiments of this application, "may" is used to mean "one or more embodiments of this application." And the term "exemplary" is intended to refer to examples or illustrations.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0035] Please see Figure 1 , Figure 1This is a schematic diagram of a first structure of the light-emitting element 100 disclosed in the first embodiment of this application. The light-emitting element 100 provided in the first embodiment of this application includes a light-emitting main body 10 and a first electrode 20 and a second electrode 30 electrically connected to the light-emitting main body 10, that is, the first electrode 20 and the second electrode 30 are electrically connected to the same side of the light-emitting main body 10.

[0036] In this embodiment, the light-emitting main body 10 includes a first end face 11 and a second end face 12 disposed opposite to each other, and a peripheral side face 13 located between the first end face 11 and the second end face 12. That is, the first end face 11 and the second end face 12 are two surfaces of the light-emitting main body 10 disposed opposite to each other, and the peripheral side face 13 is located between the first end face 11 and the second end face 12 and is connected to the first end face 11 and the second end face 12. Therefore, the first end face 11, the second end face 12, and the peripheral side face 13 form the outer surface of the light-emitting main body 10.

[0037] One end of the first electrode 20 is disposed on a portion of the first end face 11 and is electrically connected to the light-emitting main body 10. The first electrode 20 is bent from the first end face 11 toward the peripheral side face 13 and extends along the peripheral side face 13 toward the second end face 12 to form a first abutment portion 22. One end of the second electrode 30 is disposed on a portion of the first end face 11 and is spaced apart from the first electrode 20, and is electrically connected to the light-emitting main body 10. The second electrode 30 is bent from the first end face 11 toward the peripheral side face 13 and extends along the peripheral side face 13 toward the second end face 12 to form a second abutment portion 32.

[0038] In this embodiment, the surface of the first electrode 20 facing away from the second end face 12 is flush with the surface of the second electrode 30 facing away from the second end face 12.

[0039] In this embodiment, the first electrode 20 may include a first connecting portion 21 and a first supporting portion 22. Figure 1 The first connecting portion 21 and the first abutting portion 22 are schematically divided by dashed lines. The first connecting portion 21 is disposed on a portion of the first end face 11 and is electrically connected to the light-emitting main body portion 10. A portion of the sidewall of the first connecting portion 21 is flush with the peripheral side face 13, that is, the boundary of the orthographic projection of the first connecting portion 21 onto the plane where the second end face 12 is located partially overlaps with the boundary of the orthographic projection of the first end face 11 onto the plane where the second end face 12 is located. One end of the first abutting portion 22 is fixedly connected to the first connecting portion 21 and extends along the peripheral side face 13 toward the second end face 12.

[0040] In this embodiment, the second electrode 30 may include a second connecting portion 31 and a second supporting portion 32. Figure 1 The second connecting portion 31 and the second abutting portion 32 are schematically divided by dashed lines. The second connecting portion 31 is disposed on a portion of the first end face 11, spaced apart from the first connecting portion 21, and electrically connected to the light-emitting main body 10. A portion of the sidewall of the second connecting portion 31 is flush with the peripheral side surface 13, that is, the boundary of the orthographic projection of the second connecting portion 31 onto the plane where the second end face 12 is located partially overlaps with the boundary of the orthographic projection of the first end face 11 onto the plane where the second end face 12 is located. One end of the second abutting portion 32 is fixedly connected to the second connecting portion 31 and extends along the peripheral side surface 13 toward the second end face 12.

[0041] In an exemplary embodiment, the first supporting part 22 can be fixedly connected to the peripheral side surface 13 of the light-emitting main body part 10 by means of bonding or the like, and the second supporting part 32 can be fixedly connected to the peripheral side surface 13 of the light-emitting main body part 10 by means of bonding or the like, so as to increase the reliability and stability of the light-emitting element 100 when it is bonded to the array substrate.

[0042] In an exemplary embodiment, the first connecting portion 21 and the first supporting portion 22 can be integrally formed, and the second connecting portion 31 and the second supporting portion 32 can be integrally formed.

[0043] Please refer to the following: Figure 1 and Figure 2 , Figure 2 To be Figure 1 The diagram shows a first structural schematic of a light-emitting element bonded to an array substrate. In this embodiment, one end of the first abutment 22 is fixedly connected to the first connecting portion 21 and extends along the peripheral side surface 13 toward the second end face 12 until it is flush with the second end face 12. That is, the first abutment 22 includes a first abutment surface 22a flush with the second end face 12. One end of the second abutment 32 is fixedly connected to the second connecting portion 31 and extends along the peripheral side surface 13 toward the second end face 12 until it is flush with the second end face 12. That is, the second abutment 32 includes a second abutment surface 32a flush with the second end face 12. In other words, the first abutment 22 includes a first abutment surface 22a, the second abutment 32 includes a second abutment surface 32a, and both the first abutment surface 22a and the second abutment surface 32a are flush with the second end face 12 and are located in the same plane.

[0044] In this embodiment, the light-emitting element 100 is bonded to the array substrate 300 by a bonding and pressing device 200. The bonding and pressing device 200 includes a support member 210, a first pressing member 220, and a second pressing member 230. The first pressing member 220 and the second pressing member 230 are detachably mounted on the support member 210 and face the light-emitting element 100. The first pressing member 220 is aligned with the first abutting portion 22 of the first electrode 20, and the second pressing member 230 is aligned with the second abutting portion 32 of the second electrode 30. The bonding and pressing device 200 is moved so that the first pressing member 220 is aligned with the first abutting part 22, and the second pressing member 230 is aligned with the second abutting part 32. The first pressing member 220 presses against the first abutting surface 22a, and the second pressing member 230 presses against the second abutting surface 32a. The first connecting part 21 and the first abutting part 22 of the first electrode 20 contact and bond to the array substrate 300, and the second connecting part 31 and the second abutting part 32 of the second electrode 30 contact and bond to the array substrate 300, thereby bonding and binding the light-emitting element 100 to the array substrate 300. Therefore, when bonding the light-emitting element 100, the bonding pressing device 200 directly abuts against the first abutting part 22 of the first electrode 20 and the second abutting part 32 of the second electrode 30. That is, the pressure applied by the bonding pressing device 200 directly acts on the first electrode 20 and the second electrode 30, rather than on the light-emitting main body 10, thus avoiding damage to the light-emitting main body 10 caused by the pressure during the bonding process.

[0045] In this embodiment, the area of ​​the surface of the first pressing member 220 that abuts against the first abutting surface 22a is smaller than the area of ​​the first abutting surface 22a, and the area of ​​the surface of the second pressing member 230 that abuts against the second abutting surface 32a is smaller than the area of ​​the second abutting surface 32a. That is, the orthographic projection of the first pressing member 220 on the array substrate 300 is within the range of the orthographic projection of the first abutting surface 22a on the array substrate 300, and the orthographic projection of the second pressing member 230 on the array substrate 300 is within the range of the orthographic projection of the second abutting surface 32a on the array substrate 300. Therefore, when bonding the light-emitting element 100, the bonding pressing device 200 directly abuts against the first abutting part 22 of the first electrode 20 and the second abutting part 32 of the second electrode 30. That is, all the pressure applied by the bonding pressing device 200 acts directly on the first electrode 20 and the second electrode 30, ensuring that the light-emitting main body 10 is not abutted by the applied pressure and will not produce any pressure or influence on the light-emitting main body 10. This further avoids any damage to the light-emitting main body 10 caused by the pressure during the bonding process, thereby improving the yield of the light-emitting element 100 during bonding.

[0046] In an exemplary embodiment, a plurality of light-emitting elements 100 are disposed on one side of the array substrate 300, and each light-emitting element 100 is electrically connected to the array substrate 300 via the first electrode 20 and the second electrode 30. The array substrate 300 is used to transmit electrical signals to the plurality of light-emitting elements 100 to control the plurality of light-emitting elements 100 to emit light.

[0047] Please see Figure 3 , Figure 3 This is a schematic diagram of the first layer structure of the light-emitting element disclosed in the first embodiment of this application. Figure 3 As shown, the light-emitting main body 10 further includes a substrate 14, a first semiconductor layer 15, a light-emitting layer 16, and a second semiconductor layer 17 stacked sequentially. Specifically, the first semiconductor layer 15 is disposed on one surface of the substrate 14, the light-emitting layer 16 is disposed on the portion of the first semiconductor layer 15 facing away from the substrate 14, and the second semiconductor layer 17 is disposed on the surface of the light-emitting layer 16 facing away from the first semiconductor layer 15. The substrate 14 serves to provide the surface on which the first semiconductor layer 15 is formed.

[0048] In this embodiment, the substrate 14 can be made of transparent plastic or glass. The first semiconductor layer 15 can be an N-type semiconductor layer, such as an N-type gallium nitride layer, and is used to provide electrons to the light-emitting layer 16. The second semiconductor layer 17 can be a P-type semiconductor layer, such as a P-type gallium nitride layer, and is used to provide holes to the light-emitting layer 16. The light-emitting layer 16 is used to recombine electrons and holes and emit light.

[0049] In an exemplary embodiment, the first semiconductor layer 15 may be a P-type semiconductor layer, such as a P-type gallium nitride layer, and the first semiconductor layer 15 is used to provide holes to the light-emitting layer 16. The second semiconductor layer 17 may be an N-type semiconductor layer, such as an N-type gallium nitride layer, and the second semiconductor layer 17 is used to provide electrons to the light-emitting layer 16.

[0050] It is understood that the N-type semiconductor layer can be an N-type GaN layer, an N-type AlGaN layer, an N-type GaAs layer, etc., but is not limited to these. The light-emitting layer 16 can be a multilayer quantum well (MQW) layer, which can be an InGaN / GaN type MQW layer, an InGaN / AlGaN type MQW layer, an AlGaN / AlGaN type MQW layer, etc., but is not limited to these. The P-type semiconductor layer can be a P-type GaN layer, a P-type AlGaN layer, a P-type GaAs layer, etc., but is not limited to these. The material composition of the first electrode 20 and the second electrode 30 can be the same or different.

[0051] In an exemplary embodiment, the surface where the light-emitting layer 16 connects to the first semiconductor layer 15 can be configured as an uneven first connecting surface. That is, a portion of the first connecting surface convexes towards the side of the light-emitting layer 16 facing the first semiconductor layer 15, and a portion of the first connecting surface is concave towards the side of the light-emitting layer 16 away from the first semiconductor layer 15. In other words, the first connecting surface is not a flat surface. The shape of the surface where the first semiconductor layer 15 connects to the first connecting surface complements the shape of the first connecting surface; that is, the surface where the first semiconductor layer 15 connects to the first connecting surface is also an uneven connecting surface.

[0052] It is understood that the uneven first connecting surface may include, but is not limited to, multiple sequentially connected arc surfaces, multiple spaced arc surfaces, sawtooth surfaces, wavy surfaces, or any combination of the above shapes. The arc surfaces may include, but are not limited to, semi-circular arc surfaces, semi-elliptical arc surfaces, or other arc surfaces. It is understood that the uneven first connecting surface may be of any shape, and this application does not impose specific limitations on it.

[0053] It is understood that by setting the first connection surface connected to the first semiconductor layer 15 to be uneven, more electrons can enter the light-emitting layer 16 from the first semiconductor layer 15, increasing the probability of recombination of electrons and holes in the light-emitting layer 16, improving the luminous efficiency of the light-emitting layer 16, and thus improving the luminous efficiency of the light-emitting element 100.

[0054] In an exemplary embodiment, the surface where the light-emitting layer 16 connects to the second semiconductor layer 17 can also be configured as an uneven second connecting surface. That is, a portion of the second connecting surface convexes towards the side of the light-emitting layer 16 facing the second semiconductor layer 17, and a portion of the second connecting surface is concave towards the side of the light-emitting layer 16 away from the second semiconductor layer 17. In other words, the second connecting surface is not a flat surface. The shape of the surface where the second semiconductor layer 17 connects to the second connecting surface complements the shape of the second connecting surface, and the surface where the second semiconductor layer 17 connects to the second connecting surface is also an uneven connecting surface.

[0055] It is understood that the uneven second connecting surface may include, but is not limited to, multiple sequentially connected arc surfaces, multiple spaced arc surfaces, sawtooth surfaces, wavy surfaces, or any combination of the above shapes. The arc surfaces may include, but are not limited to, semi-circular arc surfaces, semi-elliptical arc surfaces, or other arc surfaces. It is understood that the uneven second connecting surface may be of any shape, and this application does not impose specific limitations on it.

[0056] It is understood that by setting the second connection surface connected to the second semiconductor layer 17 to be uneven, a greater number of holes can enter the light-emitting layer 16 from the second semiconductor layer 17, thereby increasing the probability of recombination of electrons and holes in the light-emitting layer 16, improving the luminous efficiency of the light-emitting layer 16, and thus improving the luminous efficiency of the light-emitting element 100.

[0057] In the embodiments of this application, please refer to Figure 3The first semiconductor layer 15 includes a first semiconductor structure 151 and a second semiconductor structure 153 stacked together. The first semiconductor structure 151 is disposed on one surface of the substrate 14, and the second semiconductor structure 153 is disposed on the portion of the surface of the first semiconductor structure 151 facing away from the substrate 14. Therefore, the second semiconductor structure 153 and the first semiconductor structure 151 form a stepped first semiconductor layer 15. That is, the orthographic projection of the second semiconductor structure 153 onto the substrate 14 lies within the orthographic projection of the first semiconductor structure 151 onto the substrate 14, such that a portion of the first semiconductor structure 151 is exposed on the side of the second semiconductor structure 153 facing away from the first semiconductor structure 151, forming a mounting surface 154. The mounting surface 154 is the portion of the surface of the first semiconductor structure 151 facing away from the substrate 14 that is not covered by the second semiconductor structure 153. The light-emitting layer 16 is disposed on the surface of the second semiconductor structure 153 facing away from the first semiconductor structure 151, that is, the second semiconductor structure 153 is connected to the first connection surface.

[0058] In the embodiments of this application, please refer to Figure 3 The second electrode 30 has a second connection portion 31 disposed on a portion of the mounting surface 154 and electrically connected to the first semiconductor layer 15. One end of the second abutment portion 32 is fixedly connected to the second connection portion 31 and extends along the peripheral side surface of the first semiconductor structure 151 and the peripheral side surface of the substrate 14 toward the surface of the substrate 14 opposite to the first semiconductor layer 15. The first connection portion 21 of the first electrode 20 is disposed on a portion of the surface of the second semiconductor layer 17 opposite to the light-emitting layer 16 and electrically connected to the second semiconductor layer 17. One end of the first abutment portion 22 is fixedly connected to the first connection portion 21 and extends sequentially along the peripheral side surface of the second semiconductor layer 17, the peripheral side surface of the light-emitting layer 16, the peripheral side surface of the first semiconductor layer 15, and the peripheral side surface of the substrate 14 toward the surface of the substrate 14 opposite to the first semiconductor layer 15.

[0059] It is understood that the second semiconductor layer 17 faces away from the surface of the light-emitting layer 16, and the second semiconductor layer 17, the light-emitting layer 16, and the second semiconductor structure 153 all face the surface of the second connection portion 31 and the mounting surface 154 to form the first end face 11. The substrate 14 forms the second end face 12 on the surface of the substrate facing away from the first semiconductor layer 15.

[0060] In an exemplary embodiment, the light-emitting element 100 may be a micro light-emitting diode (Micro LED) or a mini light-emitting diode (Mini LED).

[0061] Please see Figure 4 , Figure 4 This is a schematic diagram of a second structure of the light-emitting element disclosed in the first embodiment of this application. The difference between the second structure and the first structure is that one end of the first supporting portion 22 is fixedly connected to the first connecting portion 21 and extends along the peripheral side surface 13 toward the second end face 12 to protrude from the second end face 12; that is, the first supporting portion 22 includes a first supporting surface 22a protruding from the second end face 12. One end of the second supporting portion 32 is fixedly connected to the second connecting portion 31 and extends along the peripheral side surface 13 toward the second end face 12 to protrude from the second end face 12; that is, the second supporting portion 32 includes a second supporting surface 32a protruding from the second end face 12. The first abutting portion 22 includes a first abutting surface 22a protruding from the second end face 12, meaning that there is a distance difference between the first abutting surface 22a and the second end face 12, and the distance from the first abutting surface 22a to the surface of the first connecting portion 21 opposite to the light-emitting main body 10 is greater than the distance from the second end face 12 to the surface of the first connecting portion 21 opposite to the light-emitting main body 10. The second abutting portion 32 includes a second abutting surface 32a protruding from the second end face 12, meaning that there is a distance difference between the second abutting surface 32a and the second end face 12, and the distance from the second abutting surface 32a to the surface of the second connecting portion 31 opposite to the light-emitting main body 10 is greater than the distance from the second end face 12 to the surface of the second connecting portion 31 opposite to the light-emitting main body 10.

[0062] Therefore, the light-emitting element 100 is bonded to the array substrate 300 by the bonding and pressing device 200. The first pressing member 220 is aligned with the first abutting portion 22 of the first electrode 20, and the second pressing member 230 is aligned with the second abutting portion 32 of the second electrode 30. By moving the bonding and pressing device 200, the first pressing member 220 presses against the first abutting surface 22a, while the second pressing member 230 presses against the second abutting surface 32a. The first electrode 20 and the second electrode 30 simultaneously contact and bond to the array substrate 300, thereby bonding the light-emitting element 100 to the array substrate 300. Therefore, when bonding the light-emitting element 100, the bonding pressing device 200 directly abuts against the first abutting part 22 of the first electrode 20 and the second abutting part 32 of the second electrode 30. That is, the pressure applied by the bonding pressing device 200 directly acts on the first electrode 20 and the second electrode 30, rather than on the light-emitting main body 10, thus avoiding damage to the light-emitting main body 10 caused by the pressure during the bonding process.

[0063] It is understandable that, since the end of the first abutting portion 22 opposite to the first connecting portion 21 protrudes from the second end face 12, and the end of the second abutting portion 32 opposite to the second connecting portion 31 also protrudes from the second end face 12, the bonding and pressing device 200 can omit the first pressing member 220 and the second pressing member 230. That is, the support member 210 simultaneously presses against the protruding first abutting surface 22a and the second abutting surface 32a, so that the first electrode 20 and the second electrode 30 simultaneously contact and bond to the array substrate 300, thereby bonding and binding the light-emitting element 100 to the array substrate 300. Since the support member 210 is a rectangular plate with a flat surface, it can also abut against the first abutting surface 22a and the second abutting surface 32a without the first pressing member 220 and the second pressing member 230, so that the first electrode 20 and the second electrode 30 simultaneously contact and bond to the array substrate 300. Furthermore, since the first pressing member 220 and the second pressing member 230 are omitted, there is no need to align the first pressing member 220 with the first abutting portion 22 of the first electrode 20 and the second pressing member 230 with the second abutting portion 32 of the second electrode 30. Therefore, the alignment step is omitted, the pressing process is simplified, and the bonding efficiency of the light-emitting element 100 is improved.

[0064] Please refer to the following: Figure 1 and Figure 5 , Figure 5 To be Figure 1The diagram shows a second structural schematic of a light-emitting element bonded to an array substrate. One side surface of the array substrate 300 has several conductive layers 310. The array substrate 300 can be a driving substrate, comprising a substrate body and a driving circuit located on one side surface of the substrate body. The driving circuit may include substrate electrodes and a storage capacitor, and the driving circuit can be electrically connected to the conductive layers 310 through the substrate electrodes. The conductive layers 310 are located on the side surface of the driving circuit opposite to the substrate body, and each conductive layer 310 corresponds to one of the first electrode 20 and the second electrode 30. The conductive layers 310 are electrically connected to the driving circuit to drive the light-emitting element 100 to emit light normally.

[0065] It is understood that the specific configuration of the driving circuit can vary depending on the driving method of the light-emitting element 100. Specifically, when the driving method of the light-emitting element 100 is active driving, the driving circuit may include multiple thin-film transistors (TFTs) to drive the light-emitting element to emit light. When the driving method of the light-emitting element 100 is passive driving, the driving circuit may include cathode signal lines and anode signal lines to provide the light-emitting element 100 with the cathode and anode signals required for light emission, thereby driving the light-emitting element 100 to emit light. The specific configuration of the driving circuit is not described in this embodiment.

[0066] In an exemplary embodiment, the conductive layer 310 may be a contact electrode, and the material of the conductive layer 310 may include a metal or an alloy, such as Al, Ti or Mo.

[0067] like Figure 5 As shown, the array substrate 300 further includes a plurality of bonding layers 320, each corresponding to one of the conductive layers 310. The bonding layers 320 are disposed on the side of the conductive layers 310 facing the first electrode 20 and the second electrode 30. The positions of the bonding layers 320 correspond one-to-one with the first electrode 20 and the second electrode 30, respectively.

[0068] In this embodiment of the application, the light-emitting element 100 is bonded to the array substrate 300 by the bonding and pressing device 200, the first pressing member 220 is aligned with the first abutting portion 22 of the first electrode 20, and the second pressing member 230 is aligned with the second abutting portion 32 of the second electrode 30. The bonding and pressing device 200 is moved so that the first pressing member 220 is aligned with the first supporting portion 22, and the second pressing member 230 is aligned with the second supporting portion 32. The first pressing member 220 presses against the first supporting surface 22a, and the second pressing member 230 presses against the second supporting surface 32a. The first connecting portion 21 and the first supporting portion 22 of the first electrode 20 contact and bond to the bonding layer 320. At the same time, the second connecting portion 31 and the second supporting portion 32 of the second electrode 30 contact and bond to the bonding layer 320. That is, while the first electrode 20 is bonded to the bonding layer 320, the second electrode 30 is bonded to the bonding layer 320. The first electrode 20 and the second electrode 30 are embedded in the corresponding bonding layer 320, thereby bonding and binding the light-emitting element 100 to the array substrate 300. Therefore, when bonding the light-emitting element 100, the bonding pressing device 200 directly abuts against the first abutting part 22 of the first electrode 20 and the second abutting part 32 of the second electrode 30. That is, the pressure applied by the bonding pressing device 200 directly acts on the first electrode 20 and the second electrode 30, rather than on the light-emitting main body 10, thus avoiding damage to the light-emitting main body 10 caused by the pressure during the bonding process.

[0069] In one embodiment, the bonding layer 320 may be made of solder, including In solder or tin-containing lead-free solder.

[0070] In another embodiment, the bonding layer 320 may be made of conductive adhesive, specifically anisotropic conductive adhesive.

[0071] It is understood that when the bonding layer 320 is made of solder, the first electrode 20 and the second electrode 30 are bonded to the bonding layer 320 using reflow soldering. When the bonding layer 320 is made of conductive adhesive, the first electrode 20 is pressed against the bonding layer 320, interconnecting the first electrode 20 with the conductive particles in the bonding layer 320; similarly, the second electrode 30 is pressed against the bonding layer 320, interconnecting the second electrode 30 with the conductive particles in the bonding layer 320.

[0072] Please see Figure 6 , Figure 6 This is a schematic diagram of the second layer structure of the light-emitting element disclosed in the first embodiment of this application. Figure 6As shown, the light-emitting main body 10 further includes a current spreading layer 18, which is disposed on the surface of the second semiconductor layer 17 opposite to the light-emitting layer 16. The first electrode 20 is electrically connected to the second semiconductor layer 17 through the current spreading layer 18. The current spreading layer 18 can prevent current concentration near the first electrode 20 and increase the luminous efficiency of the light-emitting element 100.

[0073] In an exemplary embodiment, a passivation layer may be deposited on the surface of the light-emitting main body 10, with the first electrode 20 and the second electrode 30 exposed by the passivation layer. The passivation layer is used to passivate the sidewalls of the light-emitting main body 10, thereby improving the luminous efficiency of the light-emitting element 100. It is understood that, to ensure good process tolerance, the passivation layer can be made of AlN. Specifically, a passivation layer can be grown on the light-emitting main body 10 using a deposition technique.

[0074] In summary, the light-emitting element 100 provided in this application embodiment is bonded to the array substrate 300 via the bonding and pressing device 200. The light-emitting element 100 includes a light-emitting main body 10, a first electrode 20, and a second electrode 30. The light-emitting main body 10 includes a first end face 11, a second end face 12, and a peripheral side face 13 located between the first end face 11 and the second end face 12. One end of the first electrode 20 is disposed on a portion of the first end face 11 and electrically connected to the light-emitting main body 10. The first electrode 20 is bent from the first end face 11 toward the peripheral side face 13 and extends along the peripheral side face 13 toward the second end face 12 to form a first abutment portion 22. One end of the second electrode 30 is disposed on a portion of the first end face 11 and spaced apart from the first electrode 20, and electrically connected to the light-emitting main body 10. The second electrode 30 is bent from the first end face 11 toward the peripheral side face 13 and extends along the peripheral side face 13 toward the second end face 12 to form a second abutment portion 32. The first abutting portion 22 and the second abutting portion 32 are pressed by the bonding pressing device 200 to bond the light-emitting element 100 to the array substrate 300. Therefore, when bonding the light-emitting element 100 of this application, the bonding pressing device 200 directly abuts against the first abutting portion 22 of the first electrode 20 and the second abutting portion 32 of the second electrode 30. That is, the pressure applied by the bonding pressing device 200 acts directly on the first electrode 20 and the second electrode 30, rather than on the light-emitting body portion 10, thus avoiding damage to the light-emitting body portion 10 caused by the pressure during the bonding process, thereby improving the yield of the light-emitting element 100 during bonding.

[0075] Based on the same concept, a second embodiment of this application provides a display panel. Please refer to... Figure 7 , Figure 7 This is a schematic diagram of the layer structure of the display panel disclosed in the second embodiment of this application. The display panel 400 provided in this embodiment includes an array substrate 300 and a plurality of the above-described light-emitting elements 100. The plurality of light-emitting elements 100 are disposed on one side of the array substrate 300 and electrically connected to the array substrate 300. The array substrate 300 is used to transmit electrical signals to the plurality of light-emitting elements 100 to control the plurality of light-emitting elements 100 to emit light. Figures 1 to 6 The illustrated embodiment has already provided a relatively detailed description of the light-emitting element 100, and will not be repeated here.

[0076] In an exemplary embodiment, each of the light-emitting elements 100 is electrically connected to the array substrate 300 via the first electrode 20 and the second electrode 30.

[0077] It is understood that the first connecting portion 21 and the first supporting portion 22 of the first electrode 20 contact and bond to the bonding layer 320, while the second connecting portion 31 and the second supporting portion 32 of the second electrode 30 contact and bond to the bonding layer 320. That is, while the first electrode 20 is bonded to the bonding layer 320, the second electrode 30 is also bonded to the bonding layer 320. The first electrode 20 and the second electrode 30 are embedded in the corresponding bonding layer 320, thereby bonding and binding the light-emitting element 100 to the array substrate 300 to achieve a fixed electrical connection between the light-emitting element 100 and the array substrate 300, thereby ensuring the structural stability and service life of the formed display panel 400.

[0078] In an exemplary embodiment, the display panel 400 may further include multiple light-shielding portions (not shown), with at least one light-shielding portion disposed between two adjacent light-emitting elements 100. The light-shielding portions can block and absorb light emitted laterally from the light-emitting elements 100 to avoid mutual interference between the light emitted from adjacent light-emitting elements 100. Specifically, the light-shielding portions may be made of materials with good light absorption properties, such as black colloidal materials or resin materials used to prepare black matrices.

[0079] In an exemplary embodiment, the height of the light-shielding portion along the direction perpendicular to the plane of the array substrate 300 may be greater than or equal to the height of the light-emitting element 100. It should be noted that "the height of the light-shielding portion is greater than the height of the light-emitting element 100" can be understood as the height of the upper surface of the light-shielding portion being greater than the height of the upper surface of the light-emitting element 100; "the height of the light-shielding portion is equal to the height of the light-emitting element 100" can be understood as the upper surface of the light-shielding portion being flush with the upper surface of the light-emitting element 100, to ensure the light-shielding effect of the light-shielding portion on the light emitted by the light-emitting element 100.

[0080] In some exemplary embodiments, the light-shielding portion may have a ring-shaped structure and be disposed around the light-emitting element 100 to achieve blocking and absorption of light emitted from the light-emitting element 100 in all directions. It is understood that the shape of the light-shielding portion matches the shape of the light-emitting element 100; for example, when the light-emitting element 100 is rectangular, the light-shielding portion correspondingly has a rectangular ring-shaped structure to ensure the blocking effect.

[0081] Understandably, the display panel can be used in electronic devices that include functions such as a Personal Digital Assistant (PDA) and / or a music player, such as mobile phones, tablets, and wearable electronic devices with wireless communication capabilities (such as smartwatches). The aforementioned electronic devices can also be other electronic devices, such as laptops with touch-sensitive surfaces (e.g., touch panels). In some embodiments, the electronic device may have communication capabilities, i.e., it can establish communication with a network via 2G (second-generation mobile communication technology), 3G (third-generation mobile communication technology), 4G (fourth-generation mobile communication technology), 5G (fifth-generation mobile communication technology), 6G (sixth-generation mobile communication technology), or WLAN (wireless local area network) or other communication methods that may emerge in the future. For the sake of simplicity, this application embodiment does not further limit this aspect.

[0082] Based on the same concept, a third embodiment of this application also provides a display device. Please refer to... Figure 8 , Figure 8 This is a schematic diagram of the layer structure of the display device disclosed in the third embodiment of this application. The display device 600 provided in this embodiment includes a housing 500 and the aforementioned display panel 400. The display panel 400 is disposed within the housing 500, and the light-emitting side of the display panel 400 is exposed outside the housing 500.

[0083] Understandably, the display device 600 can be used in electronic devices including but not limited to televisions, tablets, laptops, desktop computers, mobile phones, in-vehicle displays, smartwatches, smart bracelets, and smart glasses. According to the embodiments of this application, the specific type of the display device 600 is not particularly limited, and those skilled in the art can design it accordingly based on the specific usage requirements of the display device 600, which will not be elaborated further here.

[0084] In an exemplary embodiment, the display device 600 may also include other necessary components and parts such as a power board, a high-voltage board, and a button control board. Those skilled in the art can make corresponding additions according to the specific type and actual function of the display device 600, which will not be elaborated here.

[0085] In other embodiments of this application, the display device 600 may further include a processor and a memory. The processor is electrically connected to the display panel 400 and is used to control the display panel 400 to perform a display. The memory is electrically connected to the processor and is used to store program code required for the processor to run, control the display content of the display panel 400, etc.

[0086] In an exemplary embodiment, the memory may include volatile memory, such as random access memory (RAM); the memory may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). The memory may also include combinations of the above types of memory.

[0087] In an exemplary embodiment, the processor includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), microprocessor, microcontroller, main processor, and controller, etc. The processor is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory, which enable the computing device to provide a wide range of services.

[0088] In summary, the display device 600 provided in this application embodiment includes a housing 500 and a display panel 400. The display panel 400 includes an array substrate 300 and a plurality of light-emitting elements 100. Each light-emitting element 100 includes a light-emitting main body 10, a first electrode 20, and a second electrode 30. The light-emitting main body 10 includes a first end face 11, a second end face 12, and a peripheral side face 13 located between the first end face 11 and the second end face 12. One end of the first electrode 20 is disposed on a portion of the first end face 11 and is electrically connected to the light-emitting main body 10. The first electrode 20 is bent from the first end face 11 toward the peripheral side face 13 and extends along the peripheral side face 13 toward the second end face 12 to form a first abutment portion 22. One end of the second electrode 30 is disposed on a portion of the first end face 11 and spaced apart from the first electrode 20, and electrically connected to the light-emitting main body 10. The second electrode 30 bends from the first end face 11 toward the peripheral side face 13 and extends along the peripheral side face 13 toward the second end face 12 to form a second abutment portion 32. The first abutment portion 22 and the second abutment portion 32 are pressed by the bonding pressing device 200 to bond the light-emitting element 100 to the array substrate 300. Therefore, when bonding the light-emitting element 100 of this application, the bonding pressing device 200 directly abuts against the first abutment portion 22 of the first electrode 20 and the second abutment portion 32 of the second electrode 30. That is, the pressure applied by the bonding pressing device 200 acts directly on the first electrode 20 and the second electrode 30, rather than on the light-emitting main body 10, avoiding damage to the light-emitting main body 10 by pressure during the bonding process, thereby improving the yield of the light-emitting element 100 during bonding.

[0089] It should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0090] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0091] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims. Those skilled in the art will understand that implementing all or part of the processes of the above embodiments, and equivalent changes made in accordance with the claims of this application, still fall within the scope of this application.

Claims

1. A light-emitting element, bonded to an array substrate by a bonding and pressing device, characterized in that, The light-emitting element includes a light-emitting main body, a first electrode, and a second electrode. The light-emitting main body includes a first end face, a second end face, and a peripheral side face located between the first end face and the second end face. One end of the first electrode is disposed on a portion of the first end face and electrically connected to the light-emitting main body. The first electrode is bent and disposed on the first end face and the peripheral side face, and extends along the peripheral side face toward the second end face to form a first abutment portion. One end of the second electrode is disposed on a portion of the first end face and is spaced apart from the first electrode, and is electrically connected to the light-emitting main body. The second electrode is bent and disposed on the first end face and the peripheral side face, and extends along the peripheral side face toward the second end face to form a second abutment portion. The first and second abutting portions are pressed by the bonding and pressing device to bond the light-emitting element to the array substrate.

2. The light-emitting element as described in claim 1, characterized in that, The first electrode includes a first connecting portion and a first supporting portion. The first connecting portion is disposed on a portion of the first end face and is electrically connected to the light-emitting main body. One end of the first supporting portion is fixedly connected to the first connecting portion and extends along the peripheral side surface toward the second end face until it is flush with the second end face. The second electrode includes a second connecting portion and a second supporting portion. The second connecting portion is disposed on a portion of the first end face and is spaced apart from the first connecting portion, and is electrically connected to the light-emitting main body. One end of the second supporting portion is fixedly connected to the second connecting portion and extends along the peripheral side surface toward the second end face until it is flush with the second end face.

3. The light-emitting element as described in claim 1, characterized in that, The first electrode includes a first connecting portion and a first supporting portion. The first connecting portion is disposed on a portion of the first end face and is electrically connected to the light-emitting main body. One end of the first supporting portion is fixedly connected to the first connecting portion and extends along the peripheral side surface toward the second end face to protrude from the second end face. The second electrode includes a second connecting portion and a second supporting portion. The second connecting portion is disposed on a portion of the first end face and is spaced apart from the first connecting portion, and is electrically connected to the light-emitting main body. One end of the second supporting portion is fixedly connected to the second connecting portion and extends along the peripheral side surface toward the second end face to protrude from the second end face.

4. The light-emitting element as described in claim 2 or 3, characterized in that, The light-emitting main body further includes a substrate, a first semiconductor layer, a light-emitting layer and a second semiconductor layer stacked together, wherein the surface where the light-emitting layer is connected to the first semiconductor layer is configured as a first connection surface with unevenness; and / or, the surface where the light-emitting layer is connected to the second semiconductor layer is configured as a second connection surface with unevenness.

5. The light-emitting element as described in claim 4, characterized in that, The first semiconductor layer includes a first semiconductor structure and a second semiconductor structure stacked together. The first semiconductor structure is disposed on one surface of the substrate, and the second semiconductor structure is disposed on a portion of the surface of the first semiconductor structure facing away from the substrate to form a mounting surface. The light-emitting layer is disposed on the surface of the second semiconductor structure facing away from the first semiconductor structure.

6. The light-emitting element as described in claim 5, characterized in that, The first connection portion of the first electrode is disposed on the surface of the second semiconductor layer opposite to the light-emitting layer and is electrically connected to the second semiconductor layer. One end of the first abutment portion is fixedly connected to the first connection portion and extends toward the second end face along the peripheral side surface of the second semiconductor layer, the peripheral side surface of the light-emitting layer, the peripheral side surface of the first semiconductor layer and the peripheral side surface of the substrate. The second connection portion of the second electrode is disposed on a portion of the mounting surface and is electrically connected to the first semiconductor layer. One end of the second abutment portion is fixedly connected to the second connection portion and extends along the peripheral side surface of the first semiconductor structure and the peripheral side surface of the substrate toward the second end face.

7. The light-emitting element as described in claim 4, characterized in that, The light-emitting body further includes a current spreading layer, which is disposed on the surface of the second semiconductor layer opposite to the light-emitting layer. The first electrode is electrically connected to the second semiconductor layer through the current spreading layer. The current spreading layer is used to prevent current accumulation near the first electrode.

8. A display panel, characterized in that, It includes an array substrate and a plurality of light-emitting elements as described in any one of claims 1-7, wherein the plurality of light-emitting elements are disposed on one side of the array substrate and are electrically connected to the array substrate.

9. The display panel as described in claim 8, characterized in that, The display panel also includes multiple light-shielding parts, with at least one light-shielding part provided between two adjacent light-emitting elements. The light-shielding parts are used to prevent mutual interference between the light emitted by adjacent light-emitting elements.

10. A display device, characterized in that, It includes a housing and a display panel as described in claim 8 or 9, wherein the display panel is disposed within the housing and the light-emitting side of the display panel protrudes from the housing.

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