A light-emitting chip package module
Patent Information
- Application Number
- CN202521244694.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-17
- Publication Date
- 2026-08-21
- Estimated Expiration
- 2035-06-17
AI Technical Summary
[0005]本申请的目的在于提出一种聚光型发光芯片封装模组，以解决现有技术中发光芯片封装模组的光线发散的技术问题
[0020]The beneficial effects of the focusing light-emitting chip packaging module provided in this application are at least as follows: Through the collimation surface on the reflective layer, the diverging rays in the light beam emitted by the light-emitting chip tend to be parallel. Therefore, the light beam generated by the aforementioned light-emitting chip packaging module is narrower, and the overlap of rays is reduced. A narrower light beam is beneficial for focusing light to a specific point to increase the brightness at that point, while the reduced overlap ensures that when the light beam acts on a surface, the brightness of the beam on that surface is enhanced, thereby improving the optical performance of the light-emitting chip packaging module.
Smart Images
Figure CN224670224U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of light-emitting chip technology, and more specifically, to a light-concentrating light-emitting chip packaging module. Background Technology
[0002] A light-emitting diode (LED) is a semiconductor electronic component that emits light, typically used as a light-emitting chip. Since the successful development of gallium nitride (GaN)-based LEDs by Japanese scientists in the 1990s, LED manufacturing technology has continuously improved, resulting in increased brightness and a wider range of applications. As a highly efficient, environmentally friendly, and green next-generation solid-state light source, LEDs offer advantages such as low voltage, low power consumption, small size, light weight, long lifespan, and high reliability. To fabricate LED backlights, LED chips need to be packaged to form LED packaging modules.
[0003] In some scenarios, it is necessary for the light-emitting chips in LED packaging modules to emit relatively focused light. However, the light emitted by the light-emitting chips in conventional LED packaging modules is diffuse and cannot meet the actual requirements, resulting in poor optical performance of the light-emitting chip packaging module.
[0004] Therefore, existing technologies still need improvement and development. Utility Model Content
[0005] The purpose of this application is to propose a light-concentrating light-emitting chip packaging module to solve the technical problem of light divergence in existing light-emitting chip packaging modules.
[0006] To achieve the above objectives, the technical solution adopted in this application is: to provide a light-concentrating light-emitting chip packaging module, comprising:
[0007] A substrate, on which a reflective layer is provided, the reflective layer forming an encapsulation groove on the substrate;
[0008] A light-emitting chip is disposed in the encapsulation groove, with the light-emitting surface of the light-emitting chip facing the opening of the encapsulation groove, and the reflective layer is disposed around the circumference of the light-emitting chip;
[0009] An encapsulation layer fills the encapsulation groove and encapsulates the light-emitting chip;
[0010] The surface of the reflective layer facing the light-emitting chip is a collimating surface, which is configured to reflect and collimate the light beam emitted from the side of the light-emitting chip.
[0011] Furthermore, the collimation surface has a plurality of concentrically arranged Fresnel structures along the circumferential direction, the plurality of Fresnel structures being spaced apart in the height direction of the encapsulation groove, each Fresnel structure having a first face facing the groove opening and a second face facing away from the groove opening, the first face being configured to follow a concave hemispherical profile, and both the first face and the second face being provided with a reflective film.
[0012] Furthermore, the second surface is configured as a plane or follows a convex hemispherical profile.
[0013] In some embodiments, the optical axes of the light-emitting chip and the collimation surface are located on the same straight line.
[0014] Furthermore, a reflective layer is provided on the substrate at the bottom of the encapsulation groove, the light-emitting chip is disposed on the reflective layer, and the reflective layer is configured to reflect the light beam emitted by the light-emitting chip toward the bottom of the encapsulation groove.
[0015] In some embodiments, the light-emitting chip is configured such that the cross-section of the light beam it produces is circular, and the light intensity on the cross-section decreases radially from the center of the circle.
[0016] Furthermore, it also includes a wire that electrically connects the light-emitting chip and the substrate, and the wire is encapsulated within the encapsulation layer.
[0017] In some embodiments, the wire includes a positive conductive wire and a negative conductive wire, and the bottom of the substrate is provided with a first conductive portion and a second conductive portion. One end of the negative conductive wire is connected to the negative electrode of the light-emitting chip and the other end is connected to the second conductive portion. One end of the positive conductive wire is connected to the positive electrode of the light-emitting chip and the other end is connected to the first conductive portion.
[0018] Furthermore, the encapsulation layer includes a light conversion layer, which comprises any one of a red light conversion layer, a green light conversion layer, and a violet light conversion layer, and is used to excite light of a specific wavelength in conjunction with the light beam of the light-emitting chip.
[0019] In some embodiments, the light-emitting chip includes a blue LED chip, and the light conversion layer is filled with phosphor particles or quantum dot particles.
[0020] The beneficial effects of the focusing light-emitting chip packaging module provided in this application are at least as follows: Through the collimation surface on the reflective layer, the diverging rays in the light beam emitted by the light-emitting chip tend to be parallel. Therefore, the light beam generated by the aforementioned light-emitting chip packaging module is narrower, and the overlap of rays is reduced. A narrower light beam is beneficial for focusing light to a specific point to increase the brightness at that point, while the reduced overlap ensures that when the light beam acts on a surface, the brightness of the beam on that surface is enhanced, thereby improving the optical performance of the light-emitting chip packaging module. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the structure of the light-concentrating light-emitting chip packaging module provided in the embodiments of this application;
[0023] Figure 2 for Figure 1 A schematic diagram of the structure of a focused light-emitting chip packaging module without a packaging layer;
[0024] Figure 3 This is a schematic diagram of the light beam generated by the encapsulation module in the prior art;
[0025] Figure 4 This is a schematic diagram of the light beam generated by the light-concentrating light-emitting chip packaging module provided in the embodiments of this application.
[0026] The following are the labeling elements in the figure:
[0027] 1. Substrate; 11. First conductive portion; 12. Second conductive portion;
[0028] 2. Reflective layer; 21. Encapsulation slot; 22. Slot opening; 23. Collimation surface; 24. First surface; 25. Second surface;
[0029] 3. Light-emitting chip;
[0030] 4. Encapsulation layer;
[0031] 5. Reflective layer;
[0032] 6. Wire; 61. Positive conductive wire; 62. Negative conductive wire;
[0033] 7. Light conversion layer. Detailed Implementation
[0034] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0035] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.
[0036] It should be noted that in the existing technology, a planar reflective layer is usually set around the light-emitting chip. The light beam emitted by the light-emitting chip in all directions is reflected by the reflective layer and then emitted from the front of the light-emitting chip to achieve the light-focusing effect.
[0037] However, see Figure 3 After the light beam is reflected by the reflective layer of the plane, it will scatter in all directions. The beams overlap with each other, resulting in the light beam emitted from the light-emitting surface of the packaging module being insufficiently focused, which reduces the optical performance of the packaging module.
[0038] The following description, in conjunction with the accompanying drawings, describes a concentrated light-emitting chip packaging module according to an embodiment of this application.
[0039] Please see Figure 1 and Figure 2 , Figure 1 and Figure 2 The diagram shows the structure of the light-emitting chip packaging module of this application, including a substrate 1, a light-emitting chip 3 and a packaging layer 4. It can be understood that a light-emitting circuit is provided on the substrate 1, the light-emitting chip 3 is disposed on the substrate 1 and connected to the light-emitting circuit, and the packaging layer 4 is used to encapsulate the light-emitting chip 3 on the substrate 1.
[0040] Specifically, a reflective layer 2 is provided on the substrate 1, and the reflective layer 2 surrounds the substrate 1 to form an encapsulation groove 21. A light-emitting chip 3 is disposed in the encapsulation groove 21, with the light-emitting surface of the light-emitting chip 3 facing the groove opening 22 of the encapsulation groove 21, and the reflective layer 2 is disposed around the circumference of the light-emitting chip 3. An encapsulation layer 4 fills the encapsulation groove 21 and encapsulates the light-emitting chip 3.
[0041] Among them, the surface of the reflective layer 2 facing the light-emitting chip 3 is a collimation surface 23, which is configured to reflect and collimate the light beam emitted from the side of the light-emitting chip 3.
[0042] Here, collimating surface 23 should be understood as any reflecting surface capable of collimating a beam of light.
[0043] Furthermore, the reflected and collimated beam is a collimated beam, and a collimated beam should be understood as one in which the diverging rays in the beam tend to be parallel, that is, the divergence angle of the beam is narrowed and the rays in the beam do not overlap.
[0044] After the light-emitting circuit drives the light-emitting chip 3, the light-emitting chip 3 emits light beams in all directions. The light beam from the front of the light-emitting chip 3 exits directly from the slot 22 of the encapsulation groove 21; this portion of the beam is already close to parallel light. The light beams emitted from the light-emitting chip 3 in all directions strike the collimating surface 23 of the reflective layer 2. This portion of the beam is reflected and collimated by the collimating surface 23 to form a collimated beam. In other words, the divergence angle of this portion of the beam narrows and approaches parallel light. (See reference...) Figure 4 When the collimated beam is emitted from the slot 22 of the packaging slot 21, the divergence angle of the collimated beam will be relatively reduced, and the beam will tend to be parallel, making the beam emitted from the packaging slot 21 more focused, thereby improving the optical performance of the packaging module.
[0045] By using the collimation surface 23 on the reflective layer 2, the diverging rays in the light beam emitted by the light-emitting chip 3 can be made to tend to be parallel. Therefore, the light beam generated by the aforementioned light-emitting chip 3 packaging module is narrower and the overlap of rays is reduced. The narrower light beam is beneficial for focusing light to a certain point to increase the brightness at that point, while the reduced overlap of rays ensures that when the light beam acts on a surface, the brightness of the light beam on the surface is enhanced, thereby improving the optical performance of the light-emitting chip 3 packaging module.
[0046] In some implementations, see Figure 1 and Figure 2 The collimation surface 23 has a plurality of concentric Fresnel structures along the circumferential direction. The plurality of Fresnel structures are spaced apart in the height direction of the encapsulation groove 21. Each Fresnel structure has a first surface 24 facing the groove 22 and a second surface 25 facing away from the groove 22. The first surface 24 is configured to follow a concave hemispherical profile. Both the first surface 24 and the second surface 25 are provided with a reflective film.
[0047] It should be noted that, in this embodiment, the Fresnel structure on the collimating plane 23 refers to an optical structure designed based on the Fresnel principle, specifically a Fresnel mirror.
[0048] A Fresnel reflector is a special type of reflector that uses the Fresnel principle to optimize the reflection and focusing of light.
[0049] Unlike traditional parabolic mirrors, the Fresnel mirror on the collimating surface 23 includes a first surface 24 and a second surface 25. Multiple first surfaces 24 are concentric annular reflective surfaces to achieve light focusing. These annular reflective surfaces are designed to redirect incident light rays, forming a parallel beam. This structure not only reduces the thickness and weight of the mirror but also lowers manufacturing costs to some extent while maintaining high optical efficiency.
[0050] In some devices that require highly concentrated light sources, such as health monitoring devices, the collimating surface 23 with a Fresnel structure can be used to improve the distribution of light, provide a brighter and more concentrated lighting effect, and significantly increase energy conversion efficiency.
[0051] Compared to the traditional reflective layer 2, the reflective layer 2 with a Fresnel structure is lighter and thinner, which can achieve lightweighting and improve the compactness of the packaging module.
[0052] Furthermore, the second surface 25 is configured to follow a convex hemispherical profile.
[0053] Furthermore, the second surface 25 can also be configured as a plane.
[0054] In some embodiments, the optical axes of the light-emitting chip 3 and the collimating surface 23 are located on the same straight line. After passing through the collimating surface 23, the light emitted by the light-emitting chip 3 can propagate along a straight line, forming a parallel beam, which can improve the accuracy and directionality of the optical system.
[0055] In some implementations, see Figure 1 and Figure 2 The substrate 1 is also provided with a reflective layer 5 located at the bottom of the encapsulation groove 21, and the light-emitting chip 3 is disposed on the reflective layer 5. The reflective layer 5 is configured to reflect the light beam emitted from the light-emitting chip 3 toward the bottom of the encapsulation groove 21.
[0056] The reflective layer 5 can reflect light, so that the light passes through the slot 22 of the encapsulation slot 21 as much as possible, reducing light loss and further improving light output efficiency. In specific implementation, the reflective layer 5 can be a layer of materials such as silver, platinum, or copper.
[0057] In some embodiments, the light-emitting chip 3 is configured such that the cross-section of the light beam it produces is circular, and the light intensity on the cross-section decreases radially from the center of the circle.
[0058] Furthermore, the packaging module also includes a wire 6, which electrically connects the light-emitting chip 3 and the substrate 1, and the wire 6 is encapsulated within the packaging layer 4.
[0059] The substrate 1 serves as the fundamental support structure for the entire chip-level light source. It is made of materials with good electrical conductivity and heat dissipation properties, such as ceramics, metals, or other composite materials. The substrate 1 houses the light-emitting circuitry, providing mechanical support and a heat conduction path for the light-emitting chip 3. This helps dissipate the heat generated by the light-emitting chip 3 during operation, ensuring the stability and long-term reliability of the chip-level light source.
[0060] The light-emitting circuit disposed on the substrate 1 supplies power to the light-emitting chip 3 and controls its working state. The light-emitting circuit includes a driving circuit, a control circuit, etc., and adjusts the brightness, color and on / off state of the light-emitting chip 3 through specific signals to meet different lighting or display needs.
[0061] The encapsulation layer 4 surrounds the light-emitting chip 3, which can protect the light-emitting chip 3 from environmental factors, while providing mechanical strength to prevent physical damage to the light-emitting chip 3.
[0062] Further, see Figure 1 and Figure 2 The conductor 6 includes a positive conductive wire 61 and a negative conductive wire 62. The bottom of the substrate is provided with a first conductive part 11 and a second conductive part 12. One end of the negative conductive wire 62 is connected to the negative electrode of the light-emitting chip 3 and the other end is connected to the second conductive part 12. One end of the positive conductive wire 61 is connected to the positive electrode of the light-emitting chip 3 and the other end is connected to the first conductive part 11.
[0063] In some implementations, see Figure 1 and Figure 2 The encapsulation layer 4 contains a light conversion layer 7, which includes any one of a red light conversion layer, a green light conversion layer, and a violet light conversion layer, and is used to excite light of a specific wavelength in conjunction with the light beam of the light-emitting chip 3.
[0064] Furthermore, the light-emitting chip 3 includes an LED blue light chip, and the light conversion layer 7 is filled with phosphor particles or quantum dot particles.
[0065] The packaging module of this embodiment is suitable for miniature health detection devices. These devices detect light by passing it through the skin and irradiating it with light of a specific wavelength. By analyzing the changes in reflected or transmitted light, they can infer health indicators such as blood components and hemodynamic parameters.
[0066] Specifically, the chip-level light-emitting chip 3 serves as the light source for the miniature health monitoring device, emitting detection light of a specific wavelength to penetrate or irradiate human tissue (such as skin). The light-emitting chip 3 is a semiconductor device that converts the received light signal into an electrical signal. In the miniature health monitoring device, the light-emitting chip 3 captures the light signal transmitted or reflected back after passing through human tissue; this light signal carries information about physiological parameters.
[0067] Furthermore, different wavelengths of light are suitable for detecting different parameter information.
[0068] For example, when the light conversion layer 7 is a red light conversion layer, red phosphor particles or red quantum dot particles are disposed within the red light conversion layer. Red light wavelengths (e.g., 680 nm) are sensitive to the detection of blood oxygen saturation. The absorption rate of red light by hemoglobin when bound to oxygen differs from that in the unbound state. By comparing the absorption difference between red and infrared light, blood oxygen saturation can be calculated. When the light-emitting chip 3 is a red light chip, the miniature health monitoring device is suitable for monitoring blood flow in deep tissues, such as monitoring physiological signals at the wrist in a wearable device.
[0069] When the light conversion layer 7 is a green light conversion layer, it contains green phosphor particles or green quantum dot particles. Green light wavelengths (e.g., 525nm) are effective for monitoring heart rate. The absorption rate of hemoglobin in the green light band varies significantly with blood volume, resulting in clearer photoplethysmography (PPG) signals. When the light-emitting chip 3 is a green light chip, the miniature health monitoring device is suitable for heart rate monitoring.
[0070] By utilizing the physiological properties of light at different wavelengths, miniature health monitoring devices can simultaneously or alternately measure multiple physiological parameters, such as heart rate, blood oxygen saturation, blood pressure trend, and heart rate variability, providing more comprehensive health monitoring.
[0071] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A light-concentrating chip packaging module, characterized in that, include: A substrate, on which a reflective layer is provided, the reflective layer forming an encapsulation groove on the substrate; A light-emitting chip is disposed in the encapsulation groove, with the light-emitting surface of the light-emitting chip facing the opening of the encapsulation groove, and the reflective layer is disposed around the circumference of the light-emitting chip; An encapsulation layer fills the encapsulation groove and encapsulates the light-emitting chip; The surface of the reflective layer facing the light-emitting chip is a collimating surface, which is configured to reflect and collimate the light beam emitted from the side of the light-emitting chip.
2. The focusing light-emitting chip packaging module according to claim 1, characterized in that, The collimation surface has a plurality of concentric Fresnel structures along the circumferential direction. The plurality of Fresnel structures are spaced apart in the height direction of the encapsulation groove. Each Fresnel structure has a first face facing the groove opening and a second face facing away from the groove opening. The first face is configured to follow a concave hemispherical profile. Both the first face and the second face are provided with a reflective film.
3. The light-concentrating light-emitting chip packaging module according to claim 2, characterized in that, The second surface is configured as a plane or follows a convex hemispherical profile.
4. The light-concentrating light-emitting chip packaging module according to claim 3, characterized in that, The optical axes of the light-emitting chip and the collimation surface are on the same straight line.
5. The focused light-emitting chip packaging module according to any one of claims 1-4, characterized in that, The substrate is further provided with a reflective layer located at the bottom of the encapsulation groove, and the light-emitting chip is disposed on the reflective layer. The reflective layer is configured to reflect the light beam emitted by the light-emitting chip toward the bottom of the encapsulation groove.
6. The focusing light-emitting chip packaging module according to claim 5, characterized in that, The light-emitting chip is configured such that the cross-section of the light beam it generates is circular, and the light intensity on the cross-section decreases radially from the center of the circle.
7. The light-emitting chip packaging module according to claim 5, characterized in that, It also includes wires that electrically connect the light-emitting chip and the substrate, and the wires are encapsulated within the encapsulation layer.
8. The light-concentrating light-emitting chip packaging module according to claim 7, characterized in that, The conductor includes a positive conductive wire and a negative conductive wire. The bottom of the substrate is provided with a first conductive part and a second conductive part. One end of the negative conductive wire is connected to the negative electrode of the light-emitting chip and the other end is connected to the second conductive part. One end of the positive conductive wire is connected to the positive electrode of the light-emitting chip and the other end is connected to the first conductive part.
9. The light-emitting chip packaging module according to claim 5, characterized in that, The encapsulation layer contains a light conversion layer, which includes any one of a red light conversion layer, a green light conversion layer, and a violet light conversion layer, and is used to excite light of a specific wavelength in conjunction with the light beam of the light-emitting chip.
10. The light-concentrating light-emitting chip packaging module according to claim 9, characterized in that, The light-emitting chip includes a blue LED chip, and the light conversion layer is filled with phosphor particles or quantum dot particles.