Material conveying device for electric chip integrated package

Abstract

The utility model proposes material conveying equipment for electric core chip integration package, relates to material conveying equipment technical field, including two groups of conveying mechanism, first group conveying mechanism is located left side, second group conveying mechanism is located right side, the conveying mechanism includes mounting bracket. The utility model discloses through infrared sensor can detect the position of chip, when chip is moved to the monitoring range of infrared sensor under the drive of first group conveying mechanism, first group conveying mechanism will stop running, and the start of electric track will drive servo electric jar and vacuum chuck to be close to the chip after alignment, and the start of servo electric jar will drive vacuum chuck to resist the chip, can adsorb the chip through vacuum chuck, then through electric track and servo electric jar, it is conveyed to second group conveying mechanism, and the whole movement cycle time of electric track, servo electric jar and vacuum chuck is fixed, realizes the adjustment to the chip spacing, and chip is not easy to deviate.

Description

Technical Field

[0001] This utility model relates to a material conveying device, specifically a material conveying device for integrated packaging of electronic chips, and belongs to the technical field of material conveying devices. Background Technology

[0002] After the packaged chips are separated by the lead frame punching, they are generally transported using a transfer track. During the transport process, the chip packages are often transported continuously, one after the other, and the transfer track can move individual chip packages to the inspection station or the laser marking station.

[0003] Chinese Patent Publication No. CN221092791U discloses a chip packaging conveying and discharging device. The arrangement distance of the chips on the third track can be adjusted by controlling the conveying speed of the intermediate track and the friction roller. Moreover, this adjustment method is not affected by the length of the packaged chip, but is only controlled by the conveying speed of the intermediate track and the friction roller. Therefore, chips of different lengths can be arranged.

[0004] While the aforementioned technical solutions can change the chip spacing by adjusting the conveying speed of the intermediate track and friction rollers, the chips have already shifted before the spacing is adjusted. After adjusting the chip spacing, the chips are still not neatly arranged, affecting the inspection station or laser marking. Furthermore, the above technical solutions, which adjust the chip spacing by changing the conveying speed of the intermediate track and friction rollers, are prone to further chip deflection. Therefore, a material conveying device for integrated circuit packaging of electronic chips is proposed here. Utility Model Content

[0005] This invention proposes a material conveying device for integrated packaging of electronic chips, which can first align the chips and prevent them from shifting when adjusting the spacing between them.

[0006] This utility model is achieved through the following technical solution: a material conveying device for integrated packaging of electronic chips, comprising two sets of conveying mechanisms, the first set of conveying mechanisms located on the left and the second set of conveying mechanisms located on the right. Each conveying mechanism includes a mounting frame, on which a motor is mounted. A drive roller and a driven roller are mounted at both ends of the mounting frame. The start of the motor drives the drive roller to rotate. The output end of the motor is connected to the drive roller. A conveyor belt is mounted on both the drive roller and the driven roller. The rotating drive roller, in conjunction with the driven roller, drives the conveyor belt to move, conveying the chips via the moving conveyor belt. The device also includes an infrared sensor mounted on the first set of mounting frames. The infrared sensor monitors the position of the chips on the first set of conveying mechanisms, providing signal feedback for the movement of the motors on the first set of conveying mechanisms, thus achieving automated control. When the infrared sensor detects a chip, the controller stops the motors on the first set of conveying mechanisms. After the chip is transferred, the motors restart.

[0007] It also includes two sets of alignment mechanisms, which are located below the conveying mechanism. Each alignment mechanism includes a lead screw module with two symmetrical alignment plates and a movable frame fixed on the alignment plates.

[0008] The lead screw module includes a housing, on which a servo motor is fixed, and on which a bidirectional lead screw is fixed. The start of the servo motor will drive the bidirectional lead screw to rotate. The bidirectional lead screw is rotatably connected to the housing. Two symmetrical sliders are installed on the bidirectional lead screw of the alignment mechanism. The rotation of the bidirectional lead screw will drive the two sliders to move closer to each other. The sliders are connected to the moving frame and are slidably connected to the housing.

[0009] It also includes a spacing adjustment mechanism, which is set between the two sets of conveying mechanisms. The spacing adjustment mechanism includes an electric track, on which a support frame is fixed, and on which a servo electric cylinder is set, and on which a vacuum suction cup is set.

[0010] The vacuum chuck is connected to a vacuum device. The activation of the servo cylinder can drive the vacuum chuck to move up and down, moving it to the position of the chip so that it can be adsorbed. The activation of the electric track can drive the servo cylinder and the vacuum chuck to move horizontally, allowing the vacuum chuck to adsorb the chip. A connecting frame is fixed on the electric track, and a connecting plate is fixed on the connecting frame. The servo cylinder is mounted on the connecting plate.

[0011] This utility model provides a material conveying device for integrated packaging of electronic chips, which has the following beneficial effects:

[0012] 1. The material conveying equipment for integrated packaging of electronic chips can drive the bidirectional lead screw to rotate by starting the servo motor. The rotation of the bidirectional lead screw will drive the two sliders to move closer to each other, thereby bringing the two moving frames and the two alignment plates closer to each other, and thus aligning the chips.

[0013] 2. This material conveying equipment for integrated chip packaging can detect the position of the chip through an infrared sensor. When the chip moves into the monitoring range of the infrared sensor under the drive of the first conveying mechanism, the first conveying mechanism will stop running. The start of the electric track will drive the servo cylinder and vacuum suction cup to approach the aligned chip. The start of the servo cylinder will drive the vacuum suction cup to press against the chip. The vacuum suction cup can adsorb the chip, and then the electric track and servo cylinder will transport it to the second conveying mechanism. The entire movement cycle time of the electric track, servo cylinder and vacuum suction cup is fixed, realizing the adjustment of the chip spacing and preventing the chip from shifting. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0015] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ;

[0016] Figure 3 This is a schematic diagram of the alignment mechanism structure of this utility model;

[0017] Figure 4 This is a schematic diagram of the spacing adjustment mechanism of this utility model.

[0018] Explanation of reference numerals in the attached figures

[0019] 1. Conveying mechanism; 101. Mounting frame; 102. Electric motor; 103. Conveyor belt;

[0020] 2. Alignment mechanism; 201. Alignment plate; 202. Moving frame; 203. Housing; 204. Servo motor; 205. Slider;

[0021] 3. Spacing adjustment mechanism; 301. Electric track; 302. Servo electric cylinder; 303. Vacuum suction cup; 304. Support frame; 305. Connecting frame; 306. Connecting plate;

[0022] 4. Infrared sensor. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0024] Please see Figures 1-4 The present invention proposes the following implementation scheme: a material conveying device for integrated packaging of electronic chips, including two sets of conveying mechanisms 1, the first set of conveying mechanisms 1 being located on the left side and the second set of conveying mechanisms 1 being located on the right side. The conveying mechanism 1 includes a mounting frame 101, on which a motor 102 is mounted, and at both ends of the mounting frame 101 are a drive roller and a driven roller.

[0025] Please refer to this carefully. Figure 1 and Figure 2 The starting of the motor 102 can drive the active roller to rotate. The output end of the motor 102 is connected to the active roller. The active roller and the driven roller are both equipped with a conveyor belt 103. The rotating active roller and the driven roller drive the conveyor belt 103 to move, and the moving conveyor belt 103 is used to transport the chip.

[0026] Please refer to this carefully. Figure 1 and Figure 2 It also includes an infrared sensor 4, which is installed on the first set of mounting brackets 101. The infrared sensor 4 is used to monitor the position of the chip on the first set of conveying mechanisms 1 and provide signal feedback for the operation of the motor 102 on the first set of conveying mechanisms 1 to realize automatic control. When the infrared sensor 4 detects the chip, it controls the motor 102 on the first set of conveying mechanisms 1 to stop running through the controller. After the chip is transferred, the motor 102 starts again.

[0027] Please refer to this carefully. Figure 1 and Figure 3 It also includes two sets of alignment mechanisms 2, which are located below the conveying mechanism 1. The alignment mechanism 2 includes a lead screw module, on which two symmetrical alignment plates 201 are provided, and a movable frame 202 is fixed on the alignment plate 201.

[0028] Please refer to this carefully. Figure 1 and Figure 3 The lead screw module includes a housing 203, a servo motor 204 fixed on the housing 203, and a bidirectional lead screw fixed on the servo motor 204. The start of the servo motor 204 will drive the bidirectional lead screw to rotate, and the bidirectional lead screw is rotatably connected to the housing 203.

[0029] Please refer to this carefully. Figure 1 and Figure 3Two symmetrical sliders 205 are installed on the bidirectional lead screw of the alignment mechanism 2. The rotation of the bidirectional lead screw will drive the two sliders 205 to move closer to each other. The sliders 205 are connected to the moving frame 202 and are slidably connected to the housing 203.

[0030] Please refer to this carefully. Figure 1 and Figure 4 It also includes a spacing adjustment mechanism 3, which is set between the two sets of conveying mechanisms 1. The spacing adjustment mechanism 3 includes an electric track 301, a support frame 304 fixed on the electric track 301, a servo electric cylinder 302 on the electric track 301, and a vacuum suction cup 303 on the servo electric cylinder 302.

[0031] Please refer to this carefully. Figure 1 and Figure 4 The vacuum chuck 303 is connected to a vacuum device. The start of the servo cylinder 302 can drive the vacuum chuck 303 to move up and down, moving the vacuum chuck 303 to the position of the chip so that the vacuum chuck 303 can adsorb it.

[0032] Please refer to this carefully. Figure 1 and Figure 4 The start of the electric track 301 can drive the servo cylinder 302 and the vacuum suction cup 303 to move horizontally. The vacuum suction cup 303 can adsorb the chip. A connecting frame 305 is fixed on the electric track 301, and a connecting plate 306 is fixed on the connecting frame 305. The servo cylinder 302 is installed on the connecting plate 306.

[0033] Working principle: The start of motor 102 drives the active roller to rotate. Through the cooperation of the active roller, driven roller and conveyor belt 103, the chips can be transported. At this time, the chips are not neatly arranged. The start of servo motor 204 drives the bidirectional lead screw to rotate. The rotation of the bidirectional lead screw will drive the two sliders 205 to move closer to each other, thereby making the two moving frames 202 and the two alignment plates 201 move closer to each other, and aligning the chips.

[0034] The position of the chip can be detected by the infrared sensor 4. When the chip moves into the monitoring range of the infrared sensor 4 under the drive of the first set of conveying mechanisms 1, the first set of conveying mechanisms 1 will stop running. The start of the electric track 301 will drive the servo cylinder 302 and the vacuum suction cup 303 to approach the aligned chip. The start of the servo cylinder 302 will drive the vacuum suction cup 303 to press against the chip. The vacuum suction cup 303 can adsorb the chip. Then, the chip is transported to the second set of conveying mechanisms 1 by the electric track 301 and the servo cylinder 302. The entire movement cycle time of the electric track 301, the servo cylinder 302 and the vacuum suction cup 303 is fixed, realizing the adjustment of the chip spacing and making it difficult for the chip to deviate.

[0035] To improve the alignment effect, the alignment mechanism 2 near the second set of conveying mechanism 1 is restarted and the above operation is repeated. The chips are aligned again by bringing the two moving frames 202 and the two alignment plates 201 closer to each other.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A material conveying device for integrated packaging of electronic chips, comprising two sets of conveying mechanisms (1), characterized in that: It also includes two sets of alignment mechanisms (2), which are disposed below the conveying mechanism (1); The alignment mechanism (2) includes a lead screw module, on which two symmetrical alignment plates (201) are provided, and a movable frame (202) is fixed on the alignment plate (201); It also includes a spacing adjustment mechanism (3), which is disposed between the two sets of conveying mechanisms (1); The spacing adjustment mechanism (3) includes an electric track (301), on which a servo electric cylinder (302) is provided, and on which a vacuum suction cup (303) is provided.

2. The material conveying equipment for integrated packaging of electronic chips according to claim 1, characterized in that: The conveying mechanism (1) includes a mounting frame (101), on which a motor (102) is mounted. A drive roller and a driven roller are mounted at both ends of the mounting frame (101). The output end of the motor (102) is connected to the drive roller. A conveyor belt (103) is mounted on both the drive roller and the driven roller.

3. The material conveying equipment for integrated packaging of electronic chips according to claim 1, characterized in that: The lead screw module includes a housing (203), a servo motor (204) is fixed on the housing (203), a bidirectional lead screw is fixed on the servo motor (204), and two symmetrical sliders (205) are installed on the bidirectional lead screw of the alignment mechanism (2). The sliders (205) are connected to the moving frame (202) and are slidably connected to the housing (203).

4. The material conveying equipment for integrated packaging of electronic chips according to claim 3, characterized in that: The bidirectional lead screw is rotatably connected to the housing (203).

5. The material conveying equipment for integrated packaging of electronic chips according to claim 1, characterized in that: A support frame (304) is fixed on the electric track (301).

6. The material conveying equipment for integrated packaging of electronic chips according to claim 1, characterized in that: A connecting frame (305) is fixed on the electric track (301), and a connecting plate (306) is fixed on the connecting frame (305). The servo electric cylinder (302) is mounted on the connecting plate (306).

7. The material conveying equipment for integrated packaging of electronic chips according to claim 1, characterized in that: It also includes an infrared sensor (4), which is mounted on the first set of mounting brackets (101).

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