Semiconductor chip packaging processing positioning calibration device

Abstract

The utility model relates to chip packaging technical field discloses semiconductor chip packaging processing positioning calibration equipment, to solve the problem of low positioning accuracy and unstable clamping of prior art, the equipment includes organism, suction subassembly and positioning mechanism. Its core lies in, the positioning mechanism includes a locating plate that is provided with recess, at least one limit piece one is movably arranged on the side wall of recess, the inside of locating plate is provided with the sliding slot of sliding for limit piece one, and spring one arranged in sliding slot is used for applying reset elastic force to limit piece one. When the work piece is pressed into the recess, limit piece one is pressed to give way, and after the work piece is in place, limit piece one resets under the action of spring one and carries out the location to the work piece. The utility model further includes the mounting mechanism that cooperates with the preburied shell to realize the firm fixing of equipment. The utility model improves positioning accuracy and clamping stability through the self -adaptation limit and calibration structure, guarantees the packaging quality.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to semiconductor chip packaging processing positioning and calibration equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, the requirements for precision and automation in chip packaging processes are increasing. In automated packaging processes, robotic arms and other pick-up devices are typically used to place chips and packaged casings at high speed into pre-set positioning fixtures for assembly.

[0003] Most existing positioning fixtures use fixed grooves or cavities that match the shape of the workpiece, in which the workpiece is placed for initial positioning. However, in high-speed, repetitive "pick-and-place" cycles, due to the inertia of the robotic arm and the collision between the workpiece and the fixture, the workpiece inevitably experiences a slight bounce or positional shift the moment it falls into the fixed groove.

[0004] Such minute positional deviations cannot be corrected by simple, fixed tooling. The workpiece is passively held in the groove by gravity, lacking an active, final calibration and clamping mechanism. This results in an unstable positioning, making it prone to displacement due to slight vibrations during subsequent chip implantation or top cover packaging, thus accumulating positioning errors. This inaccurate and unstable positioning directly affects the final product's packaging quality, hermeticity, and long-term reliability, representing a core challenge that needs to be addressed to improve high-precision packaging yield.

[0005] Therefore, this invention proposes a semiconductor chip packaging and processing positioning calibration device to address the shortcomings of existing technologies. Utility Model Content

[0006] In view of the problems of low positioning accuracy and unstable clamping in existing semiconductor chip packaging and processing positioning and calibration equipment, this utility model aims to provide a semiconductor chip packaging and processing positioning and calibration equipment with an improved structure that can effectively solve the above problems.

[0007] This utility model provides a semiconductor chip packaging and processing positioning and calibration device, including: a body, and a suction component and a positioning mechanism disposed on the body; the positioning mechanism is used to receive the workpiece gripped and placed by the suction component.

[0008] The positioning mechanism includes a positioning plate with a groove and at least one limiting block.

[0009] Furthermore, the limiting block is movably disposed on the side wall of the groove, and its structure is designed such that when the workpiece is pressed into the groove, the limiting block can retract inward to provide space for the workpiece to enter; and after the workpiece is placed in place, the limiting block can automatically reset and abut against and clamp the workpiece from the side, thereby achieving the final limiting and calibration of the workpiece.

[0010] Preferably, the positioning plate has a sliding groove inside for the limiting block to slide, and the positioning mechanism also includes a spring disposed in the sliding groove for applying a reset elastic force to the limiting block.

[0011] Preferably, the suction assembly includes a robotic arm, a suction plate driven and connected to the robotic arm, and an air pump connected to the suction plate via a pipeline.

[0012] Preferably, the semiconductor chip packaging and processing positioning calibration equipment further includes a mounting mechanism for fixing the equipment to the working plane.

[0013] Preferably, the mounting mechanism includes a mounting block fixedly connected to the device and a sliding shell slidably connected to the mounting block.

[0014] Preferably, it further includes a pre-embedded shell that is detachably fitted with the sliding shell, the pre-embedded shell being adapted to be pre-fixed on the working plane.

[0015] Preferably, the sliding shell is provided with a sliding plate, a second limiting block, and a second spring inside; the sliding plate is movably disposed on the sliding shell and linked to the second limiting block, and the second spring is used to apply an elastic force to the sliding plate to drive the second limiting block to extend and engage with the pre-embedded shell.

[0016] Preferably, the semiconductor chip packaging and processing positioning calibration equipment further includes a control panel, which is electrically connected to the pick-up component.

[0017] This utility model has the following beneficial effects: 1. This utility model solves the problems of inaccurate chip packaging positioning and unstable clamping that easily cause displacement in the prior art by setting a movable limiting block on the positioning plate and a spring that provides a reset elastic force for it. This allows the limiting block to automatically retract when the package shell is pressed in and automatically reset and clamp the package shell after it is placed in place. It achieves the technical effect of high-precision adaptive positioning and calibration of the package shell and chip, and significantly improves the packaging quality and reliability.

[0018] 2. This utility model, by combining a suction assembly with a robotic arm and a suction plate with the aforementioned adaptive positioning mechanism and controlling it uniformly by a control panel, solves the problems of low efficiency, high labor intensity, and poor positioning consistency in traditional manual placement of packaged materials. It achieves the technical effect of automating continuous operations of gripping, transferring, and placing with high precision, thereby significantly improving production efficiency.

[0019] 3. This utility model solves the problem of high-precision equipment's long-term operational accuracy being affected by its unstable base by designing an installation mechanism consisting of an installation block, a sliding shell, a spring, and a limiting block, and locking it in conjunction with a pre-embedded shell embedded in the ground. This achieves the technical effect of quickly and firmly fixing the entire equipment on the working plane, providing a stable and reliable operating platform for high-precision packaging operations. Attached Figure Description

[0020] Figure 1 This is a three-dimensional schematic diagram of the semiconductor chip packaging and processing positioning and calibration equipment proposed in this utility model. Figure 2 This is a schematic diagram of the positioning plate of the semiconductor chip packaging and processing positioning and calibration equipment proposed in this utility model. Figure 3 for Figure 2 Enlarged view of point A in the middle; Figure 4 for Figure 2 Enlarged view of point B in the middle; Figure 5 for Figure 2 Enlarged view of point C in the middle.

[0021] Legend: 1. Machining positioning and calibration equipment; 2. Control panel; 3. Suction assembly; 31. Robotic arm; 32. Air pump; 33. Suction plate; 4. Positioning mechanism; 41. Positioning plate; 42. Limiting block one; 43. Sliding groove; 44. Spring one; 5. Installation mechanism; 51. Installation block; 52. Sliding shell; 53. Sliding plate; 54. Limiting block two; 55. Spring two; 56. Embedded shell. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0023] Example:

[0024] Please refer to Figures 1 to 5 This utility model provides a semiconductor chip packaging and processing positioning and calibration device, which aims to solve the technical problems of low positioning accuracy and unstable clamping in existing semiconductor chip packaging positioning devices.

[0025] like Figure 1 and Figure 2 As shown, the semiconductor chip packaging processing positioning and calibration equipment includes a body, a control panel 2, a suction component 3, a positioning mechanism 4, and a mounting mechanism 5, all located on the body. The suction component 3 is electrically connected to the control panel 2 and is used to grip the workpiece and place it in the positioning mechanism 4. The positioning mechanism 4 is used to perform high-precision positioning and calibration of the workpiece. The mounting mechanism 5 is used to securely fix the entire body to the working plane.

[0026] Reference Figures 2 to 5 As the core of this solution, the positioning mechanism 4 includes a positioning plate 41 with a groove for accommodating the workpiece. The positioning mechanism 4 also includes at least one limiting block 42, a sliding groove 43 inside the positioning plate 41, and a spring 44 inside the sliding groove 43. The limiting block 42 is movably disposed on the side wall of the groove, and a portion of the limiting block 42 can extend into the sliding groove 43 to achieve a sliding fit. One end of the spring 44 abuts against the inner wall of the sliding groove 43, and the other end... The workpiece is pressed into the groove by the suction assembly 3. The side wall of the workpiece squeezes the limiting block 42, so that the limiting block 42 overcomes the elastic force of the spring 44 and retracts into the sliding groove 43, providing space for the workpiece to be placed. When the workpiece is fully placed, the squeezing force on the limiting block 42 disappears, and the limiting block 42 is then pushed outward by the elastic force of the spring 44 and tightly abuts against the side wall of the workpiece, thereby realizing adaptive clamping and limiting of the workpiece.

[0027] To achieve automated gripping and placement of workpieces, as well as stable installation of the entire device, this embodiment also includes a suction assembly 3 and an installation mechanism 5; Please refer to the following carefully. Figure 1The suction assembly 3 includes a robotic arm 31, a suction plate 33, and an air pump 32. The end of the robotic arm 31 is driven to the suction plate 33. The air pump 32 is connected to the suction plate 33 through a pipeline to provide negative pressure suction to the suction plate 33. The operation of the entire suction assembly 3 is controlled by the control panel 2 through electrical connection. Please refer to the following carefully. Figure 1 The mounting mechanism 5 is used to fix the body of the processing positioning calibration equipment 1 to the working plane. The mounting mechanism 5 includes a mounting block 51 fixedly connected to the bottom of the body and a sliding shell 52 slidably connected to the mounting block 51. The sliding shell 52 is adapted to be detachably engaged with a pre-embedded shell 56 pre-fixed on the working plane. The sliding shell 52 is provided with a sliding plate 53, a second limiting block 54 and a second spring 55 inside. The sliding plate 53 is movably disposed on the sliding shell 52 and linked to the second limiting block 54. The second spring 55 is used to apply an elastic force to the sliding plate 53. When no external force is applied, the second spring 55 pushes the sliding plate 53, thereby driving the second limiting block 54 to extend to a locking position. In the locking position, the second limiting block 54 can engage with the internal structure of the pre-embedded shell 56, thereby achieving a stable fixation of the equipment body.

[0028] Based on the above embodiments, the present invention may further include the following preferred technical solutions: Specifically, in order to achieve reliable reset and limiting functions of the limiting block 42, a sliding groove 43 is provided inside the positioning plate 41, and the back of the limiting block 42 extends into the sliding groove 43 to form a sliding fit. A spring 44 is also accommodated inside the sliding groove 43, and the spring 44 always provides a rebound force towards the center of the groove for the limiting block 42. In a preferred embodiment, the suction assembly 3 specifically includes a robotic arm 31, a suction plate 33 driven and connected to the end of the robotic arm 31, and an air pump 32 connected to the suction plate 33 via a pipeline. The entire suction assembly 3 is centrally controlled and operated through an electrically connected control panel 2. In another preferred embodiment, in order to securely fix the machining positioning calibration device 1, the mounting mechanism 5 specifically includes a mounting block 51 fixedly connected to the body of the machining positioning calibration device 1, a sliding shell 52 slidably connected to the mounting block 51, and a pre-embedded shell 56 suitable for pre-fixing on the working plane and detachably engaging with the sliding shell 52. Inside the sliding shell 52, a sliding plate 53 is movably disposed on the sliding shell 52. The sliding plate 53 is linked to a limiting block 54. A spring 55 applies an elastic force to the sliding plate 53. This elastic force is used to drive the limiting block 54 to extend and engage with the pre-embedded shell 56 for locking.

[0029] The working principle is as follows: When chip packaging is required, the suction assembly 3 is first activated via control panel 2. The robotic arm 31 moves the suction plate 33 above the pre-arranged packaging shells. Then, the air pump 32 operates, and through the pipeline, the suction plate 33 generates suction to adsorb the packaging shells. The robotic arm 31 then moves to the positioning mechanism 4 and presses the suction plate 33 along with the packaging shells downward into the groove of the positioning plate 41. During the pressing process, the side wall of the packaging shells will squeeze the limiting block 42, forcing the limiting block 42 to compress the spring 44 and retract inward into the sliding groove 43. After the packaging shells have completely fallen into the grooves, the air pump 32 stops working, and the suction plate 33 releases the packaging shells. At this time, the compressed spring 44 pushes the limiting block 42 to reset, so that it tightly abuts against and holds the packaging shells, completing the first step of high-precision positioning. Subsequently, the chip and the other half of the packaging shells are placed in the same way. Finally, the clamping action of the limiting block 42 achieves stable positioning and calibration of the entire packaging.

[0030] When the processing positioning calibration equipment 1 needs to be installed and fixed, multiple pre-embedded shells 56 must first be fixed on the working plane. Then, the equipment 1 body is moved to the designated position so that the mounting block 51 of the mounting mechanism 5 is aligned with the pre-embedded shell 56. During operation, the sliding plate 53 is pressed inward, and the second limiting block 54 is driven to retract inward into the sliding shell 52 through the linkage connection. At the same time, the second spring 55 is compressed. Then, the sliding shell 52 is completely slid into the pre-embedded shell 56. After the sliding plate 53 is released, the elastic force of the second spring 55 will push the sliding plate 53 to reset, thereby pushing out the second limiting block 54 and locking it into the internal groove of the pre-embedded shell 56. Through the locking of multiple mounting mechanisms 5, the entire equipment 1 is finally firmly fixed in the designated position.

Claims

1. A semiconductor chip packaging processing positioning and calibration device (1), comprising a body, and a suction assembly (3) and a positioning mechanism (4) disposed on the body, the positioning mechanism (4) being adapted to receive a workpiece gripped and placed by the suction assembly (3); Its features are, The positioning mechanism (4) includes a positioning plate (41), on which a groove for accommodating the workpiece is provided; The positioning plate (41) is also provided with at least one limiting block (42), the limiting block (42) is movably disposed on the side wall of the groove, and the limiting block (42) can retract when the workpiece is pressed in and reset after the workpiece is placed in place to limit the workpiece. The positioning plate (41) has a sliding groove (43) for the limiting block (42) to slide. The positioning mechanism (4) also includes a spring (44), the spring (44) is disposed in the sliding groove (43) and is used to apply a reset elastic force to the limiting block (42).

2. The semiconductor chip packaging and processing positioning calibration equipment (1) according to claim 1, characterized in that, The suction assembly (3) includes a robotic arm (31), a suction plate (33) drivenly connected to the robotic arm (31), and an air pump (32) connected to the suction plate (33) via a pipeline.

3. The semiconductor chip packaging and processing positioning calibration equipment (1) according to claim 1, characterized in that, The device (1) further includes an installation mechanism (5) for fixing the device (1) to the working plane.

4. The semiconductor chip packaging and processing positioning calibration equipment (1) according to claim 3, characterized in that, The installation mechanism (5) includes a mounting block (51) fixedly connected to the device (1) and a sliding shell (52) slidably connected to the mounting block (51).

5. The semiconductor chip packaging and processing positioning calibration equipment (1) according to claim 4, characterized in that, It also includes a pre-embedded shell (56) that is detachably fitted with the sliding shell (52), the pre-embedded shell (56) being adapted to be pre-fixed on the working plane.

6. The semiconductor chip packaging and processing positioning calibration equipment (1) according to claim 5, characterized in that, The sliding shell (52) is provided with a sliding plate (53), a second limiting block (54) and a second spring (55) inside; the sliding plate (53) is movably disposed on the sliding shell (52) and linked to the second limiting block (54); the second spring (55) is used to apply an elastic force to the sliding plate (53) to drive the second limiting block (54) to extend and engage with the pre-embedded shell (56).

7. The semiconductor chip packaging and processing positioning calibration equipment (1) according to claim 1, characterized in that, The device (1) also includes a control panel (2) which is electrically connected to the suction assembly (3).

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