A wafer basket wafer picking and inserting mechanism for changing the orientation of a silicon wafer

Abstract

The utility model discloses a change flower basket to take out a piece, insert a piece mechanism of silicon wafer direction, including take out a piece mechanism and insert a piece mechanism, the take out a piece mechanism is in the feeding end of equipment, and with the butt joint of step belt transmission mechanism feeding section, the insert a piece mechanism is in the discharge end of equipment, and with the butt joint of step belt transmission mechanism discharge section, the take out a piece mechanism includes flower basket to take out a piece mechanism, take out a piece gauge correct mechanism, step feeding mechanism, the insert a piece mechanism includes flower basket insert a piece mechanism, insert a piece gauge correct mechanism, longitudinal hit correct mechanism, step discharge mechanism. Through the innovative structure design, realize silicon wafer 90 accurate steering and take out silicon wafer, effectively reduce silicon wafer jump piece phenomenon, under the condition of same productivity, equipment size is greatly reduced, reduces the land occupation, and the structure member manufacturing is simpler, effectively improves the productivity rhythm and stability of take out a piece, insert a piece mechanism, realizes the dual promotion of space utilization and process adaptability, and the optimization production line layout.

Description

Technical Field

[0001] This utility model relates to the field of automated equipment, and in particular to a basket-shaped wafer-removing and inserting mechanism for changing the orientation of silicon wafers. Background Technology

[0002] The research and improvement of automated photovoltaic solar energy equipment have optimized the large-scale production of solar cells, enabling the widespread use of solar energy, a clean energy source. A key issue in the online connection and transfer between automated manufacturing equipment and its main process equipment for solar photovoltaic cells is achieving stable silicon wafer transport. This directly impacts the size, precision, cost, and efficiency of the entire production line.

[0003] With the market's increasing demand for large-size solar cells, the wafer-scooping and insertion mechanisms need to be replaced or adjusted for different sizes or specifications of silicon wafers, increasing production costs and limiting flexibility. During the overall operation of the equipment, the smooth transport of silicon wafers is one of the factors affecting the wafer breakage rate, as silicon wafers are highly susceptible to breakage during transport. The wafer-scooping and insertion mechanisms need to precisely align and insert the silicon wafers into designated positions. These mechanisms often employ complex mechanical structures and advanced control systems to achieve high-speed, high-precision insertion operations, which can increase the instability of the mechanisms.

[0004] The existing wafer extraction and insertion mechanisms on the market generally use a conveyor belt to directly extract or insert silicon wafers from the basket. The mechanism direction is parallel to the wafer output direction of the basket at 180°, which can easily lead to wafer skipping. Sometimes manual operation is still required, resulting in some deficiencies in the equipment in terms of precision, stability, adaptability, and automation, thereby increasing the wafer breakage rate and greatly reducing production efficiency. Utility Model Content

[0005] To address the aforementioned problems, this utility model provides a basket-type wafer-removing and inserting mechanism that changes the orientation of silicon wafers, enabling 90° reversible wafer transport, saving installation space, and effectively improving the production capacity and stability of the wafer-removing and inserting mechanism.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a basket wafer removal and insertion mechanism for changing the direction of silicon wafers, including a wafer removal mechanism and a wafer insertion mechanism. The wafer removal mechanism is located at the loading end of the equipment and is connected to the loading section of the step belt conveyor mechanism. The wafer insertion mechanism is located at the unloading end of the equipment and is connected to the unloading section of the step belt conveyor mechanism. The wafer removal mechanism includes a basket wafer removal mechanism, a wafer removal alignment mechanism, and a step loading mechanism. The wafer insertion mechanism includes a basket wafer insertion mechanism, a wafer insertion alignment mechanism, a longitudinal alignment mechanism, and a step unloading mechanism.

[0007] The flower basket scooping mechanism includes a slider connecting plate, a scooping pusher, a scooping plate, a flower basket scooping mounting plate, a servo motor, a synchronous pulley, a synchronous belt, a slider, and a linear guide. The scooping plate and the scooping pusher are mounted on the slider connecting plate, the slider is mounted on the linear guide, the linear guide and the synchronous pulley are mounted on the flower basket scooping mounting plate, and the synchronous belt is fixed on the scooping pusher. The servo motor drives the scooping pusher to move through the synchronous pulley and the synchronous belt, thereby driving the scooping plate to perform reciprocating scooping motion. The scooping direction is 90° to the scooping direction of the flower basket.

[0008] The card-removing and straightening mechanism includes an external threaded bearing, a lifting seat, a variable pitch positioning block, a card-removing and straightening drive block, a tension spring, a lifting seat, a slider side mounting plate, a lifting seat side plate, a second linear guide rail, a second slider, a first lead screw stepper motor, and a mounting base plate. The lifting seat is mounted on the second slider and the second linear guide rail. The external threaded bearing, the variable pitch positioning block, and the tension spring are mounted on the lifting seat. The card-removing and straightening drive block has a narrow top and wide bottom structure and is mounted on the mounting base plate. The external threaded bearing contacts the card-removing and straightening drive block and is connected by rolling along the side. The lifting seat is mounted on the second slider through the lifting seat side plate. The second linear guide rail is mounted on the slider side mounting plate. The first lead screw stepper motor is mounted under the mounting base plate to drive the movement of the lifting seat.

[0009] The step feeding mechanism includes a variable pitch mounting base, a transverse base plate, an eccentric wheel mounting base, a first transverse base plate, a silicon wafer transfer plate, a second transverse base plate, a drive linkage, a lead screw stepper motor, a platform upright plate, a first servo motor, and a second servo motor. The variable pitch mounting base is driven by the lead screw stepper motor. The transverse base plate is mounted on the platform upright plate via vertical slide rails. The first transverse base plate is mounted on the transverse base plate via horizontal slide rails. The second transverse base plate is mounted on the first transverse base plate via vertical slide rails. The eccentric wheel mounting base is mounted on the transverse base plate and driven by the second servo motor. The silicon wafer transfer plate is fixedly connected to the first transverse base plate. A drive linkage is mounted on the second transverse base plate and is driven by the first servo motor.

[0010] The flower basket insert mechanism, the step feeding mechanism and the flower basket scooping mechanism, the step feeding mechanism have the same structure but move in opposite directions.

[0011] The insert alignment mechanism has the same structure as the take-out alignment mechanism, except that its insert alignment drive block is different from the take-out alignment drive block. The insert alignment drive block has a structure that is wide at the top and bottom and narrow in the middle.

[0012] The longitudinal alignment mechanism includes a pneumatic gripper, a longitudinal alignment mounting base, an alignment rod, and a gripper arm. The longitudinal alignment mounting base is mounted on the step feeding mechanism, the pneumatic gripper is mounted on the longitudinal alignment mounting base, and the alignment rod and gripper arm are mounted on the pneumatic gripper.

[0013] Furthermore, the cutter plate is provided with an X-axis positioning block.

[0014] Furthermore, the silicon wafer transfer plate is designed in an "H" shape, with one end connected to the basket wafer removal mechanism and the other end connected to the step feeding mechanism.

[0015] Furthermore, a Y-axis rear positioning block is installed on the silicon wafer transfer board.

[0016] As can be seen from the above description of the structure of this utility model, compared with the prior art, this utility model has the following advantages:

[0017] 1. This utility model, through its innovative structural design, enables precise 90° rotation of silicon wafers for picking and placing, achieving wafer orientation conversion and breaking through the technical limitations of traditional unidirectional wafer picking. This effectively reduces wafer skipping, significantly reduces equipment size and footprint while maintaining the same production capacity. Furthermore, the manufacturing of structural components is simpler, which is significant for reducing land use and lowering cell costs in the future. It achieves a dual improvement in space utilization and process adaptability, overcoming the drawbacks of existing equipment's complex structure and large footprint, and facilitating optimized production line layout.

[0018] 2. The pitch-changing module of the straightening mechanism in the plate-removing and inserting mechanism of this utility model adopts a single motor drive-cam composite transmission mechanism, combined with spring tension compensation, and realizes synchronous control of lifting and pitch changing through mechanical linkage device, which reduces the number of power sources by half, reduces redundant design of mechanism, effectively improves action rhythm and action stability, and saves equipment costs, thus promoting the industry to develop towards high-efficiency production. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0020] Figure 1 This is a schematic diagram of the overall transmission structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the blade-removing mechanism of this utility model;

[0022] Figure 3 This is a schematic diagram of the insert mechanism of this utility model;

[0023] Figure 4This is a schematic diagram of the basket-shaped shovel mechanism of this utility model;

[0024] Figure 5 This is a schematic diagram of the tool straightening mechanism of this utility model;

[0025] Figure 6 This is a front view of the step feeding mechanism of this utility model;

[0026] Figure 7 This is an isometric view of the step feeding mechanism of this utility model;

[0027] Figure 8 This is a schematic diagram of the insert alignment drive block structure of this utility model;

[0028] Figure 9 This is a schematic diagram of the longitudinal straightening mechanism of this utility model. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0030] Example

[0031] refer to Figure 1-9 A basket-type wafer ejection and insertion mechanism for changing the orientation of silicon wafers includes an ejection mechanism 1 and an insertion mechanism 2. The ejection mechanism 1 is located at the loading end of the overall automated equipment and is connected to the loading section of the step belt conveyor mechanism 3. The insertion mechanism 2 is located at the unloading end of the overall automated equipment and is connected to the unloading section of the step belt conveyor mechanism 3. Figure 1 As shown, silicon wafers are taken out one by one from the full basket A and placed into the feeding section of the step belt conveyor mechanism 3. After the silicon wafers are transferred from the feeding section of the step belt conveyor mechanism 3 to the unloading section, the step belt transports the silicon wafers to the insertion mechanism 2, and the insertion mechanism 2 inserts the silicon wafers into the empty basket B.

[0032] The chip removal mechanism 1 includes a basket chip removal mechanism 11, a chip removal and straightening mechanism 12, and a step feeding mechanism 13. The chip insertion mechanism 2 includes a basket chip insertion mechanism 21, a chip insertion and straightening mechanism 22, a longitudinal straightening mechanism 23, and a step unloading mechanism 24.

[0033] The basket-shaped pouch-removing mechanism 11 includes a slider connecting plate 111, a pouch-removing push seat 112, a pouch-removing plate 113, an X-axis positioning block 114, a basket-shaped pouch-removing mounting plate 115, a servo motor 116, a synchronous pulley 117, a synchronous belt 118, a slider 119, and a linear guide rail 1110. The pouch-removing plate 113 and the pouch-removing push seat 112 are mounted on the slider connecting plate 111, and the slider 119 is mounted on the linear guide rail 1110. The linear guide rail 1110 and the synchronous pulley 119 are mounted on the linear guide rail 1110. The stepping pulley 117 is mounted on the wafer removal mounting plate 115 of the flower basket, and the synchronous belt 118 is fixed on the wafer removal push seat 112. The servo motor 116 drives the wafer removal push seat 112 to move through the synchronous pulley 117 and the synchronous belt 118, which drives the wafer removal plate 113 to perform reciprocating wafer removal movement. The wafer removal direction is 90° with the wafer exit direction of the flower basket. The wafer removal plate 113 is provided with an X-axis positioning block 114. When the silicon wafer is taken out of the flower basket, the positioning block can play the role of axial positioning.

[0034] The piece-scooping and straightening mechanism 12 includes an external threaded bearing 121, a lifting seat 122, a variable pitch positioning block 123, a piece-scooping and straightening drive block 124, a tension spring 125, a lifting seat 126, a slider side mounting plate 127, a lifting seat side plate 128, a second linear guide rail 129, a second slider 1210, a first lead screw stepper motor 1211, and a mounting base plate 1212. The lifting seat 122 is mounted on the second slider 1210 and the second linear guide rail 129. The external threaded bearing 121, the variable pitch positioning block 123, and the tension spring 125 are all mounted on the slider 1210 and the lifting seat side plate 126. The extension spring 125 is mounted on the lifting seat 122. The card-removing guide drive block 124, which has a narrow upper and wide lower structure, is mounted on the mounting base plate 1212. The external thread bearing 121 contacts the card-removing guide drive block 124 and is connected to it by rolling along the side. The lifting seat 126 is mounted on the slider 1210 through the lifting seat side plate 128. The linear guide rail 129 is mounted on the slider side mounting plate 127. The lead screw stepper motor 1211 is mounted under the mounting base plate 1212 to drive the lifting seat 126 to move.

[0035] During operation, when the basket wafer-ejecting mechanism is in the wafer-ejecting state, the external threaded bearing 121 is at the bottom of the wafer-ejecting alignment drive block 124, and the lifting seat 122 is in the open state. At this time, the tension spring 125 at the other end is in the stretched state. When the lead screw stepper motor 1211 drives the lifting seat 126 to move upward, the external threaded bearing 121 also moves along the wafer-ejecting alignment drive block 124 to the upper end. At this time, due to the elastic contraction of the spring, the lifting seat 122 is in the tightened state. At this time, the plane of the variable pitch positioning block 123 exceeds the X-axis positioning 114 of the basket wafer-ejecting mechanism, and the silicon wafer is lifted and placed on the variable pitch positioning block 123, which plays a limiting role. The lifting and variable pitch functions are realized by the lead screw stepper motor 1211, which is used to transport the silicon wafer to the step feeding mechanism 13 in the next step.

[0036] The step feeding mechanism 13 includes a variable pitch mounting base 131, a transverse base plate 132, an eccentric wheel mounting base 133, a first transverse base plate 134, a silicon wafer transfer plate 135, a Y-axis rear positioning block 136, a second transverse base plate 137, a drive linkage 138, a lead screw stepper motor 139, a step platform upright plate 1311, a first servo motor 1312, and a second servo motor 1313. The variable pitch mounting base 131 is driven by the lead screw stepper motor 139. The transverse base plate 132 is mounted on the step platform upright plate 1311 via vertical slide rails. The first transverse base plate 134 is mounted on the transverse base plate via horizontal slide rails. On 132, the second transverse sliding plate 137 is mounted on the first transverse sliding plate 134 via a slide rail in the vertical direction. The eccentric wheel mounting seat 133 is mounted on the transverse sliding base plate 132 and driven by the second servo motor 1313. The silicon wafer transfer plate 135 is fixedly connected to the first transverse sliding plate 134. The silicon wafer transfer plate 135 is equipped with a Y-axis rear positioning block 136. The silicon wafer transfer plate 135 is designed as an "H" shape, with one end connected to the basket wafer removal mechanism 11 and the other end connected to the step feeding mechanism 13. The second transverse sliding plate 137 is equipped with a drive linkage 138, which is driven by the first servo motor 1312.

[0037] During operation, the step feeding mechanism 13 moves at a 90° angle to the basket wafer removal mechanism 11. When the lifting seat 122 in the wafer removal and alignment mechanism 12 lifts the wafer, the driving link 138 rotates around the first servo motor 1312 under the drive of the first servo motor 1312, causing the second transverse sliding plate 137 to move up and down. The transverse base plate 132 driven by the second servo motor 1313 also moves the second transverse sliding plate 137 on the transverse base plate to the left and right. When the driving link 138 moves to the limit position on the other side, the second transverse sliding plate 137 moves to the left and right due to the action of the eccentric wheel mounting seat 133. The second transverse sliding plate 137 first descends, then moves laterally, then rises, and then moves back in a reciprocating cycle, lifting the silicon wafer lifted by the lifting seat 122 to the silicon wafer transfer plate 135. Since the step feeding mechanism 13 and the step belt transmission mechanism 3 are arranged in parallel, this cycle continues, transporting groups of silicon wafers to the step belt transmission mechanism 3.

[0038] The flower basket insert mechanism 21, the step feeding mechanism 24, the flower basket scooping mechanism 11, and the step feeding mechanism 13 have the same structure but move in opposite directions.

[0039] The insert alignment mechanism 22 has the same structure as the take-out alignment mechanism 12, except that its insert alignment drive block 221 is different from its take-out alignment drive block 124. Figure 8 As shown, the insert alignment drive block 221 has a structure that is wide at the top and bottom and narrow in the middle.

[0040] The longitudinal alignment mechanism 23 includes a pneumatic gripper 231, a longitudinal alignment mounting base 232, an alignment rod 233, and a gripper arm 234. The longitudinal alignment mounting base 232 is mounted on the step feeding mechanism 24, the pneumatic gripper 231 is mounted on the longitudinal alignment mounting base 232, and the alignment rod 233 and gripper arm 234 are mounted on the pneumatic gripper 231.

[0041] During operation, when the lifting seat 122 lifts the silicon wafer, the silicon wafer is axially limited along the Y-axis by the wafer positioning block on the lifting seat. At this time, the longitudinal straightening mechanism 23 moves, and the pneumatic gripper 231 drives the straightening rod 233 to straighten the silicon wafer, thus completing the straightening in the X-axis direction.

[0042] When the wafer insertion mechanism 2 is in operation, the silicon wafer is first transported along the Y-axis by the step feeding mechanism 24 through the silicon wafer transfer plate. When the silicon wafer is transported to the wafer insertion and alignment mechanism 23, the lifting seat is raised and the silicon wafer transfer plate is retracted. Then, the longitudinal alignment mechanism 23 aligns the silicon wafer. After that, the lifting seat is lowered under the action of the lead screw stepper motor 1211, and the silicon wafer falls onto the wafer insertion plate of the basket wafer insertion mechanism 21. The silicon wafer is then inserted into the empty basket along the X-axis.

[0043] Compared to conventional wafer removal and insertion mechanisms that typically use a conveyor belt to directly remove or insert silicon wafers from a basket, with the wafer removal direction parallel to the wafer output direction of the basket at 180°, this invention, through innovative structural design, enables precise 90° rotation of the silicon wafer for removal and placement. This achieves wafer orientation conversion, breaks through the technical limitations of traditional unidirectional wafer removal, and effectively reduces wafer skipping.

[0044] This invention significantly reduces equipment size and floor space while maintaining the same production capacity. It also simplifies the manufacturing of structural components, which is of great significance for reducing land use resources and lowering the cost of solar cells in the future. It achieves a dual improvement in space utilization and process adaptability, changing the shortcomings of existing equipment that is complex in structure and occupies a large space, and is conducive to optimizing production line layout.

[0045] The pitch-changing module of the straightening mechanism in the wafer-removing and inserting mechanism adopts a single-motor drive-cam composite transmission mechanism, combined with spring tension compensation, and realizes synchronous control of lifting and pitch changing through mechanical linkage device. This reduces the number of power sources by half, reduces redundant design of the mechanism, effectively improves the action cycle and action stability, and saves equipment costs, thus promoting the industry towards high-efficiency production.

[0046] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A basket-type wafer removal and insertion mechanism for changing the orientation of silicon wafers, comprising a wafer removal mechanism (1) and a wafer insertion mechanism (2), wherein the wafer removal mechanism (1) is located at the loading end of the equipment and is connected to the loading section of the step belt transmission mechanism (3), and the wafer insertion mechanism (2) is located at the unloading end of the equipment and is connected to the unloading section of the step belt transmission mechanism (3), characterized in that: The chip-scooping mechanism (1) includes a flower basket chip-scooping mechanism (11), a chip-scooping straightening mechanism (12), and a step feeding mechanism (13). The chip-insertion mechanism (2) includes a flower basket chip-insertion mechanism (21), a chip-insertion straightening mechanism (22), a longitudinal straightening mechanism (23), and a step unloading mechanism (24). The basket-shaped piecing mechanism (11) includes a slider connecting plate (111), a piecing pusher (112), a piecing plate (113), a basket-shaped piecing mounting plate (115), a servo motor (116), a synchronous pulley (117), a synchronous belt (118), a slider (119), and a linear guide rail (1110). The piecing plate (113) and the piecing pusher (112) are mounted on the slider connecting plate (111), and the slider (119) is mounted on the linear guide rail (1110). On the guide rail (1110), the linear guide rail (1110) and the synchronous pulley (117) are mounted on the basket-shaped plate mounting plate (115). The synchronous belt (118) is fixed on the plate-pulling seat (112). The servo motor (116) drives the plate-pulling seat (112) to move through the synchronous pulley (117) and the synchronous belt (118), thereby driving the plate-pulling plate (113) to perform reciprocating plate-pulling motion. The plate-pulling direction is 90° to the plate-exiting direction of the basket. The card-removing and straightening mechanism (12) includes an external thread bearing (121), a lifting seat (122), a variable pitch positioning block (123), a card-removing and straightening drive block (124), a tension spring (125), a lifting seat (126), a slider side mounting plate (127), a lifting seat side plate (128), a second linear guide rail (129), a second slider (1210), a first lead screw stepper motor (1211), and a mounting base plate (1212). The lifting seat (122) is mounted on the second slider (1210) and the second linear guide rail (129). The external thread bearing (121), the variable pitch positioning block (123), the lifting seat (124), the variable pitch positioning block (125), the lifting seat (126), the sliding seat (127), the lifting seat side plate (128), the second linear guide rail (129), the second slider (1210), the first lead screw stepper motor (1211), and the mounting base plate (1212). 3) The tension spring (125) is installed on the lifting seat (122). The card-removing guide drive block (124) is a structure that is narrow at the top and wide at the bottom and is installed on the mounting base plate (1212). The external thread bearing (121) contacts the card-removing guide drive block (124) and is connected to it by rolling along the side. The lifting seat (126) is installed on the slider two (1210) through the lifting seat side plate (128). The linear guide rail two (129) is installed on the slider side mounting plate (127). The lead screw stepper motor one (1211) is installed under the mounting base plate (1212) to drive the lifting seat (126) to move. The step feeding mechanism (13) includes a variable pitch mounting base (131), a transverse base plate (132), an eccentric wheel mounting base (133), a first transverse base plate (134), a silicon wafer transfer plate (135), a second transverse base plate (137), a drive linkage (138), a lead screw stepper motor (139), a step platform upright plate (1311), a first servo motor (1312), and a second servo motor (1313). The variable pitch mounting base (131) is driven by the lead screw stepper motor (139), and the transverse base plate (132) is mounted on the step platform upright plate (1311) via vertical slide rails. 1) The first transverse sliding plate (134) is mounted on the transverse base plate (132) via a left-right sliding rail, and the second transverse sliding plate (137) is mounted on the first transverse sliding plate (134) via a right-up sliding rail. The eccentric wheel mounting seat (133) is mounted on the transverse base plate (132) and driven by the second servo motor (1313). The silicon wafer transfer plate (135) is fixedly connected to the first transverse sliding plate (134). A drive link (138) is mounted on the second transverse sliding plate (137), and the drive link (138) is driven by the first servo motor (1312). The flower basket insert mechanism (21), the step feeding mechanism (24), the flower basket scooping mechanism (11), and the step feeding mechanism (13) have the same structure but opposite movement directions; The insert alignment mechanism (22) has the same structure as the take-out alignment mechanism (12). The insert alignment mechanism (22) includes an insert alignment drive block (221). The difference is that the insert alignment drive block (221) is different from the take-out alignment drive block (124). The insert alignment drive block (221) has a structure that is wide at the top and bottom and narrow in the middle. The longitudinal alignment mechanism (23) includes a pneumatic gripper (231), a longitudinal alignment mounting base (232), an alignment rod (233), and a gripper arm (234). The longitudinal alignment mounting base (232) is mounted on the step feeding mechanism (24), the pneumatic gripper (231) is mounted on the longitudinal alignment mounting base (232), and the alignment rod (233) and gripper arm (234) are mounted on the pneumatic gripper (231).

2. The basket-shaped wafer insertion and wafer-removal mechanism for changing the orientation of a silicon wafer according to claim 1, characterized in that: The cutter plate (113) is provided with an X-axis positioning block (114).

3. The basket-shaped wafer insertion and wafer-removal mechanism for changing the orientation of a silicon wafer according to claim 1, characterized in that: The silicon wafer transfer plate (135) is designed in an "H" shape, with one end connected to the basket wafer removal mechanism (11) and the other end connected to the step feeding mechanism (13).

4. The basket-shaped wafer insertion and wafer-removal mechanism for changing the orientation of a silicon wafer according to claim 1, characterized in that: The silicon wafer transfer board (135) is equipped with a Y-axis rear section positioning block (136).

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