An air flow rectifying device

Abstract

The utility model relates to the technical field of semiconductor, concretely relates to an airflow rectifying device, include: shunt bottom plate, liquid medicine separation groove, support column, welding base and VAT base, shunt bottom plate surrounds and is installed in the periphery of liquid medicine separation groove, its installation height is higher than liquid medicine separation groove, forms annular flow guide groove, and the vertical airflow of fan filter unit is guided to the center area of liquid medicine separation groove, shunt bottom plate both sides are equipped with the wiring groove respectively, form the edge flow guide groove, and the edge airflow of fan filter unit is guided to the center area of liquid medicine separation groove, support column top end connects shunt bottom plate, bottom end connects the top end of welding base, and the bottom end of welding base connects VAT base, and liquid medicine separation groove and VAT base form non -contact type vertical space layout, the utility model has realized the beneficial effect of improving FFU air supply device airflow utilization rate and ventilation rate, and further promotes the beneficial effect of semiconductor manufacturing production efficiency and product quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and specifically to an airflow rectification device. Background Technology

[0002] In the semiconductor manufacturing industry, cleanroom environmental control has a decisive impact on product yield. Among these components, FFUs (Fan Filter Units) are key devices for maintaining air cleanliness. Traditionally, FFUs use built-in fans and high-efficiency particulate filters (HEPA / ULPA) to vertically direct air downwards, creating a positive pressure environment in the target area to prevent external contaminants from entering and to directionally expel particulate matter. While this direct downward airflow method can ensure basic cleanliness, the lack of precise airflow control results in a significant amount of airflow not being effectively utilized. Meeting process requirements relies solely on increasing the number of FFUs or the airflow volume, leading to high energy consumption and low efficiency.

[0003] The existing FFU direct air supply mode has obvious drawbacks: because the airflow is not guided, most of the airflow diffuses in all directions under positive pressure, failing to concentrate on covering the core process area, resulting in low airflow utilization. At the same time, disordered flow is prone to turbulence and dead zones, increasing the risk of pollutant retention, making it difficult to meet the requirements of high cleanliness levels (such as ISO Class 5 and above) in terms of actual air changes per hour (ACH).

[0004] Therefore, how to improve the airflow utilization efficiency of FFU, achieve precise air delivery, and enhance the ventilation effect has become an urgent technical problem to be solved. Utility Model Content

[0005] To solve the above technical problems, this utility model provides an airflow rectification device.

[0006] The technical problem solved by this utility model can be achieved by the following technical solution:

[0007] An airflow rectification device includes: a flow-diverting base plate, a liquid separation tank, a support column, a welding base, and a VAT base;

[0008] The diversion base plate is installed around the periphery of the liquid separation tank, and its installation height is higher than that of the liquid separation tank, forming an annular guide channel to guide the vertical airflow of the fan filter unit to the central area of ​​the liquid separation tank; the diversion base plate is provided with wiring grooves on both sides to form edge guide channels to guide the edge airflow of the fan filter unit to the central area of ​​the liquid separation tank.

[0009] The support column serves as a vertical support component, with its top end connected to the diversion base plate and its bottom end connected to the top end of the welding base. The bottom end of the welding base is connected to the VAT base.

[0010] The drug separation tank and the VAT base form a non-contact vertical spatial layout.

[0011] Preferably, the bottom of the welding base is provided with U-shaped grooves on both sides.

[0012] Preferably, the material of the diversion base plate is FM PVC or FM HT PVC.

[0013] Preferably, the airflow rectification device is integrated into the wet processing equipment chamber, which contains multiple modules. According to the configuration and spatial layout requirements of the modules, the diversion base plate is cut with holes to allow the modules to pass through. There is a gap between the modules and the diversion base plate to form a non-contact layout.

[0014] Preferably, the gap between the module and the diversion base plate is 3mm.

[0015] Preferably, the module includes:

[0016] A robotic arm is installed around the liquid separation tank and passes through the opening in the diversion base plate for liquid spraying and cleaning of the wafers.

[0017] A drain cup is installed on the side of the robotic arm, corresponding to the spraying position of the robotic arm, and is used for draining the liquid from the robotic arm and for pre-spraying the liquid.

[0018] A wafer inspection sensor is installed at the edge of the liquid separation tank or on the wafer transport path to detect the level and presence of the wafer;

[0019] A fixed nozzle works in conjunction with the robotic arm for clean cleaning and emergency cleaning of wafers.

[0020] Preferably, the connection between the diversion base plate and the support column is made of external hexagonal bolts.

[0021] Preferably, the support column is connected to the welding base by bolts or a fixed seat sleeve.

[0022] Preferably, the welding base and the VAT base are movably connected by a movable screw.

[0023] Preferably, the welding base and the VAT base are fixedly connected by bolts or welding.

[0024] The advantages or beneficial effects of this utility model are as follows: By adopting the above technical solution, this utility model forms an annular guide channel and an edge guide channel through the coordinated design of the diversion bottom plate and the drug liquid separation tank, which guides the disordered vertical airflow of FFU to the core process area, significantly improving the airflow utilization efficiency, reducing turbulence and dead zones, and meeting the air exchange effect requirements of high cleanliness level while reducing energy consumption. Attached Figure Description

[0025] Figure 1 This is a schematic diagram illustrating the working principle of the airflow rectification device of this utility model.

[0026] Figure 2 This is an isometric structural diagram of the airflow rectification device of this utility model;

[0027] Figure 3 This is a partially enlarged view of the equiaxial structure of the airflow rectification device of this utility model;

[0028] Figure 4 This diagram illustrates the anti-liquid accumulation function of the welding base of the airflow rectification device of this utility model.

[0029] Figure 5 This is an isometric structural diagram of the airflow rectification device of this utility model after installation, including the chamber;

[0030] Figure 6 This is an isometric top view of the airflow rectification device of this utility model after installation, including the chamber.

[0031] Explanation of reference numerals in the attached drawings: 1. External hex bolt; 2. Support column; 3. Welded base; 4. Diverter base plate; 5. First robotic arm; 6. Liquid separation tank; 7. First drain cup; 8. Wafer inspection sensor; 9. Second robotic arm; 10. First wiring channel; 11. Second drain cup; 12. Fixed nozzle; 13. Second robotic arm; 14. Second wiring channel; 15. U-shaped slot; 16. VAT base. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0034] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0035] Reference Figure 1 , Figure 2 and Figure 5 This utility model provides an airflow rectification device, including: a diversion base plate 4, a liquid separation tank 6, a support column 2, a welding base 3, and a VAT base (Vacuum Assembly Technology) 16;

[0036] The diversion base plate 4 is installed around the periphery of the liquid separation tank 6, and its installation height is higher than that of the liquid separation tank 6, forming an annular guide channel to guide the vertical airflow of the fan filter unit to the central area of ​​the liquid separation tank 6; the diversion base plate 4 is provided with wiring channels (including the first wiring channel 10 and the second wiring channel 14) on both sides, forming an edge guide channel to guide the edge airflow of the fan filter unit to the central area of ​​the liquid separation tank.

[0037] The support column 2 serves as a vertical support component, with its top end connected to the diversion base plate 4 and its bottom end connected to the top end of the welding base 3. The bottom end of the welding base 3 is connected to the VAT base 16.

[0038] The liquid separation tank 6 and the VAT base 16 form a non-contact vertical spatial layout.

[0039] Specifically, in this embodiment of the invention, to address the problems of insufficient cleanliness, high energy consumption, and low airflow utilization caused by the disordered diffusion of airflow in traditional FFUs, a ring-shaped flow guiding structure is formed by the stepped height difference between the diversion base plate 4 and the liquid separation tank 6. This structure directs the vertical airflow of the FFU to the core process area, while the wiring channels constrain the edge airflow, achieving precise airflow convergence and turbulence suppression. This design avoids the defects of turbulence and dead zones in traditional models, effectively improving ventilation efficiency through the physical constraint of the airflow path. Under the same FFU configuration, ISO Class 5 cleanliness can be achieved while reducing fan energy consumption. The non-contact vertical layout further avoids the interference of structural vibration on airflow stability, and compared with traditional solutions, the particulate matter discharge rate is greatly improved.

[0040] In a preferred embodiment of this utility model, the welding base 3 has an anti-liquid accumulation function, then refer to... Figure 3 and Figure 4The welding base 3 has U-shaped slots 15 on both sides of its bottom end. Liquid seeps into the welding base 3 along the support column 2 and flows out through the U-shaped slots 15 on both sides of the bottom of the welding base 3, avoiding contamination caused by long-term liquid accumulation or reduced service life of the support column 2. Specifically, the bottom of the welding base 3 can be sloped at 1-3° towards the U-shaped slots 15. When cleaning fluid or condensate flows into the welding base 3 along the support column 2, the liquid automatically flows to the U-shaped slots 15 and is discharged under gravity. At the same time, the inner surface of the U-shaped slots 15 is polished, with a surface roughness Ra≤0.8μm, which can effectively reduce liquid flow resistance and prevent liquid droplet residue. In addition, the welding base 3 has a guide channel inside, and the joint with the support column 2 is sealed by welding, leaving only a liquid channel to ensure that the liquid can only be discharged through the designed path and will not seep into other areas and cause contamination.

[0041] In a preferred embodiment of this invention, the diversion base plate 4 is white and made of FM PVC or FM HT PVC. Specifically, the use of white FM PVC (fire-retardant and anti-static polyvinyl chloride) or FM HT PVC (high-temperature resistant, fire-retardant, and anti-static polyvinyl chloride) not only provides excellent airflow guidance performance but also effectively prevents dust adsorption caused by static electricity accumulation. The white surface treatment increases light reflectivity, making it easier for operators to observe the airflow distribution and for visual inspection devices to identify the position of the diversion base plate 4. This material has excellent chemical corrosion resistance and can withstand various cleaning agents used in semiconductor manufacturing processes. Its fire resistance meets the UL94 V-0 standard, ensuring safety in cleanroom environments. Furthermore, the lightweight nature of FM PVC (density approximately 1.4 g / cm³) further enhances its advantages. 3 It reduces the load on the supporting structure, while its high rigidity (elastic modulus ≥3000MPa) ensures the structural stability under the impact of high-speed airflow.

[0042] In addition, the diversion base plate 4 can also be made of other plastic materials, and its thickness can be increased or decreased according to requirements. For example, the diversion base plate 4 can be made of engineering plastics such as PEEK (polyetheretherketone), PTFE (polytetrafluoroethylene), or PC (polycarbonate) according to different working conditions. These materials not only have excellent mechanical strength and chemical corrosion resistance, but also meet the strict requirements of semiconductor cleanrooms for low gas release. The thickness of the diversion base plate 4 is designed to be 3-10mm. The thinner 3-5mm solution is suitable for low wind speed (0.3-0.5m / s) scenarios to reduce pressure drop loss, while the thicker 8-10mm solution is suitable for high wind speed (0.8-1.2m / s) environments to ensure structural rigidity. All material surfaces are treated with antistatic agents and polished to a smooth finish (Ra≤0.4μm), which avoids particulate matter adsorption and optimizes the laminar flow characteristics.

[0043] In a preferred embodiment of this utility model, the airflow rectification device is integrated into the chamber of a wet processing equipment. Multiple modules are arranged within the chamber. Based on the configuration and spatial layout requirements of the modules, the diversion base plate 4 is cut with holes to allow the modules to pass through. A 3mm gap is provided between the modules and the diversion base plate 4, forming a non-contact layout. (Refer to...) Figure 2 and Figure 5 The openings in the diversion base plate 4 are designed as rectangular or circular structures to match the shape of the module. The edges of the openings are treated with a precision chamfering process to ensure a smooth airflow transition. The 3mm gap is ensured by high-precision machining, providing the necessary space for module movement while effectively constraining the airflow path. This non-contact layout achieves triple optimization through physical isolation: first, it avoids interference with airflow stability caused by structural vibration; second, it eliminates the risk of particulate contamination caused by metal-to-metal contact friction; and third, it significantly improves the utilization efficiency of clean airflow by optimizing the airflow path. In specific implementations, circular or rectangular opening designs can be flexibly adopted for modules in different functional areas, and the opening positions and sizes can be optimized through computational fluid dynamics (CFD) simulation to ensure that airflow uniformly covers all critical process areas.

[0044] As a preferred embodiment of this utility model, refer to Figure 5 and Figure 6 The module includes:

[0045] The robotic arm (ARM), including a first robotic arm 5, a second robotic arm 9, and a second robotic arm 13, is installed around the liquid separation tank and passes through the opening of the diversion base plate for liquid spraying and cleaning of the wafer.

[0046] The drain cup (CUP), including a first drain cup 7 and a second drain cup 11, is installed on the side of the robotic arm, corresponding to the spraying position of the robotic arm, and is used for draining ARM medicine and pre-spraying drain.

[0047] The wafer inspection sensor 8 is installed at the edge of the liquid separation tank or the wafer transport path to detect the level and presence of the wafer;

[0048] The fixed nozzle 12 (FIX NZ) works in conjunction with the robotic arm for clean cleaning and emergency cleaning of wafers.

[0049] In addition, the liquid separation tank (BOWL) and the wiring trough are also modules within the cavity. The liquid separation tank (BOWL) is used for separating and draining different liquids after use. The wiring trough is used to provide wiring channels for other modules, with wiring passing through the trough to the connector below.

[0050] Specifically, in this embodiment of the invention, the modules such as the robotic arm, drain cup, wafer inspection sensor 8, and fixed nozzle 12 are designed in a coordinated manner with the openings of the diversion base plate 4. Each module maintains a uniform 3mm gap when passing through the openings, ensuring both mechanical freedom of movement and airflow guidance. The robotic arm (ARM) employs a multi-axis linkage design, forming a dynamic working radius above the liquid separation tank 6 (BOWL), complementing the cleaning coverage of the fixed nozzle 12 (FIX NZ). The drain cup (CUP) precisely corresponds to the spray position of the robotic arm through negative pressure drainage, achieving efficient liquid recovery. The wafer inspection sensor 8 integrates an optical detection module, providing real-time feedback of wafer position and status to the control system. All module wiring is centrally managed through wiring channels, avoiding cable interference with the airflow path. Simultaneously, the non-contact layout effectively isolates vibration transmission, ensuring simultaneous optimization of particle control and liquid treatment efficiency in an ISO Class 5 clean environment.

[0051] In a preferred embodiment of this invention, the connection between the diversion base plate 4 and the support column 2 is achieved using external hexagonal bolts 1. Specifically, the external hexagonal bolts 1 are made of stainless steel with a nickel-plated surface to improve corrosion resistance. The bolt specification is M8×25 to ensure the connection strength meets the requirements of high-speed airflow impact. The connection between the diversion base plate 4 and the support column 2 has precision-machined positioning holes, which, combined with the hexagonal head design of the bolts, enable quick and precise assembly, while also facilitating subsequent maintenance and disassembly. Furthermore, silicone sealing gaskets are installed between the bolt connection surfaces to prevent airflow leakage and absorb micro-vibrations during equipment operation, ensuring structural stability over long-term use. Compared to traditional welding processes, this connection method offers better adjustability and maintenance convenience, allowing for fine-tuning of the height and level of the diversion base plate according to actual airflow distribution requirements.

[0052] In a preferred embodiment of this invention, the support column 2 and the welding base 3 are connected by bolts or a fixed sleeve. Specifically, when using a bolt connection, precision-machined threaded holes are provided at the bottom of the support column 2 and the top of the welding base 3 to ensure a stable connection and facilitate disassembly and maintenance. When using a fixed sleeve, the bottom of the support column 2 is designed with a positioning flange, forming an interference fit with the precision-machined groove on the welding base 3. The fit tolerance is controlled at H7 / k6 level, and epoxy structural adhesive is used for auxiliary fixation. Both connection methods have been verified by vibration testing and will not loosen within the operating frequency range of the FFU fan (20-100Hz). The contact resistance of the connection part is less than 0.1Ω, meeting the anti-static requirements. This modular connection design ensures structural strength while facilitating on-site installation, commissioning, and subsequent maintenance and replacement.

[0053] As a preferred embodiment of this utility model, refer to Figure 5The welding base 3 and VAT base 16 of this invention are fixedly connected by bolts or welding. Specifically, when using bolts, M10 high-strength stainless steel bolts are selected with anti-loosening washers. Precision-machined mounting holes are provided on the bottom of the welding base 3 and the VAT base 16 to ensure a stable connection and facilitate future maintenance. When using welding, TIG welding is used with ER308L stainless steel welding wire. The weld height is controlled at 3-5mm, and X-ray flaw detection is performed after welding to ensure welding quality. Both connection methods have undergone rigorous vibration and sealing tests, maintaining a stable connection under semiconductor equipment operating conditions (vibration frequency 5-200Hz, acceleration 0.5-2g), and the airtightness of the connection meets the ISO 14644-1 Class 5 cleanliness standard requirements. This flexible connection scheme can be selected according to different installation environments and maintenance needs, ensuring structural strength while meeting the stringent cleanliness and stability requirements of semiconductor equipment.

[0054] In addition, the welding base 3 and the VAT base 16 can also be connected via a movable screw. This movable screw connection combines flexibility and stability, allowing for fine-tuning within a certain range to adapt to different process requirements or optimize airflow distribution. Specifically, the movable screw adopts a precision ball screw structure, with a high-precision linear guide rail on the VAT base 16. Combined with the adjustment mechanism at the bottom of the welding base 3, bidirectional adjustment along the X / Y axes (adjustment range ±15mm, accuracy 0.05mm) can be achieved. The adjustment mechanism is equipped with a digital display dial and a self-locking device; after adjustment, the position can be fixed by tightening the locking nut. This connection method uses stainless steel with a special surface treatment (surface roughness Ra≤0.4μm), meeting cleanroom dustproof requirements while withstanding vibrations generated by the FFU system (vibration frequency 20-100Hz, amplitude ≤0.1mm).

[0055] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An airflow rectification device, characterized in that, include: Diversion base plate, liquid separation tank, support column, welding base and VAT base; The diversion base plate is installed around the periphery of the liquid separation tank, and its installation height is higher than that of the liquid separation tank, forming an annular guide channel to guide the vertical airflow of the fan filter unit to the central area of ​​the liquid separation tank; the diversion base plate is provided with wiring grooves on both sides to form edge guide channels to guide the edge airflow of the fan filter unit to the central area of ​​the liquid separation tank. The support column serves as a vertical support component, with its top end connected to the diversion base plate and its bottom end connected to the top end of the welding base. The bottom end of the welding base is connected to the VAT base. The drug separation tank and the VAT base form a non-contact vertical spatial layout.

2. The airflow rectification device according to claim 1, characterized in that, The welding base has U-shaped grooves on both sides of its bottom end.

3. The airflow rectification device according to claim 1, characterized in that, The material of the diversion base plate is FM PVC or FM HT PVC.

4. The airflow rectification device according to claim 1, characterized in that, The airflow rectification device is integrated into the wet processing equipment chamber, which contains multiple modules. According to the configuration and spatial layout requirements of the modules, the diversion base plate is cut with holes to allow the modules to pass through. There is a gap between the modules and the diversion base plate to form a non-contact layout.

5. The airflow rectification device according to claim 4, characterized in that, The gap between the module and the distribution base plate is 3mm.

6. The airflow rectification device according to claim 4, characterized in that, The module includes: A robotic arm is installed around the liquid separation tank and passes through the opening in the diversion base plate for liquid spraying and cleaning of the wafers. A drain cup is installed on the side of the robotic arm, corresponding to the spraying position of the robotic arm, and is used for draining the liquid from the robotic arm and for pre-spraying the liquid. A wafer inspection sensor is installed at the edge of the liquid separation tank or on the wafer transport path to detect the level and presence of the wafer; A fixed nozzle works in conjunction with the robotic arm for clean cleaning and emergency cleaning of wafers.

7. The airflow rectification device according to claim 1, characterized in that, The connection between the diversion base plate and the support column is made of external hexagonal bolts.

8. The airflow rectification device according to claim 1, characterized in that, The support column is connected to the welding base by bolts or a fixed seat sleeve.

9. The airflow rectification device according to claim 1, characterized in that, The welding base and the VAT base are movably connected by movable screws.

10. The airflow rectification device according to claim 1, characterized in that, The welding base and the VAT base are fixedly connected by bolts or welding.

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