Lower tooling module and mass transfer apparatus

Abstract

The utility model discloses a kind of lower jig module and mass transfer equipment, it is related to mass transfer technical field, applied to mass transfer equipment, the crystal grain of upper substrate is transferred to lower substrate, the lower jig module includes moving device, three leveling components and placement jig, the moving device is equipped with mounting table;Three The leveling component is connected in the mounting table;The placement jig is connected in three The leveling component, the placement jig is equipped with placement surface, and the placement surface is used to fix the lower substrate;Wherein, three The leveling component adjusts the levelness of the lower substrate, to make the lower substrate and the upper substrate relatively parallel.The technical scheme provided by the utility model aims at reducing the production cost of lower jig module for carrying lower substrate, while ensuring the leveling effect of lower substrate.

Description

Technical Field

[0001] This utility model relates to the field of mass transfer technology, and in particular to a lower fixture module and a mass transfer device. Background Technology

[0002] Mass transfer technology plays a crucial role in the manufacturing process of LED devices. Micro-LEDs are typically manufactured on semiconductor substrates and require sophisticated processes to transfer them to a driver backplane. The number of pixels transferred in Micro-LED display technology is enormous, and mass transfer is commonly used. During mass transfer, an upper substrate is typically supported by an upper stage, a lower substrate by a lower stage, and a transfer device transfers the chips from the upper substrate to the lower substrate. Before supporting the chips on the lower substrate, it needs to be leveled to ensure that the position of the chips from the upper substrate does not shift during transfer. Related technologies often utilize a hexapod platform to support the lower substrate and level its position; however, using a hexapod platform is costly and not conducive to mass production. Utility Model Content

[0003] The main purpose of this invention is to propose a lower jig module and a mass transfer device, which aims to reduce the production cost of the lower jig module used to support the lower substrate, while ensuring the leveling effect of the lower substrate.

[0004] To achieve the above objectives, this utility model proposes a lower fixture module applied to a mass transfer device, wherein the mass transfer device transfers the die from an upper substrate to a lower substrate, and the lower fixture module includes:

[0005] The mobile device is equipped with a mounting platform;

[0006] Three leveling components, the three leveling components being connected to the mounting platform; and

[0007] A placement fixture is provided, which is connected to the three leveling components. The placement fixture has a placement surface for fixing the lower substrate.

[0008] The three leveling components adjust the horizontality of the lower substrate so that the lower substrate and the upper substrate are relatively parallel.

[0009] In one embodiment, the placement fixture has a first side, a second side, a third side, and a fourth side connected in sequence. The leveling component includes three components. Two of the leveling components are respectively disposed at the connection points of the first side and the second side and the connection points of the first side and the fourth side, and the other leveling component is disposed at the middle position of the third side.

[0010] In one embodiment, the leveling assembly includes a mounting bracket and a leveling electric cylinder. The mounting bracket has an installation space, and the side of the mounting bracket facing away from the installation space is hinged to the placement fixture. The leveling electric cylinder is located in the installation space and connected to the mounting bracket. The output end of the leveling electric cylinder is hinged to the mounting platform.

[0011] In one embodiment, the leveling assembly further includes a first joint bearing and a second joint bearing. The first joint bearing is disposed between the mounting bracket and the placement fixture, and the second joint bearing is disposed between the output end of the leveling electric cylinder and the mounting platform, so that the mounting bracket and the placement fixture are hinged, and the output end of the leveling electric cylinder is hinged to the mounting platform.

[0012] In one embodiment, the first joint bearing and the second joint bearing are arranged colinearly with the leveling electric cylinder.

[0013] In one embodiment, the mounting bracket includes a top wall and a first side wall and a second side wall connected to both sides of the top wall. The first side wall, the second side wall, and the top wall enclose the mounting space, and the side of the top wall facing away from the mounting space is connected to the placement fixture.

[0014] In one embodiment, the moving device includes a three-axis drive device and a turntable device, the turntable device being connected to the output end of the three-axis drive device, and the output end of the turntable device being provided with the mounting platform.

[0015] In one embodiment, the three-axis drive device includes an X-axis drive assembly, a Y-axis drive assembly, and a Z-axis drive assembly. The Y-axis drive assembly is connected to the output end of the X-axis drive assembly, the Z-axis drive assembly is connected to the output end of the Y-axis drive assembly, and the turntable device is connected to the output end of the Z-axis drive assembly.

[0016] In one embodiment, the placement fixture has a placement column on the side opposite to the leveling component. The placement column includes a plurality of columns, which are detachably disposed on the placement fixture. Each placement column has a placement surface.

[0017] This utility model also proposes a mass transfer device, including the lower fixture module as described above.

[0018] The technical solution of this utility model involves placing a lower substrate using a placement fixture. A moving device includes a mounting platform, and three leveling components are positioned between the mounting platform and the placement fixture. Before transferring the die from the upper substrate to the lower substrate, these three leveling components alone can adjust the spacing between at least three positions on the lower substrate and their corresponding positions on the upper substrate to be equal, thereby ensuring that the lower and upper substrates are parallel. This guarantees uniform spacing between the upper and lower substrates during die transfer, improving the success rate and accuracy of the transfer. The moving device can drive the mounting platform to move the placement fixture, adjusting the position of the lower substrate in space to accommodate alignment requirements of the lower and upper substrates at different locations. The lower fixture module in this application achieves the leveling process for both the lower and upper substrates using only three leveling components, greatly simplifying the module's structure and reducing its production cost. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the upper and lower fixture module in one embodiment provided by this utility model;

[0021] Figure 2 An exploded view of the lower fixture module in one embodiment of this utility model;

[0022] Figure 3 for Figure 2 A magnified view of a portion of point A in the middle.

[0023] Explanation of icon numbers:

[0024] 100. Lower jig module; 1. Moving device; 11. Three-axis drive device; 111. X-axis drive assembly; 112. Y-axis drive assembly; 113. Z-axis drive assembly; 12. Turntable device; 13. Mounting platform; 2. Leveling assembly; 21. Mounting bracket; 211. Top wall; 212. First side wall; 213. Second side wall; 214. Mounting space; 22. Leveling electric cylinder; 23. Second joint bearing; 3. Placement jig; 31. Placement column; 311. Placement surface; 32. First side; 33. Second side; 34. Third side; 35. Fourth side; 4. Lower base plate.

[0025] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0027] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0028] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0029] Please refer to the reference. Figures 1 to 3 As shown, this utility model proposes a lower fixture module 100, which is applied to a mass transfer device. The mass transfer device transfers the die of an upper substrate to a lower substrate 4. The lower fixture module 100 includes a moving device 1, three leveling components 2, and a placement fixture 3. The moving device 1 is provided with a mounting platform 13. The three leveling components 2 are connected to the mounting platform 13. The placement fixture 3 is connected to the three leveling components 2 and is provided with a placement surface 311 for fixing the lower substrate 4. The three leveling components 2 adjust the levelness of the lower substrate 4 so that the lower substrate 4 and the upper substrate are relatively parallel.

[0030] In this embodiment, three leveling components 2 are disposed between the mounting stage 13 and the placement fixture 3. The lower substrate 4 is placed on the placement surface 311 of the placement fixture 3. Before transferring the die from the upper substrate to the lower substrate 4, the spacing between at least three positions on the lower substrate 4 and the corresponding positions on the upper substrate can be adjusted to be equal using only the three leveling components 2. This ensures that the lower substrate 4 and the upper substrate are aligned in a parallel state, guaranteeing that the spacing between the upper substrate and the lower substrate 4 is uniform during the die transfer process, thereby improving the success rate and accuracy of the die transfer. The moving device 1 can drive the mounting stage 13 to move the placement fixture 3 to adjust the position of the lower substrate 4 in space, adapting to the alignment requirements of the lower substrate 4 and the upper substrate at different positions. The lower fixture module 100 in this application can achieve the leveling steps of the lower substrate 4 and the upper substrate using only three leveling components 2, greatly simplifying the structure of the lower fixture module 100 and reducing the production cost of the lower fixture module 100.

[0031] Optionally, all three leveling components 2 are vertically arranged. When vertically arranged, the axis of the leveling electric cylinder 22 is aligned with the direction of gravity, enabling it to more directly bear and counteract the pressure generated by the placement fixture 3 and the lower substrate 4 placed on it. When adjusting the levelness of the lower substrate 4, the driving of the leveling components 2 can more precisely change the height of the lower substrate 4 in the vertical direction, thereby achieving more accurate and stable support and leveling, which is beneficial to improving the accuracy and quality of grain transfer. At the same time, the vertical arrangement of the leveling components 2 can also reduce or even avoid the lateral force generated by the leveling components 2 on the placement fixture 3 and the lower substrate 4, preventing the placement fixture 3 and the lower substrate 4 from twisting or deforming due to lateral force, thus maintaining better flatness and stability of the placement fixture 3 and the lower substrate 4.

[0032] In actual implementation, the three leveling components 2 are arranged non-collinearly between the mounting platform 13 and the placement fixture 3. Besides leveling the lower substrate 4, the leveling components 2 also support the placement fixture 3. The non-collinear arrangement of the three leveling components 2 provides stable support for the placement fixture 3. The leveling components 2 are detachably connected to both the mounting platform 13 and the placement fixture 3 using methods such as snap-fit ​​structures or bolts, facilitating maintenance and replacement of the leveling components 2 and reducing the production and usage costs of the lower fixture module 100.

[0033] In one embodiment of this utility model, such as Figure 1 and Figure 2 As shown, the fixture 3 has a first side 32, a second side 33, a third side 34 and a fourth side 35 connected in sequence. The leveling component 2 includes three components. Two leveling components 2 are respectively set at the connection points of the first side 32 and the second side 33 and the connection points of the first side 32 and the fourth side 35. The other leveling component 2 is set at the middle position of the third side 34.

[0034] In this embodiment, the three leveling components 2 are respectively positioned at two adjacent corners of the fixture 3 and on the non-adjacent side of those two corners. This arrangement of the three leveling components 2 forms a stable triangular configuration, ensuring the stability of the support for the fixture 3. Furthermore, this arrangement results in a larger spacing between the three leveling components 2, which is more conducive to the leveling accuracy of the fixture 3 and the lower base plate 4. The force on the three leveling components 2 is also more uniform, helping to ensure the stability of their operation and extending their service life.

[0035] Optionally, the three leveling components 2 can be positioned at the three corners of the fixture 3, without specific limitations. In actual implementation, the fixture 3 is arranged in a rectangular, square, or other quadrilateral shape.

[0036] In one embodiment of this utility model, such as Figure 2 and Figure 3 As shown, the leveling assembly 2 includes a mounting bracket 21 and a leveling electric cylinder 22. The mounting bracket 21 has a mounting space 214. The side of the mounting bracket 21 facing away from the mounting space 214 is hinged to the placement fixture 3. The leveling electric cylinder 22 is located in the mounting space 214 and connected to the mounting bracket 21. The output end of the leveling electric cylinder 22 is hinged to the mounting table 13.

[0037] In this embodiment, the leveling cylinder 22 is disposed within the mounting space 214 of the mounting bracket 21. The mounting bracket 21 provides a certain degree of protection for the leveling cylinder 22, preventing external factors from interfering with its operation and improving the leveling effect on the lower substrate 4. It is understood that the output end of the leveling cylinder 22 is hinged to the mounting platform 13, and the leveling cylinder 22 is hinged to the placement fixture 3 via the mounting bracket 21. That is, both ends of the leveling component 2 are hinged to the mounting platform 13 and the placement fixture 3, respectively. The hinge allows the connected components to rotate relative to each other within a certain angle range. This allows the placement fixture 3 to flexibly adjust its angle during leveling, better adapting to different leveling requirements and effectively preventing the placement fixture 3 and the lower substrate 4 from bending or deforming during the leveling process due to the three leveling components 2. The hinged connection not only avoids stress concentration caused by restricted relative movement between the mounting platform 13 and the leveling component 2, and between the leveling component 2 and the placement fixture 3, but also avoids additional torque caused by installation errors of the leveling component 2.

[0038] In practical implementation, the leveling electric cylinder 22 can be a miniature leveling electric cylinder 22. This leveling electric cylinder 22 has a small size and a large thrust, which can meet the leveling requirements of the lower jig module 100 in a confined space. The two sides of the leveling electric cylinder 22 are detachably connected to the mounting bracket 21 by bolts or clips.

[0039] In one embodiment of this utility model, such as Figure 2 and Figure 3 As shown, the leveling assembly 2 also includes a first joint bearing and a second joint bearing 23. The first joint bearing is located between the mounting bracket 21 and the placement fixture 3, and the second joint bearing 23 is located between the output end of the leveling electric cylinder 22 and the mounting platform 13, so that the mounting bracket 21 and the placement fixture 3 are hinged, and the output end of the leveling electric cylinder 22 and the mounting platform 13 are hinged.

[0040] In this embodiment, the mounting bracket 21 and the placement fixture 3 are connected by a first joint bearing, and the output end of the leveling electric cylinder 22 and the mounting platform 13 are connected by a second joint bearing 23. The first joint bearing and the second joint bearing 23 have a self-aligning function, which can adapt to the installation error of the leveling component 2, and is beneficial to the stability of the leveling component 2 in supporting the placement fixture 3 and the lower substrate 4, so as to ensure the stability of the lower substrate 4 after leveling, and thus ensure the accuracy and efficiency of the grain transfer process.

[0041] In practice, a spherical plain bearing includes an inner ring with an outer spherical surface and an outer ring with an inner spherical surface. The outer and inner spherical surfaces form a sliding friction pair. The inner and outer rings are connected to different components to achieve hinge between the different components.

[0042] In one embodiment of this utility model, such as Figure 2 and Figure 3 As shown, the first joint bearing and the second joint bearing 23 are arranged colinearly with the leveling electric cylinder 22.

[0043] In this embodiment, the line connecting the first joint bearing and the second joint bearing 23 is collinear with the axis of the output shaft of the leveling electric cylinder 22. During the leveling process, the mounting platform 13 provides support for the leveling assembly 2, which in turn provides support for the placement fixture 3. The collinear arrangement of the first and second joint bearings 23 with the leveling electric cylinder 22 ensures that the force of the leveling assembly 2 is transmitted along its axis, thus guaranteeing the stability of the leveling assembly 2 in supporting the placement fixture 3. Simultaneously, this also prevents the leveling assembly 2 from being subjected to eccentric torque, which could affect its service life and leveling accuracy. The collinear arrangement makes the leveling assembly 2 more evenly stressed, reducing stress concentration and component wear caused by eccentric forces, further improving the accuracy and reliability of the leveling assembly 2, and providing a strong guarantee for the precise leveling of the lower substrate 4.

[0044] In one embodiment of this utility model, such as Figure 2 and Figure 3 As shown, the mounting bracket 21 includes a top wall 211 and a first side wall 212 and a second side wall 213 connected to both sides of the top wall 211. The first side wall 212, the second side wall 213 and the top wall 211 enclose a mounting space 214. The side of the top wall 211 facing away from the mounting space 214 is connected to the placement fixture 3.

[0045] In this embodiment, the mounting bracket 21 is arranged in a gate shape, with the top wall 211 connected to the placement fixture 3, and the first side wall 212 and the second side wall 213 connected to the leveling electric cylinder 22. The first side wall 212 and the second side wall 213 limit the leveling electric cylinder 22, ensuring that the leveling electric cylinder 22 will not shift or shake during operation, thus avoiding affecting the leveling accuracy. The first side wall 212, the second side wall 213, and the top wall 211 also provide a certain degree of shielding for the leveling electric cylinder 22, effectively preventing external factors from affecting the operation of the leveling assembly 2.

[0046] In actual implementation, the leveling electric cylinder 22 is connected to the first side wall 212 and the second side wall 213 in a detachable manner such as by clips or bolts. Optionally, the top wall 211 is spaced apart from the leveling electric cylinder 22 to avoid obstructing the drive part of the leveling electric cylinder 22, thereby preventing the drive part from being compressed and affecting the stability and lifespan of the leveling electric cylinder 22.

[0047] In one embodiment of this utility model, such as Figure 1 and Figure 2 As shown, the mobile device 1 includes a three-axis drive device 11 and a turntable device 12. The turntable device 12 is connected to the output end of the three-axis drive device 11, and the output end of the turntable device 12 is provided with a mounting platform 13.

[0048] In this embodiment, the three-axis drive device 11 serves as the spatial position adjustment mechanism of the lower fixture module 100, possessing high precision and flexibility, enabling rapid and accurate movement of the lower substrate 4 in three-dimensional space. The turntable device 12 is used to adjust the angle between the placement fixture 3 and the lower substrate 4 in the plane, facilitating the alignment of the lower substrate 4 with the upper substrate. The three-axis drive device 11 has three drive directions arranged at an angle to achieve spatial position adjustment of the lower substrate 4.

[0049] In practical implementation, the turntable device 12 can be an electric turntable. The three driving directions of the three-axis drive device 11 can be the X-axis, Y-axis, and Z-axis. The upper substrate is set parallel to the XY plane, and the fixture 3 and the lower substrate 4 are also set parallel to the XY plane. The rotation axis of the turntable device 12 is the Z-axis. The turntable device 12 can adjust the projections of the upper substrate and the lower substrate 4 in the XY plane to overlap, so as to facilitate the transfer of the die from the upper substrate to the lower substrate 4. Through the coordinated work of the three-axis drive device 11 and the turntable device 12, the lower substrate 4 can be adjusted omnidirectionally in space to meet the alignment requirements of different positions and angles with the upper substrate, thereby improving the adaptability and flexibility of the mass transfer equipment.

[0050] In one embodiment of this utility model, such as Figure 1 and Figure 2As shown, the three-axis drive device 11 includes an X-axis drive assembly 111, a Y-axis drive assembly 112, and a Z-axis drive assembly 113. The Y-axis drive assembly 112 is connected to the output end of the X-axis drive assembly 111, the Z-axis drive assembly 113 is connected to the output end of the Y-axis drive assembly 112, and the turntable device 12 is connected to the output end of the Z-axis drive assembly 113.

[0051] In this embodiment, the driving directions of the X-axis drive assembly 111, the Y-axis drive assembly 112, and the Z-axis drive assembly 113 are respectively arranged parallel to the X-axis, Y-axis, and Z-axis directions, and the X-axis, Y-axis, and Z-axis are arranged perpendicular to each other.

[0052] In actual implementation, the X-axis drive assembly 111, Y-axis drive assembly 112, and Z-axis drive assembly 113 are independent yet closely coordinated. Through motors, lead screws, guide rails, and other transmission components, the X-axis drive assembly 111, Y-axis drive assembly 112, and Z-axis drive assembly 113 achieve precise displacement control in the X-axis, Y-axis, and Z-axis directions. The three-axis drive device 11 provides a stable moving platform for the lower fixture module 100, ensuring that the lower substrate 4 can accurately move to the designated position and be precisely aligned with the upper substrate during the die transfer process.

[0053] In one embodiment of this utility model, such as Figures 1 to 3 As shown, the placement fixture 3 has a placement column 31 on the side away from the leveling component 2. The placement column 31 includes multiple columns, which are detachably mounted on the placement fixture 3. The placement column 31 has a placement surface 311.

[0054] In this embodiment, the lower substrate 4 is placed on the placement posts 31 of the placement fixture 3. The placement surface 311 of the placement posts 31 provides flat and stable support for the lower substrate 4. The multiple placement posts 31 are distributed on the placement fixture 3 to avoid damaging the electronic components on the lower substrate 4 and affecting the quality of the lower substrate 4. The detachable design of the placement posts 31 allows the user to flexibly adjust the position of the placement posts 31 according to the lower substrate 4 of different sizes and shapes, improving the versatility and adaptability of the lower fixture module 100.

[0055] In actual implementation, the placement fixture 3 is provided with a placement groove, and the placement column 31 is set at the bottom of the placement groove. When the lower substrate 4 is placed on the placement surface 311, the side of the lower substrate 4 is limited by the groove wall of the placement groove to ensure that the lower substrate 4 maintains a fixed position during the die transfer process and avoids affecting the die transfer quality.

[0056] This utility model also proposes a mass transfer device, which includes a lower fixture module 100. The specific structure of the lower fixture module 100 is as described in the above embodiments. Since this mass transfer device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0057] In actual implementation, the mass transfer equipment also includes an upper fixture module and a laser module. The upper fixture module is used to fix the upper substrate, and the laser module is used to ablate the grains attached to the upper substrate, causing them to fall to a designated area on the lower substrate 4, thereby realizing the transfer of the grains.

[0058] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A lower fixture module, applied in a mass transfer apparatus, the mass transfer apparatus transferring grains from an upper substrate to a lower substrate, characterized in that, The lower fixture module includes: The mobile device is equipped with a mounting platform; Three leveling components, the three leveling components being connected to the mounting platform; and A placement fixture is provided, which is connected to the three leveling components. The placement fixture has a placement surface for fixing the lower substrate. The three leveling components adjust the horizontality of the lower substrate so that the lower substrate and the upper substrate are relatively parallel.

2. The lower fixture module as described in claim 1, characterized in that, The placement fixture has a first side, a second side, a third side, and a fourth side connected in sequence. The leveling component includes three components. Two of the leveling components are respectively set at the connection points of the first side and the second side and the connection points of the first side and the fourth side, and the other leveling component is set at the middle position of the third side.

3. The lower fixture module as described in claim 2, characterized in that, The leveling assembly includes a mounting bracket and a leveling electric cylinder. The mounting bracket has an installation space, and the side of the mounting bracket facing away from the installation space is hinged to the placement fixture. The leveling electric cylinder is located in the installation space and connected to the mounting bracket. The output end of the leveling electric cylinder is hinged to the mounting platform.

4. The lower fixture module as described in claim 3, characterized in that, The leveling assembly further includes a first joint bearing and a second joint bearing. The first joint bearing is disposed between the mounting bracket and the placement fixture, and the second joint bearing is disposed between the output end of the leveling electric cylinder and the mounting platform, so that the mounting bracket and the placement fixture are hinged, and the output end of the leveling electric cylinder is hinged to the mounting platform.

5. The lower fixture module as described in claim 4, characterized in that, The first joint bearing and the second joint bearing are arranged colinearly with the leveling electric cylinder.

6. The lower fixture module as described in claim 3, characterized in that, The mounting bracket includes a top wall and a first side wall and a second side wall connected to both sides of the top wall. The first side wall, the second side wall and the top wall enclose the mounting space. The side of the top wall facing away from the mounting space is connected to the placement fixture.

7. The lower fixture module as described in any one of claims 1 to 6, characterized in that, The mobile device includes a three-axis drive device and a turntable device. The turntable device is connected to the output end of the three-axis drive device, and the output end of the turntable device is provided with the mounting platform.

8. The lower fixture module as described in claim 7, characterized in that, The three-axis drive device includes an X-axis drive assembly, a Y-axis drive assembly, and a Z-axis drive assembly. The Y-axis drive assembly is connected to the output end of the X-axis drive assembly, the Z-axis drive assembly is connected to the output end of the Y-axis drive assembly, and the turntable device is connected to the output end of the Z-axis drive assembly.

9. The lower fixture module as described in any one of claims 1 to 6, characterized in that, The placement fixture has a placement column on the side opposite to the leveling component. The placement column includes multiple columns, which are detachably mounted on the placement fixture. Each placement column has a placement surface.

10. A mass transfer device, characterized in that, Includes the lower fixture module as described in any one of claims 1 to 9.

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