Pressurizing device and bonding apparatus

Abstract

The application discloses a pressing device and a bonding device, which comprises a carrying platform, a driving member and a pressing member. The driving member comprises a driving shaft reciprocating in a first direction, and the pressing member comprises a pressing part in sliding connection with the driving shaft. The device meets three working conditions: in a first state, the driving shaft and the pressing part are in rigid abutment, and the pressing part is in contact with the pressed object, so that stable large pressure can be accurately applied to meet the large pressure bonding requirement; in a second state, the driving shaft and the pressing part are kept apart, but the pressing part is in contact with the pressed object, so that uniform small pressure can be applied to facilitate pre-bonding and eliminate air gap, and the small pressure bonding requirement is met; and in a third state, the driving shaft, the pressing part and the pressed object are kept apart, the action is fast in response, and the start and stop of the pressing action can be accurately controlled. The application can meet the requirements of different bonding processes by taking into account the large pressure bonding and the small pressure bonding, and the start and stop of the pressing action can be accurately controlled while being fast in response.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a pressure application device and bonding equipment. Background Technology

[0002] In semiconductor device manufacturing, bonding is one of the key steps in achieving multilayer packaging, 3D integration, and the bonding of heterogeneous materials. Common bonding methods involve diffusion or interfacial reactions on the substrate surface in an atmospheric or vacuum environment, ultimately forming a high-strength bonding interface.

[0003] Currently, the mainstream pressure application methods are as follows: one method involves filling a bellows with compressed gas, which then expands the bellows under internal pressure, converting the gas pressure into mechanical pressure acting on the substrate; the other method uses a pneumatic booster to convert low air pressure into high hydraulic pressure, driving the hydraulic fluid to act on the pressurizing device to achieve a larger pressure output. However, the pneumatic method is limited by its low pressure tolerance and response lag, making it unable to meet the high-pressure, high-speed bonding requirements; while the gas-to-liquid method can output larger pressures, its poor accuracy, inability to apply pressure throughout the entire stroke, and lag result in uneven bonding pressure distribution and insufficient thickness control accuracy. Utility Model Content

[0004] This application provides a pressurizing device and bonding equipment, which aim to improve the technical problems existing in the prior art, so as to improve the efficiency and reliability of substrate bonding and adapt to the needs of different bonding conditions.

[0005] To achieve the above objectives, according to a first aspect of this application, a pressurization device is provided, comprising:

[0006] A loading platform used to support objects being compressed;

[0007] The driving component includes a drive shaft that reciprocates along a first direction, the first direction being perpendicular to the plane of the loading platform;

[0008] The pressure-applying component includes a pressure-applying part, which is slidably connected to the drive shaft. The pressure-applying part has a first surface and a second surface that are opposite to each other in a first direction, with the second surface facing the loading platform.

[0009] The pressurizing device has a first state, a second state, and a third state, and is configured as follows:

[0010] When the pressurizing device is in the first state, the second surface abuts against the object being pressed, and the end face of the drive shaft facing the pressure-applying member abuts against the first surface;

[0011] When the pressurizing device is in the second state, the second surface abuts against the object being pressed, and the end face of the drive shaft facing the pressure-applying member has a first distance from the first surface;

[0012] When the pressurizing device is in the third state, the second surface is separated from the object being pressed, and the end face of the drive shaft facing the pressure-applying member has a second distance from the first surface.

[0013] Optionally, the first spacing is less than or equal to the second spacing.

[0014] Optionally, the pressure applied to the object being pressed by the pressurizing device in the first state is greater than the pressure applied to the object being pressed in the second state, and the pressurizing device does not apply pressure to the object being pressed in the third state.

[0015] Optionally, the pressure-applying component further includes a connector, which is fixedly connected to the pressure-applying part. The connector has a through-hole, through which the drive shaft passes, and the outer diameter of the end of the drive shaft near the pressure-applying part is larger than the inner diameter of the through-hole.

[0016] Optionally, the connector includes a connecting plate and a connecting shaft. The connecting plate has a connecting hole that passes through it. The connecting shaft extends along a first direction. One end of the connecting shaft is fixedly connected to the connecting plate, and the other end is fixedly connected to the pressure-applying part.

[0017] Optionally, the pressure-applying part includes:

[0018] A bellows is arranged along the first direction, with the end face facing the loading platform being the second face, and the end face away from the loading platform being fixedly connected to the connecting shaft.

[0019] The ball-shaped cup structure includes a ball seat and a hemispherical head. The ball seat is fixedly connected to the end face of the bellows away from the loading platform. The spherical surface of the hemispherical head is located in the groove of the ball seat and is slidably connected to the ball seat. The plane of the hemispherical head away from the ball seat is the first surface.

[0020] Optionally, a force sensor is also included, disposed on the side of the drive member facing the pressure-applying member. The force sensor is sleeved on the drive shaft, and the force sensor is configured as follows:

[0021] The force output by the drive shaft is detected.

[0022] Optionally, it also includes a support base, and the driving component is an electric press, which is fixed to the support base.

[0023] According to a second aspect of this application, a bonding apparatus is provided, comprising the pressurizing device described in any of the preceding claims, wherein the object to be pressed comprises a substrate disposed opposite to the object along a first direction.

[0024] Optionally, it also includes a housing having a vacuum chamber, in which the pressurizing device is disposed.

[0025] The pressurizing device in this embodiment achieves switching between three working conditions: high pressure, low pressure, and no pressure, by setting a first state, a second state, and a third state. In the first state, the drive shaft and the pressurizing part are rigidly abutted together, and the pressurizing part is in contact with the object being pressed. This can apply a stable and sufficiently high pressure to the object being pressed, overcoming the shortcomings of insufficient pressure-bearing capacity of traditional bellows and meeting the high-strength bonding requirements of large-size substrates. In the second state, the drive shaft and the pressurizing part are kept apart, but the pressurizing part is in contact with the object being pressed. The pressurizing part applies only a small and uniform pressure to the object being pressed, which is beneficial for the full bonding between substrates and the elimination of interface air gaps. It also avoids the problem of unstable low pressure caused by friction dead zones and error amplification in pneumatic booster hydraulic solutions. In the third state, the drive shaft, the pressurizing part, and the object being pressed are all kept apart. This action is rapid and flexible, and the start and stop of the pressurizing action can be precisely controlled, overcoming the shortcomings of slow air filling and discharging of bellows and inertial delay of hydraulic systems. Therefore, this application outperforms existing technologies in terms of pressure range, control precision, response speed, and process adaptability, significantly improving the efficiency and reliability of substrate bonding.

[0026] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0029] Figure 1 This is a schematic diagram of the overall structure of a pressurizing device disclosed in an embodiment of this application. Figure 1 ;

[0030] Figure 2 This is a schematic diagram of the overall structure of a pressurizing device disclosed in an embodiment of this application. Figure 2 ;

[0031] Figure 3 yes Figure 2 Cross-sectional view at point AA;

[0032] Figure 4 This is a schematic diagram of the overall structure of a pressurizing device disclosed in an embodiment of this application. Figure 3 ;

[0033] Figure 5 yes Figure 4 Cross-sectional view at point BB;

[0034] Figure 6 yes Figure 5 Enlarged view of point D in the middle;

[0035] Figure 7 This is a schematic diagram of the overall structure of a pressurizing device disclosed in an embodiment of this application. Figure 4 ;

[0036] Figure 8 yes Figure 7 Cross-sectional view at point CC;

[0037] Figure 9 yes Figure 8 Enlarged view of point E in the middle.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. Cargo platform;

[0040] 2. Driving components; 21. Drive shaft;

[0041] 3. Pressure-applying components;

[0042] 31. Pressure application section; 311. Bellows; 3111. Second surface; 312. Ball-and-socket structure; 3121. Ball seat; 3122. Hemispherical head; 3123. First surface;

[0043] 32. Connecting component; 321. Connecting plate; 3211. Connecting hole; 322. Connecting shaft;

[0044] 4. Force sensor;

[0045] 5. Support base;

[0046] 6. The object being pressed. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0048] As described in the background section, in semiconductor device manufacturing, bonding is one of the key steps in achieving multilayer packaging, 3D integration, and the bonding of heterogeneous materials. A common bonding method involves aligning two substrates to be bonded in an atmospheric or vacuum environment, then heating them to a certain temperature and applying uniform pressure to induce diffusion or interfacial reactions on the substrate surfaces, ultimately forming a high-strength bonding interface.

[0049] The quality of substrate bonding directly affects the yield of subsequent processes and device performance, while the magnitude and uniformity of pressure distribution are important factors determining the total thickness variation of the bonding surface and the bonding strength.

[0050] In one embodiment, bonding to the substrate is achieved by filling the bellows chamber with compressed gas, causing it to expand and convert the gas pressure into mechanical pressure acting on the substrate. Due to the deformation limits and material strength limitations of the bellows, its pressure resistance is typically limited to no more than 0.5 MPa. This is based on a 12-inch substrate (pressure area approximately 500 cm²). 2 For example, the maximum output force is only about 25,000 N, which is far below the high-pressure bonding requirements; at the same time, the bellows volume is large, and the response cycle of air pressure driven expansion and release is long, making it difficult to achieve rapid pressure adjustment.

[0051] In another embodiment, a pneumatic booster device amplifies low air pressure into high hydraulic pressure via a booster cylinder, which then acts on a pressure actuator to output a large thrust for bonding the substrate. In this embodiment, the air pressure regulation error is amplified synchronously by the booster cylinder, leading to a decrease in hydraulic control accuracy. Furthermore, the booster device needs to overcome initial frictional resistance, making it difficult to output effective pressure in the initial stage of its stroke. Additionally, the pipeline inertia and valve switching delays in the hydraulic system affect real-time pressure regulation.

[0052] Therefore, in order to improve the above-mentioned technical problems and enhance the efficiency and reliability of substrate bonding, Embodiment 1 of this application discloses a pressurizing device.

[0053] Reference Figure 1 The pressurizing device disclosed in Embodiment 1 of this application includes a loading platform 1, a driving member 2, and a pressure applying member 3. The pressurizing device has a first direction, which is perpendicular to the plane of the loading platform 1. Further, referring to... Figure 2 and Figure 3 The loading platform 1 is used to support the object 6 to be pressed. The driving member 2 includes a driving shaft 21 that reciprocates along a first direction. The pressure applying member 3 includes a pressure applying part 31, which is slidably connected to the driving shaft 21. The pressure applying part 31 has a first surface 3123 and a second surface 3111 that are opposite each other in the first direction, with the second surface 3111 facing the loading platform 1.

[0054] In this embodiment, the pressurizing device has a first state, a second state, and a third state. (Refer to...) Figure 2 and Figure 3 When the pressurizing device is in the first state, the second surface 3111 abuts against the object being pressed 6, and the end face of the drive shaft 21 facing the pressure-applying member 3 abuts against the first surface 3123; refer to Figure 4 , Figure 5 and Figure 6 When the pressurizing device is in the second state, the second surface 3111 abuts against the object being pressed 6, and the end face of the drive shaft 21 facing the pressure-applying member 3 has a first distance X1 between it and the first surface 3123; refer to Figure 7 , Figure 8 , Figure 9 When the pressurizing device is in the third state, the second surface 3111 is separated from the object being pressed 6, and the end face of the drive shaft 21 facing the pressure member 3 has a second distance X2 between it and the first surface 3123.

[0055] In the above embodiments of this application, the pressurizing device does not apply pressure to the object 6 in the third state. The driving member 2 pulls the pressing part 31 by the driving shaft 21, so that the pressing part 31 is separated from the object 6. When the pressurizing device is in the third state, the loading, alignment and unloading processes of the object 6 can be ensured to be free of external force, avoiding damage to the object 6 during loading, unloading and alignment stages.

[0056] In the second state, the pressurizing device drives the drive shaft 21 towards the platform 1, and the drive shaft 21 also moves the pressure applying part 31 towards the platform 1, causing the pressure applying part 31 to come into contact with the object 6 being pressed. In this second state, a first distance X1 is maintained between the drive shaft 21 and the pressure applying part 31, ensuring that the pressure applying part 31 applies only a small and uniform pressure to the object 6. This pressure helps to ensure sufficient contact between the object 6 and the pressure applying part 31 and to eliminate interfacial air gaps before formal high-pressure bonding. When the object 6 is a substrate, the substrate to be bonded can fully contact and eliminate interfacial air gaps in the second state, thereby reducing local stress concentration during subsequent high-pressure bonding and improving bonding uniformity and yield. Compared to the problem of ineffective pressure output due to frictional resistance in the initial stage of the stroke in pneumatic pressurization hydraulic methods, this application can stably and accurately generate small pressures, avoiding the defects of insufficient low-pressure control accuracy. It is understood that the substrate includes wafers and other materials that need to be bonded.

[0057] In the first state, the pressurizing device has the pressure-applying part 31 in contact with the object being pressed 6. At this time, the driving member 2 drives the driving shaft 21 to continue moving towards the platform 1. Since the driving shaft 21 is slidably connected to the pressure-applying part 31, the driving shaft 21 can continue to move towards the platform 1 until it contacts the first surface 3123. Through the rigid contact between the driving shaft 21 and the pressure-applying part 31, a large pressure can be directly applied to the object being pressed 6, without being restricted by the material strength and deformation limit of the bellows 311. This breaks through the limitation of the traditional bellows pressurization method, which has a pressure limit of only 0.5MPa. At the same time, the pressure output to the object being pressed 6 through the driving shaft 21 is stable and controllable, which can meet the high-strength bonding requirements of 12-inch and larger substrates and ensure the reliability of the bonding interface.

[0058] In summary, the pressurization device of this application embodiment forms a first state, a second state, and a third state through the above structure, realizing the switching between three working conditions: high pressure, low pressure, and no pressure. It is superior to the prior art in terms of pressure range, control accuracy, response speed, and process adaptability, and significantly improves the efficiency and reliability of substrate bonding.

[0059] Specifically, in some embodiments, the applied pressure in the second state is between zero and the sum of the weight of the pressure-applying component 3 and the vacuum force. Therefore, in this state, the first gap X1 formed between the drive shaft 21 and the pressure-applying part 31 is set to be equal to or less than the second gap X2 in the unpressurized third state. This design ensures that in the second state, the pressure-applying part 31 and the object being pressed 6 maintain only slight contact without generating excessive load, which is beneficial for pre-fitting the surface of the pressure-applying part 31 and eliminating interface air gaps. Simultaneously, because the gap values ​​are equal or close, it facilitates precise control of the drive component 2, simplifies the switching logic between the three operating conditions, avoids shocks or instability caused by excessive stroke differences, thereby improving the pressure regulation accuracy and operational reliability of the device.

[0060] In some embodiments, the pressurizing device further includes a support base 5, and the driving component 2 is an electric press, which is fixed to the support base 5. Specifically, in this embodiment, the electric press is fixed to the support base 5 by bolts. The support base 5 has openings on both sides in the first direction, and the support base 5 has a receiving cavity. The driving shaft 21 extends into the receiving cavity, and the pressure applying component 3 is partially located inside the receiving cavity and partially located outside the receiving cavity.

[0061] The drive component 2 is fixed to the support base 5 with bolts, which effectively ensures the installation firmness and working stability of the drive component 2 and avoids positional displacement or vibration when high pressure is output. The drive component 2 and the pressure application component 3 are connected in the accommodating cavity, which can maintain the compact structure while providing a certain degree of protection for the internal transmission components, preventing external dust or impurities from entering and affecting their motion accuracy.

[0062] In some embodiments, the pressurizing device further includes a force sensor 4. The force sensor 4 is disposed on the side of the drive member 2 facing the pressure-applying member 3, and the drive shaft 21 passes through the force sensor 4. The force sensor 4 is configured to detect the force output by the drive shaft 21. It should be noted that in some embodiments, the force sensor 4 is also located within the accommodating cavity.

[0063] Force sensor 4 can directly measure the force on drive shaft 21 during the pressurization process, enabling real-time monitoring of the pressure applied to the pressing part 31 and avoiding poor substrate bonding due to insufficient force control. Simultaneously, by inputting the detected tensile or compressive values ​​into the software, the system can automatically calculate the required tensile or compressive output of the electric press, achieving closed-loop control and making the pressure applied to the substrate more precise and repeatable.

[0064] In some embodiments, the pressure-applying member 3 further includes a connector 32. The connector 32 is fixedly connected to the pressure-applying part 31, and the connector 32 has a through-hole 3211 through which the drive shaft 21 passes, and the outer diameter of the end of the drive shaft 21 near the pressure-applying part 31 is larger than the inner diameter of the through-hole 3211.

[0065] In this embodiment, in the third state, the larger outer diameter of the end of the drive shaft 21 can abut against the edge of the connecting hole 3211, thereby pulling the connector 32 and the pressure part 31 upward by the drive shaft 21, achieving reliable lifting of the pressure part 31 and preventing the pressure part 31 from sagging or accidentally touching the object 6 being pressed. In the first state, the drive shaft 21 can slide freely along the connecting hole 3211 until its end face approaches and abuts against the first surface 3123 of the pressure part 31, thereby applying pressure to the pressure part 31, ensuring the flexibility and reliability of the pressurization action.

[0066] Specifically, in some embodiments, a limiting step is formed on the outer periphery of the end of the drive shaft 21 near the pressure part 31. The limiting step is fixedly connected to the drive shaft so that the outer diameter of the end of the drive shaft 21 near the pressure part 31 is larger than the inner diameter of the connecting hole 3211. During the pressure reduction stage, the limiting step abuts against the connector 32, thereby restricting the vertical movement of the drive shaft 21.

[0067] Further, in some embodiments, the connector 32 includes a connecting plate 321 and a connecting shaft 322. The connecting plate 321 has a through-hole 3211. The connecting shaft 322 extends along a first direction, with one end fixedly connected to the connecting plate 321 and the other end fixedly connected to the pressure-applying part 31. Specifically, in some embodiments, the connecting shaft 322 is connected to the connecting plate 321 by bolts. This embodiment creates a space between the connecting plate 321 and the pressure-applying part 31 in the first direction, ensuring that the drive shaft 21 can slide smoothly along the first direction in the first state without interference, thereby improving the stability of the pressure application action and the convenience of assembly. It is understood that the protrusions formed on the outer periphery of the limiting step and the protrusions formed on the inner diameter of the connecting plate 321 are staggered to achieve limiting.

[0068] Furthermore, in some embodiments, the connector 32 further includes a hook (not shown) fixed circumferentially to the side of the connecting plate 321 away from the pressure application portion 31. The hook includes a first part and a second part connected together, wherein the first part overlaps with the connecting plate 321, and the second part forms a 90° angle with the first part and extends along a first direction between two adjacent protrusions of the limiting step. By providing the hook, it is possible to prevent the limiting step from passing through the protrusions at the inner diameter of the connecting plate 321 due to large-angle rotation when it becomes loose or disengaged from the drive shaft 21, thereby avoiding uncontrolled pressure regulation. It is understood that the number and distribution of the hooks can be determined accordingly based on the protrusion design of the limiting step.

[0069] Further, in some embodiments, the pressure-applying part 31 includes a bellows 311 and a ball-and-socket structure 312. The bellows 311 is arranged along a first direction. The end face of the bellows 311 facing the platform 1 is a second face 3111, and the end face away from the platform 1 is fixedly connected to the connecting shaft 322. The ball-and-socket structure 312 includes a ball seat 3121 and a hemispherical head 3122. The ball seat 3121 is fixedly connected to the end face of the bellows 311 away from the platform 1. The spherical surface of the hemispherical head 3122 is located in the groove of the ball seat 3121 and is slidably connected to the ball seat 3121. The plane of the hemispherical head 3122 away from the ball seat 3121 is a first face 3123.

[0070] In this embodiment, by providing a bellows 311, in the second state, the bellows 311 can flexibly float and adjust to the slight changes in the posture (horizontal tilt) of the object being pressed 6, ensuring a uniform distribution of contact pressure applied to the object, avoiding localized stress concentration, and improving the adhesion of the bonding interface. Simultaneously, the bellows 311 has elastic buffering characteristics, absorbing minor impacts during pressing and reducing the risk of damage to substrates or sheet-like objects. By providing a ball-and-cup structure 312, in the first state, the self-aligning function between the hemispherical head 3122 and the ball seat 3121 can automatically correct the parallelism deviation between the drive shaft 21 and the pressure application part 31. Even if there is a slight tilt in the output direction of the electric press, the floating ball-and-cup can compensate, ensuring that the direction of the large pressure applied to the object is always perpendicular. This effectively eliminates lateral shear force, ensures the stability and reliability of the applied pressure, and extends the service life of the bellows 311 and the overall pressure application part 31.

[0071] Embodiment 2 of this application also discloses a bonding device, which includes any of the above-described pressure devices, and the object being pressed 6 includes a substrate disposed opposite to it along a first direction.

[0072] Understandably, in some embodiments, an adsorption structure may be provided on the end face (i.e., the second face 3111) of the bellows 311 facing the platform 1 to adsorb the substrate and drive the substrate to move toward the platform 1, so as to bond with another substrate placed on the platform 1.

[0073] In some embodiments, at atmospheric pressure, and in some embodiments in a vacuum, when in a vacuum, the bonding apparatus further includes a housing having a vacuum chamber in which a pressurizing device is disposed.

[0074] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0075] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0076] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0077] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A pressurizing device, characterized in that, include: A loading platform is used to support objects that are being crushed. The driving component includes a drive shaft that reciprocates along a first direction, the first direction being perpendicular to the plane of the loading platform; The pressure-applying component includes a pressure-applying part, which is slidably connected to the drive shaft. The pressure-applying part has a first surface and a second surface that are opposite to each other in a first direction, with the second surface facing the loading platform. The pressurizing device has a first state, a second state, and a third state, and is configured as follows: When the pressurizing device is in the first state, the second surface abuts against the object being pressed, and the end face of the drive shaft facing the pressure-applying member abuts against the first surface; When the pressurizing device is in the second state, the second surface abuts against the object being pressed, and the end face of the drive shaft facing the pressure-applying member has a first distance from the first surface; When the pressurizing device is in the third state, the second surface is separated from the object being pressed, and the end face of the drive shaft facing the pressure-applying member has a second distance from the first surface.

2. The pressurizing device according to claim 1, characterized in that, The first spacing is less than or equal to the second spacing.

3. The pressurizing device according to claim 1, characterized in that, The pressure applied to the object by the pressurizing device in the first state is greater than the pressure applied to the object by the pressurizing device in the second state, and the pressurizing device does not apply pressure to the object by the pressurizing device in the third state.

4. The pressurizing device according to claim 1, characterized in that, The pressure-applying component also includes a connector, which is fixedly connected to the pressure-applying part. The connector has a through-hole, through which the drive shaft passes. The outer diameter of the end of the drive shaft near the pressure-applying part is larger than the inner diameter of the through-hole.

5. The pressurizing device according to claim 4, characterized in that, The connector includes a connecting plate and a connecting shaft. The connecting plate has a through-hole. The connecting shaft extends along a first direction. One end of the connecting shaft is fixedly connected to the connecting plate, and the other end is fixedly connected to the pressure-applying part.

6. The pressurizing device according to claim 5, characterized in that, The pressure-applying part includes: A corrugated pipe is arranged along the first direction, with the end face facing the loading platform being the second face, and the end face away from the loading platform being fixedly connected to the connecting shaft. The ball-shaped cup structure includes a ball seat and a hemispherical head. The ball seat is fixedly connected to the end face of the bellows away from the loading platform. The spherical surface of the hemispherical head is located in the groove of the ball seat and is slidably connected to the ball seat. The plane of the hemispherical head away from the ball seat is the first surface.

7. The pressurizing device according to claim 1, characterized in that, It also includes a force sensor disposed on the side of the drive member facing the pressure-applying member, the force sensor being sleeved on the drive shaft, and the force sensor being configured as follows: The force output by the drive shaft is detected.

8. The pressurizing device according to claim 1, characterized in that, It also includes a support base, and the driving component is an electric press, which is fixed on the support base.

9. A bonding apparatus, characterized in that, The pressurizing device includes any one of claims 1 to 8, wherein the object being pressurized includes substrates disposed opposite each other along a first direction.

10. The bonding apparatus according to claim 9, characterized in that, It also includes a housing having a vacuum chamber, in which the pressurizing device is disposed.

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