Wafer spin-drying device and semiconductor processing apparatus

Abstract

The application provides a wafer spin-drying device and a semiconductor processing equipment, and belongs to the technical field of semiconductor processing equipment. Specifically, the wafer spin-drying device comprises a supporting tray and a blocking piece. When the blocking piece rotates with the supporting tray, due to the large mass below the rotating axis of the blocking piece, under the action of the rotating centrifugal force, the part below the rotating axis of the blocking piece moves to the radial outside, and the part above the rotating axis of the blocking piece moves to the radial inside, so that the part above the rotating axis of the blocking piece limits the wafer. During the rotation of the supporting tray, the blocking piece can automatically enter the buckling state to limit the axial direction of the wafer. Meanwhile, after the wafer is spin-dried, the supporting tray stops rotating, and under the action of the mass below the rotating axis of the blocking piece, the blocking piece can automatically recover from the buckling state to the open state. The operation process does not need manual adjustment of the blocking piece by an operator, and can realize automatic limitation and automatic return of the wafer, thereby improving the wafer taking, placing and spin-drying efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing equipment technology, and more specifically, to a wafer spin dryer and semiconductor processing equipment. Background Technology

[0002] During wafer processing, grinding and polishing are required to achieve extremely high flatness and smoothness on the wafer surface. After polishing, the wafer must be cleaned and inspected. Cleaning removes surface impurities, and quality inspection ensures the wafer meets manufacturing requirements. After cleaning, any residual liquid on the wafer needs to be spun dry for subsequent wafer inspection.

[0003] Currently, wafer spin-drying structures typically include a tray on which the wafer is placed and rotated for spin-drying. To prevent the wafer from detaching during rotation, a stop is placed on the tray to restrict the wafer's position. However, current stop mechanisms restrict the wafer's position by moving the stop to a preset location. When picking up or placing the wafer, the stop needs to be adjusted to remove the wafer from or place it on the tray, which is a rather cumbersome operation. Utility Model Content

[0004] The purpose of this application is to provide a wafer spin dryer and semiconductor processing equipment, which aims to solve the problem in the related technology that, in order to restrict the position of the wafer during the spin dryer process, the blocking member needs to be moved to a preset position to restrict the wafer, and when picking up and placing the wafer, the blocking member needs to be adjusted to remove the wafer from the tray or place the wafer on the tray, which is a rather cumbersome operation.

[0005] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description or may be learned by practice of this application.

[0006] According to a first aspect of this application, a wafer spin-drying apparatus is provided, comprising:

[0007] Substrate and support tray;

[0008] The support tray is rotatably mounted on the substrate, and the support tray is used to place the wafers to be spin-dried;

[0009] The tray is provided with a blocking member, which is used to block the outer periphery of the wafer to limit the position of the wafer, and the blocking member is provided with a drainage channel for draining liquid.

[0010] In one exemplary embodiment of this application, the blocking member includes a clamping portion and a blocking portion. The blocking member is mounted on the support tray via the clamping portion, and the blocking portion is used to block the outer periphery of the wafer.

[0011] The blocking part is provided with a drainage channel for discharging liquid.

[0012] In one exemplary embodiment of this application, the clamping part is provided with a central platform, which is used to support the lower surface of the wafer;

[0013] The blocking part is provided with a clamping member, which is used to contact the outer periphery of the wafer to restrict the position of the wafer on the support tray.

[0014] In one exemplary embodiment of this application, the clamping member is formed with a ramp that slopes downward from the central platform.

[0015] In one exemplary embodiment of this application, the ramp has two symmetrically arranged with the central platform as the center line and the central platform as the axis of symmetry;

[0016] The drainage channels are located on both sides of the central platform and are connected to the slope on the same side.

[0017] In one exemplary embodiment of this application, the clamping member includes a clamping block rotatably mounted on the clamping portion. The direction of rotation of the clamping block is radial to the wafer. When the support tray is stationary, the clamping block is in a natural state. When the support tray is rotating, the clamping block rotates toward the wafer to restrict the position of the wafer in the axial direction.

[0018] In one exemplary embodiment of this application, the clamping block has a groove on its end face facing the wafer, the groove being used to accommodate the outer periphery of the wafer.

[0019] In one exemplary embodiment of this application, a counterweight block is also included, connected below the clamping block.

[0020] In one exemplary embodiment of this application, a sensor is also included, disposed on the substrate, the sensor being used to detect whether a wafer is placed on the tray.

[0021] In one exemplary embodiment of this application, the sensor includes a receiver and a transmitter, one of which is disposed below the support tray and the other is disposed above the support tray, and the detection path between the receiver and the transmitter is inclined to the support tray and passes through the area where the wafer is located on the support tray;

[0022] The receiver or transmitter located above is on the outer circumference of the wafer.

[0023] In one exemplary embodiment of this application, after the wafer is placed on the support tray, the receiver and the transmitter are respectively located on both sides of the first axis of symmetry of the wafer, and both the receiver and the transmitter are located on one side of the second axis of symmetry of the wafer, wherein the first axis of symmetry and the second axis of symmetry are perpendicular to each other.

[0024] According to a second aspect of this application, a semiconductor processing apparatus is provided, including the wafer spin dryer described above.

[0025] The exemplary embodiments of this application may have some or all of the following beneficial effects:

[0026] The wafer spin-drying device provided in the example embodiment of this application includes a tray for placing wafers to be spin-dried. A blocking member is provided on the tray, rotatably mounted on it. The rotation direction of the blocking member is towards the axis of the tray, and the mass of the blocking member below its rotation axis is greater than the mass above it. This causes the portion of the blocking member below its rotation axis to move radially outward under the centrifugal force as it rotates with the tray, while the portion above its rotation axis moves radially inward. This restricts the wafer. During the rotation of the tray, the blocking member can automatically enter a locking state to restrict the axial direction of the wafer. After the wafer is spin-dried, the tray stops rotating, and the blocking member automatically returns to an open state under the action of its mass below its rotation axis. The operation does not require manual adjustment of the blocking member, achieving automatic wafer restriction and automatic return to its original position, thus improving wafer handling and spin-drying efficiency.

[0027] In addition, a sensor is installed on the tray, which includes a receiver and a transmitter. One of the receiver and transmitter is located below the tray, and the other is located above the tray. The receiver or transmitter located above the tray is on the outer circumference of the wafer, while the transmitter or receiver located below the tray is on the inner circumference of the wafer. The detection path between the receiver and transmitter passes through the area where the wafer is located. This design can not only detect whether a wafer is placed on the tray, but also prevent liquid from dripping from the receiver or transmitter onto the wafer because the receiver or transmitter is located on the outer circumference of the wafer, thus ensuring the wafer is effectively dried.

[0028] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0030] Figure 1 A top view of the wafer spin dryer in an embodiment of this application is shown;

[0031] Figure 2 A top view of the connection structure between the tray and the blocking member in an embodiment of this application is shown;

[0032] Figure 3 A schematic diagram of the connection structure between the blocking member and the support tray in an embodiment of this application is shown;

[0033] Figure 4 A schematic cross-sectional view of the blocking member in an embodiment of this application is shown;

[0034] Figure 5 This is a schematic diagram showing the state when the blocking element restricts the axial direction of the wafer in an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. Base; 2. Support tray; 3. Blocking component; 31. Clamping part; 311. Center table; 32. Blocking part; 321. Groove; 322. Slope; 323. Drainage channel; 324. Counterweight; 325. Rotating shaft; 326. Blocking hook; 4. Transmitter; 5. Receiver; 6. Screw. Detailed Implementation

[0037] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed descriptions will be omitted. Furthermore, the drawings are merely illustrative of this application and are not necessarily drawn to scale.

[0038] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples in the accompanying drawings. It is understood that if the device of the icon is flipped so that it is upside down, the component described as "upper" will become the component described as "lower." When a structure is "upper" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0039] The terms “a,” “one,” “the,” and “at least one” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first” and “second” are used only as markers and are not a limitation on the number of objects.

[0040] Example 1

[0041] This embodiment provides a specific implementation of a wafer spin-drying device, such as... Figure 1 and Figure 2As shown, the device includes a tray 2, which is rotatably mounted on a base 1. The base 1 is the frame structure of the wafer spin dryer, including the frame and mounting space for the tray 2, as well as a drive mechanism for driving the tray 2 to rotate and a transmission structure between the drive mechanism and the tray 2. Specifically, the drive mechanism can be a drive motor, and the transmission structure can be gear transmission, belt transmission, etc. The tray 2 can rotate around its own axis and is used to place wafers to be spin-dried. The tray 2 has a blocking member 3, which is rotatably mounted on the tray 2. The rotation direction of the blocking member 3 is towards the axis of the tray 2, and the mass of the blocking member 3 below its rotation axis is greater than the mass of the blocking member 3 above its rotation axis. The blocking member 3 has an open state that allows wafers to be placed on the tray 2, and a closed state that rotates towards the axis of the tray 2 under the action of the centrifugal force of the tray 2 to restrict the axial movement of the wafers. When the tray 2 is stationary, the blocking member remains in the open state under the action of gravity. When the blocking component rotates with the tray, due to the larger mass below the axis of rotation, the portion below the axis of rotation of the blocking component will move radially outward under the action of centrifugal force, while the portion above the axis of rotation will move radially inward. This allows the portion above the axis of rotation of the blocking component to restrict the wafer. During the rotation of the tray, the blocking component can automatically enter the locking state to restrict the axial direction of the wafer. At the same time, after the wafer is spun dry, the tray stops rotating, and under the action of the mass below the axis of rotation of the blocking component, the blocking component can automatically return from the locking state to the open state.

[0042] The blocking component 3 can be a block, bar, or other structure fixedly mounted on the support tray 2, or it can be a block, bar, or other structure movably mounted on the support tray 2. Of course, the blocking component 3 can also be an annular assembly of an integral connector, wherein the shape of the annular assembly matches the outer contour of the wafer and is fitted onto the outer surface of the wafer to restrict the movement of the wafer. The blocking component 3 can also be multiple independent blocking structures, which are respectively set at the outer periphery of the wafer and limit the wafer by abutting against the outer circumference of the wafer. As long as a drainage channel can be opened on it and the outer periphery of the wafer can be restricted, it is acceptable.

[0043] In this embodiment, as Figure 3As shown, the blocking member 3 includes a clamping part 31 and a blocking part 32. The blocking member 3 is mounted on the support tray 2 via the clamping part 31, and the blocking part 32 is used to block the outer periphery of the wafer. Specifically, a central platform 311 is provided on the blocking part 32. The central platform 311 is used to contact the outer periphery of the wafer. The central platform 311 extends along the axial direction of the support tray 2, which can accommodate wafers at different heights. The blocking member 3 is movably mounted on the support tray 2 via the clamping part 31, which enables quick installation and removal of the blocking member 3. This facilitates operators in replacing different support trays 2 or blocking members 3 to accommodate wafers of different sizes.

[0044] In this embodiment, as Figure 4 and Figure 5 As shown, the blocking part 32 includes a clamping block, which is rotatably mounted on the clamping part 31, and the rotation direction of the clamping block is towards the wafer. The central platform 311 is used to support the wafer. When the support tray 2 drives the wafer to rotate, the wafer will also move upward along the axial direction. Under the action of the centrifugal force of the support tray 2, the clamping block rotates towards the wafer, which restricts the wafer in the axial direction and prevents the wafer from detaching from the support tray 2. When the support tray 2 is in working state, the wafer will generally be suspended above the central platform 311. The axial direction restriction is applied to the wafer by the groove 321 on the clamping block that rotates under the action of centrifugal force.

[0045] Furthermore, the clamping block is rotatably mounted on the clamping part 31 via the rotating shaft 325, and a counterweight 324 is connected below the clamping block. The addition of the counterweight 324 facilitates the clamping block to rotate toward the wafer under the action of centrifugal force and restricts the wafer.

[0046] In this embodiment, as Figure 4 and Figure 5 As shown, a groove 321 is formed on the end face of the clamping block facing the wafer, and a blocking hook 326 is formed at the upper end of the groove 321. The groove 321 is used to accommodate the outer periphery of the wafer. When the tray 2 is stationary, the state of the clamping block is as follows. Figure 4 As shown, the wafer is placed on the support tray 2. After the wafer is placed, the support tray 2 is driven to rotate. During the rotation of the support tray 2, the state of the clamping block changes under the action of inertia. Figure 5 As shown, the clamping block is inwardly engaged, causing the blocking hook 326 to rotate radially inward towards the wafer and restricting the wafer's upward axial movement. When the tray 2 rotates, the wafer will suspend and rotate after the rotation speed reaches a certain speed. The clamping block can restrict the wafer and prevent it from detaching from the tray 2.

[0047] In this embodiment, the clamping part 31 has an L-shaped cross-section, such as... Figure 4 and Figure 5As shown, the clamping part 31 extends upward on the left side, and the top end forms a central platform 311 with a gradually decreasing cross-section. The right side of the clamping part 31 is plate-shaped and is fastened to the support tray 2 by screws 6.

[0048] Furthermore, the fixing part is formed with a ramp 322 that slopes downward from the central platform 311. Specifically, the ramp 322 is located below the central platform 311, that is, below the wafer on the support tray 2. Drainage channels 323 are formed on both sides of the central platform 311 and communicate with the ramp 322. Liquid sliding down from the ramp 322 flows into the drainage channel 323. When the liquid on the wafer is thrown to the central platform 311 by inertia, it falls to the ramp 322, slides down the ramp 322 into the drainage channel 323, and is discharged from the support tray 2 through the drainage channel 323.

[0049] In this embodiment, the clamping part 31 is mounted on the support tray 2 by screws 6. The clamping part 31 can be a clamping plate with a central platform 311 formed on it, and the clamping block in the blocking part 32 is rotatably mounted on the clamping plate by a rotating shaft 325.

[0050] In this embodiment, a sensor is also included. The sensor is set on the substrate 1 and is used to detect whether a wafer is placed on the tray 2. Through the detection of the sensor, it can be determined whether a wafer is placed on the tray 2 and whether the tray 2 can be opened to make it rotate and work.

[0051] Furthermore, the sensor includes a receiver 5 and a transmitter 4. One of the receiver 5 and transmitter 4 is positioned below the tray 2, and the other is positioned above the tray 2. The detection path between the receiver 5 and transmitter 4 is inclined relative to the tray 2, allowing the detection path to pass through the area where the wafer is located on the tray. This design not only detects whether a wafer is placed on the tray 2, but also prevents liquid from dripping from the receiver 5 or transmitter 4 onto the wafer, ensuring the wafer is effectively dried. Specifically, the upper receiver 5 or transmitter 4 is located outside the circumference of the wafer, while the lower transmitter 4 or receiver 5 is located inside the circumference of the wafer, allowing the detection path between the receiver 5 and transmitter 4 to be inclined relative to the tray 2 and to pass through the area where the wafer is located.

[0052] Furthermore, receiver 5 and transmitter 4 are located on opposite sides of the first axis of symmetry of the wafer, and on the same side of the second axis of symmetry on the wafer. The first and second axes of symmetry are perpendicular to each other. Receiver 5 and transmitter 4 are tilted in a corresponding manner, such that the upper receiver 5 or transmitter 4 is located outside the circumference of the wafer. This design ensures that even if liquid drips from the upper receiver 5 and transmitter 4 during the spin-drying process, it will not fall onto the wafer surface, avoiding the need to extend the spin-drying time after liquid drips onto the wafer surface, thus improving the spin-drying efficiency to some extent. Simultaneously, placing transmitter 4 and receiver 5 on the same side of the second axis of symmetry... Figure 1 As shown, this design can, to some extent, prevent the tray 2 from obstructing the transmitter 4 or receiver 5 located below it. If the receiver 5 or transmitter 4 were placed in another position, it would be more likely to be obstructed by the tray 2. This design can mitigate the influence of the tray 2 on the detection signals of the receiver 5 and transmitter 4. In this embodiment, the transmitter 4 is preferably placed below the tray 2, and the receiver 5 is placed above the tray 2. The positions of the two can be interchanged, and there is no restriction on this. The operator can choose according to the actual situation.

[0053] Specifically, taking the center of the disc below the tray 2 as the origin, draw a vertical first axis and a horizontal second axis, where the first axis is the first axis of symmetry and the second axis is the second axis of symmetry, to illustrate the specific geodetic relationship between the transmitter 4 and the receiver 5.

[0054] In this embodiment, a drive motor is provided on the substrate 1, and the tray 2 is mounted on the drive shaft of the drive motor through a gear structure. The drive motor is communicatively connected to the sensor, so that the drive motor can receive the signal transmitted by the sensor. When the wafer blocks the transmission signal between the transmitter 4 and the receiver 5, it can transmit the signal that the wafer has been placed on the tray 2 to the drive motor, so that the drive motor drives the tray 2 and the wafer to rotate and spin dry, thereby realizing automatic control.

[0055] Work process:

[0056] by Figure 1For example, the tray 2 is rotatably mounted on the base 1. The tray 2 is rectangular in shape, and there are four blocking members 3, which are located at the four corners of the rectangular tray 2. The four blocking members 3 are located on the circumference of the wafer. The wafer to be spun out moves onto the tray 2 and is confined in the space between the four blocking members 3. After the wafer is placed, it will block the signal transmission between the transmitter 4 and the receiver 5, so that the signal that the wafer has been placed on the tray 2 can be collected. At this time, the tray 2 can be driven to rotate, which will drive the wafer to rotate. During the process of the tray 2 driving the wafer to rotate and spin dry, the liquid that is spun to the blocking members 3 is discharged through the drainage channel 323, ensuring the efficiency of the wafer rotation and spin drying.

[0057] Example 2

[0058] This embodiment provides a specific implementation of a semiconductor processing equipment, including the wafer spin dryer in Embodiment 1.

[0059] Other embodiments of this application will readily conceive of by those skilled in the art upon consideration of the specification and practice of the embodiments thereof. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not claimed in this application. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this application are indicated by the appended claims.

Claims

1. A wafer spin-drying device, characterized in that, include: Pallet support; The tray can rotate about its own axis, and the tray is used to place the wafers to be spun dry; The support tray is provided with a blocking member, which is rotatably mounted on the support tray. The direction of rotation of the blocking member is towards the axis of the support tray. The mass of the blocking member below its axis of rotation is greater than the mass of the blocking member above its axis of rotation. The blocking member has an open state that allows the wafer to be placed on the support tray, and a locking state that rotates towards the axis of the support tray under the action of the centrifugal force of the rotation of the support tray to restrict the axial movement of the wafer. When the support tray is stationary, the blocking member maintains the open state under the action of gravity.

2. The wafer spin dryer according to claim 1, characterized in that, The blocking component includes a fixing part and a blocking part. The fixing part is connected to the support tray, and the blocking part is rotatably connected to the fixing part. A counterweight is connected below the blocking part.

3. The wafer spin dryer according to claim 1, characterized in that, The blocking part includes a clamping block rotatably mounted on the fixed part. The end of the clamping block is provided with a blocking hook. When the blocking part is in the latching state, the blocking hook is used to abut against the upper surface of the wafer to restrict the movement of the wafer in its axial direction.

4. The wafer spin dryer according to claim 3, characterized in that, The clamping block has a groove on the end face facing the wafer, and the upper end of the groove is formed with the blocking hook. The groove is used to accommodate the outer periphery of the wafer.

5. The wafer spin dryer according to claim 2, characterized in that, The fixing part is formed with a central platform for supporting the wafer, and the tip of the central platform is used to support the lower surface of the wafer.

6. The wafer spin dryer according to claim 2, characterized in that, The blocking part is provided with a drainage channel for liquid to flow out.

7. The wafer spin dryer according to claim 1, characterized in that, It also includes a sensor mounted on the substrate, which is used to detect whether a wafer is placed on the tray.

8. The wafer spin dryer according to claim 7, characterized in that, The sensor includes a receiver and a transmitter, one of which is disposed below the support tray and the other is disposed above the support tray. The detection path between the receiver and the transmitter is inclined to the support tray and passes through the area where the wafer is located on the support tray. The receiver or transmitter located above is on the outer circumference of the wafer.

9. The wafer spin dryer according to claim 8, characterized in that, After the wafer is placed on the tray, the receiver and the transmitter are located on opposite sides of the first axis of symmetry of the wafer, and both the receiver and the transmitter are located on one side of the second axis of symmetry of the wafer. The first axis of symmetry and the second axis of symmetry are perpendicular to each other.

10. Semiconductor processing equipment, characterized in that, The wafer spin dryer includes any one of claims 1-9.

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