Light-emitting substrate, printhead, and printing apparatus

Abstract

The application discloses a light-emitting substrate, a print head and a printing device. The light-emitting substrate comprises a substrate, a driving chip assembly, at least one pixel row and a plurality of first fan-out wires. The substrate comprises a main body part, and the main body part comprises a first area and a second area. The pixel row is arranged on the substrate, and the pixel row is arranged at least in the first area. The pixel row comprises a plurality of sub-pixels arranged at intervals in a first direction. The plurality of first fan-out wires are arranged on the substrate. The first fan-out wire comprises a first sub-wire and a second sub-wire connected to each other. The first sub-wire is electrically connected to the driving chip assembly, and the second sub-wire is electrically connected to the sub-pixel. The extension direction of the first sub-wire intersects with the extension direction of the second sub-wire. The light-emitting substrate further comprises at least one pre-cutting line. The pre-cutting line is arranged on the main body part, and the pre-cutting line is located between two adjacent second sub-wires. The application can solve the compatibility problem of the print head and different sizes of printers, so that the large-size print head can be compatible with small-size printers after cutting.

Description

Technical Field

[0001] This application relates to the field of printing technology, specifically to a light-emitting substrate, a print head, and a printing device. Background Technology

[0002] In related technologies, for printing devices that use LED (Light Emitting Diode) printheads, LED printheads using silicon substrates are usually limited by the size of the silicon substrate. They cannot use a single silicon substrate to make a large printhead. Instead, multiple silicon substrates need to be spliced ​​together to form a large printhead. Glass substrates, on the other hand, are not limited by size and can be used to make large printheads.

[0003] However, if a large printhead is designed for a large-size printing device, a corresponding small printhead needs to be redesigned if a smaller printer is required. A large printhead cannot be directly cut at both ends to form a smaller printhead because direct cutting can easily cause short circuits and other defects in the edge wires, affecting the normal use of the cut printhead. Therefore, related technologies have compatibility issues between printheads and printers of different sizes.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this application is to provide a light-emitting substrate, a printhead, and a printing device that can solve the compatibility problem between the printhead and printers of different sizes, so that a large printhead can be cut to be compatible with a small printhead.

[0006] To solve the above problems, the technical solution of this application is as follows:

[0007] In a first aspect, this application proposes a light-emitting substrate, comprising:

[0008] A substrate includes a main body portion, the main body portion including a first region and a second region;

[0009] A driver chip assembly is disposed on the substrate and located in the second region;

[0010] At least one pixel row is disposed on the substrate, the pixel row being at least disposed in the first region, the pixel row comprising a plurality of sub-pixels spaced apart along a first direction; and

[0011] Multiple first fan-out traces are disposed on the substrate. Each first fan-out trace includes a first sub-line and a second sub-line connected to each other. The first sub-line is electrically connected to the driver chip assembly, and the second sub-line is electrically connected to the sub-pixel. The extension direction of the first sub-line intersects the extension direction of the second sub-line.

[0012] The light-emitting substrate also has at least one pre-cut line, which is disposed on the main body and located between two adjacent second sub-lines.

[0013] In one embodiment of this application, in a plan view of the light-emitting substrate, the spacing between two adjacent second sub-lines is greater than or equal to 3 mm.

[0014] In one embodiment of this application, the light-emitting substrate further includes:

[0015] A first trace is disposed on the substrate and electrically connected to the sub-pixel; and

[0016] The second trace is disposed on the side of the first trace away from the substrate. The second trace is disposed on a different layer from the first trace and is insulated from each other. The second trace is electrically connected to the sub-pixel.

[0017] The orthographic projection of the portion of the first trace corresponding to the pre-cut line on the substrate and the orthographic projection of the portion of the second trace corresponding to the pre-cut line on the substrate are spaced apart.

[0018] In one embodiment of this application, the light-emitting substrate includes a plurality of pixel rows, the plurality of pixel rows being arranged at intervals along a second direction, the second direction intersecting the first direction;

[0019] The light-emitting substrate has multiple pre-cut lines;

[0020] The light-emitting substrate further includes a gate driving circuit and multiple gate control signal lines. The driving chip assembly is electrically connected to the gate driving circuit. The gate driving circuit is electrically connected to the multiple gate control signal lines respectively. One gate control signal line is electrically connected to multiple sub-pixels of one pixel row.

[0021] The main body includes a non-cutting area and a pre-cutting area connected to at least one side of the non-cutting area, and a plurality of pre-cutting lines are provided in the pre-cutting area;

[0022] The driver chip assembly and the gate drive circuit are located in the non-cut area.

[0023] In one embodiment of this application, the light-emitting substrate includes a pixel row and a gate control signal line, and the driving chip assembly is directly electrically connected to a plurality of sub-pixels of the pixel row through the gate control signal line;

[0024] The light-emitting substrate has multiple pre-cut lines;

[0025] The main body includes a non-cutting area and a pre-cutting area connected to at least one side of the non-cutting area, and a plurality of pre-cutting lines are provided in the pre-cutting area;

[0026] The driver chip assembly is located in the non-cut area.

[0027] In one embodiment of this application, the first sub-line includes a first sub-segment and a second sub-segment connected to each other. The first sub-segment is electrically connected to the driver chip assembly, and the second sub-segment is connected to the second sub-line. The second sub-segment extends along the first direction.

[0028] In a plan view of the light-emitting substrate, at least one of the second segments intersects the pre-cut line.

[0029] In one embodiment of this application, the first fan-out routing cable further includes a bent section, the bent section connecting the first sub-line and the second sub-line;

[0030] In a plan view of the light-emitting substrate, the bent section protrudes toward one side of the edge of the main body in the first direction;

[0031] The protruding portion of the bent section of one of the first fan-out routes, and the second sub-segment of another first fan-out route whose protruding portion faces the same pre-cut line, all intersect with the same pre-cut line.

[0032] In one embodiment of this application, the light-emitting substrate further includes a power line and a ground line;

[0033] The sub-pixels include:

[0034] A pixel driving circuit includes a first transistor and a driving transistor. The control electrode of the first transistor is electrically connected to the gate control signal line, the input electrode of the first transistor is electrically connected to the second sub-line, the output electrode of the first transistor is electrically connected to the control electrode of the driving transistor, and the input electrode of the driving transistor is connected to the power supply line.

[0035] A light-emitting chip, comprising an anode and a cathode, wherein the anode is electrically connected to the output terminal of the driving transistor via a third sub-line, the third sub-line intersects with the pre-cutting line to form a pre-cutting point, and the cathode is electrically connected to the ground line;

[0036] In a plan view of the light-emitting substrate, multiple light-emitting chips in the same pixel row are arranged at intervals along the first direction.

[0037] In one embodiment of this application, the substrate further includes an edge portion connected to at least one side of the main body portion in the first direction;

[0038] The pixel row is disposed on the first region and the edge region. The sub-pixel located in the first region is a light-emitting sub-pixel, and the sub-pixel located in the edge region is an edge sub-pixel. The first fan-out trace electrically connects the driving chip assembly and the light-emitting sub-pixel.

[0039] The light-emitting substrate also includes a second outgoing trace;

[0040] The two ends of the second fan-out trace are respectively connected to the edge sub-pixel and the driving chip assembly; or,

[0041] The second fan-out trace includes a first edge sub-line and a second edge sub-line. The first edge sub-line and the second edge sub-line are separated and insulated from each other. One end of the first edge sub-line is connected to the driver chip assembly, and the other end of the first edge sub-line extends to the edge of the edge portion away from the main body portion. One end of the second edge sub-line is connected to the edge sub-pixel, and the other end of the second edge sub-line extends to the edge of the edge portion away from the main body portion.

[0042] Secondly, this application proposes a printhead including a light-emitting substrate, the light-emitting substrate comprising:

[0043] A substrate includes a main body portion, the main body portion including a first region and a second region;

[0044] A driver chip assembly is disposed on the substrate and located in the second region;

[0045] At least one pixel row is disposed on the substrate, the pixel row being at least disposed in the first region, the pixel row comprising a plurality of sub-pixels spaced apart along a first direction; and

[0046] Multiple first fan-out traces are disposed on the substrate. Each first fan-out trace includes a first sub-line and a second sub-line connected to each other. The first sub-line is electrically connected to the driver chip assembly, and the second sub-line is electrically connected to the sub-pixel. The extension direction of the first sub-line intersects the extension direction of the second sub-line.

[0047] The light-emitting substrate also has at least one pre-cut line, which is disposed on the main body and located between two adjacent second sub-lines.

[0048] Thirdly, this application proposes a printing apparatus, including a print head, the print head including a light-emitting substrate, the light-emitting substrate comprising:

[0049] A substrate includes a main body portion, the main body portion including a first region and a second region;

[0050] A driver chip assembly is disposed on the substrate and located in the second region;

[0051] At least one pixel row is disposed on the substrate, the pixel row being at least disposed in the first region, the pixel row comprising a plurality of sub-pixels spaced apart along a first direction; and

[0052] Multiple first fan-out traces are disposed on the substrate. Each first fan-out trace includes a first sub-line and a second sub-line connected to each other. The first sub-line is electrically connected to the driver chip assembly, and the second sub-line is electrically connected to the sub-pixel. The extension direction of the first sub-line intersects the extension direction of the second sub-line.

[0053] The light-emitting substrate also has at least one pre-cut line, which is disposed on the main body and located between two adjacent second sub-lines.

[0054] In this application, the first output trace includes a first sub-line and a second sub-line whose extension directions intersect. The first sub-line is connected to the second sub-line, the first sub-line is electrically connected to the driver chip assembly, and the second sub-line is electrically connected to the sub-pixel. The light-emitting substrate has at least one pre-cut line. When facing the problem of large-size printheads being incompatible with small-size printers, the main body can be cut along the pre-cut line. Since the pre-cut line of this application is located between two adjacent second sub-lines, after cutting, the second sub-line of the outer first output trace is removed, the first sub-line of the outer first output trace remains, and the first and second sub-lines of the inner first output trace are completely retained. At this time, since the first sub-line of the inner first output trace is completely retained, the remaining part of the outer first output trace will not short-circuit with the inner first output trace. This application solves the compatibility problem between the printhead and printers of different sizes, making it possible for large-size printheads to be compatible with small-size printers after cutting. Attached Figure Description

[0055] Figure 1 This is a schematic diagram of one embodiment of the printhead of this application;

[0056] Figure 2 This is a schematic diagram of one embodiment of the light-emitting substrate of this application;

[0057] Figure 3 This is a schematic diagram of another embodiment of the light-emitting substrate of this application;

[0058] Figure 4 This is a schematic diagram of a light-emitting substrate according to the first embodiment of this application;

[0059] Figure 5 This is another schematic diagram of the light-emitting substrate according to the first embodiment of this application;

[0060] Figure 6This is a schematic diagram of a light-emitting substrate according to the second embodiment of this application;

[0061] Figure 7 This is a schematic diagram of a light-emitting substrate according to the third embodiment of this application;

[0062] Figure 8 This is a circuit diagram of a light-emitting substrate according to the third embodiment of this application;

[0063] Figure 9 This is another schematic diagram of the light-emitting substrate according to the third embodiment of this application.

[0064] Figure 10 This is yet another schematic diagram of the light-emitting substrate according to the third embodiment of this application;

[0065] Figure 11 This is a schematic diagram of a light-emitting substrate according to the fourth embodiment of this application.

[0066] Explanation of reference numerals in the attached figures:

[0067] Printhead 1000; Light-emitting substrate 100; Photosensitive drum 200; First direction D1; Second direction D2; Pre-cut line CL;

[0068] Substrate 10; Main body 11; First region 111; Second region 112; Non-cutting region 113; Pre-cutting region 114; Edge region 12;

[0069] Driver chip assembly 20;

[0070] Pixel row 30; Sub-pixel 31; Luminous sub-pixel 311; Edge sub-pixel 312;

[0071] First exit line 40; First sub-line 41; First sub-segment 411; Second sub-segment 412; Second sub-line 42; Bend segment 43;

[0072] First routing line 51; Second routing line 52;

[0073] Gate drive circuit 60;

[0074] Power line 71; Ground line 72; Gate control signal line 73; Pixel driving circuit T; First transistor T1; Driving transistor T2; Light-emitting chip 74; Third sub-line 75; Pre-cutting point 76;

[0075] Second exit line 80; First edge sub-line 81; Second edge sub-line 82. Detailed Implementation

[0076] The terms used in this specification and claims have the meanings that are commonly understood by one of ordinary skill in the art to which this application pertains. The terms used in this specification and claims are for the purpose of facilitating the description and understanding of this application only, and are not intended to limit this application to the narrow interpretation of the specific terms used in the specification and claims.

[0077] This application discloses a printing apparatus, including a printhead 1000 and a photosensitive drum 200. The photosensitive drum 200 is disposed on the light-emitting side of the printhead 1000. In this application, the printhead 1000 employs a light source sensitive to the photosensitive drum 200. As the photosensitive drum 200 rotates, the printhead 1000 forms an image line by line on the photosensitive drum 200. The image area of ​​the photosensitive drum 200 carries an electric charge to attract toner and complete the printing process.

[0078] Please see Figure 1 This application proposes a printhead 1000, which includes a light-emitting substrate 100. A light-emitting chip 74 is disposed on the light-emitting substrate 100, and the light emitted by the light-emitting chip 74 can be a light source that is sensitive to the photosensitive drum 200, such as red light or infrared light.

[0079] Please see Figure 2 This application proposes a light-emitting substrate 100. The light-emitting substrate 100 includes a substrate 10, a driving chip assembly 20, at least one pixel row 30, and a plurality of first fan-out traces 40.

[0080] The substrate 10 includes a main body portion 11. The main body portion 11 includes a first region 111 and a second region 112.

[0081] The driver chip assembly 20 is disposed on the substrate 10 and located in the second region 112.

[0082] At least one pixel row 30 is disposed on the substrate 10. The pixel row 30 is at least disposed in the first region 111. The pixel row 30 includes a plurality of sub-pixels 31 arranged at intervals along the first direction D1.

[0083] Multiple first-fan outgoing traces 40 are disposed on the substrate 10. Each first-fan outgoing trace 40 includes a first sub-line 41 and a second sub-line 42 connected to each other. The first sub-line 41 is electrically connected to the driver chip assembly 20. The second sub-line 42 is electrically connected to the sub-pixel 31. The extension direction of the first sub-line 41 intersects the extension direction of the second sub-line 42.

[0084] The light-emitting substrate 100 also has at least one pre-cut line CL. The pre-cut line CL is provided on the main body portion 11. The pre-cut line CL is located between two adjacent second sub-lines 42.

[0085] In this embodiment, the first fan-out trace 40 includes a first sub-line 41 and a second sub-line 42 whose extension directions intersect. The first sub-line 41 is connected to the second sub-line 42, the first sub-line 41 is electrically connected to the driver chip assembly 20, and the second sub-line 42 is electrically connected to the sub-pixel 31. The light-emitting substrate 100 has at least one pre-cutting line CL. When facing the problem of large-size printhead 1000 being incompatible with small-size printers, the main body 11 can be cut along the pre-cutting line CL. Since the pre-cutting line CL in this embodiment is located between two adjacent second sub-lines 42, after cutting, the second sub-line 42 of the outer first fan-out trace 40 is removed, the first sub-line 41 of the outer first fan-out trace 40 remains, and the first sub-line 41 and the second sub-line 42 of the inner first fan-out trace 40 are both completely retained. At this time, since the first sub-line 41 of the first output line 40 located on the inner side is completely preserved, the remaining part of the first output line 40 located on the outer side will not be short-circuited with the first output line 40 located on the inner side. This embodiment solves the compatibility problem between the print head 1000 and printers of different sizes, so that the large-size print head 1000 can be compatible with small-size printers after being cut.

[0086] Optionally, the substrate 10 is a glass substrate 10. Compared to a silicon substrate 10, the glass substrate 10 is not limited in size and can be used to fabricate large-sized light-emitting substrates 100.

[0087] Optionally, the driver chip assembly 20 can be a chip directly bonded to the substrate 10, or it can be a chip on film (COF) or a chip on glass (COG). No limitation is made on the driver chip assembly 20 here.

[0088] Optionally, in this embodiment, the pre-cut line CL can be located using CCD vision, and then the pre-cut line CL can be cut.

[0089] Optionally, the light-emitting substrate 100 further includes at least one first alignment mark. The first alignment mark is disposed on the glass substrate 10. One alignment mark corresponds to one pre-cutting line CL. The first alignment mark is used to position the pre-cutting line CL. In this embodiment, the pre-cutting line CL can also be positioned using the first alignment mark to achieve precise cutting of the light-emitting substrate 100. The material of the first alignment mark can be ink.

[0090] It should be understood that the pre-cut line CL can be cut by laser cutting, or by etching, physical cutting, etc., and no limitation is made on the cutting method.

[0091] Optionally, in a plan view of the light-emitting substrate 100, the spacing L1 between two adjacent second sub-lines 42 is greater than or equal to 3 mm.

[0092] In this embodiment, a certain distance must be maintained between two adjacent second sub-wires 42 to avoid short-circuiting of the two second sub-wires 42 after cutting due to excessively small distance. In this application, when the distance between two second sub-wires 42 is greater than or equal to 3 mm, the occurrence of short-circuiting of the second sub-wires 42 after cutting can be reduced.

[0093] On the other hand, when using laser cutting, a heat-affected zone exists near the actual cutting line due to the thermal effect of laser cutting. If the heat-affected zone covers the second sub-line 42, it will affect the first fan-shaped output line 40. This embodiment ensures that adjacent second sub-lines 42 are greater than or equal to 3 mm, which can reduce the impact of the thermal effect of laser cutting on adjacent second sub-lines 42.

[0094] It is important to understand that even if the spacing L1 of the second sub-line 42 is less than 3 mm, it will not necessarily short-circuit after cutting. When the spacing L1 of the two third sub-lines 75 is greater than or equal to 3 mm, the yield of the light-emitting substrate 100 after cutting can be improved.

[0095] The spacing L1 between two adjacent second sub-lines 42 can be 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, 16 mm, 17 mm, 18 mm, 19 mm, 20 mm, etc.

[0096] Please see Figure 3 Optionally, the first sub-line 41 includes a first sub-segment 411 and a second sub-segment 412 connected to each other. The first sub-segment 411 is electrically connected to the driver chip assembly 20. The second sub-segment 412 is connected to the second sub-line 42. The second sub-segment 412 extends along a first direction D1.

[0097] In a plan view of the light-emitting substrate 100, at least one second segment 412 intersects with the pre-cut line CL.

[0098] In this embodiment, the first sub-line 41 includes a first sub-segment 411 and a second sub-segment 412. The first sub-segment 411 is used to connect to the driver chip assembly 20, and the second sub-segment 412 is used to connect to the second sub-line 42.

[0099] In this embodiment, by changing the direction of the first fan-out trace 40, the second sub-segment 412 of the first fan-out trace 40 is adjusted to be parallel to the direction in which multiple sub-pixels 31 are arranged in the same pixel row 30. This ensures that the cut trace is relatively short, thus reducing the affected area.

[0100] In the first embodiment of this application:

[0101] Please see Figure 4 Optionally, the substrate 10 further includes an edge portion 12. The edge portion 12 is connected to at least one side of the main body portion 11 in the first direction D1.

[0102] Pixel rows 30 are located on the first region 111 and the edge region 12. The sub-pixels 31 located in the first region 111 are light-emitting sub-pixels 311, and the sub-pixels 31 located in the edge region 12 are edge sub-pixels 312. The first fan-out trace 40 electrically connects the driver chip assembly 20 and the light-emitting sub-pixels 311.

[0103] The light-emitting substrate 100 also includes a second outgoing line 80.

[0104] Optionally, the two ends of the second fan-out trace 80 are connected to the edge sub-pixel 312 and the driver chip assembly 20, respectively.

[0105] In the first embodiment, the light-emitting substrate 100 is the light-emitting substrate 100 before cutting. At this time, both the main body portion 11 and the edge portion 12 of the light-emitting substrate 100 are provided with sub-pixels 31. In the light-emitting substrate 100 before cutting, both the edge sub-pixels 312 and the light-emitting sub-pixels 311 can emit light normally, and the light-emitting substrate 100 has a large effective light-emitting area.

[0106] Please see Figure 5 Optionally, the first outgoing cable 40 may also include a bend section 43. The bend section 43 connects the first sub-line 41 and the second sub-line 42.

[0107] In a plan view of the light-emitting substrate 100, the bent section 43 protrudes toward one side of the edge of the main body 11 in the first direction D1.

[0108] The protruding portion of the bend segment 43 of a first sector outgoing line 40 and the second sub-segment 412 of another first sector outgoing line 40, which faces the adjacent protruding portion, both intersect with the same pre-cut line CL.

[0109] In the first embodiment, in the laser cutting scheme, laser cutting creates a heat-affected zone near the actual cutting line, affecting the sub-pixels 31 near the actual cutting line in the cut light-emitting substrate 100. If the sub-pixel 31 is located within the heat-affected zone, its light emission will also be affected. In this embodiment, the sub-pixel 31 near the actual cutting line after cutting is defined as a virtual sub-pixel 31. This embodiment requires cutting the first fan-out trace 40 connecting the virtual sub-pixel 31 so that the cut virtual sub-pixel 31 does not emit light, avoiding the impact of poor light emission from the affected virtual sub-pixel 31 on the printed image.

[0110] However, if the first fan-out line 40 connecting the virtual sub-pixel 31 is cut after the light-emitting substrate 100 is cut, there will be multiple cuts, which will not only be inefficient but also lead to a decrease in product yield. Therefore, this embodiment makes further improvements to the first fan-out line 40, so that the first fan-out line 40 of the edge sub-pixel 312 is cut simultaneously during the cutting of the light-emitting substrate 100, reducing the number of cuts and improving the yield of the cut light-emitting substrate 100.

[0111] Specifically, the first outgoing cable 40 in this embodiment includes a bent section 43, which connects the first sub-line 41 and the second sub-line 42.

[0112] Before cutting, in adjacent sub-pixels 31 located inside the same pre-cutting line CL, the bent segment 43 protrudes towards the pre-cutting line CL and intersects with the pre-cutting line CL. In adjacent sub-pixels 31 located outside the same pre-cutting line CL, the second sub-segment 412 intersects with the pre-cutting line CL.

[0113] During the cutting process, the traces intersecting with the pre-cut line CL will be cut. Therefore, the first fan-out trace 40 of the adjacent sub-pixel 31 located inside the same pre-cut line CL will be cut off along with the light-emitting substrate 100.

[0114] After cutting, since the first fan-out trace 40 of the edge sub-pixel 312 has been cut during the cutting process, there is no need to cut the first fan-out trace 40 of the edge sub-pixel 312 again, which reduces the number of cuttings and improves the yield of the cut light-emitting substrate 100.

[0115] In the second embodiment of this application:

[0116] To avoid redundancy, the second embodiment of this application only describes the differences from the first embodiment of this application.

[0117] The second embodiment of this application differs from the first embodiment of this application in that:

[0118] Please see Figure 6 Optionally, the second fan-out trace 80 includes a first edge sub-line 81 and a second edge sub-line 82. The first edge sub-line 81 and the second edge sub-line 82 are separated and insulated from each other. One end of the first edge sub-line 81 is connected to the driver chip assembly 20, and the other end of the first edge sub-line 81 extends to the edge of the edge portion 12 away from the main body portion 11. One end of the second edge sub-line 82 is connected to the edge sub-pixel 312, and the other end of the second edge sub-line 82 extends to the edge of the edge portion 12 away from the main body portion 11.

[0119] In the second embodiment of this application, the light-emitting substrate 100 is a cut light-emitting substrate 100. The difference from the first embodiment is that the bent segment 43 of the edge sub-pixel 312 is cut off along with the portion of the light-emitting substrate 100 located outside the pre-cut line CL during the cutting process. Therefore, the second fan-out trace 80 only has two broken segments of the first edge sub-line 81 and the second edge sub-line 82 remaining.

[0120] It should be understood that the second embodiment is the cut light-emitting substrate 100, while the first embodiment is the light-emitting substrate 100 before cutting. The disconnected second fan-out trace 80 in the second embodiment is the continuous first fan-out trace 40 in the first embodiment. The edge sub-pixel 312 in the second embodiment is defined as the virtual sub-pixel 31 in the first embodiment.

[0121] The beneficial effect of the second embodiment of this application is that after cutting, since the second fan-out routing line 80 of the edge sub-pixel 312 has been cut during the cutting process, it is not necessary to cut the second fan-out routing line 80 of the edge sub-pixel 312 again, which reduces the number of cuttings and improves the yield of the cut light-emitting substrate 100.

[0122] In the third embodiment of this application:

[0123] Please see Figure 7 Optionally, the light-emitting substrate 100 includes a plurality of pixel rows 30. The plurality of pixel rows 30 are arranged at intervals along a second direction D2. The second direction D2 intersects with the first direction D1.

[0124] The light-emitting substrate 100 has multiple pre-cut lines CL.

[0125] The light-emitting substrate 100 also includes a gate driving circuit 60 and multiple gate control signal lines 73. The driving chip assembly 20 is electrically connected to the gate driving circuit 60. The gate driving circuit 60 is electrically connected to the multiple gate control signal lines 73. One gate control signal line 73 is electrically connected to multiple sub-pixels 31 of a pixel row 30.

[0126] The main body 11 includes a non-cutting area 113 and a pre-cutting area 114 connected to at least one side of the non-cutting area 113. Multiple pre-cutting lines CL are provided in the pre-cutting area 114.

[0127] The driver chip assembly 20 and the gate drive circuit 60 are located in the non-cut region 113.

[0128] In this embodiment, the light-emitting substrate 100 includes multiple pixel rows 30. The light-emitting substrate 100 with multiple pixel rows 30 has high printing efficiency. To reduce manufacturing costs and simplify process steps, the design of multiple pixel rows 30 includes a gate driving circuit 60 and multiple gate control lines on the light-emitting substrate 100, enabling line-by-line scanning driving. The gate driving circuit 60 can save on gate driving chips, reducing production costs.

[0129] To avoid damaging the gate drive circuit 60 during the cutting process, the substrate 10 of this application includes a cutting area and a non-cutting area 113. The pre-cutting line CL is only located in the pre-cutting area 114 and not in the non-cutting area 113, thereby preventing the electronic components located in the non-cutting area 113 from being cut off. Therefore, in this embodiment, electronic components that cannot be cut off, such as the driver chip assembly 20 and the gate drive circuit 60, can be located in the non-cutting area 113, thereby ensuring the functional integrity of the light-emitting substrate 100 after cutting.

[0130] Please see Figure 8 Optionally, the light-emitting substrate 100 also includes a power line 71 and a ground line 72.

[0131] Subpixel 31 includes pixel driving circuit T and light-emitting chip 74.

[0132] The pixel driving circuit T includes a first transistor T1 and a driving transistor T2. The control electrode of the first transistor T1 is electrically connected to the gate control signal line 73. The input electrode of the first transistor T1 is electrically connected to the second sub-line 42. The output electrode of the first transistor T1 is electrically connected to the control electrode of the driving transistor T2. The input electrode of the driving transistor T2 is connected to the power supply line 71.

[0133] The light-emitting chip 74 includes an anode and a cathode. The anode is electrically connected to the output of the driving transistor T2 via a third sub-line 75. The third sub-line 75 intersects with the pre-cut line CL to form a pre-cut point 76. The cathode is electrically connected to the ground line 72.

[0134] In a plan view of the light-emitting substrate 100, multiple light-emitting chips 74 in the same pixel row 30 are arranged at intervals along the first direction D1.

[0135] In this application, the pixel driving circuit T is used to control the light-emitting chip 74. The third sub-line 75 is a trace connecting the anode of the light-emitting chip 74 and the output terminal of the driving transistor T2. In this embodiment, the point where the trace intersects with the pre-cutting line CL is defined as the pre-cutting point 76. By setting the pre-cutting point 76 on the third sub-line 75, only the third trace can be cut during cutting, reducing the impact of laser cutting on other traces and improving the yield of the light-emitting substrate 100 after cutting.

[0136] Please see Figure 9 Optionally, the light-emitting substrate 100 may also include a first trace 51 and a second trace 52.

[0137] The first trace 51 is disposed on the substrate 10 and is electrically connected to the sub-pixel 31.

[0138] The second trace 52 is located on the side of the first trace 51 away from the substrate 10. The second trace 52 and the first trace 51 are disposed on different layers and are insulated from each other. The second trace 52 is electrically connected to the sub-pixel 31.

[0139] Please see Figure 10 The orthographic projection of the portion of the first trace 51 corresponding to the pre-cut line CL on the substrate 10 is spaced apart from the orthographic projection of the portion of the second trace 52 corresponding to the pre-cut line CL on the substrate 10.

[0140] Optionally, the first trace 51 can be electrically connected to one of the input and output terminals of the driving transistor T2, and the second trace 52 can be electrically connected to the other of the input and output terminals of the driving transistor T2.

[0141] Since the impedance of the first trace 51 and the second trace 52 is related to their width, in actual production, because the first trace 51 and the second trace 52 are disposed on different layers, their widths are set to be wider to reduce their impedance. However, due to the limited size of the substrate 10, the wider first trace 51 and the second trace 52 will overlap in the thickness direction of the light-emitting substrate 100.

[0142] In this embodiment, since the pre-cut line CL is set to intersect with the first trace 51 and the second trace 52, and the first trace 51 and the second trace 52 overlap, there is a risk of short circuit between the first trace 51 and the second trace 52 after cutting. Therefore, in this embodiment, the portions of the first trace 51 corresponding to the pre-cut line CL and the second trace 52 corresponding to the pre-cut line CL are staggered in the thickness direction of the substrate 10. After cutting, the risk of short circuit between the first trace 51 and the second trace 52 is greatly reduced, improving the yield of the light-emitting substrate 100 after cutting.

[0143] In the fourth embodiment of this application:

[0144] To avoid redundancy, the fourth embodiment of this application only describes the differences from the third embodiment of this application.

[0145] The fourth embodiment of this application differs from the third embodiment in that:

[0146] Please see Figure 11Optionally, the light-emitting substrate 100 includes a pixel row 30 and a gate control signal line 73. The driving chip assembly 20 is directly electrically connected to a plurality of sub-pixels 31 of the pixel row 30 via the gate control signal line 73.

[0147] The light-emitting substrate 100 has multiple pre-cut lines CL.

[0148] The main body 11 includes a non-cutting area 113 and a pre-cutting area 114 connected to at least one side of the non-cutting area 113, with multiple pre-cutting lines CL disposed in the pre-cutting area 114.

[0149] The driver chip assembly 20 is located in the non-cut area 113.

[0150] Unlike the third embodiment of this application, the light-emitting substrate 100 of the fourth embodiment of this application includes only one pixel row 30. Therefore, the light-emitting substrate 100 of the fourth embodiment does not require a gate driving circuit 60. In the light-emitting substrate 100 of the fourth embodiment, the driving chip assembly 20 is directly connected to multiple sub-pixels 31 of one pixel row 30 through the gate control signal line 73. The fourth embodiment can save the fabrication of the gate driving circuit 60, simplify the process, and reduce production costs.

[0151] The specific embodiments of this application have been described in detail above. The embodiments disclosed above are merely preferred embodiments of this application. Those skilled in the art can make many modifications and improvements without departing from the concept of this application. All such modifications and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A light-emitting substrate, characterized in that, include: A substrate includes a main body portion, the main body portion including a first region and a second region; A driver chip assembly is disposed on the substrate and located in the second region; At least one pixel row is disposed on the substrate, the pixel row being at least disposed in the first region, the pixel row comprising a plurality of sub-pixels spaced apart along a first direction; and Multiple first fan-out traces are disposed on the substrate. Each first fan-out trace includes a first sub-line and a second sub-line connected to each other. The first sub-line is electrically connected to the driver chip assembly, and the second sub-line is electrically connected to the sub-pixel. The extension direction of the first sub-line intersects the extension direction of the second sub-line. The light-emitting substrate also has at least one pre-cut line, which is disposed on the main body and located between two adjacent second sub-lines.

2. The light-emitting substrate as described in claim 1, characterized in that, In a plan view of the light-emitting substrate, the spacing between two adjacent second sub-lines is greater than or equal to 3 mm.

3. The light-emitting substrate as described in claim 1, characterized in that, The light-emitting substrate further includes: A first trace is disposed on the substrate and electrically connected to the sub-pixel; and The second trace is disposed on the side of the first trace away from the substrate. The second trace is disposed on a different layer from the first trace and is insulated from each other. The second trace is electrically connected to the sub-pixel. The orthographic projection of the portion of the first trace corresponding to the pre-cut line on the substrate and the orthographic projection of the portion of the second trace corresponding to the pre-cut line on the substrate are spaced apart.

4. The light-emitting substrate as described in claim 1, characterized in that, The light-emitting substrate includes a plurality of pixel rows, which are arranged at intervals along a second direction, the second direction intersecting the first direction; The light-emitting substrate has multiple pre-cut lines; The light-emitting substrate further includes a gate driving circuit and multiple gate control signal lines. The driving chip assembly is electrically connected to the gate driving circuit. The gate driving circuit is electrically connected to the multiple gate control signal lines respectively. One gate control signal line is electrically connected to multiple sub-pixels of one pixel row. The main body includes a non-cutting area and a pre-cutting area connected to at least one side of the non-cutting area, and a plurality of pre-cutting lines are provided in the pre-cutting area; The driver chip assembly and the gate drive circuit are located in the non-cut area.

5. The light-emitting substrate as described in claim 1, characterized in that, The light-emitting substrate includes a pixel row and a gate control signal line, and the driving chip assembly is directly electrically connected to a plurality of sub-pixels of the pixel row through the gate control signal line; The light-emitting substrate has multiple pre-cut lines; The main body includes a non-cutting area and a pre-cutting area connected to at least one side of the non-cutting area, and a plurality of pre-cutting lines are provided in the pre-cutting area; The driver chip assembly is located in the non-cut area.

6. The light-emitting substrate as described in claim 1, characterized in that, The first sub-line includes a first sub-segment and a second sub-segment connected to each other. The first sub-segment is electrically connected to the driver chip assembly, and the second sub-segment is connected to the second sub-line. The second sub-segment extends along the first direction. In a plan view of the light-emitting substrate, at least one of the second segments intersects the pre-cut line.

7. The light-emitting substrate as described in claim 6, characterized in that, The first fan-out routing line also includes a bend section, which connects the first sub-line and the second sub-line; In a plan view of the light-emitting substrate, the bent section protrudes toward one side of the edge of the main body in the first direction; The protruding portion of the bent section of one of the first fan-out routes, and the second sub-segment of another first fan-out route whose protruding portion faces the same pre-cut line, all intersect with the same pre-cut line.

8. The light-emitting substrate as described in claim 4 or 5, characterized in that, The light-emitting substrate also includes power lines and ground lines; The sub-pixels include: A pixel driving circuit includes a first transistor and a driving transistor. The control electrode of the first transistor is electrically connected to the gate control signal line, the input electrode of the first transistor is electrically connected to the second sub-line, the output electrode of the first transistor is electrically connected to the control electrode of the driving transistor, and the input electrode of the driving transistor is connected to the power supply line. A light-emitting chip, comprising an anode and a cathode, wherein the anode is electrically connected to the output terminal of the driving transistor via a third sub-line, the third sub-line intersects with the pre-cutting line to form a pre-cutting point, and the cathode is electrically connected to the ground line; In a plan view of the light-emitting substrate, multiple light-emitting chips in the same pixel row are arranged at intervals along the first direction.

9. The light-emitting substrate according to any one of claims 1-7, characterized in that, The substrate further includes an edge portion connected to at least one side of the main body portion in the first direction; The pixel row is disposed on the first region and the edge region. The sub-pixel located in the first region is a light-emitting sub-pixel, and the sub-pixel located in the edge region is an edge sub-pixel. The first fan-out trace electrically connects the driving chip assembly and the light-emitting sub-pixel. The light-emitting substrate also includes a second outgoing line; The two ends of the second fan-out trace are respectively connected to the edge sub-pixel and the driving chip assembly; or, The second fan-out trace includes a first edge sub-line and a second edge sub-line. The first edge sub-line and the second edge sub-line are separated and insulated from each other. One end of the first edge sub-line is connected to the driver chip assembly, and the other end of the first edge sub-line extends to the edge of the edge portion away from the main body portion. One end of the second edge sub-line is connected to the edge sub-pixel, and the other end of the second edge sub-line extends to the edge of the edge portion away from the main body portion.

10. A printhead, characterized in that, It includes the light-emitting substrate as described in any one of claims 1-9.

11. A printing device, characterized in that, Includes the printhead as described in claim 10.

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