Lamp bead support and LED lamp bead

Abstract

The utility model discloses a lamp pearl support and LED lamp pearl, the lamp pearl support includes support body and is located multiple cup -shaped structure on the support body, the support body includes resin body and along the first direction interval arrangement's multiple metal support, every metal support includes first platform part, second platform part and third platform part, first platform part, second platform part and third platform part along the second direction setting, and be located different cup -shaped structure. Adopt the lamp pearl support and LED lamp pearl provided by the utility model can integrate multiple white light emitting structure, improve the air tightness of LED lamp pearl, and can realize the demand of different color temperature, different apparent index, different brightness, improve the product competitiveness.

Description

Technical Field

[0001] This utility model relates to the field of LED display technology, and in particular to a lamp bead bracket and an LED lamp bead. Background Technology

[0002] Existing white LED chip packaging technologies mainly include phosphor conversion technology, RGB chip three-primary-color combination technology, and quantum dot technology. Phosphor conversion technology, currently the most mainstream white LED packaging technology, involves bonding a blue LED chip to a single cup within an LED packaging bracket. The metal part of the bracket forms a metal functional area on the front, and after bending, leads are formed on the back. Bonding wires electrically connect the blue LED chip to the metal functional area. An encapsulating adhesive containing silicone and phosphor is then applied, and finally, the chip is deposited to form individual white LED chips. The blue light emitted by the blue LED chip excites the phosphor to produce yellow light, which mixes with the remaining blue light to form white light. By adjusting the chemical composition of the phosphor and the thickness of the encapsulating adhesive layer, different color temperatures of white light can be obtained. However, the planar structure of existing LED chips makes it easy for moisture to seep into the chip along the leads, leading to burnout. Furthermore, the brightness, color temperature, and color rendering index of a single LED chip are fixed after packaging, making it difficult to adjust according to usage requirements. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a lamp bead bracket and LED lamp beads, which integrate multiple white light emitting structures into one, improve the airtightness of LED lamp beads, and at the same time meet the needs of different color temperatures, different color rendering indices, and different brightness, thereby improving product competitiveness.

[0004] To solve the above-mentioned technical problems, the present invention provides a lamp bead bracket, including a bracket body and a plurality of cup-shaped structures disposed on the upper surface of the bracket body. The bracket body includes an encapsulating resin body and a plurality of metal brackets spaced apart along a first direction. Each metal bracket includes a first platform portion, a second platform portion and a third platform portion disposed along a second direction. The plurality of cup-shaped structures are respectively disposed on the upper surface of the first platform portion, the second platform portion and the third platform portion.

[0005] As an improvement to the above solution, the metal bracket is bent upward from one side of the second platform portion to form a first sidewall, bent horizontally along the edge of the first sidewall to form a first platform portion, and bent downward along the edge of the first platform portion to form a second sidewall.

[0006] The metal bracket is formed by bending the second platform portion upward from the side away from the first platform portion to form a third sidewall, bending horizontally along the edge of the third sidewall to form a third platform portion, and bending downward along the edge of the third platform portion to form a fourth sidewall.

[0007] As an improvement to the above solution, pads are formed on the upper surfaces of the first platform section, the second platform section and the third platform section, and pins are formed on the lower surface of the second platform section.

[0008] As an improvement to the above solution, the cup-shaped structure includes a first cup-shaped structure, a second cup-shaped structure and a third cup-shaped structure. The first cup-shaped structure is disposed on the upper surface of the first platform portion, the second cup-shaped structure is disposed on the upper surface of the second platform portion and is disposed between the first sidewall and the third sidewall, and the third cup-shaped structure is disposed on the upper surface of the third platform portion.

[0009] The upper surfaces of the first cup-shaped structure, the second cup-shaped structure, and the third cup-shaped structure are located on the same horizontal plane.

[0010] Accordingly, the present invention also provides an LED bead, including an LED chip, an encapsulating adhesive layer and the aforementioned bead support, wherein a plurality of the LED chips are respectively disposed on the first platform portion, the second platform portion and the third platform portion, and the encapsulating adhesive layer is disposed in the cup-shaped structure and at least covers the LED chips.

[0011] As an improvement to the above solution, the metal bracket includes a first metal bracket, a second metal bracket, a third metal bracket, a fourth metal bracket, and a fifth metal bracket, which are spaced apart along a first direction.

[0012] As an improvement to the above solution, the upper surfaces of the first metal bracket, the second metal bracket, the fourth metal bracket and the fifth metal bracket are each formed with independent pads, and the upper surface of the third metal bracket is formed with a common pad.

[0013] The lower surfaces of the first, second, fourth, and fifth metal brackets each form independent pins, while the lower surface of the third metal bracket forms a common pin.

[0014] As an improvement to the above solution, the LED chip includes a first LED chip, a second LED chip, a third LED chip, and a fourth LED chip. The first LED chip is disposed on the first platform portion of the third metal bracket, the second LED chip is disposed on the third platform portion of the third metal bracket, the third LED chip is disposed on the second platform portion of the second metal bracket, and the fourth LED chip is disposed on the second platform portion of the fourth metal bracket.

[0015] As an improvement to the above solution, the two electrodes of the first LED chip are electrically connected to the second metal bracket and the third metal bracket, respectively; the two electrodes of the second LED chip are electrically connected to the third metal bracket and the fourth metal bracket, respectively; the two electrodes of the third LED chip are electrically connected to the first metal bracket and the third metal bracket, respectively; and the two electrodes of the fourth LED chip are electrically connected to the third metal bracket and the fifth metal bracket, respectively.

[0016] As an improvement to the above solution, all LED chips are blue light chips.

[0017] Implementing this utility model has the following beneficial effects:

[0018] The LED chip holder provided by this utility model uses multiple metal brackets spaced apart along a first direction to fix multiple LED chips. Each metal bracket includes a first platform, a second platform, and a third platform, which can extend the path for moisture to penetrate into the LED chip and improve the airtightness of the LED chip. Different cup-shaped structures are provided on different platform sections, which is equivalent to integrating multiple white light emitting structures into one, so as to meet the needs of different color temperatures, different color rendering indices, and different brightness, and improve product competitiveness. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the LED bead holder provided by this utility model;

[0020] Figure 2 This is a top view of the LED bead holder provided by this utility model;

[0021] Figure 3 This is a bottom view of the LED bead holder provided by this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the support body provided by this utility model;

[0023] Figure 5 This is a schematic diagram of the structure of the LED lamp bead provided by this utility model;

[0024] Figure 6 This is a top view of the LED lamp bead provided by this utility model. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the following will describe this utility model in further detail with reference to the accompanying drawings. It is hereby declared that the terms "up," "down," "left," "right," "front," "back," "inner," and "outer," etc., appearing or about to appear in this document, are based solely on the accompanying drawings and are not intended to specifically limit this utility model.

[0026] like Figures 1-3 As shown, this utility model embodiment provides a lamp bead bracket 300, including a bracket body 1 and a plurality of cup-shaped structures 2 disposed on the upper surface of the bracket body 1. The bracket body 1 includes an encapsulating resin body 11 and a plurality of metal brackets 12 spaced apart along a first direction. Each metal bracket 12 includes a first platform portion 121, a second platform portion 122 and a third platform portion 123 disposed along a second direction. The plurality of cup-shaped structures 2 are respectively disposed on the upper surface of the first platform portion 121, the second platform portion 122 and the third platform portion 123.

[0027] The LED chip holder 300 provided by this utility model fixes multiple LED chips through multiple metal brackets 12 spaced apart along a first direction. Each metal bracket 12 includes a first platform portion 121, a second platform portion 122, and a third platform portion 123, which can extend the path for water vapor to penetrate into the LED chip and improve the airtightness of the LED chip. Different cup-shaped structures 2 are provided on the upper surface of different platform portions, which is equivalent to integrating multiple white light emitting structures into one, realizing the needs of different color temperatures, different color rendering indices, and different brightness, and improving product competitiveness.

[0028] It should be noted that, as Figure 2 As shown, the first direction is the width direction of the LED bead bracket 300 in the top view, and the second direction is the length direction of the LED bead bracket 300 in the top view, which is the perpendicular direction of the first direction on the same horizontal plane.

[0029] Specifically, the metal bracket 12 is bent upward from one side of the second platform portion 122 to form a first sidewall 124, bent horizontally along the edge of the first sidewall 124 to form a first platform portion 121, and bent downward along the edge of the first platform portion 121 to form a second sidewall 125.

[0030] The metal bracket 12 is formed by bending upward from the side of the second platform portion 122 away from the first platform portion 121 to form a third side wall 126, bending horizontally along the edge of the third side wall 126 to form a third platform portion 123, and bending downward along the edge of the third platform portion 123 to form a fourth side wall 127.

[0031] In other words, the second platform section 122, the first platform section 121, and the third platform section 123 are located on different horizontal planes. The sidewall formed by the bend increases the difficulty for water vapor to enter the lamp bead, thereby further avoiding the problem that water vapor in the planar structure can easily seep into the lamp bead along the pin part and cause the lamp to burn out.

[0032] In one embodiment, the upper surfaces of the first platform portion 121, the second platform portion 122, and the third platform portion 123 form pads, and the lower surface of the second platform portion 122 forms pins. The upper surfaces of the first platform portion 121, the second platform portion 122, and the third platform portion 123 are used to fix the LED chip and form an electrical connection with the LED chip, and the lower surface of the second platform portion 122 is used to solder to a PCB or circuit as a channel for current input and / or output.

[0033] In a preferred embodiment, the cup-shaped structure 2 includes a first cup-shaped structure 2a, a second cup-shaped structure 2b, and a third cup-shaped structure 2c. The first cup-shaped structure 2a is disposed on the upper surface of the first platform portion 121, the second cup-shaped structure 2b is disposed on the upper surface of the second platform portion 122 and between the first sidewall 124 and the third sidewall 126, and the third cup-shaped structure 2c is disposed on the upper surface of the third platform portion 123. The upper surfaces of the first cup-shaped structure 2a, the second cup-shaped structure 2b, and the third cup-shaped structure 2c are located on the same horizontal plane. The overall structure of the LED bead bracket 300 is regular, and the flush cup-shaped structures 2 prevent some of the light emitted by the LED chip from being blocked by the sidewalls of adjacent cup-shaped structures 2, making the light from different LED chips more uniformly superimposed in space.

[0034] like Figures 4-6 As shown, this utility model embodiment also provides an LED lamp bead, including an LED chip 100, an encapsulating adhesive layer 200 and the aforementioned lamp bead bracket 300. A plurality of LED chips 100 are respectively disposed on the first platform portion 121, the second platform portion 122 and the third platform portion 123. The encapsulating adhesive layer 200 is disposed in the cup-shaped structure 2 and at least covers the LED chip 100.

[0035] In one embodiment, the metal bracket 12 includes a first metal bracket 12a, a second metal bracket 12b, a third metal bracket 12c, a fourth metal bracket 12d, and a fifth metal bracket 12e, wherein the first metal bracket 12a, the second metal bracket 12b, the third metal bracket 12c, the fourth metal bracket 12d, and the fifth metal bracket 12e are spaced apart along a first direction.

[0036] In a preferred embodiment, the upper surfaces of the first metal bracket 12a, the second metal bracket 12b, the fourth metal bracket 12d, and the fifth metal bracket 12e are each formed with an independent pad, and the upper surface of the third metal bracket 12c is formed with a common pad.

[0037] The lower surfaces of the first metal bracket 12a, the second metal bracket 12b, the fourth metal bracket 12d, and the fifth metal bracket 12e each form independent pins, while the lower surface of the third metal bracket 12c forms a common pin.

[0038] Correspondingly, the LED chip 100 includes a first LED chip 100a, a second LED chip 100b, a third LED chip 100c, and a fourth LED chip 100d. The first LED chip 100a is disposed on the first platform portion 121 of the third metal bracket 12c, the second LED chip 100b is disposed on the third platform portion 123 of the third metal bracket 12c, the third LED chip 100c is disposed on the second platform portion 122 of the second metal bracket 12b, and the fourth LED chip 100d is disposed on the second platform portion 122 of the fourth metal bracket 12d.

[0039] The two electrodes of the first LED chip 100a are electrically connected to the second metal bracket 12b and the third metal bracket 12c, respectively. The two electrodes of the second LED chip 100b are electrically connected to the third metal bracket 12c and the fourth metal bracket 12d, respectively. The two electrodes of the third LED chip 100c are electrically connected to the first metal bracket 12a and the third metal bracket 12c, respectively. The two electrodes of the fourth LED chip 100d are electrically connected to the third metal bracket 12c and the fifth metal bracket 12e, respectively.

[0040] Preferably, all LED chips 100 are blue light chips. That is, by applying different encapsulants to the first LED chip 100a and the second LED chip 100b, different color temperatures and color rendering indexes can be achieved using the first cup-shaped structure 2a and the second cup-shaped structure 2b. The third cup-shaped structure 2c can house the third LED chip 100c and the fourth LED chip 100d to meet different display brightness requirements. In practical use, different white light requirements can also be combined according to other customer needs.

[0041] In addition, the metal bracket 12 can be made of copper-based material, and the encapsulated resin body 11 and the cup-shaped structure 2 can both be made of PCT. PCT has high temperature resistance and stability, and is especially suitable for high-power LED brackets that need to withstand high-temperature welding and long-term high heat load.

[0042] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

Claims

1. A lamp bead holder, characterized in that, The device includes a support body and a plurality of cup-shaped structures disposed on the upper surface of the support body. The support body includes an encapsulating resin body and a plurality of metal supports spaced apart along a first direction. Each metal support includes a first platform portion, a second platform portion, and a third platform portion disposed along a second direction. The plurality of cup-shaped structures are respectively disposed on the upper surface of the first platform portion, the second platform portion, and the third platform portion.

2. The LED bead bracket as described in claim 1, characterized in that, The metal bracket is formed by bending upward from one side of the second platform portion to form a first sidewall, bending horizontally along the edge of the first sidewall to form a first platform portion, and bending downward along the edge of the first platform portion to form a second sidewall. The metal bracket is formed by bending the second platform portion upward from the side away from the first platform portion to form a third sidewall, bending horizontally along the edge of the third sidewall to form a third platform portion, and bending downward along the edge of the third platform portion to form a fourth sidewall.

3. The LED bead bracket as described in claim 1, characterized in that, Pads are formed on the upper surfaces of the first platform section, the second platform section and the third platform section, and pins are formed on the lower surface of the second platform section.

4. The LED bead bracket as described in claim 1, characterized in that, The cup-shaped structure includes a first cup-shaped structure, a second cup-shaped structure, and a third cup-shaped structure. The first cup-shaped structure is disposed on the upper surface of the first platform portion, the second cup-shaped structure is disposed on the upper surface of the second platform portion and is disposed between the first sidewall and the third sidewall, and the third cup-shaped structure is disposed on the upper surface of the third platform portion. The upper surfaces of the first cup-shaped structure, the second cup-shaped structure, and the third cup-shaped structure are located on the same horizontal plane.

5. An LED lamp bead, comprising an LED chip, an encapsulating layer, and a lamp bead bracket as described in any one of claims 1 to 4, characterized in that, Multiple LED chips are respectively disposed on the first platform portion, the second platform portion and the third platform portion, and the encapsulating adhesive layer is disposed in the cup-shaped structure and at least covers the LED chips.

6. The LED lamp bead as described in claim 5, characterized in that, The metal support includes a first metal support, a second metal support, a third metal support, a fourth metal support, and a fifth metal support, which are spaced apart along a first direction.

7. The LED lamp bead as described in claim 6, characterized in that, The upper surfaces of the first metal bracket, the second metal bracket, the fourth metal bracket, and the fifth metal bracket each form an independent pad, while the upper surface of the third metal bracket forms a common pad. The lower surfaces of the first, second, fourth, and fifth metal brackets each form independent pins, while the lower surface of the third metal bracket forms a common pin.

8. The LED lamp bead as described in claim 6, characterized in that, The LED chip includes a first LED chip, a second LED chip, a third LED chip, and a fourth LED chip. The first LED chip is disposed on the first platform portion of the third metal bracket, the second LED chip is disposed on the third platform portion of the third metal bracket, the third LED chip is disposed on the second platform portion of the second metal bracket, and the fourth LED chip is disposed on the second platform portion of the fourth metal bracket.

9. The LED lamp bead as described in claim 8, characterized in that, The two electrodes of the first LED chip are electrically connected to the second metal bracket and the third metal bracket, respectively. The two electrodes of the second LED chip are electrically connected to the third metal bracket and the fourth metal bracket, respectively. The two electrodes of the third LED chip are electrically connected to the first metal bracket and the third metal bracket, respectively. The two electrodes of the fourth LED chip are electrically connected to the third metal bracket and the fifth metal bracket, respectively.

10. The LED lamp bead as described in claim 8, characterized in that, All LED chips are blue light chips.

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