Wafer transport device and semiconductor process equipment

Abstract

The application discloses a wafer conveying device and a semiconductor process equipment, and belongs to the technical field of semiconductor processing. The wafer conveying device comprises a wafer bearing, a moving driving assembly, a detection element and an alarm module. The moving driving assembly is connected with the wafer bearing and is used for driving the wafer bearing to move. The detection element is used for detecting the load of the moving driving assembly. The alarm module is in communication connection with the detection element. The alarm module is used for alarming when the load detected by the detection element is greater than or smaller than a preset load. In the scheme, whether the wafer is stuck or the wafer bearing collides with other components is determined through the detection of the load of the moving driving assembly by the detection element, and an alarm is given, so that the operator can know and handle in time, and the wafer or the wafer conveying device can be further prevented from being damaged, thereby the integrity and quality of the wafer can be improved, and the service life of the wafer conveying device can be prolonged.

Description

Technical Field

[0001] This application belongs to the field of semiconductor processing technology, specifically relating to a wafer transport device and semiconductor process equipment. Background Technology

[0002] In semiconductor process equipment, wafer transport devices are indispensable for transporting wafers to different locations or for processing.

[0003] In related technologies, during the wafer transfer process, when the wafer or the wafer carrier of the wafer transfer device is interfered with, such as when the wafer becomes stuck or the wafer carrier collides with other components, the operator cannot take quick measures, which can easily lead to wafer breakage or damage to the components of the wafer transfer device. Utility Model Content

[0004] The purpose of this application is to provide a wafer transport device and semiconductor process equipment that can solve the problem in the related art that operators cannot take quick measures when the wafer or wafer carrier is disturbed.

[0005] In a first aspect, embodiments of this application provide a wafer transport device, the wafer transport device comprising: Wafer carrier; A motion drive component is connected to the wafer carrier and is used to drive the wafer carrier to move; A detection element for detecting the load on the moving drive component; An alarm module is communicatively connected to the detection element, and the alarm module is used to issue an alarm when the load detected by the detection element is greater than or less than a preset load.

[0006] Secondly, embodiments of this application also provide a semiconductor process apparatus, which includes a robotic arm and the aforementioned wafer transfer device. The robotic arm is used to grasp wafers on the wafer carrier of the wafer transfer device or to place wafers on the wafer carrier.

[0007] In this embodiment, by detecting the load of the moving drive component by the detection element, it can be determined whether there is wafer jamming or collision between the wafer carrier and other components. When the load of the moving drive component detected by the detection element is greater than or less than the preset load, it indicates that there is a problem such as wafer jamming or collision between the wafer carrier and other components. At this time, the alarm module will sound an alarm so that the operator can be informed and deal with it in time, thereby preventing further damage to the wafer or wafer transmission device, thereby improving the integrity and quality of the wafer and extending the service life of the wafer transmission device. Attached Figure Description

[0008] Figure 1 This is one of the perspective views of the wafer transfer device disclosed in the embodiments of this application; Figure 2 This is a second perspective view of the wafer transmission device disclosed in the embodiments of this application; Figure 3 This is a partial enlarged view of the wafer transfer device disclosed in the embodiments of this application; Figure 4 This is a perspective view of the connecting block disclosed in the embodiments of this application; Figure 5 This is one of the connection diagrams of the fixed frame, detection element and sliding assembly and other components disclosed in the embodiments of this application from a stereoscopic perspective; Figure 6 This is the second diagram showing the connection relationship of the components such as the fixing frame, detection element and sliding assembly disclosed in the embodiments of this application from a stereoscopic perspective; Figure 7 This is an exploded view of the components such as the fixing frame, detection element, and sliding assembly disclosed in the embodiments of this application from a stereoscopic perspective; Figure 8 This is one of the connection diagrams of the sliding component, the second transmission wheel and the elastic element disclosed in the embodiments of this application from a three-dimensional perspective; Figure 9 This is the second diagram showing the connection relationship between the sliding component, the second transmission wheel, and the elastic element in a three-dimensional view, as disclosed in the embodiments of this application. Figure 10 This is the third diagram showing the connection relationship of the sliding component, the second transmission wheel, and the elastic element in a three-dimensional view (hidden limiting element). Figure 11 This is one of the perspective views of the slider disclosed in the embodiments of this application; Figure 12 This is a second perspective view of the slider disclosed in the embodiments of this application.

[0009] Explanation of reference numerals in the attached figures: 100 - Machine base; 110 - Mounting plate; 120 - Bottom support plate; 130 - Limiting plate; 140 - Slide rail; 200 - Wafer carrier; 210 - Movable base plate; 211 - Adjustment hole; 212 - Adjustment screw; 220 - First side plate; 230 - Second side plate; 240 - First wafer holder; 241 - First support groove; 250 - Second wafer tray; 251 - Second carrier groove; 300 - Motion drive assembly; 310 - Drive component; 311 - Drive motor; 320 - First transmission pulley; 330 - Second transmission pulley; 340 - First transmission belt; 350 - Drive wheel; 360 - Third drive wheel; 370 - Second drive belt; 380 - Drive shaft; 390 - Sliding component; 391 - Slider; 392 - Detection piece; 393 - First part; 394 - Second part; 3941 - First connecting hole; 395 - Third part; 3951 - Second connecting hole; 396 - Through hole; 397 - Opening; 398 - Limiting groove; 399 - Sliding part; 3910 - Connecting shaft; 3911 - Bearing; 3912 - Bearing mounting hole; 3913 - Limiting component; 3110 - Connecting assembly; 3111 - Connecting block; 31111 - Support part; 31112 - Connecting part; 3112 - Pressure block; 400 - Fixing frame; 410 - First fixing plate; 420 - Second fixing plate; 430 - Third fixing plate; 440 - Fourth fixing plate; 441 - Slide groove; 450-Fixed slide bar; 500-Elastic element; 600-Detection element; 610-Detection port; 700-Connecting bracket; 710 - Strip hole; 720 - Fastener; 730 - Bracket fixing pin; 800 - Intermediate adjusting plate; 900 - Adjusting component; 1000-slider. Detailed Implementation

[0010] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0011] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0012] The wafer transport device and semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0013] refer to Figures 1-12 The wafer transfer device provided in this application embodiment may include a wafer carrier 200, a motion drive assembly 300, a detection element 600, and an alarm module.

[0014] like Figure 1 As shown, the wafer carrier 200 can be used to carry wafers, and the motion drive assembly 300 can be connected to the wafer carrier 200 and used to drive the wafer carrier 200 to move, thereby realizing the transfer of wafers. For example, the motion drive assembly 300 can be used to drive the wafer carrier 200 to rise and fall, so that a robot can grasp the wafer on the wafer carrier 200 or place the wafer on the wafer carrier 200.

[0015] The detection element 600 can be used to detect the load on the mobile drive assembly 300. An alarm module can be communicatively connected to the detection element 600 and can sound an alarm when the load detected by the detection element 600 is greater than or less than a preset load, so that the operator is promptly notified. For example, the alarm module may include an indicator light and / or a buzzer; when the load detected by the detection element 600 is greater than or less than the preset load, the indicator light flashes and / or the buzzer sounds.

[0016] In this embodiment, by detecting the load of the moving drive assembly 300 by the detection element 600, it can be determined whether there is wafer jamming or collision between the wafer carrier 200 and other components. When the load of the moving drive assembly 300 detected by the detection element 600 is greater than or less than a preset load, it indicates that there is a problem such as wafer jamming or collision between the wafer carrier 200 and other components. At this time, the alarm module will sound an alarm so that the operator can be informed and deal with it in time, thereby preventing further damage to the wafer or wafer transmission device, thereby improving the integrity and quality of the wafer and extending the service life of the wafer transmission device.

[0017] In optional embodiments of this application, such as Figure 1 and Figure 2As shown, the wafer transfer device may further include a machine base 100. The motion drive assembly 300 may include a first drive wheel 320, a second drive wheel 330, a first drive belt 340, and a drive member 310. The first drive wheel 320 is rotatably mounted on the machine base 100, and the first drive wheel 320 and the second drive wheel 330 are spaced apart in the direction of movement of the wafer carrier 200. The first drive belt 340 may be sleeved on the first drive wheel 320 and the second drive wheel 330, and may drive the first drive wheel 320 and the second drive wheel 330. The first drive belt 340 is connected to the wafer carrier 200. The drive member 310 may be connected to the first drive wheel 320 and is used to drive the first drive wheel 320 to rotate, thereby causing the first drive belt 340 to move the wafer carrier 200 to realize the transfer or processing of the wafer at different positions. For example, the movement of the first drive belt 340 may cause the wafer carrier 200 to rise or fall.

[0018] In this embodiment, the wafer carrier 200 is moved by the first transmission belt 340. Compared to moving the wafer carrier 200 by a ball screw structure, the first transmission belt 340 has lower rigidity and a certain degree of flexibility and elasticity. When the drive component 310 starts or stops moving, the first transmission belt 340 undergoes a certain degree of elastic deformation, thus playing a buffering role. This makes the speed change of the wafer carrier 200 more gradual, reducing the inertial force on the wafer and thus helping to reduce the risk of the wafer sliding, displacing, or breaking due to inertial force. In addition, the movement of the wafer carrier 200 is achieved by the cooperation of the transmission wheel and the transmission belt, which makes the structure of the wafer transport device simple and requires no maintenance for long-term operation.

[0019] For example, the first drive belt 340 can be a belt or a rope. Of course, the first drive belt 340 can also be a chain or a track, or other structures.

[0020] In other embodiments, the motion drive assembly 300 may include a drive member 310 and a ball screw structure. The drive member 310 is connected to the lead screw of the ball screw structure, and the nut of the ball screw structure is connected to the wafer carrier 200. The movement of the nut drives the wafer carrier 200 to move, thereby realizing the position adjustment of the wafer.

[0021] In an optional embodiment, the drive element 310 includes a drive motor 311 that directly drives the first transmission wheel 320 to rotate. In another optional embodiment, such as Figure 2As shown, the driving component 310 includes a drive motor 311, a drive wheel 350, a third transmission wheel 360, and a second transmission belt 370. The drive wheel 350 can be connected to the drive motor 311, and both the drive wheel 350 and the third transmission wheel 360 can be rotatably connected to the machine base 100. The third transmission wheel 360 and the first transmission wheel 320 can be connected via a transmission shaft 380. The third transmission wheel 360 can drive the first transmission wheel 320 to rotate. The second transmission belt 370 can be sleeved on the drive wheel 350 and the third transmission wheel 360 and drive the drive wheel 350 and the third transmission wheel 360 to rotate, so that the drive wheel 350 can drive the third transmission wheel 360 to rotate, thereby driving the first transmission wheel 320 to rotate.

[0022] In optional embodiments of this application, such as Figure 2 As shown, the mobile drive assembly 300 may further include a sliding assembly 390, which can be slidably connected to the machine base 100, such as... Figures 5-7 As shown, the second transmission wheel 330 can be rotatably connected to the sliding assembly 390, and the sliding direction of the sliding assembly 390 is parallel to the moving direction of the wafer carrier 200.

[0023] The detection element 600 can be used to detect the movement of the sliding component 390. The load of the movement drive component 300 includes the movement of the sliding component 390. The alarm module can be used to trigger an alarm when the detection element 600 detects that the movement of the sliding component 390 is greater than or less than a preset movement amount.

[0024] In this embodiment, the second transmission wheel 330 can convert the force on the first transmission belt 340 into the movement of the sliding component 390. By detecting the movement of the sliding component 390, compared with directly detecting the force on the first transmission belt 340, it is not necessary to set the detection element 600 inside the first transmission belt 340, and there is no need to modify the structure of the first transmission belt 340, which facilitates the installation of the detection element 600.

[0025] In other embodiments, the detection element 600 can also be used to detect the force acting on the first transmission belt 340. The detection element 600 can be disposed inside the first transmission belt 340, and the load of the moving drive assembly 300 can also include the force acting on the first transmission belt 340. If the detection element 600 detects that the force acting on the first transmission belt 340 is greater than or less than a preset value, an alarm device will sound an alarm.

[0026] In optional embodiments, such as Figure 7As shown, the sliding assembly 390 may include a slider 391 and a detection piece 392 connected to the slider 391. The slider 391 can be slidably connected to the machine base 100, and the second transmission wheel 330 can be rotatably connected to the slider 391. The detection element 600 can be connected to the machine base 100 and may be provided with a detection port 610. The detection piece 392 can slide into the detection port 610. When the detection piece 392 is outside the detection port 610, the movement of the slider 391 is greater than or less than a preset movement amount. In this embodiment, the detection element 600 can detect the detection piece 392 to detect the displacement of the sliding assembly 390. This eliminates the need for a sensor for precisely detecting the displacement of the slider 391, thus reducing costs. When the detection element 600 detects the detection piece 392, it indicates that the slider 391 is within the detection range of the detection element 600, and the wafer is not stuck, the wafer carrier 200 is not colliding with other components, or the wafer is not falling off. When the detection element 600 does not detect the detection piece 392, it indicates that the slider 391 is not within or exceeds the detection range of the detection element 600, and in this case, the wafer is falling off, stuck, or the wafer carrier 200 is colliding with other components. In this embodiment, the detection piece 392 can be connected to the slider 391 by connecting screws.

[0027] Optionally, the detection element 600 may include a mounting base and a photoelectric switch disposed on the mounting base, and the mounting base may be connected to the machine tool 100.

[0028] In other embodiments, the sliding assembly 390 may not include the detection piece 392, the detection element 600 may not have the detection port 610, and the detection element 600 may not be connected to the machine base 100. The detection element 600 may be connected to the slider 391 and slide together with the slider 391 to detect the displacement of the slider 391 in real time. For example, the detection element 600 may be a position sensor.

[0029] In some embodiments, such as Figures 5-7As shown, the wafer transfer device may further include a connecting bracket 700 and a fixing member 720. The connecting bracket 700 can be connected to the machine base 100. Specifically, the connecting bracket 700 can be connected to the fixing frame 400 described below. The connecting bracket 700 may be provided with a strip hole 710, which can extend along the sliding direction of the sliding assembly 390. One end of the fixing member 720 can pass through the strip hole 710 and connect to the detection element 600. The fixing member 720 can slide along the strip hole 710 and can lock the detection element 600 and the connecting bracket 700. With this configuration, the installation position of the detection element 600 can be adjusted to adjust the detection range of the detection element 600, that is, the detection chip 392 can be placed within or outside the detection range of the detection element 600, thereby enabling the alarm module to alarm and realize the sensing of different loads.

[0030] In other embodiments, the strip hole 710 may not be provided on the connecting bracket 700, and the fastener 720 may connect the detection element 600 and the connecting bracket 700, so that the detection element 600 is fixed on the connecting bracket 700.

[0031] Optionally, such as Figures 5-7 As shown, the connecting bracket 700 may be provided with two slotted holes 710, and the wafer transfer device may include two fixing members 720. One end of each fixing member 720 may pass through the slotted holes 710 and be connected to the detection element 600. This arrangement can improve the stability of the connection between the detection element 600 and the connecting bracket 700.

[0032] In optional embodiments, such as Figures 5-7 As shown, the wafer transfer device may further include an elastic element 500. The first end of the elastic element 500 can be connected to the machine base 100, and the second end of the elastic element 500 can be connected to the sliding assembly 390. In this embodiment, when the drive unit 310 starts or stops operating, or when the load changes, the load on the first transmission belt 340 will dynamically change. This change on the first transmission belt 340 will be transmitted to the sliding assembly 390, and then from the sliding assembly 390 to the elastic element 500, causing the elastic element 500 to undergo elastic deformation. The elastic element 500 can absorb a portion of the energy from this change and convert it into elastic potential energy for storage. Meanwhile, the elastic restoring force of the elastic element 500 will gradually act on the first transmission belt 340 through the sliding component 390, making the moving speed of the first transmission belt 340 relatively slow, such as making the first transmission belt 340 start slowly, similar to the soft start of a motor, thereby making the moving speed of the wafer carrier 200 relatively slow, preventing the speed of the wafer carrier 200 from changing drastically, thus effectively reducing the inertial force and impact force borne by the wafer, and greatly reducing the risk of wafer breakage.

[0033] In other embodiments, the wafer transfer device may also exclude the elastic element 500.

[0034] In optional embodiments, such as Figures 5-7 As shown, the wafer transfer device may further include a mounting bracket 400, which can be connected to the machine base 100. The sliding assembly 390 and the elastic element 500 can both be located within the mounting bracket 400, such as... Figure 5 As shown, one of the mounting bracket 400 and the sliding component 390 is provided with a groove 441, the extension direction of which is parallel to the movement direction of the wafer carrier 200. The other is provided with a sliding part 399, the groove 441 and the sliding part 399 are slidably engaged, and the first end of the elastic member 500 is connected to the mounting bracket 400. In this embodiment, the sliding component 390 and the elastic member 500 can be integrated into the mounting bracket 400, and then the sliding component 390, the elastic member 500 and the mounting bracket 400 can be connected to the machine tool 100 as a whole. In this way, the machine tool 100 only needs to provide a relatively simple connection structure to achieve the connection with the mounting bracket 400, thereby avoiding major modifications to the structure of the machine tool 100 and simplifying the installation process of the sliding component 390 and the elastic member 500 with the machine tool 100. Furthermore, the sliding engagement between the groove 441 and the sliding portion 399 ensures that the sliding assembly 390 can move freely in a direction parallel to the moving direction of the wafer carrier 200, and prevents the sliding assembly 390 from deviating during sliding. Optionally, the sliding portion 399 can be a guide follower; specifically, the sliding portion 399 can be a roller to reduce the friction between the sliding portion 399 and the groove wall of the groove 441.

[0035] Of course, the wafer transfer device may not include the mounting bracket 400, the sliding component 390 can be directly slidably mounted on the machine base 100, and the elastic element 500 can be directly connected to the machine base 100.

[0036] In optional embodiments, such as Figures 5-7As shown, the wafer transfer device may further include an intermediate adjusting plate 800 and an adjusting member 900. The intermediate adjusting plate 800 may be located within the fixed frame 400. The first end of the elastic member 500 may be connected to the fixed frame 400 via the intermediate adjusting plate 800, and the intermediate adjusting plate 800 may be movably connected to the fixed frame 400. The adjusting member 900 may be connected to the fixed frame 400 and may also be connected to the intermediate adjusting plate 800, and is used to drive the intermediate adjusting plate 800 to move. With this configuration, the position of the intermediate adjusting plate 800 can be adjusted via the adjusting member 900, thereby controlling the compression amount of the elastic member 500, which in turn controls the displacement of the sliding assembly 390, thus controlling the alarm range of the alarm module. For example, the adjusting member 900 may be a bolt. The fixed frame 400 may have a threaded hole, one end of which may pass through the threaded hole and be connected to the intermediate adjusting plate 800. The bolt may also be threaded into the threaded hole, and the position of the intermediate adjusting plate 800 can be adjusted by rotating the bolt.

[0037] In other embodiments, the wafer transfer device may also exclude the intermediate adjustment plate 800 and the adjustment element 900.

[0038] In optional embodiments, such as Figures 8-10 As shown, a fixed slide rod 450 can be provided inside the fixed frame 400. The sliding component 390 can be sleeved on the fixed slide rod 450 and can slide in cooperation with the fixed slide rod 450. The extension direction of the fixed slide rod 450 can be the same as the sliding direction of the sliding component 390. In addition, in a first direction, the fixed slide rod 450 can limit the sliding component 390. The first direction intersects with the moving direction of the sliding component 390. In this embodiment, the fixed slide rod 450 can guide and limit the sliding component 390, so that the sliding component 390 can only slide along the extension direction of the fixed slide rod 450. It can also further prevent the sliding component 390 from deviating during the sliding process, ensuring the accuracy of the movement of the sliding component 390.

[0039] Here, the first direction can be the radial direction of the fixed slide rod 450. In this embodiment, the two ends of the fixed slide rod 450 can be connected to the first fixing plate 410 and the second fixing plate 420 described below, respectively.

[0040] In other embodiments, the fixed slide rod 450 may not be provided inside the fixed frame 400.

[0041] In optional embodiments, such as Figure 12As shown, a limiting groove 398 is provided on the sliding component 390. A portion of the elastic element 500 is located within the limiting groove 398, and the second end of the elastic element 500 is connected to the bottom of the limiting groove 398. In a first direction, the elastic element 500 is limited and engaged with the groove wall of the limiting groove 398. The first direction intersects with the sliding direction of the sliding component 390. In this embodiment, the groove wall of the limiting groove 398 can limit the elastic element 500, preventing it from deforming in the first direction. Furthermore, the limiting groove 398 can prevent the elastic element 500 from separating from the sliding component 390, ensuring that the elastic element 500 can effectively act on the sliding component 390, thereby providing a stable elastic force to the sliding component 390. Here, the first direction can be the radial direction of the elastic element 500.

[0042] Of course, the limit slot 398 may not be provided on the sliding component 390.

[0043] Optionally, the number of elastic elements 500 can be at least two. The first end of each elastic element 500 can be connected to the fixing frame 400. The sliding assembly 390 can be provided with at least two limiting grooves 398. A portion of each elastic element 500 is respectively disposed in each limiting groove 398, and the second end of each elastic element 500 can be connected to the bottom of the corresponding limiting groove 398. In this embodiment, each elastic element 500 can share the force applied by the sliding assembly 390 and can balance the force on the sliding assembly 390, thereby improving the stability of the sliding assembly 390 during the sliding process, which is beneficial to improving the smoothness of the movement of the wafer carrier 200.

[0044] Of course, there can also be only one elastic element of 500.

[0045] Further optional, such as Figures 11-12 As shown, the sliding component 390 is provided with a through hole 396, which can be coaxially arranged and connected with one of the limiting grooves 398. The fixed sliding rod 450 can pass through the through hole 396 and the limiting groove 398, and the elastic element 500 opposite to the limiting groove 398 can be sleeved on the fixed sliding rod 450. In this arrangement, the fixed sliding rod 450 can limit the elastic element 500 to prevent the elastic element 500 from deforming in the first direction.

[0046] In some embodiments, such as Figure 11As shown, the sliding assembly 390 includes a first part 393, a second part 394, and a third part 395. Both the second part 394 and the third part 395 are connected to the first part 393. A through hole 396 can be formed between the first part 393, the second part 394, and the third part 395, and an opening 397 is formed between the second part 394 and the third part 395, communicating with the through hole 396. The second part 394 may be provided with a first connecting hole 3941, and the third part 395 may be provided with a second connecting hole 3951, with the second connecting hole 3951 opposite to the first connecting hole 3941. The sliding assembly 390 may also include a fixing screw, which can pass through the first connecting hole 3941 and connect to the second connecting hole 3951. By adjusting the tightness of the fixing screw, the size of the opening 397 can be adjusted, thereby adjusting the diameter of the through hole 396, and thus adjusting the gap between the wall of the through hole 396 and the fixed slide rod 450.

[0047] In optional embodiments, such as Figure 10 As shown, the sliding assembly 390 may include a slider 391 and a connecting shaft 3910 passing through the slider 391. One end of the connecting shaft 3910 may be connected to the second transmission wheel 330, as shown. Figures 5-9 As shown, the other end of the connecting shaft 3910 can be connected to a limiting member 3913. The limiting member 3913 engages with the slider 391 in a limiting fit along the axial direction of the connecting shaft 3910. This configuration allows the limiting member 3913 to restrict movement of the connecting shaft 3910 and the second transmission wheel 330 along its axial direction.

[0048] Of course, the connecting shaft 3910 may not be connected to the limiting member 3913.

[0049] In some embodiments, such as Figure 10 As shown, the connecting shaft 3910 can be rotatably connected to the slider 391 via a bearing 3911. For example, the slider 391 may be provided with a bearing mounting hole 3912, and the bearing 3911 can be fitted into the bearing mounting hole 3912.

[0050] In some embodiments, such as Figures 5-7As shown, the fixing frame 400 may include a first fixing plate 410, a second fixing plate 420, a third fixing plate 430, and a fourth fixing plate 440. The first fixing plate 410 and the second fixing plate 420 are arranged vertically opposite each other. The third fixing plate 430 and the fourth fixing plate 440 are located between the first fixing plate 410 and the second fixing plate 420, and are all connected to the first fixing plate 410 and the second fixing plate 420. The first fixing plate 410, the second fixing plate 420, the third fixing plate 430, and the fourth fixing plate 440 can form a space for accommodating the sliding assembly 390. The first fixing plate 410 can be connected to the machine base 100 to realize the connection between the fixing frame 400 and the machine base 100. The intermediate adjusting plate 800 can be located between the elastic member 500 and the second fixing plate 420, and the second fixing plate 420 can be provided with a threaded hole for threaded connection with the adjusting member 900. The fourth fixing plate 440 may be provided with a sliding groove 441, and the sliding component 390 may be provided with a sliding part 399. The sliding part 399 may be disposed in the sliding groove 441 and slide in cooperation with the sliding groove 441. Optionally, the connecting bracket 700 mentioned above may be connected to the second fixing plate 420 through the bracket fixing pin 730. The third fixing plate 430 may be provided with a clearance hole, which can be used to avoid the detection piece 392, so that the detection piece 392 can move into the detection range of the detection element 600 and avoid interfering with the movement of the detection piece 392.

[0051] In optional embodiments of this application, such as Figure 1 and Figure 3 As shown, the mobile drive component 300 may further include a connecting component 3110, which may include a connecting block 3111 and a pressing block 3112, such as... Figure 4 As shown, the connecting block 3111 may include a support portion 31111 and a connecting portion 31112 connected to the support portion 31111. The support portion 31111 can be connected to the wafer carrier 200, and the pressure block 3112 can be connected to the connecting portion 31112. A clamping space can be formed between the pressure block 3112 and the connecting portion 31112. A portion of the first transmission belt 340 is located within the clamping space to achieve the connection between the wafer carrier 200 and the first transmission belt 340. With this configuration, the connection between the first transmission belt 340 and the wafer carrier 200 can be achieved without modifying the first transmission belt 340.

[0052] In other embodiments, the connecting component 3110 may not include the pressure block 3112. The first transmission belt 340 may be provided with a connecting hole, and the fixing pin may pass through the connecting hole and connect with the connecting part 31112 of the connecting block 3111 to realize the connection between the first transmission belt 340 and the connecting block 3111.

[0053] Optionally, such as Figure 1 and Figure 3 As shown, the connecting assembly 3110 may include at least two pressure blocks 3112. Each pressure block 3112 may be distributed along the length direction of the first transmission belt 340, and each pressure block 3112 may be connected to the connecting portion 31112, forming a clamping space between each pressure block 31112 and the connecting portion 31112. This arrangement can improve the connection strength between the first transmission belt 340 and the connecting assembly 3110.

[0054] In this embodiment, each pressure block 3112 can be connected to the connecting part 31112 by connecting screws.

[0055] In optional embodiments, such as Figure 1 and Figure 2 As shown, the wafer carrier 200 may include a movable base plate 210, a first side plate 220, and a second side plate 230. The bottom ends of both the first side plate 220 and the second side plate 230 can be connected to the movable base plate 210. Specifically, the first side plate 220 and the second side plate 230 can be connected to the movable base plate 210 via adjusting screws 212. Furthermore, the first side plate 220 and the second side plate 230 are spaced apart. The top end of the first side plate 220 may be provided with a first wafer holder 240, and the top end of the second side plate 230 may be provided with a second wafer holder 250. The first wafer holder 240 may be provided with multiple first carrier grooves 241, and the second wafer holder 250 may be provided with multiple second carrier grooves 251. Each first carrier groove 241 and each second carrier groove 251 can be provided in a one-to-one correspondence. When supporting a wafer, the wafer can be embedded in the first support groove 241 and the second support groove 251 corresponding to the first support groove 241, so that the first wafer holder 240 and the second wafer holder 250 jointly support the wafer, which can improve the stability of wafer fixation.

[0056] Optionally, the spacing between the first side plate 220 and the second side plate 230 is adjustable so that the wafer carrier 200 can carry wafers of different sizes. Specifically, such as Figure 3 As shown, the movable base plate 210 may be provided with an adjustment hole 211. The adjustment hole 211 may extend along the direction from the first side plate 220 to the second side plate 230. The adjustment screw 212 may pass through the adjustment hole 211 and be connected to the first side plate 220 or the second side plate 230. The adjustment screw 212 may move along the adjustment hole 211 to adjust the position of the first side plate 220 or the second side plate 230, thereby adjusting the distance between the first side plate 220 and the second side plate 230.

[0057] In optional embodiments, such as Figure 1 and Figure 3As shown, a slide rail 140 can be provided on the machine base 100. The wafer carrier 200 can be slidably connected to the slide rail 140 via a slider 1000. In a first direction, the slider 1000 and the slide rail 140 are mutually limiting and engaged, and this first direction intersects with the moving direction of the wafer carrier 200. In this embodiment, the cooperation between the slider 1000 and the slide rail 140 can constrain the wafer carrier 200, ensuring that it can only move in the desired direction. For example, the slide rail 140 can extend vertically, and the desired direction can be vertical. The slider 1000 and the moving base plate 210 of the wafer carrier 200 can be connected by screws.

[0058] Of course, the slide rail 140 may not be installed on the machine 100.

[0059] In some embodiments, such as Figure 1 and Figure 2 As shown, the machine tool 100 may include a bottom support plate 120, a mounting plate 110, and a limiting plate 130. The bottom end of the mounting plate 110 is connected to the bottom support plate 120, and the limiting plate 130 is connected to the top end of the mounting plate 110. The limiting plate 130 may be provided with a through hole for the wafer carrier 200 to pass through. In the second direction, the size of the through hole is smaller than the size of the first wafer holder 240 and the second wafer holder 250, so that the limiting plate 130 can limit the first wafer holder 240 and the second wafer holder 250 and prevent the wafer from colliding with the limiting plate 130. The fixing frame 400 mentioned above can be connected to the mounting plate 110, the first transmission wheel 320 and the third transmission wheel 360 can be rotatably connected to the mounting plate 110, and the slide rail 140 can be provided on the mounting plate 110.

[0060] In this embodiment, during the wafer lifting process, when the wafer or wafer carrier 200 encounters an obstacle (such as a robotic arm) and cannot move, the load on the wafer or wafer carrier 200 increases. The load is transmitted to the second transmission wheel 330 via the wafer carrier 200 and the first transmission belt 340. At this time, the second transmission wheel 330 senses the increased downward load and transmits the load to the sliding assembly 390, causing the sliding assembly 390 to convert the load into movement. At this time, the sliding assembly 390 moves downward and compresses the elastic member 500. Simultaneously, the detection piece 392 moves downward synchronously with the sliding assembly 390, moves out of the detection port 610, and exceeds the detection range of the detection element 600. The detection element 600 cannot detect the detection piece 392 and transmits a signal to the alarm module. The alarm module alarms and controls the drive unit 310 to stop, so that the first transmission belt 340 can no longer drive the wafer carrier 200 to move.

[0061] During the wafer lifting process, if the number of wafers carried by the first wafer holder 240 and the second wafer holder 250 of the wafer carrier 200 decreases, it indicates that a wafer drop has occurred. For example, normally it can carry 25 wafers, but in reality it only carries 22 wafers. After the wafer carrier 200 carries the wafers, it transfers the load to the first transmission belt 340, which then transfers it to the second transmission wheel 330. This causes the second transmission wheel 330 to move downwards under force, which in turn drives the sliding assembly 390 downwards, compressing the elastic element 500. At the same time, the detection piece 392 moves downwards with the sliding assembly 390. However, because the number of wafers carried by the wafer carrier 200 is reduced, the load on the second drive wheel 330 is less than the preset load, which causes the detection piece 392 to not enter the detection range of the detection element 600. At this time, the detection element 600 cannot detect the detection piece 392 and transmits the signal to the alarm module, causing the alarm module to sound an alarm. In addition, the control drive 310 is stopped, so that the first drive belt 340 can no longer drive the wafer carrier 200 to move.

[0062] It should be noted that when the wafer carrier 200 does not carry a wafer and the detection element 600 does not detect the detection chip 392, the alarm module may not sound an alarm.

[0063] Based on the wafer transfer device provided in the embodiments of this application, the embodiments of this application also provide a semiconductor process equipment. The semiconductor process equipment may include a robot and the wafer transfer device described in any of the above embodiments. The robot can be used to grasp wafers on the wafer carrier 200 of the wafer transfer device or to place wafers on the wafer carrier 200.

[0064] The beneficial effects achieved by the semiconductor process equipment provided in this application embodiment are consistent with the beneficial effects achieved by the wafer transport device provided in this application embodiment, and will not be repeated here.

[0065] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A wafer transport device, characterized in that, include: Wafer carrier (200); A motion drive assembly (300) is connected to the wafer carrier (200) and is used to drive the wafer carrier (200) to move; A detection element (600) is used to detect the load on the motion drive assembly (300); An alarm module is communicatively connected to the detection element (600), and the alarm module is used to issue an alarm when the load detected by the detection element (600) is greater than or less than a preset load.

2. The wafer transport device according to claim 1, characterized in that, The wafer transfer device further includes a platform (100), and the motion drive assembly (300) includes: The first transmission wheel (320) is rotatably mounted on the machine base (100); The second drive wheel (330) is provided at a distance from the first drive wheel (320) in the direction of movement of the wafer carrier (200); The first transmission belt (340) is sleeved on the outside of the first transmission wheel (320) and the second transmission wheel (330) and drives the first transmission wheel (320) and the second transmission wheel (330). The first transmission belt (340) is connected to the wafer carrier (200). The driving component (310) is connected to the first transmission wheel (320) and is used to drive the first transmission wheel (320) to rotate.

3. The wafer transport device according to claim 2, characterized in that, The moving drive assembly (300) further includes a sliding assembly (390), which is slidably connected to the machine base (100), and the second transmission wheel (330) is rotatably connected to the sliding assembly (390). The sliding direction of the sliding assembly (390) is parallel to the moving direction of the wafer carrier (200). The detection element (600) is used to detect the amount of movement of the sliding component (390), the load of the moving drive component (300) includes the amount of movement of the sliding component (390), and the alarm module is used to issue an alarm when the detection element (600) detects that the amount of movement of the sliding component (390) is greater than or less than a preset amount of movement.

4. The wafer transport device according to claim 3, characterized in that, The sliding assembly (390) includes a slider (391) and a detection piece (392) connected to the slider (391). The slider (391) is slidably connected to the machine base (100), and the second transmission wheel (330) is rotatably connected to the slider (391). The detection element (600) is connected to the machine base (100). The detection element (600) is provided with a detection port (610). The detection piece (392) can slide into the detection port (610). When the detection piece (392) is outside the detection port (610), the movement of the slider (391) is greater than or less than the preset movement amount.

5. The wafer transport device according to claim 4, characterized in that, The wafer transport device further includes: A connecting bracket (700) is connected to the machine base (100), and the connecting bracket (700) is provided with a strip hole (710) that extends along the sliding direction of the sliding assembly (390). A fixing member (720) has one end passing through the strip hole (710) and connected to the detection element (600). The fixing member (720) can slide along the strip hole (710) and can lock the detection element (600) and the connecting bracket (700).

6. The wafer transport device according to claim 3, characterized in that, The wafer transfer device further includes an elastic element (500), the first end of which is connected to the machine base (100), and the second end of which is connected to the sliding assembly (390).

7. The wafer transport device according to claim 6, characterized in that, The wafer transfer device further includes a mounting frame (400) connected to the machine base (100). The sliding component (390) and the elastic element (500) are both located within the mounting frame (400). One of the mounting frame (400) and the sliding component (390) is provided with a groove (441) whose extension direction is parallel to the moving direction of the wafer carrier (200). The other component is provided with a sliding part (399) in which the groove (441) and the sliding part (399) slide together. The first end of the elastic element (500) is connected to the mounting frame (400).

8. The wafer transport device according to claim 7, characterized in that, The wafer transport device further includes: An intermediate adjusting plate (800) is located inside the fixed frame (400). The first end of the elastic element (500) is connected to the fixed frame (400) through the intermediate adjusting plate (800). The intermediate adjusting plate (800) and the fixed frame (400) are movably connected. An adjusting member (900) is connected to the fixed frame (400) and the adjusting member (900) is connected to the intermediate adjusting plate (800) and is used to drive the intermediate adjusting plate (800) to move.

9. The wafer transport device according to claim 7, characterized in that, A fixed slide rod (450) is provided inside the fixed frame (400). The sliding component (390) is sleeved on the fixed slide rod (450) and slides in cooperation with the fixed slide rod (450). The extension direction of the fixed slide rod (450) is the same as the sliding direction of the sliding component (390). In a first direction, the fixed slide rod (450) and the sliding component (390) are in a limiting cooperation. The first direction intersects with the sliding direction of the sliding component (390).

10. The wafer transport device according to claim 7, characterized in that, The sliding component (390) is provided with a limiting groove (398), a portion of the elastic element (500) is located in the limiting groove (398), and the second end of the elastic element (500) is connected to the bottom of the limiting groove (398). In a first direction, the elastic element (500) is limited and engaged with the groove wall of the limiting groove (398). The first direction intersects with the sliding direction of the sliding component (390).

11. The wafer transport device according to claim 3, characterized in that, The sliding assembly (390) includes a slider (391) and a connecting shaft (3910) passing through the slider (391). One end of the connecting shaft (3910) is connected to the second transmission wheel (330), and the other end of the connecting shaft (3910) is connected to a limiting member (3913). In the axial direction of the connecting shaft (3910), the limiting member (3913) is in a limiting engagement with the slider (391).

12. The wafer transport device according to claim 2, characterized in that, The mobile drive component (300) further includes a connection component (3110), the connection component (3110) comprising: The connecting block (3111) includes a support portion (31111) and a connecting portion (31112) connected to the support portion (31111), wherein the support portion (31111) is connected to the wafer carrier (200); A pressure block (3112) is connected to the connecting part (31112), and a clamping space is formed between the pressure block (3112) and the connecting part (31112), and a portion of the first transmission belt (340) is located in the clamping space.

13. The wafer transport device according to claim 2, characterized in that, The machine tool (100) is provided with a slide rail (140), and the wafer carrier (200) is slidably connected to the slide rail (140) through a slider (1000). In a first direction, the slider (1000) and the slide rail (140) are in a limiting cooperation. The first direction intersects with the moving direction of the wafer carrier (200).

14. A semiconductor process apparatus, characterized in that, Includes a robotic arm and a wafer transport device according to any one of claims 1-13, wherein the robotic arm is used to grasp a wafer on a wafer carrier (200) of the wafer transport device or to place a wafer on the wafer carrier (200).

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