Wafer marking machine

Abstract

The utility model embodiment provides a kind of wafer marking machine, and wafer marking machine includes marking machine platform.The marking machine platform includes installation platform and the positioning mounting plate installed on installation platform, and the positioning mounting plate is used to place the wafer to be marked, and two interval arrangement's strip slot is opened on the positioning mounting plate, in the extension direction of strip slot, the interval of two strip slots changes, and strip slot is used to place positioning pin, and positioning pin can move in the extension direction of strip slot.Because positioning pin can move in the extension direction of strip slot, two positioning pins can move in two strip slots respectively, can change the position of positioning pin on positioning mounting plate, to enable the wafer of different sizes to be positioned, so that wafer marking machine can mark the wafer of different sizes.

Description

Technical Field

[0001] This utility model relates to the field of wafer marking technology, and more specifically, to a wafer marking machine. Background Technology

[0002] Wafer marking machines are critical precision devices in the semiconductor manufacturing process, primarily used to permanently mark the surface of semiconductor wafers. These markings are essential for subsequent production tracking, quality control, yield analysis, and product traceability.

[0003] Wafer marking machines typically have a positioning mounting plate. Holes on the mounting plate engage with positioning pins, which are then matched with the wafer positioning adapter to achieve coarse positioning and orientation alignment of the wafer, ensuring precise marking.

[0004] Some laser marking machines in related technologies can only mark wafers of a certain size. Utility Model Content

[0005] The purpose of this invention is to provide a wafer marking machine that can be adapted to wafers of different sizes and can mark wafers of various sizes.

[0006] The embodiments of this utility model can be implemented as follows: In a first aspect, this utility model provides a wafer marking machine, comprising: The marking machine base includes a mounting table and a positioning mounting plate mounted on the mounting table. The positioning mounting plate is used to place the wafer to be marked. The positioning mounting plate has two spaced-apart strip grooves. The distance between the two strip grooves varies in the extension direction of the strip grooves. The strip grooves are used to place positioning pins, which can move in the extension direction of the strip grooves.

[0007] In an optional embodiment, the strip groove extends through the positioning mounting plate along the thickness direction of the positioning mounting plate. The strip groove includes a first groove and a second groove that are connected and arranged sequentially along the thickness direction of the positioning mounting plate. The width of the first groove is greater than the width of the second groove, and the first groove is closer to the mounting platform than the second groove. The positioning pin includes a pin head and a pin shaft portion. The radial dimension of the pin shaft portion is smaller than the radial dimension of the pin head. The pin head and the pin shaft portion are respectively accommodated in the first groove and the second groove.

[0008] In an optional implementation, the pin head's axial dimension is less than or equal to the dimension of the first groove in the thickness direction of the positioning mounting plate.

[0009] In an optional implementation, the locating pin can be locked or unlocked relative to the slot.

[0010] In an optional implementation, the positioning mounting plate is detachably mounted on the mounting platform.

[0011] In an alternative implementation, the positioning mounting plate is mounted to the mounting platform using threaded fasteners.

[0012] In an optional embodiment, a recess is provided on the side of the positioning mounting plate away from the mounting platform. The recess is used to accommodate the head of the threaded fastener. A mating hole is provided at the bottom of the recess, which penetrates the positioning mounting plate along the thickness direction. The mounting platform is provided with a threaded hole opposite to the mating hole.

[0013] In an optional implementation, there are multiple sinks, which are arranged in a rectangular array on the positioning mounting plate.

[0014] In an optional implementation, a dust collection groove is also provided on the positioning mounting plate.

[0015] In an optional implementation, the ash collection trough is located between two strip troughs.

[0016] The beneficial effects provided by this embodiment of the invention include: A wafer marking machine provided by this embodiment includes a marking machine base. The marking machine base includes a mounting table and a positioning mounting plate mounted on the mounting table. The positioning mounting plate is used to place the wafer to be marked. Two spaced-apart stripe grooves are formed on the positioning mounting plate. The distance between the two stripe grooves varies along their extension direction. The stripe grooves are used to place positioning pins, which can move along the extension direction of the stripe grooves. Because the positioning pins can move along the extension direction of the stripe grooves, the two positioning pins can move within the two stripe grooves respectively, changing the position of the positioning pins on the positioning mounting plate. This allows for the positioning of wafers of different sizes, enabling the wafer marking machine to mark wafers of different sizes. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a wafer marking machine provided in an embodiment of the present invention; Figure 2 A top-view structural diagram of the positioning mounting plate provided in an embodiment of this utility model; Figure 3 This is a structural schematic diagram of the positioning mounting plate provided in an embodiment of the present utility model, viewed from below.

[0019] Icons: 1-Wafer marking machine; 100-Marking machine table; 110-Mounting table; 120-Positioning mounting plate; 121-Strip groove; 1211-First groove; 1212-Second groove; 122-Sinking groove; 123-Mating hole; 124-Dust collection groove; 200-Positioning pin; 210-Pin head; 220-Pin shaft; 2-Wafer to be marked. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0026] In some existing wafer marking machines 1, the positioning mounting plate 120 is equipped with positioning holes to install positioning pins 200. During wafer fabrication, there are orientation characteristics; the wafer may have a positioning flat edge or a positioning notch on its outer periphery. The positioning pins 200 make positioning contact with the outer wall of the wafer (flat edge or positioning notch) to achieve coarse positioning and orientation alignment of the wafer, enabling the wafer marking machine 1 to perform precise marking. However, the position of the positioning pins 200 is fixed, and the wafer marking machine 1 can only mark wafers of a certain size.

[0027] To address the aforementioned issues, this utility model provides a wafer marking machine 1, which has a strip groove 121 on a positioning mounting plate 120. The positioning pin 200 can move within the strip groove 121 along the extension direction of the strip groove 121 to adapt to wafers of different sizes, so as to facilitate radial marking of wafers of various sizes.

[0028] The following describes in detail, with reference to the accompanying drawings, the specific structure of a wafer marking machine 1 provided by this utility model and the corresponding technical effects it brings.

[0029] Please refer to Figures 1-3 The present invention provides a wafer marking machine 1, which includes a marking machine table 100, a laser source, a lens, and other structures. The marking machine table 100 includes a mounting table 110 and a positioning mounting plate 120 mounted on the mounting table 110. The positioning mounting plate 120 is used to place the wafer 2 to be marked. The positioning mounting plate 120 has two spaced-apart strip grooves 121. The distance between the two strip grooves 121 varies in the extending direction of the strip grooves 121. The strip grooves 121 are used to place positioning pins 200, which can move in the extending direction of the strip grooves 121.

[0030] Understandably, since the positioning pin 200 can move in the extension direction of the strip groove 121, and the two positioning pins 200 can move in the two strip grooves 121 respectively, the position of the positioning pin 200 on the positioning mounting plate 120 can be changed. In this way, the position of the substrate can be freely adjusted and the two positioning pins 200 can be held to achieve positioning, thereby enabling the positioning of wafers of different sizes, so that the wafer marking machine 1 can mark wafers of different sizes.

[0031] Since the spacing between the two stripes 121 changes along the extension direction of the stripe 121, it can be understood that the spacing between the two stripes 121 gradually increases or decreases along the extension direction of the stripe 121, or the spacing first increases and then decreases, or the spacing first decreases and then increases. This can expand the wafer marking area.

[0032] Optionally, the strip groove 121 can be an arc-shaped groove or a straight groove. In this embodiment, the strip groove 121 is an arc-shaped groove, that is, the extension direction of the strip groove 121 extends along an arc. The wide openings of the two arc-shaped strip grooves 121 are arranged opposite each other.

[0033] Of course, in some other embodiments, the strip groove 121 can also be a straight groove, that is, the extension direction of the strip groove 121 extends in a straight line.

[0034] In detail, the strip groove 121 extends through the positioning mounting plate 120 along its thickness direction. The strip groove 121 includes a first groove 1211 and a second groove 1212 that are connected and sequentially arranged along the thickness direction of the positioning mounting plate 120. The width of the first groove 1211 is greater than the width of the second groove 1212, that is, the diameter of the first groove 1211 is greater than the diameter of the second groove 1212. Furthermore, the first groove 1211 is closer to the mounting platform 110 than the second groove 1212. The positioning pin 200 includes a pin head 210 and a pin shaft portion 220, the radial dimension of which is smaller than the radial dimension of the pin head.

[0035] It should be noted that in this embodiment, the first groove 1211 and the second groove 1212 have the same extension direction and length.

[0036] The pin head 210 and the pin shaft portion 220 are respectively accommodated in the first groove 1211 and the second groove 1212. That is, the strip groove 121 is a stepped groove formed by the first groove 1211 and the second groove 1212. It can be understood that the pin head 210 of the positioning pin 200 can move within the first groove 1211 along the extending direction of the strip groove 121, thereby driving the pin shaft portion 220 to move within the second groove 1212. When moving the positioning pin 200, the pin head 210 can also be moved within the first groove 1211 by driving the pin shaft portion 220 of the positioning pin 200 to move within the second groove 1212 along the extending direction of the strip groove 121. It should be noted that the pin shaft portion 220 extends out of the second groove 1212 to mate with the outer wall of the wafer 2 to be marked.

[0037] Optionally, in some embodiments, to avoid the pin head 210 affecting the installation of the positioning mounting plate 120 and the mounting platform 110, in this embodiment, the dimension of the pin head 210 in its own axial direction is less than or equal to the dimension of the first groove 1211 in the thickness direction of the positioning mounting plate 120. That is, the pin head 210 will not protrude from the first groove 1211. After the positioning mounting plate 120 and the mounting platform 110 are installed, the pin head 210 will not protrude from the first groove 1211, causing the positioning mounting plate 120 to tilt.

[0038] Of course, in some other embodiments, the pin head 210 may be larger in its own axial direction than the first groove 1211 may be larger in the thickness direction of the positioning mounting plate 120.

[0039] In detail, in this embodiment, the positioning pin 200 can be locked or unlocked relative to the slot 121. In other words, when the positioning pin 200 is locked relative to the slot 121, it means that the positioning pin 200 is fixed relative to the slot 121, and the positioning pin 200 cannot move within the slot 121. This ensures the stability of the positioning pin 200. When the positioning pin 200 is unlocked relative to the slot 121, the positioning pin 200 can move within the slot 121.

[0040] Optionally, the positioning pin 200 can be locked and unlocked with the slot 121 through other structures. For example, the positioning pin 200 can be locked with the slot 121 after the positioning mounting plate 120 is assembled with the mounting platform 110. That is, the axial dimension of the positioning pin 200 can be greater than or equal to the thickness of the first slot 1211 on the positioning mounting plate 120. In this case, the end face of the positioning pin 200 is flush with the side of the positioning mounting plate 120 near the mounting platform 110. When the positioning mounting plate 120 is securely installed on the mounting platform 110, the pin head 210 can be pressed between the mounting platform 110 and the end wall of the first slot 1211, so that the positioning pin 200 is fixed relative to the slot 121.

[0041] Alternatively, the locating pin 200 can be fixed to the groove wall of the slot 121 by a threaded fastener to lock the locating pin 200 to the slot 121. After the threaded fastener is released from locking the locating pin 200 to the slot 121, the locating pin 200 can move relative to the locating pin 200.

[0042] Optionally, to facilitate operator replacement of the positioning mounting plate 120, the positioning mounting plate 120 is detachably mounted on the mounting stage 110. Understandably, the detachable mounting of the positioning mounting plate 120 on the mounting stage 110 not only facilitates operator installation and removal but also allows for the replacement of positioning mounting plates 120 of different sizes to accommodate wafers of different sizes. In the event of damage to the positioning mounting plate 120, only the positioning mounting plate 120 needs to be replaced, without having to replace the mounting stage 110 as well, thus saving costs.

[0043] For example, the positioning mounting plate 120 is installed on the mounting platform 110 by threaded fasteners. It can be understood that installing the positioning mounting plate 120 on the mounting platform 110 by threaded fasteners not only facilitates the operator's disassembly and assembly, but also ensures the connection strength between the positioning mounting plate 120 and the mounting platform 110.

[0044] Of course, in some other embodiments, the positioning mounting plate 120 can also be snapped into the mounting platform 110.

[0045] In detail, the positioning mounting plate 120 has a recess 122 on the side away from the mounting platform 110. The recess 122 is used to accommodate the head of the threaded fastener. The bottom wall of the recess 122 has a mating hole 123 that penetrates the positioning mounting plate 120 along the thickness direction. The mounting platform 110 has a threaded hole corresponding to the mating hole 123. That is to say, the positioning mounting plate 120 can be fastened to the mounting platform 110 by the threaded fastener. Due to the setting of the recess 122, the head of the threaded fastener can be prevented from protruding from the positioning mounting plate 120 and affecting the placement of the wafer. This ensures that the wafer is placed stably on the positioning mounting plate 120.

[0046] The number of recesses 122 is multiple, and the multiple recesses 122 are arranged in a rectangular array on the positioning mounting plate 120. That is to say, the positioning mounting plate 120 has multiple mounting positions with the mounting platform 110. Of course, the mounting platform 110 has multiple threaded holes that correspond to the mating holes 123 in the recesses 122 to ensure the stability of the positioning mounting plate 120 and the mounting platform 110.

[0047] In this embodiment, the positioning mounting plate 120 is also provided with a dust accumulation groove 124. It is understood that dust may accumulate on the positioning mounting plate 120 during the marking process or for other reasons. The operator can temporarily sweep the dust into the dust accumulation groove 124 and then clean the dust in the dust accumulation groove 124 after removing the positioning mounting plate 120.

[0048] In detail, in this embodiment, the dust collection trough 124 is located between two strip grooves 121 so as to clean the dust caused by the marking process into the dust collection trough 124.

[0049] In summary, this utility model embodiment provides a wafer marking machine 1, which includes a marking machine table 100. The marking machine table 100 includes a mounting table 110 and a positioning mounting plate 120 mounted on the mounting table 110. The positioning mounting plate 120 is used to place the wafer 2 to be marked. The positioning mounting plate 120 has two spaced-apart strip grooves 121. The distance between the two strip grooves 121 varies in the extending direction of the strip grooves 121. The strip grooves 121 are used to place positioning pins 200, which can move in the extending direction of the strip grooves 121. Since the positioning pins 200 can move in the extending direction of the strip grooves 121, the two positioning pins 200 can move in the two strip grooves 121 respectively, which can change the position of the positioning pins 200 on the positioning mounting plate 120, thereby enabling the positioning of wafers of different sizes, so that the wafer marking machine 1 can mark wafers of different sizes.

[0050] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer marking machine, characterized in that, include: A marking machine base (100) includes a mounting table (110) and a positioning mounting plate (120) mounted on the mounting table (110). The positioning mounting plate (120) is used to place the wafer (2) to be marked. Two spaced strip grooves (121) are formed on the positioning mounting plate (120). The distance between the two strip grooves (121) varies in the extension direction of the strip grooves (121). The strip grooves (121) are used to place positioning pins (200). The positioning pins (200) can move in the extension direction of the strip grooves (121).

2. The wafer marking machine according to claim 1, characterized in that: The strip groove (121) penetrates the positioning mounting plate (120) along the thickness direction. The strip groove (121) includes a first groove (1211) and a second groove (1212) that are connected and arranged sequentially along the thickness direction of the positioning mounting plate (120). The width of the first groove (1211) is greater than the width of the second groove (1212), and the first groove (1211) is closer to the mounting platform (110) than the second groove (1212). The positioning pin (200) includes a pin head (210) and a pin shaft portion (220). The radial dimension of the pin shaft portion (220) is smaller than the radial dimension of the pin head. The pin head (210) and the pin shaft portion (220) are respectively accommodated in the first groove (1211) and the second groove (1212).

3. The wafer marking machine according to claim 2, characterized in that: The pin head (210) has an axial dimension that is less than or equal to the dimension of the first groove (1211) in the thickness direction of the positioning mounting plate (120).

4. The wafer marking machine according to claim 1, characterized in that: The positioning pin (200) can be locked or unlocked relative to the strip groove (121).

5. The wafer marking machine according to claim 1, characterized in that: The positioning mounting plate (120) is detachably mounted on the mounting platform (110).

6. The wafer marking machine according to claim 1, characterized in that: The positioning mounting plate (120) is mounted on the mounting table (110) by threaded fasteners.

7. The wafer marking machine according to claim 6, characterized in that: The positioning mounting plate (120) is provided with a recess (122) on the side away from the mounting platform (110). The recess (122) is used to accommodate the head of the threaded fastener. The bottom of the recess (122) is provided with a mating hole (123) that penetrates the positioning mounting plate (120) along the thickness direction. The mounting platform (110) is provided with a threaded hole opposite to the mating hole (123).

8. The wafer marking machine according to claim 7, characterized in that: The number of the sinks (122) is multiple, and the multiple sinks (122) are arranged in a rectangular array on the positioning mounting plate (120).

9. The wafer marking machine according to claim 1, characterized in that: The positioning mounting plate (120) is also provided with a dust collection groove (124).

10. The wafer marking machine according to claim 9, characterized in that: The ash collection trough (124) is located between the two strip grooves (121).

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