LED encapsulation lamp bead and display module

Abstract

The utility model relates to the technical field of LED packaging, especially relates to a kind of LED packaging lamp bead and display module, the LED packaging lamp bead includes substrate and LED chip structure that is inverted on substrate, one side of substrate setting LED chip structure is provided with encapsulation adhesive layer, white cover is provided at least corresponding the position of the directly above of LED chip structure on encapsulation adhesive layer;Encapsulation adhesive layer is fluorescent adhesive layer or transparent adhesive layer;Hollow part is opened on substrate, LED chip structure corresponds with hollow part, and reflective structure is filled in hollow part.The full reflection loss of LED chip on substrate is reduced, and the light-emitting angle of LED packaging lamp bead whole is increased.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to an LED packaged lamp bead and display module. Background Technology

[0002] In LED packaging technology, flip-chips are widely used due to their advantages such as high thermal conductivity and high power density. However, in white light solutions, their emission angle is often smaller than that of traditional conventional chips. In particular, some existing flip-chip structures typically use bottom filler to fill the gap between the substrate solder joints and the flip chip, which limits the emission angle of the flip chip. Utility Model Content

[0003] To address the problem that existing methods using bottom-filled adhesive to fill the gap between the solder joints and the flip chip limit the light emission angle of the flip chip, this invention provides an LED packaged lamp bead and display module.

[0004] The present invention provides an LED encapsulated lamp bead, comprising a substrate and an LED chip structure flip-chip mounted on the substrate. An encapsulating adhesive layer is provided on one side of the substrate where the LED chip structure is mounted. A white cap is provided on the encapsulating adhesive layer at least directly above the LED chip structure. The encapsulating adhesive layer is a fluorescent adhesive layer or a transparent adhesive layer. A hollow portion is formed on the substrate, and the LED chip structure corresponds to the hollow portion. A reflective structure is filled within the hollow portion.

[0005] Preferably, the substrate is a sheet substrate, and a reflective layer is disposed between the sheet substrate and the encapsulating adhesive layer. The reflective layer surrounds the LED chip structure and avoids the side of the LED chip structure that is away from the substrate. The thickness of the reflective layer is less than or equal to the thickness of the LED chip structure.

[0006] Preferably, the encapsulating adhesive layer is the fluorescent adhesive layer, and a transparent layer is disposed between the fluorescent adhesive layer and the white cover.

[0007] Preferably, the side of the white cover facing the transparent layer is one of a planar shape, an arc shape, or a composite shape combining a planar and an arc shape.

[0008] Preferably, the radius of curvature of the arc-shaped side of the white cover is 0.5mm-10mm; the distance between the arc vertex of the white cover and the side of the transparent layer near the substrate is 0.2mm-2.0mm; the thickness of the substrate is 0.1mm-0.3mm, the thickness of the reflective layer is 0.01mm-0.2mm, the thickness of the fluorescent adhesive layer is 0.2mm-0.6mm, the thickness of the transparent layer is 0.2mm-3.0mm, and the thickness of the white cover is 0.02mm-0.5mm.

[0009] Preferably, the encapsulating adhesive layer is the transparent adhesive layer, and the LED chip structure includes a CSP encapsulated chip structure.

[0010] Preferably, the thickness of the fluorescent adhesive layer is 0.4mm-1.0mm.

[0011] Preferably, the side of the fluorescent adhesive layer facing away from the LED chip structure is planar or arc-shaped.

[0012] Preferably, the substrate is one of a flat plate support and a cup-shaped support.

[0013] This utility model also provides a display module, including LED packaged lamp beads as described in any of the preceding claims.

[0014] Compared with the prior art, the LED packaged lamp beads and display module of this utility model have the following advantages:

[0015] 1. This utility model provides an LED packaged lamp bead, including a substrate and an LED chip structure flip-chip mounted on the substrate. An encapsulating adhesive layer is provided on one side of the substrate where the LED chip structure is mounted. A white cap is provided on the encapsulating adhesive layer at least directly above the LED chip structure. The encapsulating adhesive layer is a fluorescent adhesive layer or a transparent adhesive layer. A hollow portion is formed on the substrate, and the LED chip structure corresponds to the hollow portion. A reflective structure is filled within the hollow portion. By filling the hollow portion of the substrate with a reflective structure instead of filling the gap between the chip and the substrate with adhesive in the existing flip-chip structure, the light emitted from the bottom of the LED chip structure can be diffusely reflected through the reflective structure, thereby reducing the total internal reflection loss of the LED chip structure on the substrate, improving the lateral light emission angle, and thus increasing the overall light emission angle of the LED packaged lamp bead. Furthermore, the white cap blocks the light directly facing the center of the LED chip structure, reflecting the light horizontally. Combined with the reflective structure, this achieves the reflection of light at the top and bottom center positions of the LED chip structure, further reducing high-light interference at the center position of the LED chip structure, increasing the overall light emission angle of the LED packaged lamp bead, and making the light more uniform.

[0016] 2. The substrate of this utility model is a wafer substrate. A reflective layer is disposed between the wafer substrate and the encapsulating adhesive layer. The reflective layer surrounds the LED chip structure and avoids the side of the LED chip structure that faces away from the substrate. The thickness of the reflective layer is less than or equal to the thickness of the LED chip structure. By setting the reflective layer on the wafer substrate and cooperating with the reflective structure of the hollow part, a reflective structure can be set at the bottom and periphery of the chip. Thus, the diffuse reflection of the light emitted by the LED chip structure achieved by the reflective structure and the reflective layer replaces the total internal reflection of the pad silver plating layer of the existing flip-chip light-emitting structure, thereby reducing the high light interference caused by total internal reflection, making the light scatter uniformly, and the overall light effect is softer and more natural. In addition, the thickness of the reflective layer is less than or equal to the thickness of the LED chip structure, thereby avoiding the reflective layer being too high and affecting the side light emission angle of the light-emitting chip.

[0017] 3. The encapsulating adhesive layer of this utility model is a fluorescent adhesive layer, and a transparent layer is provided between the fluorescent adhesive layer and the white cover. By providing a transparent layer, the light emitted from the top of the LED chip structure enters the transparent layer after passing through the fluorescent adhesive layer, so as to better open the optical angle through the transparent layer. After some light is reflected by the white cover, the light is reflected in the horizontal direction so that it is emitted through the transparent layer, further opening the optical angle.

[0018] 4. The side of the white cover facing the transparent layer of this utility model is one of a planar shape, an arc shape, or a composite shape combining a planar and an arc shape. By using white covers with various shapes corresponding to the light-emitting centers of the LED chip structure, different usage needs can be met and more usage environments can be adapted, providing users with more choices and improving applicability.

[0019] 5. The radius of curvature of the arc-shaped surface on the white cover of this utility model is 0.5mm-10mm; the distance between the arc-shaped vertex on the white cover and the side of the transparent layer near the substrate is 0.2mm-2.0mm. By controlling the range of the radius of curvature of the arc-shaped surface on the white cover, the curvature of the arc protruding into the transparent layer on the white cover can be controlled, thereby ensuring the best reflection effect of the arc surface of the white cover on the light-emitting center of the LED chip structure, avoiding the situation where the arc surface is too curved or not curved enough, and cannot achieve the reflection of the light-emitting center of the light-emitting chip; and by controlling the range of the distance between the arc-shaped vertex on the white cover and the side of the transparent layer near the substrate, the light-guiding effect of the transparent layer on the LED chip structure is ensured, so that the light-guiding effect of the light-transmitting layer and the light-reflecting effect of the white cover layer can be balanced within this distance range.

[0020] 6. The thickness of the fluorescent adhesive layer in this invention is 0.4mm-1.0mm. By increasing the thickness of the fluorescent adhesive layer, the emission distance of the light can be increased, which is more conducive to opening the angle of the light.

[0021] 7. The side of the fluorescent adhesive layer facing away from the LED chip structure in this invention is either planar or arc-shaped. An arc-shaped fluorescent adhesive layer can improve light extraction efficiency, enhance color uniformity, expand the viewing angle, and reduce light loss; a planar fluorescent adhesive layer is simple to manufacture and has low cost; and it provides more options for fluorescent adhesive layers to meet different manufacturing and application requirements.

[0022] 8. This utility model also provides a display module, which has the same beneficial effects as the LED packaged lamp beads mentioned above, and will not be described in detail here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a cross-sectional schematic diagram of the LED packaged lamp bead provided in the first embodiment of this utility model.

[0025] Figure 2 This is a top view of the substrate of the LED packaged lamp bead provided in the first embodiment of this utility model.

[0026] Figure 3 This is a cross-sectional schematic diagram of the LED packaged lamp bead provided in the second embodiment of this utility model.

[0027] Figure 4 This is a cross-sectional view of the LED packaged lamp bead provided in the third embodiment of this utility model. Figure 1 .

[0028] Figure 5 This is a cross-sectional view of the LED packaged lamp bead provided in the third embodiment of this utility model. Figure 2 .

[0029] Figure 6 This is a cross-sectional view of the white cover of the LED packaged lamp bead provided in the fourth embodiment of the present invention, which is a planar shape. Figure 1 .

[0030] Figure 7 This is a cross-sectional view of the white cover of the LED packaged lamp bead provided in the fourth embodiment of the present invention, which is a planar shape. Figure 2 .

[0031] Figure 8 This is a schematic cross-sectional view of the white cover of the LED packaged lamp bead provided in the fourth embodiment of the present invention, which is arc-shaped. Figure 1 .

[0032] Figure 9 This is a schematic cross-sectional view of the white cover of the LED packaged lamp bead provided in the fourth embodiment of the present invention, which is arc-shaped. Figure 2 .

[0033] Figure 10 This is a cross-sectional schematic diagram of the white cover of the LED packaged lamp bead provided in the fourth embodiment of the present invention, which has a composite shape.

[0034] Figure 11 This is a schematic cross-sectional view of the phosphor layer of the LED packaged lamp bead provided in the fourth embodiment of the present invention, which is planar. Figure 1 .

[0035] Figure 12 This is a schematic cross-sectional view of the phosphor layer of the LED packaged lamp bead provided in the fourth embodiment of the present invention, which is planar. Figure 2 .

[0036] Figure 13 This is a schematic cross-sectional view of the phosphor layer of the LED packaged lamp bead provided in the fourth embodiment of the present invention, which is planar. Figure 3 .

[0037] Figure 14 This is a cross-sectional schematic diagram of the LED packaged lamp bead provided in the fifth embodiment of this utility model.

[0038] Figure 15 This is a cross-sectional view of the cup-shaped bracket for the LED packaged lamp bead provided in the sixth embodiment of this utility model. Figure 1 .

[0039] Figure 16 This is a cross-sectional view of the cup-shaped bracket for the LED packaged lamp bead provided in the sixth embodiment of this utility model. Figure 2 .

[0040] Figure 17 This is a block diagram of the display module provided in the seventh embodiment of this utility model.

[0041] Explanation of reference numerals in the attached diagram:

[0042] 1. LED packaged lamp beads; 2. Display module;

[0043] 11. Substrate; 12. LED chip structure; 13. Phosphor layer; 14. White cap; 15. Reflective structure; 16. Reflective layer; 17. Transparent layer; 18. Transparent adhesive layer; 19. CSP packaged chip structure;

[0044] 111. Hollowed-out section; 112. Positive electrode pad; 113. Negative electrode pad; 116. Cup mouth support; 141. Arc-shaped vertex; 191. LED chip; 192. Phosphor layer. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the scope of the present utility model.

[0046] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0047] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0048] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0049] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0050] Please see Figure 1 and Figure 2The first embodiment of this utility model provides an LED packaged lamp bead 1, including a substrate 11 and an LED chip structure 12 flip-chip mounted on the substrate 11. An encapsulating adhesive layer is provided on one side of the substrate 11 where the LED chip structure 12 is disposed. A white cap 14 is provided on the encapsulating adhesive layer at least at a position directly above the LED chip structure 12. The encapsulating adhesive layer is a fluorescent adhesive layer 13. A hollow portion 111 is formed on the substrate 11, and the LED chip structure 12 corresponds to the hollow portion 111. A reflective structure 15 is filled in the hollow portion 111.

[0051] Specifically, in this embodiment, the LED packaged lamp bead 1 can adopt a POB (Package on Board) solution, which refers to the process of first manufacturing the lamp bead and then attaching it to the PCB (Printed Circuit Board). When the encapsulating adhesive layer is a fluorescent adhesive layer 13, the fluorescent adhesive layer covers the top and side surfaces of the LED chip structure 12, except for the side connected to the substrate 11, so that the light emitted by the LED chip structure 12 will be converted to white light after passing through the fluorescent layer. The white cover 14 can be made of a highly reflective material, specifically, a reflective adhesive layer can be formed by using transparent silicone and titanium dioxide. This white cover 14 can block and reflect the light emitted by the LED chip structure 12 after the light has been converted to white light by the fluorescent adhesive layer 13. Specifically, the white cover 14 needs to be directly facing the light-emitting center of the LED chip structure 12, so as to reflect the light at the center of the LED chip structure 12 horizontally to prevent the brightness at the center from being too high, thereby making it easier to open the light emission angle and make the light emission more uniform.

[0052] Specifically, the LED chip structure 12 can be an LED chip, allowing the LED chip to be directly flip-chip mounted on the substrate 11, simplifying the overall packaging process. The reflective structure 15 can also be made of components such as silicone and titanium dioxide. Thus, the reflective structure 15 diffusely reflects the light emitted from the bottom of the LED chip structure 12, directing it outwards from a direction unobstructed by the pads of the LED chip structure 12.

[0053] More specifically, the cutout portion 111 is the gap between the positive electrode pad 112 and the negative electrode pad 113 in the substrate 11. When the LED chip structure 12 is flip-chip mounted on the substrate 11, the positive and negative electrode pads 113 of the LED chip structure 12 are respectively soldered to a set of positive electrode pads 112 and negative electrode pads 113 on the substrate 11, and span across the cutout portion 111, so that a gap is formed between the bottom of the LED chip structure 12 and the substrate 11. In this embodiment, the gap directly connects to the corresponding cutout portion 111. The reflective structure 15 can fill the entire cutout portion 111. The reflective structure 15 can also be made of components such as silicone and titanium dioxide, thereby not only achieving the bonding between the LED chip structure 12 and the bottom of the substrate 11, but also diffusely reflecting the light emitted from the bottom of the LED chip structure 12 through the reflective structure 15, and ensuring that the light is not blocked by the pads of the LED chip structure 12.

[0054] Understandably, by filling the hollow portion 111 of the substrate 11 with a reflective structure 15 instead of filling the gap between the chip and the substrate 11 in the existing flip chip structure with adhesive, the light emitted from the bottom of the LED chip structure 12 can be diffusely reflected by the reflective structure 15, thereby reducing the total internal reflection loss of the LED chip structure 12 on the substrate 11, improving the lateral light emission angle, and thus increasing the overall light emission angle of the LED packaged lamp bead 1. In addition, the white cap 14 can block and reflect the light directly facing the center position of the LED chip structure 12, reflecting the light horizontally. In conjunction with the reflective structure 15, the light at the top and bottom center positions of the LED chip structure 12 is reflected, further reducing the high-light interference formed at the center position of the LED chip structure 12, increasing the overall light emission angle of the LED packaged lamp bead 1, and making the light more uniform.

[0055] Please see Figure 3 The present invention also provides a second embodiment. The second embodiment differs from the first embodiment only in that the encapsulating adhesive layer is different, while the rest of the structure remains the same. In this embodiment, the encapsulating adhesive layer is a transparent adhesive layer 18.

[0056] Understandably, by setting the transparent adhesive layer 18 as the encapsulating layer for the LED chip structure 12, a colored lighting scheme can be achieved, allowing the LED chip structure 12 to emit light directly through the transparent adhesive layer 18 without color conversion. For example, when the LED chip structure 12 is a blue LED chip, the final LED encapsulated lamp bead will emit blue light.

[0057] It should be noted that users can choose different colored LED chips to achieve different colored lighting effects according to their actual lighting needs, or choose the fluorescent adhesive layer 13 as the encapsulating adhesive layer to achieve a white light solution. This embodiment does not impose any restrictions on this.

[0058] Please see Figure 4and Figure 5 The present invention also provides a third embodiment, which has a reflective layer 16 based on the first embodiment.

[0059] In this embodiment, the substrate 11 is a sheet substrate 11, and a reflective layer 16 is provided between the sheet substrate 11 and the encapsulating adhesive layer. The reflective layer 16 surrounds the LED chip structure 12 and avoids the side of the LED chip structure 12 that is away from the substrate 11.

[0060] Specifically, in this embodiment, the substrate 11 can be a sheet substrate 11, which is a hollowed-out copper sheet, and the hollowed-out portion 111 is called the hollowed-out portion 111. The encapsulating adhesive layer can be a phosphor layer 13. The side of the sheet substrate 11 where the LED is disposed can also be coated with a high-reflectivity material to form a reflective layer 16, so that the reflective layer 16 is located between the phosphor layer 13 and the substrate 11. The material used for the reflective layer 16 can be the same as the material used for the reflective structure 15, and can be prepared using components such as silicone and titanium dioxide, so that the reflective structure 15 and the reflective layer 16 have the same effect on the reflection of light from the LED chip structure 12.

[0061] More specifically, the reflective layer 16 can surround the LED chip structure 12 and avoid the side of the LED chip structure 12 that is away from the substrate 11, so as to achieve diffuse reflection of the light emitted from the LED chip structure 12 while avoiding blocking the light emitted from the top of the LED chip structure 12 and affecting the overall light emission angle.

[0062] Understandably, by setting the reflective layer 16 on the substrate 11 and surrounding the LED chip structure 12, and cooperating with the reflective structure 15 of the cutout portion 111, it is possible to set the reflective structure 15 at the bottom and periphery of the chip. This allows the diffuse reflection of light emitted from the LED chip structure 12 through the reflective structure 15 and the reflective layer 16 to replace the total internal reflection of the pads in the existing flip-chip light-emitting structure. This reduces the high-light interference caused by total internal reflection, resulting in uniform light scattering and a softer, more natural overall light effect. Furthermore, setting the reflective layer 16 on the substrate 11 and the reflective structure 15 in the cutout portion 111 increases the bonding strength between the substrate 11 and the LED chip structure 12, and between the phosphor layer 13 and the reflective layer 16, while preventing sulfidation.

[0063] Optionally, when the reflective layer 16 surrounds the LED chip structure 12, it may be attached to the side of the LED chip structure 12 or form a preset gap. Attaching the layer allows for a tighter bond between the LED chip structure 12 and the reflective layer 16, resulting in a more stable overall structure. Setting a preset gap allows for the reflection and emission of light from the side and bottom of the light-emitting chip, thereby increasing the luminous effect.

[0064] Please see Figure 6The present invention also provides a fourth embodiment, which has a transparent layer 17 based on the third embodiment.

[0065] In this embodiment, a transparent layer 17 is provided between the fluorescent adhesive layer 13 and the white cover 14.

[0066] Understandably, the transparent layer 17 may be made of transparent silicone or silicone with a small amount of diffusing agent added, and can be used to guide light and open the angle of light. After the light emitted from the LED chip structure 12 is converted by the phosphor layer 13, the light will pass through the transparent layer 17 to expand the light emission angle, and then be reflected by the reflective layer 16 before entering the transparent layer 17 again, so as to expand the angle again in the transparent layer 17.

[0067] Understandably, the transparent layer 17 is provided so that the light emitted from the top of the LED enters the transparent layer 17 after passing through the phosphor layer 13, so that the optical angle can be better opened through the transparent layer 17. After some light is reflected by the white cover 14, the light is reflected in the horizontal direction so that it can be emitted through the transparent layer 17, thereby increasing the lateral light emission angle of the LED packaged lamp bead 1 and further opening the optical angle.

[0068] Furthermore, the thickness of the reflective layer 16 is less than or equal to the thickness of the LED chip structure 12.

[0069] Understandably, controlling the thickness of the reflective layer 16 to be less than or equal to the thickness of the LED chip structure 12 can prevent the reflective layer 16 from being too high and blocking the light emitted by the LED chip structure 12.

[0070] Understandably, the shape of the white cover 14 is not limited, as long as the white cover 14 is at least directly facing the LED chip structure 12 and reflects the light in the central area in a horizontal direction.

[0071] Please see Figures 6-9 Understandably, the side of the white cover 14 facing the transparent layer 17 is one of a planar shape, an arc shape, or a composite shape combining a planar shape and an arc shape.

[0072] Understandably, when the side of the white cover 14 facing the transparent layer 17 and the side opposite the LED chip is any of the following shapes: planar, curved, or a combination of planar and curved, at least part of the structure must be aligned with the central light-emitting area of ​​the LED chip to reduce the brightness of the central area. By using white covers 14 of various shapes corresponding to the light-emitting center of the LED chip structure 12, different usage needs can be met and more usage environments can be adapted, providing users with more choices and improving applicability.

[0073] Please see Figure 6As a first embodiment where the shape of the white cover 14 is optional, when the white cover 14 is planar, the area of ​​the reflective surface of the white cover 14 can be greater than or equal to the area of ​​the side of the transparent layer 17 facing away from the LED chip structure 12, thereby completely covering the side of the transparent layer 17 facing away from the LED chip structure 12, increasing the light reflection effect and making the light more uniform. In addition, the planar structure is also more conducive to the formation of a more regular structure of the LED packaged lamp beads 1.

[0074] Please see Figure 7 As a second alternative embodiment of the shape of the white cover 14, when the white cover 14 is planar, the area of ​​the reflective surface of the white cover 14, that is, the side of the white cover 14 facing the LED chip structure 12, can also be smaller than the area of ​​the side of the transparent layer 17 facing away from the LED chip structure 12. This allows the white cover 14 to cover only the area of ​​the central region facing the LED chip structure 12, with the aim of reducing the brightness of only the central region of the light-emitting chip, thereby reducing the production cost of the white cover 14.

[0075] Please see Figure 8 As a third alternative embodiment of the shape of the white cover 14, the white cover 14 is arc-shaped and only covers the area directly opposite the LED chip structure 12. Thus, by setting the arc shape, the brightness reflection effect of the central area of ​​the LED chip structure 12 can be ensured while achieving low cost.

[0076] Please see Figure 9 As a fourth embodiment of the optional shape of the white cover 14, the side of the white cover 14 facing the LED chip structure 12 is arc-shaped, and when the white cover 14 can completely cover the side of the transparent layer 17 away from the LED chip structure 12, the arc-shaped setting can better adapt to the changes in the light emitted by the LED chip structure 12, thereby balancing the intensity of the light emitted by the LED chip structure 12.

[0077] Please see Figure 10 As a fifth embodiment of the optional shape of the white cover 14, the white cover 14 is a composite shape of planar and arc-shaped, that is, the middle area of ​​the white cover 14 can be arc-shaped, and the surrounding area can be planar, and the composite structure can completely cover the transparent layer 17. This not only improves the light reflection effect of the middle area of ​​the white cover 14, but also the surrounding white cover 14 will reflect the light, thereby greatly opening the angle of light emission and making the light emission more uniform.

[0078] It should be noted that any of the optional shapes of the white cover 14 can be applied to any embodiment of this utility model, as long as the white cover 14 is at least partially facing the central area of ​​the LED chip to reduce the brightness of the corresponding central area of ​​the light-emitting chip.

[0079] Please see Figure 8Furthermore, the radius of curvature of the arc-shaped surface on the white cover 14 is 0.5mm-10mm; the distance D between the arc-shaped vertex 141 on the white cover 14 and the side of the transparent layer 17 near the substrate 11 (e.g., Figure 8 As shown in Figure D), the diameter is 0.2mm-2.0mm.

[0080] Understandably, when the side of the white cover 14 facing the LED chip structure 12 is curved or composite, the radius of curvature of the curved vertex 141 on this side can be controlled to remain within the range of 0.5mm-10mm. This allows control over the curvature range of the curved shape protruding into the transparent layer 17 on the white cover 14, ensuring optimal reflection of the light-emitting center of the LED chip structure 12 by the curved surface of the white cover 14, and avoiding situations where the curved surface is too curved or not curved enough, failing to reflect the light-emitting center of the light-emitting chip. Furthermore, by controlling the distance D between the curved vertex 141 on the white cover 14 and the side of the transparent layer 17 near the substrate 11 to be 0.2mm-2.0mm, the light-guiding effect of the transparent layer 17 on the light emitted from the LED chip structure 12 is ensured, so that within this distance range, the light-guiding effect of the light-transmitting layer and the light-reflecting effect of the white cover 14 layer can be balanced.

[0081] Understandably, the shape of the white cover 14 is not limited. In addition to the above shapes, it can also be other shapes. The specific shape can be set according to the actual use requirements. This implementation does not limit this, as long as the white cover 14 is at least facing the LED chip structure 12 and reflects the light in the central area in a horizontal direction.

[0082] Please see Figure 8 Furthermore, the thickness H1 of substrate 11 (e.g.) Figure 8 As shown in H1) 0.1mm-0.3mm, the thickness H2 of the reflective layer 16 (as shown in H1) Figure 8 The thickness of H2 shown is 0.01mm-0.2mm, and the thickness of the fluorescent adhesive layer 13 is H3 (as shown). Figure 7 As shown, H3) is 0.2mm-0.6mm, and the thickness H4 of the transparent layer 17 (as shown) Figure 8 The thickness of H4 shown is 0.2mm-3.0mm, and the white cap is 14H5 (as shown). Figure 8 The thickness of H5 shown is 0.02mm-0.5mm.

[0083] Understandably, by controlling the thickness range of each layer in the LED packaged lamp bead 1, the overall thickness of the LED packaged lamp bead 1 can be ensured as much as possible, thereby reducing the overall volume occupied by the LED packaged lamp bead 1 while ensuring the light emission effect. In addition, within this range of the structure of each layer, it can be ensured that while each layer in the corresponding range achieves the light emission effect, the effects of the three can be more balanced, thereby ensuring the maximum effect of opening the light emission angle.

[0084] It should be noted that when the thickness H4 of the transparent layer 17 is in the range of 0.2mm-3.0mm, the height of the transparent layer 17 is also higher, and the light emission angle that can be opened is also larger.

[0085] Understandably, the thickness of each layer and structure in the LED packaged lamp bead 1 is not limited. In addition to the above thickness range, it can also be located outside the above thickness range. The specific thickness range of each layer can be determined according to the actual use requirements. This embodiment does not limit this, as long as the thickness of each layer can achieve the corresponding effect within the corresponding thickness range.

[0086] In an optional embodiment, when the LED packaged lamp bead 1 does not have a transparent layer 17, the thickness h3 of the phosphor layer 13 (e.g., Figure 1 The thickness of h3 shown is 0.4mm-1.0mm.

[0087] Understandably, when the LED packaged lamp bead 1 does not have a transparent layer 17, the phosphor layer can be thickened to a thickness h3 of 0.4mm-1.0mm to ensure that the light emission angle is not reduced while having a transparent layer 17. In addition, replacing the transparent layer 17 with a thicker phosphor layer 13 simplifies production.

[0088] Understandably, the thickness of the fluorescent adhesive layer 13 in the LED packaged lamp bead 1 in this embodiment is not limited. The fluorescent adhesive layer 13 may also be located outside the above-mentioned thickness range. Specifically, the thickness range can be determined according to the actual usage requirements. This embodiment does not limit this, as long as the fluorescent adhesive layer 13 can achieve the corresponding effect.

[0089] Please see Figures 11-13 As one embodiment where the shape of the phosphor layer 13 is optional, the side of the phosphor layer 13 facing away from the LED chip structure 12 is planar.

[0090] Understandably, the phosphor layer 13 needs to cover the LED chip structure 12 so that the light emitted from the LED chip structure 12 will be converted by the phosphor layer 13. The phosphor layer 13 can be planar and completely cover the reflective layer 16, thereby ensuring the color conversion effect on the LED chip structure 12. Moreover, the phosphor layer 13 is set as a layered structure, which increases the bonding between the phosphor layer 13 and the reflective layer 16 and the transparent layer 17 on both sides respectively, further improving the stability of the overall structure.

[0091] Please see Figure 6 As a second embodiment where the shape of the fluorescent adhesive layer 13 is optional, the side of the fluorescent adhesive layer 13 facing away from the LED chip structure 12 is arc-shaped.

[0092] Understandably, the phosphor layer 13 can be hemispherical, so that the phosphor layer 13 only completely covers the LED chip structure 12 and does not cover the entire reflective layer 16. This achieves the color conversion effect of the LED chip structure 12 with a smaller amount of phosphor, thus saving costs.

[0093] Please see Figure 14 The present invention also provides a fifth embodiment, which adopts an LED chip structure 12 that is different from any one of the first to fourth embodiments, based on the second embodiment, while keeping the rest of the structure the same.

[0094] In this embodiment, the encapsulating adhesive layer is a transparent adhesive layer 18, and the LED chip structure includes a CSP packaged chip structure 19. A reflective layer 16 is disposed between the substrate 11 and the transparent adhesive layer 18. The reflective layer 16 surrounds the CSP packaged chip structure 19 and avoids the side of the CSP packaged chip structure 19 that faces away from the substrate 11.

[0095] Specifically, the CSP packaged chip structure 19 employs CSP (Chip Scale Package) technology to directly encapsulate the LED chip onto the substrate 11, and directly encapsulates a phosphor layer 192 onto the LED chip 191, thus converting the light emitted by the LED chip 191 into white light. A transparent adhesive layer 18 completely encapsulates the phosphor layer 192 and covers the reflective layer 16. This completes the encapsulation, forming the LED packaged lamp bead 1.

[0096] Understandably, using the CSP packaged chip structure 19 as the LED chip structure enables the overall LED packaged lamp bead 1 to achieve the corresponding opening light emission angle while forming a smaller and thinner LED packaged lamp bead 1. In addition, the LED packaged lamp bead 1 made using the CSP packaged chip structure 19 has better reliability and better light emission effect.

[0097] Please see Figure 15 and Figure 16 The present invention also provides a sixth embodiment, which, based on the first embodiment, uses a different substrate 11 than the third embodiment.

[0098] In this embodiment, a transparent layer 17 is provided on the fluorescent adhesive layer 13, and a white cover 14 is provided on the transparent layer 17. The substrate 11 is one of a flat plate support and a cup mouth support 116, thereby providing users with more choices to meet different production and preparation needs.

[0099] Optionally, in this embodiment, a flat plate bracket is used instead of the sheet bracket in the second embodiment, and a reflective layer 16 is provided on the sheet bracket. The flat plate bracket also has a hollow portion 111, which is also filled with a reflective structure 15. This can increase the opening light-emitting angle while reducing the manufacturing cost.

[0100] Optionally, in this embodiment, the cup-mouth support 116 replaces the sheet substrate 11 and the reflective layer 16 on the sheet substrate 11 in the second embodiment. The cup-mouth support 116 also has a hollow portion 111, which is also filled with reflective structures 15. The transparent layer 17 covers the cup mouth of the cup-mouth support 116. This can increase the opening angle of light emission while reducing lateral light loss and improving light efficiency through the cup-mouth support 116.

[0101] Please see Figure 17 The seventh embodiment of this utility model provides a display module 2, which includes LED packaged lamp beads 1 as described in any one of the first to sixth embodiments.

[0102] Understandably, the display module 2 in this embodiment includes the LED packaged lamp bead 1 described in any one of the first to sixth embodiments, and has the same beneficial effects as the LED packaged lamp bead 1 described in any one of the first to sixth embodiments. This embodiment will not elaborate on this.

[0103] Optionally, the display module 2 may include, but is not limited to, display structures such as light strips and light panels, and may be applied according to specific circumstances. This embodiment does not impose any restrictions on this.

[0104] Compared with the prior art, the LED packaged lamp beads and display module of this utility model have the following advantages:

[0105] 1. This utility model provides an LED packaged lamp bead, including a substrate and an LED chip structure flip-chip mounted on the substrate. An encapsulating adhesive layer is provided on one side of the substrate where the LED chip structure is mounted. A white cap is provided on the encapsulating adhesive layer at least directly above the LED chip structure. The encapsulating adhesive layer is a fluorescent adhesive layer or a transparent adhesive layer. A hollow portion is formed on the substrate, and the LED chip structure corresponds to the hollow portion. A reflective structure is filled within the hollow portion. By filling the hollow portion of the substrate with a reflective structure instead of filling the gap between the chip and the substrate with adhesive in the existing flip-chip structure, the light emitted from the bottom of the LED chip structure can be diffusely reflected through the reflective structure, thereby reducing the total internal reflection loss of the LED chip structure on the substrate, improving the lateral light emission angle, and thus increasing the overall light emission angle of the LED packaged lamp bead. Furthermore, the white cap blocks the light directly facing the center of the LED chip structure, reflecting the light horizontally. Combined with the reflective structure, this achieves the reflection of light at the top and bottom center positions of the LED chip structure, further reducing high-light interference at the center position of the LED chip structure, increasing the overall light emission angle of the LED packaged lamp bead, and making the light more uniform.

[0106] 2. The substrate of this utility model is a wafer substrate. A reflective layer is disposed between the wafer substrate and the encapsulating adhesive layer. The reflective layer surrounds the LED chip structure and avoids the side of the LED chip structure that faces away from the substrate. The thickness of the reflective layer is less than or equal to the thickness of the LED chip structure. By setting the reflective layer on the wafer substrate and cooperating with the reflective structure of the hollow part, a reflective structure can be set at the bottom and periphery of the chip. Thus, the diffuse reflection of the light emitted by the LED chip structure achieved by the reflective structure and the reflective layer replaces the total internal reflection of the pad silver plating layer of the existing flip-chip light-emitting structure, thereby reducing the high light interference caused by total internal reflection, making the light scatter uniformly, and the overall light effect is softer and more natural. In addition, the thickness of the reflective layer is less than or equal to the thickness of the LED chip structure, thereby avoiding the reflective layer being too high and affecting the side light emission angle of the light-emitting chip.

[0107] 3. The encapsulating adhesive layer of this utility model is a fluorescent adhesive layer, and a transparent layer is provided between the fluorescent adhesive layer and the white cover. By providing a transparent layer, the light emitted from the top of the LED chip structure enters the transparent layer after passing through the fluorescent adhesive layer, so as to better open the optical angle through the transparent layer. After some light is reflected by the white cover, the light is reflected in the horizontal direction so that it is emitted through the transparent layer, further opening the optical angle.

[0108] 4. The side of the white cover facing the transparent layer of this utility model is one of a planar shape, an arc shape, or a composite shape combining a planar and an arc shape. By using white covers with various shapes corresponding to the light-emitting centers of the LED chip structure, different usage needs can be met and more usage environments can be adapted, providing users with more choices and improving applicability.

[0109] 5. The radius of curvature of the arc-shaped surface on the white cover of this utility model is 0.5mm-10mm; the distance between the arc-shaped vertex on the white cover and the side of the transparent layer near the substrate is 0.2mm-2.0mm. By controlling the range of the radius of curvature of the arc-shaped surface on the white cover, the curvature of the arc protruding into the transparent layer on the white cover can be controlled, thereby ensuring the best reflection effect of the arc surface of the white cover on the light-emitting center of the LED chip structure, avoiding the situation where the arc surface is too curved or not curved enough, and cannot achieve the reflection of the light-emitting center of the light-emitting chip; and by controlling the range of the distance between the arc-shaped vertex on the white cover and the side of the transparent layer near the substrate, the light-guiding effect of the transparent layer on the LED chip structure is ensured, so that the light-guiding effect of the light-transmitting layer and the light-reflecting effect of the white cover layer can be balanced within this distance range.

[0110] 6. The thickness of the fluorescent adhesive layer in this invention is 0.4mm-1.0mm. By increasing the thickness of the fluorescent adhesive layer, the emission distance of the light can be increased, which is more conducive to opening the angle of the light.

[0111] 7. The side of the fluorescent adhesive layer facing away from the LED chip structure in this invention is either planar or arc-shaped. An arc-shaped fluorescent adhesive layer can improve light extraction efficiency, enhance color uniformity, expand the viewing angle, and reduce light loss; a planar fluorescent adhesive layer is simple to manufacture and has low cost; and it provides more options for fluorescent adhesive layers to meet different manufacturing and application requirements.

[0112] 8. This utility model also provides a display module, which has the same beneficial effects as the LED packaged lamp beads mentioned above, and will not be described in detail here.

[0113] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An LED packaged lamp bead, characterized in that: The device includes a substrate and an LED chip structure flip-chip mounted on the substrate. An encapsulating adhesive layer is provided on one side of the substrate on which the LED chip structure is disposed. A white cap is provided on the encapsulating adhesive layer at least at a position directly above the LED chip structure. The encapsulating adhesive layer is a fluorescent adhesive layer or a transparent adhesive layer. The substrate has a hollowed-out portion, the LED chip structure corresponds to the hollowed-out portion, and the hollowed-out portion is filled with a reflective structure.

2. The LED packaged lamp bead as described in claim 1, characterized in that: The substrate is a sheet substrate, and a reflective layer is disposed between the sheet substrate and the encapsulating adhesive layer. The reflective layer surrounds the LED chip structure and avoids the side of the LED chip structure that is away from the substrate. The thickness of the reflective layer is less than or equal to the thickness of the LED chip structure.

3. The LED packaged lamp bead as described in claim 2, characterized in that: The encapsulating adhesive layer is the fluorescent adhesive layer, and a transparent layer is disposed between the fluorescent adhesive layer and the white cover.

4. The LED packaged lamp bead as described in claim 3, characterized in that: The side of the white cover facing the transparent layer is one of a planar shape, an arc shape, or a composite shape combining a planar and an arc shape.

5. The LED packaged lamp bead as described in claim 4, characterized in that: The radius of curvature of the arc-shaped surface on the white cover is 0.5mm-10mm; the distance between the arc vertex on the white cover and the side of the transparent layer near the substrate is 0.2mm-2.0mm; the thickness of the substrate is 0.1mm-0.3mm, the thickness of the reflective layer is 0.01mm-0.2mm, the thickness of the fluorescent adhesive layer is 0.2mm-0.6mm, the thickness of the transparent layer is 0.2mm-3.0mm, and the thickness of the white cover is 0.02mm-0.5mm.

6. The LED packaged lamp bead as described in claim 2, characterized in that: The encapsulating adhesive layer is the transparent adhesive layer, and the LED chip structure includes a CSP encapsulated chip structure.

7. The LED packaged lamp bead as described in claim 1, characterized in that: The thickness of the fluorescent adhesive layer is 0.4mm-1.0mm.

8. The LED packaged lamp bead as described in claim 1, characterized in that: The side of the fluorescent adhesive layer facing away from the LED chip structure is planar or curved.

9. The LED packaged lamp bead as described in claim 1, characterized in that: The substrate is one of a flat plate support or a cup-shaped support.

10. A display module, characterized in that: Includes LED packaged lamp beads as described in any one of claims 1-9.

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