Wafer cleaning apparatus

Abstract

The utility model belongs to the technical field of electrical components, specifically relates to a device specially suitable for processing semiconductor or electric solid device in manufacturing or processing process, especially relates to a wafer cleaning device. Contain and clean through the setting of the cleaning chamber to wafer, even spray and wash the cleaning liquid to the cleaning chamber through the setting of the spray mechanism, and the waste liquid and waste gas in the cleaning chamber are synchronously discharged through the waste mechanism, and the clamping mechanism in the cleaning chamber is matched with the supporting column through the clamping jaw, so that the point contact of the edge of wafer is only contacted, that is, the effective cleaning area is sufficiently increased, so that the cleaning effect is improved.

Description

Technical Field

[0001] This utility model belongs to the field of electrical component technology, specifically relating to a device specifically suitable for processing semiconductor or solid-state devices during manufacturing or processing, and particularly to a wafer cleaning device. Background Technology

[0002] In the wafer cleaning process, a cleaning chamber module is usually used to clean the wafer before electroplating to prevent the wafer from contaminating the chemical solution in the subsequent electroplating tank. In related technologies, wafers are usually cleaned one by one, which has a good cleaning effect. However, related technologies usually use a clamping method to fix the wafer, but this method will prevent the clamped part of the wafer from being cleaned, resulting in incomplete wafer cleaning.

[0003] There is an urgent need to provide a wafer cleaning device to solve the technical problem of incomplete wafer cleaning in related technologies.

[0004] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0005] This disclosure provides at least one wafer cleaning apparatus, including: a cleaning chamber with a clamping mechanism disposed therein; and The spraying mechanism is located outside the cleaning chamber, with its spray heads positioned above the cleaning chamber; and The waste discharge mechanism is located at the bottom of the cleaning chamber and is connected to the cleaning chamber to discharge the waste liquid and waste gas after cleaning; among which The clamping mechanism is configured to point-grip the edge of the wafer using its jaws and support posts to increase the effective cleaning area of ​​the wafer.

[0006] In one alternative embodiment, the clamping mechanism further includes: a lifting assembly and a mounting bracket; The mounting bracket is located at the upper part of the cleaning chamber; and The lifting assembly is positioned at the center of the mounting frame, and its bottom is mounted on a fixed plate below the cleaning chamber; wherein The mounting frame is provided with support column mounting positions and gripper mounting positions, and the support column mounting positions and gripper mounting positions are arranged at intervals. The support pillar is configured to support the bottom of the wafer, and the grippers are configured to clamp the top of the wafer; and The lifting assembly is configured to move up and down to drive the grippers to move up and down and open and close, thereby receiving and holding the wafer.

[0007] In one optional embodiment, the lifting assembly includes: a lifting cylinder and a lifting block; The top of the lifting cylinder is provided with a wafer receiving position; wherein The lifting cylinder is configured to move upward so that its wafer receiving position receives the placed wafer; The lifting blocks are arranged around the periphery of the lifting cylinder, and the positions of the lifting blocks correspond to the grippers; and The lifting block is configured to follow the lifting cylinder as it moves upward to push the gripper, thereby causing the gripper to move upward and open.

[0008] In one optional embodiment, the gripper includes: a gripper body, a gripper frame, and a mounting sleeve; The mounting sleeve is disposed within the gripper mounting position; and The claw body is connected to the mounting sleeve, and the claw body is located on top of the claw body.

[0009] In one alternative embodiment, the gripper further includes a connecting shaft; The connecting shaft is disposed inside the claw body, and the top of the connecting shaft is connected to the bottom of the claw body; and The connecting shaft is configured to push the claw body from the clamping posture to the avoidance posture when it moves upward, so that the claw opens, and after the connecting shaft moves downward, it pulls the claw body from the avoidance posture back to the clamping posture, thereby performing edge clamping on the placed wafer.

[0010] In one optional embodiment, a first resistance spring is provided inside the claw body; A second resistance spring is fitted on the outer side of the claw body; The top of the second resistance spring is connected to the bottom of the mounting sleeve, and the bottom of the second resistance spring is connected to the bottom of the claw body; wherein The stiffness of the second resistance spring is greater than that of the first resistance spring, meaning that the lifting block is suitable for first pushing the connecting shaft to move so that the claw body flips from a vertical posture to an inclined posture before pushing the entire claw body upward.

[0011] In one optional embodiment, the lifting assembly further includes a rotating cylinder sleeved around the lifting cylinder; The outer wall of the rotating cylinder is provided with a lifting block mounting position; and A rotary cylinder is provided at the bottom of the rotating cylinder.

[0012] In one optional embodiment, the spraying mechanism includes: a spray pipe and a drive component; The driving component is disposed at the lower end of the spray pipe; and The end of the spray pipe is provided with a spray head mounting position; wherein The drive unit is configured to rotate the spray pipe so that the spray head covers the cleaning chamber.

[0013] In one optional embodiment, the waste discharge mechanism includes: an exhaust pipe and a liquid discharge pipe; Both the exhaust pipe and the drain pipe are located at the bottom of the cleaning chamber.

[0014] In one optional embodiment, the wafer cleaning apparatus further includes a drive motor disposed at the bottom of the cleaning chamber; and The output end of the drive motor is connected to the clamping mechanism via a belt; and The drive motor is configured to drive the clamping mechanism to rotate in a circular motion, thereby driving the wafer to rotate.

[0015] The beneficial effects of this utility model are that the wafer cleaning device contains and cleans the wafer through a cleaning chamber, sprays cleaning solution evenly into the cleaning chamber through a spraying mechanism, and discharges waste liquid and waste gas from the cleaning chamber simultaneously through a waste discharge mechanism. Furthermore, the clamping mechanism in the cleaning chamber, through the cooperation of its claws and support columns, ensures that the wafer only makes point contact at the edge, thus greatly increasing the effective cleaning area and improving the cleaning effect.

[0016] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0017] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 A three-dimensional structural schematic diagram of the wafer cleaning apparatus provided in an embodiment of this disclosure is shown; Figure 2 A top view of the wafer cleaning apparatus provided in an embodiment of this disclosure is shown; Figure 3A cross-sectional structural schematic diagram of the wafer cleaning apparatus provided in an embodiment of this disclosure is shown; Figure 4 A three-dimensional structural schematic diagram of the gripper provided in an embodiment of this disclosure is shown; Figure 5 A cross-sectional structural schematic diagram of the gripper provided in an embodiment of this disclosure is shown; Figure 6 A schematic diagram of the installation structure of the lifting cylinder and the rotary cylinder provided in the embodiments of this disclosure is shown; Figure 7 A schematic diagram of the internal structure of the wafer cleaning apparatus provided in an embodiment of this disclosure is shown. In the picture: 1. Cleaning chamber; 10. Fixing plate; 2. Spraying mechanism; 20. Spray pipe; 21. Driving component; 22. Spray head; 3. Waste discharge mechanism; 31. Drainage pipe; 32. Exhaust pipe; 4. Clamping mechanism; 41. Gripper; 410. Mounting sleeve; 411. Gripper body; 412. First resistance spring; 413. Connecting shaft; 414. Second resistance spring; 415. Gripper body; 42. Support column; 43. Lifting assembly; 431. Lifting cylinder; 432. Lifting block; 433. Wafer receiving position; 434. Rotary cylinder; 435. Rotating cylinder; 44. Mounting bracket; 5. Drive motor; 51. Pulley. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the figures, the thickness of parts may be exaggerated or reduced for the purpose of effectively depicting the technical content.

[0022] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0023] See Figure 1 , Figure 1A wafer cleaning apparatus is shown, comprising: a cleaning chamber 1, wherein a clamping mechanism 4 is disposed therein; a spraying mechanism 2 is disposed outside the cleaning chamber 1, wherein a spray head 22 is located above the cleaning chamber 1; and a waste discharge mechanism 3 is disposed at the bottom of the cleaning chamber 1 and communicates with the cleaning chamber 1 to discharge waste liquid and waste gas after cleaning; wherein the clamping mechanism 4 is configured to clamp the edge of the wafer at a point using its grippers 41 and support columns 42 to increase the effective cleaning area of ​​the wafer.

[0024] Specifically, the wafer is contained and cleaned in the cleaning chamber 1. The cleaning solution is evenly sprayed into the cleaning chamber 1 by the spraying mechanism 2. The waste liquid and waste gas in the cleaning chamber 1 are discharged simultaneously by the waste discharge mechanism 3. The clamping mechanism 4 in the cleaning chamber 1, through the cooperation of its claws 41 and support columns 42, makes point contact with the wafer only at the edge, which greatly increases the effective cleaning area and improves the cleaning effect.

[0025] See Figure 2 and Figure 3 In some embodiments, the clamping mechanism 4 further includes: a lifting assembly 43 and a mounting frame 44; the mounting frame 44 is disposed on the upper part of the cleaning chamber 1; and the lifting assembly 43 is disposed at the center of the mounting frame 44, with the bottom of the lifting assembly 43 disposed on the fixing plate 10 below the cleaning chamber 1; wherein the mounting frame 44 is provided with a support column 42 mounting position and a gripper 41 mounting position, and the support column 42 mounting position and the gripper 41 mounting position are arranged at intervals; the support column 42 is configured to support the bottom of the wafer, and the gripper 41 is configured to clamp the top of the wafer; and the lifting assembly 43 is configured to move up and down to drive the gripper 41 to move up and down and open and close, thereby receiving and clamping the wafer.

[0026] In some embodiments, the mounting bracket 44 may include, but is not limited to, being disposed on the lifting assembly 43. Specifically, the mounting bracket 44 may be disposed on the top of the lifting cylinder 431 of the lifting assembly 43, and the mounting bracket 44 is slidably connected to the lifting cylinder 431, that is, the up and down movement of the lifting cylinder 431 will not cause the mounting bracket 44 to move. The mounting bracket 44 is provided with mounting positions for the gripper 41 and the support column 42, and the support column 42 and the gripper 41 are spaced apart at the edge of the mounting bracket 44, so that the bottom of the wafer is supported by the support column 42, and the top is pressed by the gripper 41 to complete the fixation. For the wafer, only the end of the support column 42 and the claw tip of the gripper 41 are in contact with it, thereby reducing the area of ​​the wafer that is blocked.

[0027] See Figure 3 and Figure 6In some embodiments, the lifting assembly 43 includes: a lifting cylinder 431 and a lifting block 432; the top of the lifting cylinder 431 is provided with a wafer receiving position 433; wherein the lifting cylinder 431 is configured to move upward so that its wafer receiving position 433 receives the placed wafer; the lifting block 432 is arranged around the periphery of the lifting cylinder 431, and the position of the lifting block 432 corresponds to the gripper 41; and the lifting block 432 is configured to follow the lifting cylinder 431 upward to push the gripper 41, thereby causing the gripper 41 to move upward and open.

[0028] See Figure 7 Specifically, the wafer receiving position 433 at the top of the lifting cylinder 431 is configured to first contact the wafer for receiving and positioning. Specifically, the lifting cylinder 431 moves upward to drive the lifting block 432 to move upward. When the lifting block 432 moves upward, it contacts the bottom of the gripper 41 and pushes the connecting shaft 413 of the gripper 41 to move upward. The upward movement of the connecting shaft 413 pushes the gripper body 411 to rotate to an inclined position. After the gripper body 411 rotates to the inclined position, the connecting shaft 413 continues to move upward to push the gripper 41 to move upward as a whole, thereby receiving the wafer.

[0029] See Figure 4 and Figure 5 As an optional implementation, the mounting sleeve 410 located on the outermost part of the gripper 41 is mounted on the mounting frame 44. The gripper body 415 of the gripper 41 is slidably connected to the mounting sleeve 410. The gripper body 415 has a hollow cavity and a connecting shaft 413 is embedded inside. A first resistance spring 412 is provided at the lower end of the connecting shaft 413, and the upper end of the connecting shaft 413 is connected to the gripper body 411. A second resistance spring 414 is also sleeved on the outer side of the gripper body 415, and the stiffness of the second resistance spring 414 is greater than that of the first resistance spring 412. When the lifting block 432 moves upward, the lifting block 432 contacts the lower end face of the connecting shaft 413, pushing the connecting shaft 413 upward. At this time, the connecting... The connecting shaft 413 first pushes the claw body 411 to rotate and compress the first resistance spring 412. When the connecting shaft 413 moves up to the limit position, the lifting block 432 continues to move up, thereby pushing the claw body 415 to move up as a whole until it finally moves up to the limit position, that is, it is in the position of receiving the wafer. When the wafer is placed into the cleaning chamber 1, the lifting block 432 resets and drives the claw body 411 and the wafer receiving position 433 to move down and reset simultaneously until the head end of the support column 42 contacts the bottom surface of the wafer. After the lifting block 432 resets, the first resistance spring 412 resets and drives the claw body 411 to change from the tilted open posture to the initial vertical posture, thereby pressing the wafer and fixing the wafer.

[0030] See Figure 6 and Figure 7In some embodiments, the lifting assembly 43 further includes: a rotating cylinder 435 sleeved around the lifting cylinder 431; a lifting block 432 mounting position is provided on the outer wall of the rotating cylinder 435; and a rotating cylinder 434 is provided at the bottom of the rotating cylinder 435.

[0031] Specifically, the rotating cylinder 435 is configured to drive the lifting block 432 to rotate. When wafers need to be picked up or placed, the rotating cylinder 435 rotates to align the lifting block 432 with the gripper 41 and then moves it upward. During cleaning, the rotating cylinder 435 rotates to misalign the lifting block 432 with the gripper 41, thereby avoiding accidental contact with the gripper 41 caused by equipment vibration or pressure fluctuations during cleaning, which would affect the wafer fixing effect.

[0032] In some embodiments, the spraying mechanism 2 includes: a spray pipe 20 and a drive member 21; the drive member 21 is disposed at the lower end of the spray pipe 20; and the end of the spray pipe 20 is provided with a spray head 22 mounting position; wherein the drive member 21 is configured to drive the spray pipe 20 to rotate so that the spray head 22 covers the cleaning chamber 1.

[0033] In some embodiments, the waste discharge mechanism 3 includes an exhaust pipe 32 and a liquid discharge pipe 31; both the exhaust pipe 32 and the liquid discharge pipe 31 are located at the bottom of the cleaning chamber 1.

[0034] In some embodiments, the wafer cleaning apparatus further includes a drive motor 5, which is disposed at the bottom of the cleaning chamber 1; and the output end of the drive motor 5 is connected to the clamping mechanism 4 via a belt; that is, a pulley 51 is also provided at the bottom of the lifting cylinder 431 in the clamping mechanism 4, so that the lifting cylinder 431 is driven to rotate under the transmission of the belt, thereby driving the wafer to rotate.

[0035] In summary, this wafer cleaning apparatus uses a cleaning chamber 1 to contain and clean the wafer, a spray mechanism 2 to uniformly spray cleaning solution into the cleaning chamber 1, and a waste discharge mechanism 3 to simultaneously discharge waste liquid and waste gas from the cleaning chamber 1. Furthermore, the clamping mechanism 4 installed in the cleaning chamber 1, through the cooperation of its grippers 41 and support columns 42, ensures that the wafer only makes point contact at the edge, thus significantly increasing the effective cleaning area and improving the cleaning effect.

[0036] In this document, when it is said that the first component is located on the second component, this can mean that the first component can be directly formed on the second component, or that the third component can be inserted between the first component and the second component.

[0037] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0038] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0039] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0040] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A wafer cleaning apparatus, characterized in that, include: The cleaning chamber (1) is equipped with a clamping mechanism (4); and, The spraying mechanism (2) is located outside the cleaning chamber (1), and its spray head (22) is located above the cleaning chamber (1); as well as Waste discharge mechanism (3) is located at the bottom of cleaning chamber (1) and connected to cleaning chamber (1) to discharge waste liquid and waste gas after cleaning; wherein The clamping mechanism (4) is configured to clamp the edge point of the wafer by means of its jaws (41) and support posts (42).

2. The wafer cleaning apparatus as described in claim 1, characterized in that, The clamping mechanism (4) further includes: a lifting assembly (43) and a mounting bracket (44); The mounting bracket (44) is disposed on the upper part of the cleaning chamber (1); and The lifting assembly (43) is located at the center of the mounting bracket (44), and the bottom of the lifting assembly (43) is located on the fixing plate (10) below the cleaning chamber (1); wherein The mounting bracket (44) is provided with a support column (42) mounting position and a clamp (41) mounting position, and the support column (42) mounting position and the clamp (41) mounting position are arranged at intervals; The support pillar (42) is configured to support the bottom of the wafer, and the gripper (41) is configured to clamp the top of the wafer; and The lifting assembly (43) is configured to move up and down to drive the gripper (41) to move up and down and open and close, thereby receiving and holding the wafer.

3. The wafer cleaning apparatus as described in claim 2, characterized in that, The lifting assembly (43) includes: a lifting cylinder (431) and a lifting block (432); The top of the lifting cylinder (431) is provided with a wafer receiving position (433); wherein The lifting cylinder (431) is configured to move upward so that its wafer receiving position (433) receives the placed wafer; The lifting block (432) is arranged around the periphery of the lifting cylinder (431), and the position of the lifting block (432) corresponds to that of the gripper (41); and The lifting block (432) is configured to follow the lifting cylinder (431) to move upward to push the gripper (41), thereby causing the gripper (41) to move upward and open.

4. The wafer cleaning apparatus as described in claim 3, characterized in that, The gripper (41) includes: a gripper body (415), a gripper body (411), and a mounting sleeve (410). The mounting sleeve (410) is disposed within the mounting position of the gripper (41); and The claw body (415) is connected to the mounting sleeve (410), and the claw body (411) is located on the top of the claw body (415).

5. The wafer cleaning apparatus as described in claim 4, characterized in that, The gripper (41) further includes a connecting shaft (413); The connecting shaft (413) is disposed inside the claw body (415), and the top of the connecting shaft (413) is connected to the bottom of the claw body (411); and The connecting shaft (413) is configured to push the claw body (411) from the clamping posture to the avoidance posture when it moves upward, so that the claw (41) opens, and after the connecting shaft (413) moves downward, it pulls the claw body (411) from the avoidance posture back to the clamping posture, thereby performing edge clamping on the placed wafer.

6. The wafer cleaning apparatus as described in claim 5, characterized in that, The claw body (415) is provided with a first resistance spring (412). A second resistance spring (414) is fitted on the outer side of the claw body (415). The top of the second resistance spring (414) is connected to the bottom of the mounting sleeve (410), and the bottom of the second resistance spring (414) is connected to the bottom of the claw body (415); wherein The stiffness of the second resistance spring (414) is greater than that of the first resistance spring (412), that is, the lifting block (432) is adapted to first push the connecting shaft (413) to move so that the claw body (411) flips from a vertical posture to an inclined posture and then pushes the claw body (415) to move upward as a whole.

7. The wafer cleaning apparatus as described in claim 3, characterized in that, The lifting assembly (43) further includes a rotating cylinder (435) sleeved around the lifting cylinder (431). The outer wall of the rotating cylinder (435) is provided with a mounting position for a lifting block (432); and A rotary cylinder (434) is provided at the bottom of the rotary cylinder (435).

8. The wafer cleaning apparatus as described in claim 1, characterized in that, The spraying mechanism (2) includes: a spray pipe (20) and a drive component (21); The drive element (21) is disposed at the lower end of the spray pipe (20); and The end of the spray pipe (20) is provided with a spray head (22) mounting position; wherein The drive (21) is configured to rotate the spray pipe (20) so that the spray head (22) covers the cleaning chamber (1).

9. The wafer cleaning apparatus as described in claim 1, characterized in that, The waste discharge mechanism (3) includes: an exhaust pipe (32) and a liquid discharge pipe (31); Both the exhaust pipe (32) and the drain pipe (31) are located at the bottom of the cleaning chamber (1).

10. The wafer cleaning apparatus as described in claim 1, characterized in that, Also includes: A drive motor (5) is provided at the bottom of the cleaning chamber (1); and The output end of the drive motor (5) is connected to the clamping mechanism (4) via a belt; and The drive motor (5) is configured to drive the clamping mechanism (4) to rotate in a circular motion, thereby driving the wafer to rotate.

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