An LED encapsulation device

Abstract

The utility model belongs to the technical field of semiconductor accessories, and we propose a kind of LED packaging device, including bottom plate and installation shell, installation shell is set in the top of bottom plate, installation shell is formed by the splicing of protective cover and bottom cover, installation groove for placing LED chip is opened in protective cover, the position of bottom cover close to protective cover is provided with supporting plate, the bottom of bottom cover is provided with support layer, support layer is the openwork diamond structure, and support layer and supporting plate between are filled with heat-conducting adhesive;Efficient heat dissipation, promote device life: adopt supporting plate→heat conductor+heat-conducting adhesive→openwork support layer multistage heat radiation path: supporting plate directly absorbs chip heat, heat conductor and heat-conducting adhesive enhance heat transfer efficiency (avoid heat accumulation), ensure that heat dissipation component is closely contacted, reduce thermal resistance, improve heat dissipation efficiency.Openwork diamond structure of support layer increases the contact area with air, accelerates air convection heat dissipation, significantly reduces chip junction temperature, prolongs service life.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor component technology, specifically to an LED packaging device. Background Technology

[0002] LEDs (light-emitting diodes), as a high-efficiency, energy-saving, and long-life solid-state light source, have been widely used in lighting, display, and communication fields. The design of LED packaging devices directly affects the luminous efficiency, heat dissipation performance, and lifespan of LED chips.

[0003] Existing LED packaging devices have the following shortcomings: 1) Poor heat dissipation performance: LED chips generate a lot of heat when they are working. If the heat cannot be dissipated in time, the junction temperature of the chip will rise, reducing the luminous efficiency or even burning out the chip. In traditional packaging structures, the heat dissipation path is single, and the thermal conductive material is not in close contact with the heat dissipation component, resulting in low heat transfer efficiency.

[0004] 2) Insufficient structural stability: The splicing of the package shell is mostly done by snap-fit ​​or glue. After long-term use, it is easy to loosen due to vibration and temperature changes, which may cause chip displacement or external moisture and dust to enter, affecting the reliability of the device. Utility Model Content

[0005] The purpose of this invention is to provide an LED packaging device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an LED packaging device, including a base plate and a mounting shell, wherein the mounting shell is disposed on the top of the base plate and is composed of a protective cover and a bottom cover. The protective cover has an installation groove for placing LED chips. A support plate is disposed on the bottom cover near the protective cover. A support layer is disposed at the bottom of the bottom cover. The support layer has a hollow diamond structure, and thermally conductive adhesive is filled between the support layer and the support plate.

[0007] Preferably, the base plate has mounting feet at its four corners, and bolts are installed on the mounting feet; a glass lens is installed inside the protective cover.

[0008] Preferably, the support plate lifts the LED chip upwards, and the support plate is a heat-absorbing plate; one end of the heat conductor abuts against the support plate, while the other end is inserted downwards into the support layer.

[0009] Preferably, the heat conductor transfers heat to the support layer through thermal conduction, and then dissipates it through the hollow structure of the support layer; the heat conductor is evenly distributed between the support layer and the support plate.

[0010] Preferably, a nut is embedded in the edge of the protective cover, and screws are installed from bottom to top on the edge of the bottom cover, with the screws screwed upward into the nut. The splicing and fixing of the housing is completed by the mating of the screws and the nut.

[0011] Compared with the prior art, the beneficial effects of this utility model are: Efficient heat dissipation and improved device lifespan: A multi-stage heat dissipation path is employed, consisting of a support plate, a thermal conductor and thermal adhesive, and a perforated support layer. The support plate directly absorbs heat from the chip, while the thermal conductor and thermal adhesive enhance heat transfer efficiency (preventing heat buildup). This ensures tight contact between heat dissipation components while reducing thermal resistance and improving heat dissipation efficiency. The perforated diamond structure of the support layer increases the contact area with air, accelerating air convection and significantly reducing chip junction temperature, thus extending device lifespan.

[0012] The modular structure facilitates assembly and maintenance: the mounting shell is fixed by screw-nut mating, which provides higher connection strength compared to clips or glue, and can resist external interference such as vibration and temperature changes, preventing the encapsulation shell from loosening; the encapsulation shell is spliced ​​using a screw-nut detachable structure, and if internal components (such as chips or lenses) need to be replaced or repaired, they can be quickly disassembled by removing the screws, reducing maintenance costs. Attached Figure Description

[0013] Figure 1 This is the front view of the present utility model; Figure 2 This is a top view of the present invention; Figure 3 This is a cross-sectional view of the present invention.

[0014] In the diagram: 1. Base plate, 2. Protective cover, 3. Bottom cover, 4. Mounting feet, 5. Nuts, 6. Mounting groove, 7. Glass lens, 8. Support plate, 9. Support layer, 10. Heat conductor, 11. Screws. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0017] Example: Please see Figure 1-3 The present invention provides the following technical solution: An LED packaging device includes a base plate 1 and a mounting shell; the mounting shell is disposed on the top of the base plate 1, and mounting feet 4 are provided at the four corners of the base plate 1, with bolts provided on the mounting feet 4; The mounting housing is composed of a protective cover 2 and a bottom cover 3. The protective cover 2 has a mounting slot 6 for placing LED chips and a glass lens 7 inside. A support plate 8 is provided at the position of the bottom cover 3 near the protective cover 2. The support plate 8 supports the LED chip upward and is a heat-absorbing plate. The bottom of the base cover 3 is provided with a support layer 9, which is a hollow diamond structure, and thermally conductive adhesive is filled between the support layer 9 and the support plate 8. A heat conductor 10 is evenly distributed between the support layer 9 and the support plate 8. One end of the heat conductor 10 abuts against the support plate 8, while the other end is inserted downward into the support layer 9. The heat conductor 10 transfers heat to the support layer 9 through heat conduction, and then dissipates it through the hollow structure of the support layer 9. A nut 5 is embedded in the edge of the protective cover 2, and a screw 11 is installed from bottom to top on the edge of the bottom cover 3. The screw 11 is screwed upward into the nut 5, and the splicing and fixing of the housing is completed by the mating of the screw 11 and the nut 5.

[0018] Working principle: The mounting housing consists of two parts: a protective cover 2 and a bottom cover 3. The edge of the protective cover 2 is inlaid with a nut 5, and the corresponding position of the edge of the bottom cover 3 is fitted with screws 11 from bottom to top. When the screws 11 are screwed upward into the nut 5, the protective cover 2 and the bottom cover 3 fit tightly together to form a closed mounting housing, providing a stable mounting space for the internal LED chip. The entire device is fixed to the external equipment by the mounting feet 4 at the four corners of the base plate 1 and bolts, ensuring the stability of the overall structure; An installation slot 6 is provided inside the protective cover 2 for placing LED chips. The glass lens 7 inside can directly cover the LED chips, which can prevent dust and moisture. At the same time, the glass lens 7 can optimize the refraction and propagation of LED light and improve the lighting effect. The support plate 8 on the bottom cover 3 lifts the LED chip upwards and cooperates with the mounting slot 6 to fix the LED chip inside the mounting shell, preventing the LED chip from being damaged by shaking or vibration. LED chips generate a lot of heat when they are working. Poor heat dissipation will affect lifespan and performance. The heat of the LED chip is directly transferred to the support plate 8 that is in contact with it. The support plate is a heat-absorbing plate with high heat absorption properties, which can quickly absorb the heat of the LED chip. The heat from the support plate 8 is transferred to the support layer 9 through two paths: one is through the thermally conductive adhesive filled between the two, which enhances the tightness of the contact and improves the heat conduction efficiency; the other is through the uniformly distributed heat conductor 10, one end of which abuts against the support plate and the other end is inserted into the support layer 9, directly conducting the heat to the support layer 9. The support layer 9 has a hollowed-out rhomboid structure. On the one hand, the rhomboid structure itself has high strength and can support the weight of the support plate 8 and the LED chip. On the other hand, the hollow design increases the contact area with the air and does not hinder air circulation. The heat transferred from the support plate 8 is quickly dissipated to the outside air through the hollow structure of the support layer 9, completing the heat dissipation cycle.

[0019] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this utility model, and no reference numerals in the claims should be considered as limiting the scope of the claims.

[0020] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An LED packaging device, comprising a base plate (1) and a mounting shell, characterized in that: The mounting shell is set on the top of the base plate (1). The mounting shell is made up of a protective cover (2) and a bottom cover (3). The protective cover (2) has a mounting slot (6) for placing LED chips. The bottom cover (3) has a support plate (8) near the protective cover (2). The bottom of the bottom cover (3) has a support layer (9). The support layer (9) is a hollow diamond structure, and thermally conductive adhesive is filled between the support layer (9) and the support plate (8).

2. The LED packaging device according to claim 1, characterized in that: Mounting feet (4) are provided at the four corners of the base plate (1), and bolts are provided on the mounting feet (4); a glass lens (7) is provided inside the protective cover (2).

3. The LED packaging device according to claim 1, characterized in that: The support plate (8) lifts the LED chip upwards, and the support plate (8) is a heat-absorbing plate; one end of the heat conductor (10) abuts against the support plate (8), while the other end is inserted downwards into the support layer (9).

4. An LED packaging device according to claim 3, characterized in that: The heat conductor (10) transfers heat to the support layer (9) through heat conduction, and then dissipates it through the hollow structure of the support layer (9); the heat conductor (10) is evenly distributed between the support layer (9) and the support plate (8).

5. An LED packaging device according to claim 1, characterized in that: The edge of the protective cover (2) is fitted with a nut (5), and the edge of the bottom cover (3) is fitted with screws (11) from bottom to top. The screws (11) are screwed upward into the nut (5). The installation shell is spliced ​​and fixed by the connection between the screws (11) and the nut (5).

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