Nozzle assembly and substrate processing apparatus

Abstract

A nozzle assembly and substrate processing apparatus are provided. The nozzle assembly includes a boom, a plate set, a link, and a nozzle. The plate set has a first side and a second side, the first side connected to the boom. The link has opposite first and second link ends, the first link end rotatably connected to the second side of the plate set such that the link is rotatable about a first axis relative to the plate set. The nozzle is rotatably connected to the second link end such that the nozzle is rotatable about a second axis relative to the link, the first and second axes being different from each other.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more particularly to a nozzle assembly and a substrate processing apparatus. Background Technology

[0002] Traditional wet cleaning equipment typically uses a fixed nozzle design, with a preset and non-adjustable spray direction. When the wafer surface has uneven areas such as bevels, curved edges, or tiny depressions, the fixed-angle spray cannot fully cover all cleaning dead spots. This allows particles, chemical residues, or other contaminants to easily remain in hard-to-reach areas, resulting in poor cleaning performance, affecting process yield, and increasing the risk of defects or scrap in subsequent processes.

[0003] While existing technologies attempt to increase cleaning coverage by combining multiple nozzles and arranging them in different directions to improve the limitations of spray angle, such solutions often face the following challenges: First, the structure of multi-nozzle systems is relatively complex, leading to an increase in the overall size of the equipment; second, the design difficulty of control logic and drive system is significantly increased in order to achieve consistent and synchronized spray control; and finally, these structural and control complexities will significantly increase the overall equipment manufacturing and maintenance costs.

[0004] In view of this, it is necessary to provide a nozzle assembly and a substrate processing apparatus to solve the above-mentioned technical problems. Utility Model Content

[0005] To address the problems of the prior art, the present application aims to provide a nozzle assembly and a substrate processing apparatus that can flexibly adjust the spray angle of the nozzle according to actual cleaning needs, so as to improve the efficiency of particle removal from semiconductor wafers in wet processes.

[0006] In a first aspect, this application provides a nozzle assembly comprising: a cantilever; a plate assembly having a first side and a second side, the first side being connected to the cantilever; a connector having opposing first connecting ends and second connecting ends, wherein the first connecting ends are rotatably connected to the second side of the plate assembly, such that the connector is rotatable relative to the plate assembly about a first axis; and a nozzle rotatably connected to the second connecting end of the connector, such that the nozzle is rotatable relative to the connector about a second axis, wherein the first axis and the second axis are different from each other.

[0007] In some embodiments, a first rotating shaft and a first mating seat are provided at the connection between the plate assembly and the connector, and the first mating seat is pivotally mounted on the first rotating shaft so that the first mating seat rotates around the first rotating shaft; and a second rotating shaft and a second mating seat are provided at the connection between the connector and the nozzle, and the second mating seat is pivotally mounted on the second rotating shaft so that the second mating seat rotates around the second rotating shaft.

[0008] In some embodiments, locking members are provided on both sides of the first docking seat and the second docking seat respectively. When the first docking seat and the second docking seat rotate around the first rotating shaft and the second rotating shaft to a specific angle, the locking members lock the first docking seat and the second docking seat to the corresponding first rotating shaft and the second rotating shaft.

[0009] In some embodiments, the first docking seat and the second docking seat are disposed on the connector, the first rotating shaft is disposed on the plate assembly, and the second rotating shaft is disposed on the nozzle.

[0010] In some embodiments, the first connecting end and the second connecting end of the connector are respectively formed with inwardly recessed cylindrical grooves to form the first mating seat and the second mating seat; the second side of the plate assembly is formed with an outwardly protruding cylindrical structure to form the first rotating shaft; and one side of the nozzle is formed with an outwardly protruding cylindrical structure to form the second rotating shaft.

[0011] In some embodiments, the nozzle assembly further includes: a first motor, fixedly disposed on the second side of the plate assembly and including the first rotating shaft; a second motor, fixedly disposed on the second connecting end of the connector and including the second rotating shaft; wherein the first mating seat is disposed on the first connecting end of the connector, and the second mating seat is disposed on the nozzle.

[0012] In some embodiments, both the first rotating shaft and the second rotating shaft are geometric columnar structures with non-circular cross sections, and the first mating seat and the second mating seat are respectively provided with geometric groove structures that match the corresponding geometric columnar structures, so that each geometric columnar structure can mesh with the corresponding geometric groove structure.

[0013] In some embodiments, the cantilever is provided with a groove, and the first side of the plate assembly is slidably disposed in the groove and can be selectively fixed at any position within the groove.

[0014] In some embodiments, the nozzle is provided with an inlet, an outlet, and an internal channel, and the inlet and the outlet are respectively located at both ends of the internal channel; the inlet is connected to a liquid supply system so that process liquid from the liquid supply system enters the nozzle through the inlet, flows through the internal channel, and is finally discharged from the outlet.

[0015] Secondly, this application also provides a substrate processing apparatus, comprising: a substrate holding portion for holding a substrate; a nozzle assembly as described above; and a moving device connected to the nozzle assembly and disposed outside the substrate holding portion, wherein the moving device is used to drive the nozzle assembly to move the nozzle of the nozzle assembly between a standby position and above the substrate holding portion.

[0016] Compared to prior art, this application provides a nozzle assembly with a biaxially adjustable angle structure, which allows for flexible adjustment of the nozzle's spray angle according to actual cleaning needs, thereby improving the efficiency of particle removal from semiconductor wafers in wet processes. Traditional nozzle designs with a fixed spray direction are prone to creating cleaning dead zones on the wafer surface or edges, resulting in incomplete removal of contaminating particles and affecting product yield and subsequent process stability. However, the dual-axis structure proposed in this application allows the nozzle and connector to rotate and adjust around the X and Y axes respectively, enabling the nozzle to generate a multi-directional impact cleaning effect, effectively overcoming the limitations of traditional fixed spray angles. Attached Figure Description

[0017] The following detailed description of the specific embodiments of this application, in conjunction with the accompanying drawings, will make the technical solution and other beneficial effects of this application readily apparent.

[0018] Figure 1 A schematic diagram of a substrate processing apparatus according to an embodiment of this application is shown.

[0019] Figure 2 show Figure 1 A partial top view of the substrate processing apparatus.

[0020] Figure 3 A schematic diagram of a nozzle assembly according to a first embodiment of this application is shown.

[0021] Figure 4 show Figure 3 A schematic diagram of the first action of the connecting member rotating about the first axis relative to the plate assembly.

[0022] Figure 5 show Figure 3 The second actuation diagram shows the connecting member rotating relative to the plate assembly around the first axis.

[0023] Figure 6show Figure 3 A schematic diagram of the first actuation of the nozzle rotating about the second axis relative to the connector.

[0024] Figure 7 show Figure 3 A schematic diagram of the second action of the nozzle rotating about the second axis relative to the connector.

[0025] Figure 8 show Figure 3 A cross-sectional view of the nozzle.

[0026] Figure 9 A schematic diagram showing a nozzle assembly according to a second embodiment of this application.

[0027] Figure 10 show Figure 9 A schematic diagram of the first action of the connecting member rotating about the first axis relative to the plate assembly.

[0028] Figure 11 show Figure 9 The second actuation diagram shows the connecting member rotating relative to the plate assembly around the first axis.

[0029] Figure 12 show Figure 9 A schematic diagram of the first actuation of the nozzle rotating about the second axis relative to the connector.

[0030] Figure 13 show Figure 9 A schematic diagram of the second action of the nozzle rotating about the second axis relative to the connector.

[0031] Figure 14 show Figure 9 A cross-sectional view of the nozzle. Detailed Implementation

[0032] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0033] Please refer to Figure 1 and Figure 2 , Figure 1 A schematic diagram showing a substrate processing apparatus according to an embodiment of this application, and Figure 2 show Figure 1A partial top view of the substrate processing apparatus. The substrate processing apparatus 10 of this application is used to perform various processes on a substrate, such as wet etching or removing particles from the substrate surface. The substrate processing apparatus 10 includes a substrate holding section 11, a nozzle assembly 12, a moving device 13, and a liquid supply system 14. The substrate holding section 11 is provided with a rotating disk for holding and fixing the substrate 2. The substrate 2 can be adsorbed onto the rotating disk by vacuum adsorption or clamped and fixed by a clamping mechanism, and the method is not limited. The nozzle assembly 12 includes a nozzle 121 provided at the end and other necessary components, the specific structure of which will be described in detail later. The liquid supply system 14 is connected to the nozzle assembly 12 through a pipeline and is configured to supply process liquids, such as etching solution or deionized water.

[0034] like Figure 1 and Figure 2 As shown, the moving device 13 is connected to the nozzle assembly 12 and drives the nozzle 121 of the nozzle assembly 12 to move between the standby position P1 and above the substrate holding portion 11. The moving device 13 includes a mechanism such as a rotating lifting column and is disposed outside the substrate holding portion 11, maintaining a distance therefrom. The end of the nozzle assembly 12 away from the nozzle 121 is fixed to the moving device 13, so that the moving device 13 can synchronously drive the entire nozzle assembly 12 to move when driven. For example, when the moving device 13 is activated, the nozzle 121 can rotate from the standby position P1 to above the substrate 2 and spray process liquid along a predetermined path R. The path R may include: moving from a point A on the edge of the substrate 2 toward the center point O of the substrate, and then moving from the center point O to another point B on the edge, thereby achieving a continuous and uniform processing effect.

[0035] In some embodiments, the moving device 13 includes a rotation drive and a lifting drive. The rotation drive and the lifting drive can be controlled by independent motors or integrated into the same drive device and connected to the moving device 13. Driven by the rotation drive, the moving device 13 can rotate around a vertical axis, thereby moving the nozzle 121 of the nozzle assembly 12 along path R on the horizontal plane; while driven by the lifting drive, the moving device 13 can move up and down in a direction perpendicular to the horizontal plane, thereby adjusting the horizontal height of the nozzle 121.

[0036] Please refer to Figure 3 This diagram shows a nozzle assembly according to a first embodiment of the present application. The nozzle assembly 20 includes a cantilever 21, a plate assembly 22, a connector 23, and a nozzle 24. It should be understood that the nozzle assembly 20 shown in this embodiment is an exemplary implementation of the nozzle assembly 12 of the substrate processing apparatus 10 described above, wherein one end of the cantilever 21 is connected to the moving device 13, and the other end is sequentially provided with components such as the plate assembly 22, the connector 23, and the nozzle 24.

[0037] like Figure 3 As shown, the plate assembly 22 includes a first plate 221 and a second plate 222, both of which are bent into a trapezoidal shape. This bending design allows the connecting piece 23 and the nozzle 24 to be positioned with a specific lateral distance and height difference relative to the cantilever 21, effectively avoiding interference with other mechanisms. One end of the first plate 221 is fixedly connected to the cantilever 21, and this connecting side serves as the first side 223 of the plate assembly 22. Conversely, the other end of the first plate 221 is connected to the second plate 222, and the side of the second plate 222 furthest from the connecting side of the first plate 221 serves as the second side 224 of the plate assembly 22, which is further connected to the connecting piece 23.

[0038] like Figure 3 As shown, in this embodiment, a groove 211 is provided on the cantilever 21, and the first side 223 of the plate assembly 22 is slidably disposed in the groove and its position can be adjusted as needed, thereby selectively fixing it at any position within the groove. This allows for flexible adjustment of the position of the plate assembly 22 relative to the cantilever 21 according to different substrate sizes or cleaning requirements, helping to improve the overall adaptability and cleaning efficiency of the nozzle assembly 20.

[0039] like Figure 3 As shown, the connector 23 has a first connecting end 231 and a second connecting end 232 opposite to each other, wherein the first connecting end 231 is rotatably connected to the second side 224 of the plate assembly 22, allowing the connector 23 to rotate relative to the plate assembly 22 about a first axis. In this embodiment, the first axis is, for example, the X-axis direction.

[0040] Specifically, please refer to Figure 4 and Figure 5 , Figure 4 show Figure 3 A schematic diagram of the first action of the connecting member rotating about a first axis relative to the plate assembly, and Figure 5 show Figure 3 The second actuation diagram shows the connecting member rotating relative to the plate assembly around the first axis. Figure 4 This is the initial state before connector 23 has rotated. Figure 5 This represents the change in state of the connector 23 after rotation around the first axis. As shown in the figure, when the connector 23 rotates around the first axis, its second connecting end 232 moves away from the cantilever 21, thereby driving the nozzle 24 to shift in the same direction. Through this rotational action, the spatial position of the connector 23 is adjusted, thereby changing the position or angle of the nozzle and improving the overall structural flexibility and application adaptability. The rotation around the first axis referred to here means that one end of the connector 23 rotates and moves in a direction toward or away from the cantilever 21 to further achieve the purpose of adjustment or driving.

[0041] like Figure 3 As shown, the nozzle 24 is rotatably disposed on the second connecting end 232 of the connector 23, allowing it to rotate relative to the connector 23 about a second axis, wherein the first axis and the second axis are different from each other, such as being perpendicular to each other or non-parallel, and are independent of each other. In this embodiment, the second axis may be the Y-axis direction.

[0042] Further reference Figure 6 and Figure 7 , Figure 6 show Figure 3 A schematic diagram of the first actuation of the nozzle rotating relative to the connector about the second axis, and Figure 7 show Figure 3 A schematic diagram of the second actuation of the nozzle rotating about a second axis relative to the connecting member. Specifically, Figure 6 This is the initial state before nozzle 24 rotates. Figure 7 This represents the state after the nozzle 24 has rotated. As shown in the figure, when the nozzle 24 rotates around the second axis, its end will shift away from the end where the cantilever 21 is connected to the plate assembly 22. The rotation of the nozzle 24 around the second axis refers to the rotational movement of one end towards or away from the end where the cantilever 21 is connected to the plate assembly 22, thereby changing the spatial position of the nozzle 24. Through this rotational adjustment, the spray angle and range can be effectively changed, further improving the coverage and impact of the cleaning liquid. This is especially suitable for processing wafer surfaces with concave, sloping, or edge-varying structures, achieving a more efficient and precise wet cleaning effect.

[0043] like Figure 3 As shown, a first rotating shaft 225 and a first mating seat 233 are provided at the connection between the plate assembly 22 and the connector 23. The first mating seat 233 is pivotally mounted on the first rotating shaft 225, allowing it to rotate around the first rotating shaft 225. In this embodiment, the first connecting end 231 of the connector 23 has an inwardly recessed cylindrical groove, which constitutes the first mating seat 233; correspondingly, the second side 224 of the plate assembly 22 has an outwardly protruding cylindrical structure, serving as the first rotating shaft 225. In other words, the first mating seat 233 and the first rotating shaft 225 can be interlocked through the cylindrical structure, achieving a rotatable pivot connection. It is worth noting that although this embodiment uses a design where the first mating seat 233 is located on the connector 23 and the first rotating shaft 225 is located on the plate assembly 22, the configuration can be interchanged in other embodiments and is not limited thereto.

[0044] like Figure 3As shown, a second rotating shaft 241 and a second docking seat 234 are provided at the joint between the nozzle 24 and the connector 23, forming a pivot mechanism. The second docking seat 234 is pivotally mounted on the second rotating shaft 241. This mechanism allows the nozzle 24 to rotate relative to the connector 23 around the second rotating shaft 241 to accommodate different spray angle requirements. In this embodiment, the second connecting end 232 of the connector 23 has an inwardly recessed cylindrical groove, which constitutes the second docking seat 234. Conversely, the corresponding end of the nozzle 24 has an outwardly protruding cylindrical structure, serving as the second rotating shaft 241. Through the fitting of these cylindrical structures, the second docking seat 234 can be securely mounted on the second rotating shaft 241 and possesses a rotatable pivoting function, realizing the adjustable angle design of the nozzle 24. Furthermore, this structural design is highly modular and flexible. Although in this embodiment the second docking seat 234 is set on the connector 23 and the second rotating shaft 241 is set on the nozzle 24, in practical applications, the two can be interchanged depending on the space configuration or manufacturing process requirements. Their functions and effects are not essentially different and should be understood as equivalent.

[0045] like Figure 3 As shown, the connector 23 has a first mating seat 233 and a second mating seat 234 on both sides, and a locking member 235 is arranged at the relative position of these mating seats. When the first mating seat 233 and the second mating seat 234 rotate around the first rotating shaft 225 and the second rotating shaft 241 to a predetermined angle, the locking member 235 can fix and lock the first mating seat 233 and the second mating seat 234 to the corresponding first rotating shaft 225 and the second rotating shaft 241 to prevent angular deviation and ensure that the nozzle 24 is stably positioned.

[0046] Furthermore, such as Figure 3 As shown, the connector 23 has a scale on the corresponding positions of the first docking seat 233 and the second docking seat 234, allowing the user to adjust the rotation angle by observing the scale readings. Therefore, the nozzle assembly 20 provided in this embodiment can be manually adjusted by adjusting the rotation angle of the connector 23 to precisely set the nozzle 24 to the required angle, achieving flexible cleaning direction setting.

[0047] Please refer to Figure 8 Its display Figure 3 A cross-sectional view of the nozzle. The nozzle 24 has a liquid inlet 242, a liquid outlet 243, and an internal channel 244 communicating therebetween, wherein the liquid inlet 242 and the liquid outlet 243 are respectively located at both ends of the internal channel 244. The liquid inlet 242 is connected to a liquid supply system (e.g., Figure 1The process liquid is connected to the liquid supply system 14 shown, so that the process liquid can be introduced from the liquid supply system into the nozzle 24 through the inlet 242, flow along the internal channel 244, and finally be discharged from the outlet 243. In this embodiment, the nozzle 24 has two inlets 242, but this is only one embodiment and is not limited thereto. In practical applications, the two inlets 242 can respectively introduce the same or different types of process liquids to meet different process requirements, improve processing flexibility and equipment compatibility.

[0048] Please refer to Figure 9 This diagram shows a nozzle assembly according to a second embodiment of the present application. The nozzle assembly 30 includes a cantilever 31, a plate assembly 32, a connector 33, and a nozzle 34. It should be understood that the nozzle assembly 30 shown in this embodiment is an exemplary implementation of the nozzle assembly 12 of the substrate processing apparatus 10 described above, wherein one end of the cantilever 31 is connected to the moving device 13, and the other end is sequentially provided with components such as the plate assembly 32, the connector 33, and the nozzle 34.

[0049] like Figure 9 As shown, the plate assembly 32 includes a first plate 321 and a second plate 322, both of which are bent into a trapezoidal shape. This bending design allows the connecting piece 33 and the nozzle 34 to be positioned with a specific lateral distance and height difference relative to the cantilever 31, effectively avoiding interference with other mechanisms. One end of the first plate 321 is fixedly connected to the cantilever 31, and this connecting side serves as the first side 323 of the plate assembly 32. Conversely, the other end of the first plate 321 is connected to the second plate 322, and the side of the second plate 322 furthest from the connecting side of the first plate 321 serves as the second side 324 of the plate assembly 32, which is further connected to the connecting piece 33.

[0050] like Figure 9 As shown, in this embodiment, a groove 311 is provided on the cantilever 31, and the first side 323 of the plate assembly 32 is slidably disposed in the groove and its position can be adjusted as needed, thereby selectively fixing it at any position within the groove. This allows for flexible adjustment of the position of the plate assembly 32 relative to the cantilever 31 according to different substrate sizes or cleaning requirements, helping to improve the overall adaptability and cleaning efficiency of the nozzle assembly 30.

[0051] like Figure 9 As shown, the connector 33 has a first connecting end 331 and a second connecting end 332 opposite to each other, wherein the first connecting end 331 is rotatably connected to the second side 324 of the plate assembly 32, so that the connector 33 can rotate relative to the plate assembly 32 about a first axis. In this embodiment, the first axis is, for example, the X-axis direction.

[0052] Specifically, please refer to Figure 10 and Figure 11 , Figure 10 show Figure 9 A schematic diagram of the first action of the connecting member rotating about a first axis relative to the plate assembly, and Figure 11 show Figure 9 The second actuation diagram shows the connecting member rotating relative to the plate assembly around the first axis. Figure 10 This is the initial state before connector 33 has rotated. Figure 11 This represents the change in state of the connector 33 after rotating around the first axis. As shown in the figure, when the connector 33 rotates around the first axis, its second connecting end 332 moves away from the cantilever 31, thereby driving the nozzle 34 to shift in the same direction. Through this rotational action, the spatial position of the connector 33 is adjusted, thereby changing the position or angle of the nozzle and improving the overall structural flexibility and application adaptability. The rotation around the first axis referred to here means that one end of the connector 33 rotates and moves in a direction toward or away from the cantilever 31 to further achieve the purpose of adjustment or driving.

[0053] like Figure 9 As shown, the nozzle 34 is rotatably disposed on the second connecting end 332 of the connector 33, allowing it to rotate relative to the connector 33 about a second axis, wherein the first axis and the second axis are different from each other, such as being perpendicular to each other or non-parallel, and are independent of each other. In this embodiment, the second axis may be the Y-axis direction.

[0054] Further reference Figure 12 and Figure 13 , Figure 12 show Figure 9 A schematic diagram of the first actuation of the nozzle rotating relative to the connector about the second axis, and Figure 13 show Figure 9 A schematic diagram of the second actuation of the nozzle rotating about a second axis relative to the connecting member. Specifically, Figure 12 This represents the initial state before nozzle 34 rotates. Figure 13 This represents the state after the nozzle 34 has rotated. As shown in the figure, when the nozzle 34 rotates around the second axis, its end will shift away from the end where the cantilever 31 is connected to the plate assembly 32. The rotation of the nozzle 34 around the second axis refers to the rotational movement of one end towards or away from the end where the cantilever 31 is connected to the plate assembly 32, thereby changing the spatial position of the nozzle 34. Through this rotational adjustment, the spray angle and range can be effectively changed, further improving the coverage and impact of the cleaning liquid. This is especially suitable for processing wafer surfaces with concave, sloping, or edge-varying structures, achieving a more efficient and precise wet cleaning effect.

[0055] like Figure 9As shown, the nozzle assembly 30 of this embodiment further includes a first motor 35 and a second motor 36. The first motor 35 is fixedly disposed on the second side 324 of the plate assembly 32. The second motor 36 is fixedly disposed on the second connecting end 332 of the connector 33. The first motor 35 includes a first rotating shaft 351, and the second motor 36 includes a second rotating shaft 361.

[0056] like Figure 9 As shown, a first rotating shaft 351 and a first mating seat 333 are provided at the connection between the plate assembly 32 and the connector 33. The first mating seat 333 is pivotally mounted on the first rotating shaft 351, allowing it to rotate around the first rotating shaft 351. In this embodiment, the first rotating shaft 351 is designed as a geometric columnar structure with a non-circular cross-section. The first connecting end 331 of the connector 33 is provided with an inwardly recessed geometric groove structure. This groove constitutes the first mating seat 333 and matches the geometric columnar structure of the first rotating shaft 351, so that the geometric columnar structure can engage with the corresponding geometric groove structure and achieve a rotatable pivotal connection. It is worth noting that although this embodiment adopts a design in which the first mating seat 333 is set on the connector 33 and the first rotating shaft 351 is set on the first motor 35 connected to the plate assembly 32, the configuration can be interchanged in other embodiments and is not limited thereto.

[0057] like Figure 9 As shown, a second rotating shaft 361 and a second docking seat 341 are provided at the joint between the nozzle 34 and the connector 33, forming a pivoting mechanism, that is, the second docking seat 341 is pivotally mounted on the second rotating shaft 361. This mechanism allows the nozzle 34 to rotate relative to the connector 33 around the second rotating shaft 361 to accommodate different spray angle requirements. In this embodiment, the second connecting end 332 of the connector 33 is connected to the second motor 36. The second rotating shaft 361 of the second motor 36 is designed as a geometric columnar structure with a non-circular cross-section. The end of the nozzle 34 connected to the connector 33 has an inwardly recessed geometric groove structure. This groove constitutes the second docking seat 341 and matches the geometric columnar structure of the second rotating shaft 361, allowing the geometric columnar structure to engage with the corresponding geometric groove structure and achieving a rotatable pivoting effect. It is worth noting that although this embodiment adopts the design of setting the second docking seat 341 on the nozzle 34 and the second rotating shaft 361 on the second motor 36 connected to the connector 33, in practical applications, the two can be interchanged depending on the needs of space configuration or manufacturing process. Their functions and effects are not essentially different and should be understood as equivalent.

[0058] In this embodiment, the corresponding rotating shaft is driven to rotate by a motor rotor, and the rotor is locked after rotation to achieve precise positioning of the rotating shaft. Furthermore, the geometric design between the rotating shaft and the mating seat ensures a stable engagement between the two, effectively preventing unexpected rotation, avoiding angular deviation, and ensuring that the nozzle 24 can be stably and accurately fixed at the target position.

[0059] In some embodiments, the nozzle assembly 30 can automatically adjust the spray angle of the nozzle 34 according to the position and morphology of contaminants on the wafer surface, thereby achieving intelligent and flexible cleaning functions. This dynamic control mechanism can be combined with sensor feedback or control algorithms for real-time adjustment, so that the spray angle is automatically optimized according to actual process conditions or contaminant distribution, significantly improving the overall intelligence of the equipment. Through the dynamically tiltable nozzle structure, the liquid jet can precisely change direction according to actual cleaning needs, thereby impacting the sides of particles or hard-to-reach areas on the wafer surface at multiple angles and with high kinetic energy, effectively improving cleaning coverage and efficiency. In addition, the system can also be set to automatically control the position, so that the first motor 35 and the second motor 36 drive the nozzle 34 to change angles along the first axis or the second axis, respectively. The spray points are set as follows: When both motors are in their original positions and stationary, nozzle 34 will spray vertically downwards, which is the first point. If the first motor 35 controls the first rotating shaft 351 to rotate clockwise along the first axis, and the second motor 36 remains stationary, then nozzle 34 will tilt clockwise along the first axis, forming the second point. If the first motor 35 causes the first rotating shaft 351 to rotate counterclockwise, and the second motor 36 remains stationary, then nozzle 34 will tilt counterclockwise, forming the third point. If the first motor 35 is stationary, and the second motor 36 controls the second rotating shaft 361 to rotate clockwise along the second axis, then nozzle 34 will tilt clockwise along the second axis, forming the fourth point. When the second rotating shaft 361 rotates counterclockwise, nozzle 34 will tilt counterclockwise along the second axis, forming the fifth point. Through similar methods, more angle variations can be further expanded to meet various cleaning needs.

[0060] Please refer to Figure 14 Its display Figure 9 A cross-sectional view of the nozzle. The nozzle 34 has a liquid inlet 342, a liquid outlet 343, and an internal channel 344 connecting them, wherein the liquid inlet 342 and the liquid outlet 343 are respectively located at both ends of the internal channel 344. The liquid inlet 342 is connected to a liquid supply system (e.g., Figure 1The liquid supply system 14 shown is connected to the nozzle 24 so that the process liquid can be introduced from the liquid supply system into the nozzle 24 through the inlet 342, flow along the internal channel 344, and finally be discharged from the outlet 343. In this embodiment, the nozzle 34 is provided with two inlets 342, but this is only one embodiment and is not limited thereto. In practical applications, the two inlets 342 can respectively introduce the same or different types of process liquids to meet different process requirements, improve processing flexibility and equipment compatibility.

[0061] In summary, the nozzle assembly disclosed in this application features a biaxially adjustable angle structure, allowing for flexible adjustment of the nozzle's spray angle according to actual cleaning needs, thereby improving the efficiency of particle removal from semiconductor wafers in wet processes. Compared to traditional nozzle designs with fixed spray directions, which are prone to creating cleaning dead zones on the wafer surface or edges, resulting in incomplete removal of contaminating particles and affecting product yield and subsequent process stability, the dual-axis structure proposed in this application allows the nozzle to be rotated and adjusted around the X and Y axes respectively via connectors. This enables the nozzle to generate a multi-directional impact cleaning effect, effectively overcoming the limitations of traditional fixed spray angles. Through real-time adjustment of the spray angle, intelligent and targeted cleaning can be performed based on the distribution and morphology of contaminants, further enhancing the removal force of the cleaning fluid on the lateral attachment areas of particles, making it particularly suitable for removing sub-micron level particles. In other words, this technical solution achieves a more comprehensive cleaning effect, effectively removing particles and chemical residues attached to the wafer surface and edges, significantly reducing the risk of contamination redeposition or residual contamination. By significantly reducing impurity interference, the stability and reproducibility of subsequent key process steps such as thin film deposition, photoresist coating, and lithography are improved, thereby substantially enhancing the overall process yield and product consistency. Furthermore, compared to the traditional method of using multiple nozzles to achieve multi-angle cleaning, the nozzle assembly of this application has the advantages of simple structure and convenient assembly, making it easy to integrate into existing substrate processing equipment and reducing overall system maintenance and operating costs. It possesses significant industrial application value and flexible expansion potential.

[0062] The above provides a detailed description of a nozzle assembly and substrate processing apparatus provided in the embodiments of this application. Specific embodiments have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions in the embodiments of this application.

Claims

1. A nozzle assembly, characterized in that, Include: cantilever; A panel assembly having a first side and a second side, the first side being connected to the cantilever; A connector having a first connecting end and a second connecting end opposite to each other, wherein the first connecting end is rotatably connected to the second side of the plate assembly, such that the connector rotates relative to the plate assembly about a first axis. A nozzle is rotatably connected to the second connecting end of the connector, such that the nozzle rotates relative to the connector about a second axis, wherein the first axis and the second axis are different from each other.

2. The nozzle assembly as claimed in claim 1, characterized in that, The connection between the plate assembly and the connector is provided with a first rotating shaft and a first mating seat, and the first mating seat is pivotally mounted to the first rotating shaft, allowing the first mating seat to rotate around the first rotating shaft; and The connection between the connector and the nozzle is provided with a second rotating shaft and a second mating seat, and the second mating seat is pivotally mounted on the second rotating shaft so that the second mating seat rotates around the second rotating shaft.

3. The nozzle assembly as claimed in claim 2, characterized in that, Locking members are provided on both sides of the first docking seat and the second docking seat respectively. When the first docking seat and the second docking seat rotate around the first rotating shaft and the second rotating shaft to a specific angle, the locking members lock the first docking seat and the second docking seat to the corresponding first rotating shaft and the second rotating shaft.

4. The nozzle assembly as claimed in claim 2, characterized in that, The first docking seat and the second docking seat are disposed on the connector, the first rotating shaft is disposed on the plate assembly, and the second rotating shaft is disposed on the nozzle.

5. The nozzle assembly as claimed in claim 4, characterized in that, The first connecting end and the second connecting end of the connector are respectively formed with inwardly recessed cylindrical grooves to form the first mating seat and the second mating seat. The second side of the plate assembly has an outwardly protruding cylindrical structure to form the first pivot; and One side of the nozzle has an outwardly protruding cylindrical structure to form the second rotating shaft.

6. The nozzle assembly as claimed in claim 2, characterized in that, The nozzle assembly also includes: A first motor is fixedly mounted on the second side of the plate assembly and includes the first rotating shaft; The second motor is fixedly mounted on the second connecting end of the connector and includes the second rotating shaft; The first docking seat is disposed at the first connecting end of the connector, and the second docking seat is disposed at the nozzle.

7. The nozzle assembly as claimed in claim 6, characterized in that, Both the first and second rotating shafts are geometric columnar structures with non-circular cross-sections, and the first and second mating seats are respectively provided with geometric groove structures that match the corresponding geometric columnar structures, so that each geometric columnar structure can mesh with the corresponding geometric groove structure.

8. The nozzle assembly as claimed in claim 1, characterized in that, The cantilever is provided with a sliding groove, and the first side of the plate assembly is slidably disposed in the sliding groove and can be selectively fixed at any position within the sliding groove.

9. The nozzle assembly as claimed in claim 1, characterized in that, The nozzle is provided with an inlet, an outlet and an internal channel, and the inlet and the outlet are located at opposite ends of the internal channel. The inlet is connected to a liquid supply system so that process liquid from the liquid supply system enters the nozzle through the inlet, flows through the internal channel and is finally discharged from the outlet.

10. A substrate processing apparatus, characterized in that, include: A substrate holding section for holding a substrate; The nozzle assembly as claimed in any one of claims 1 to 9; as well as A moving device, connected to the nozzle assembly and disposed outside the substrate holding portion, wherein the moving device is used to drive the nozzle assembly to move the nozzle of the nozzle assembly between a standby position and above the substrate holding portion.

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