A wafer boat film placement device

Abstract

The application relates to the technical field of semiconductor auxiliary production equipment, in particular to a wafer boat wafer placing device. The wafer boat wafer placing device comprises a base body, a plurality of positioning columns and two guide plates. The positioning columns are arranged on the base body and used for positioning a wafer boat placed on the base body. The guide plates are arranged on the base body and located on both sides of the wafer boat. The guide plates are provided with guide grooves corresponding to grooves of the wafer boat. The guide plates can rotate relative to the base body to make the guide grooves communicate with the corresponding grooves. The wafer boat wafer placing device can assist in placing wafers into a wafer boat and can avoid the wafers from contacting the wafer boat or other wafers when the wafers are placed into the wafer boat, so that the risk of wafer scratch is reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor auxiliary manufacturing equipment technology, and more specifically, to a wafer unloading device. Background Technology

[0002] When shipping wafers, they are usually transferred to an octagonal wafer boat for shipment.

[0003] Currently, the method for transferring wafers is to manually move them from a metal basket to an octagonal wafer boat. However, during this manual transfer, the wafer may come into contact with the octagonal wafer boat or other wafers, resulting in scratches. Utility Model Content

[0004] This application provides at least one wafer loading device that can assist in placing wafers into a wafer boat and prevent wafers from contacting the wafer boat or other wafers when placing them into the wafer boat, thereby reducing the risk of wafer scratches.

[0005] This application provides a wafer loading device, including: a substrate, a plurality of positioning posts and two guide plates; the positioning posts are disposed on the substrate and are used to position the wafer placed on the substrate; the guide plates are disposed on the substrate and located on both sides of the wafer, the guide plates are provided with guide grooves corresponding to the grooves of the wafer, and the guide plates are rotatable relative to the substrate so that the guide grooves are connected to the corresponding grooves.

[0006] In one alternative embodiment, the guide plate has a first position and a second position that rotate relative to the substrate. In the first position, the guide groove of the guide plate is connected to the corresponding groove. In the second position, the guide plate is offset from the crystal boat to provide mounting space for the box cover of the crystal boat.

[0007] In one alternative embodiment, the guide plate is provided with a first locking member, and the base is provided with a second locking member, the first locking member and the second locking member being able to cooperate to limit the guide plate to the first position and / or the second position.

[0008] In one alternative embodiment, the first locking member is provided with a latch, and the second locking member is provided with a slot conforming to the latch, wherein the latch can be inserted into the slot in the first position / second position to limit the guide plate.

[0009] In one alternative implementation, the latch is capable of disengaging from the slot when the guide plate is rotated under force.

[0010] In one optional embodiment, the surface of the guide plate is provided with an antistatic layer, and the guide groove is disposed on the antistatic layer.

[0011] In one optional embodiment, the base includes a base plate and a mounting platform, the mounting platform being disposed on the base plate and capable of rotating relative to the base plate to achieve tilting, and the positioning column and the guide plate being disposed on the mounting platform.

[0012] In one alternative embodiment, the base plate is provided with a first limiting member, and the mounting platform is provided with a second limiting member, the first limiting member and the second limiting member being able to cooperate to limit the mounting platform to different tilt angles.

[0013] In one optional embodiment, the first limiting member is disposed on the side of the base plate facing the mounting platform, and the surface of the first limiting member facing the second limiting member is provided with a plurality of slots.

[0014] The second limiting member is rotatably disposed on the side of the mounting platform facing the base plate. The second limiting member can rotate relative to the mounting platform to engage with different slots, thereby limiting the mounting platform to different tilt angles.

[0015] In one alternative embodiment, the bottom surface of the substrate is provided with an anti-slip pad.

[0016] The above-mentioned technical solution of this application has the following beneficial technical effects:

[0017] The wafer loading apparatus of this application embodiment has a guide plate that guides the wafer when it is placed into the wafer boat, thereby preventing the wafer from contacting the wafer boat or other wafers and reducing the risk of wafer scratches. Furthermore, since the substrate and positioning posts can position the wafer boat, it will not move arbitrarily during the loading process, preventing contact with the wafer due to wafer boat movement, thus further reducing the risk of wafer scratches.

[0018] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This paper shows a schematic diagram of the structure of a wafer loading apparatus provided in an embodiment of this application;

[0021] Figure 2 It shows Figure 1 A diagram from another perspective;

[0022] Figure 3 It shows Figure 1 A diagram from yet another perspective;

[0023] Figure 4 It shows Figure 1 A schematic diagram of the installation platform with a tilt angle of 0°.

[0024] Figure 5 It shows Figure 1 A schematic diagram of the installation platform at a tilt angle of 15°;

[0025] Figure 6 It shows Figure 1 A schematic diagram of the installation platform at an inclination angle of 22.5°;

[0026] Figure 7 It shows Figure 1 A schematic diagram of the installation platform at a tilt angle of 30°;

[0027] Figure 8 It shows Figure 1 The wafer placement device in the process of assisted wafer placement;

[0028] Figure 9 It shows Figure 1 A schematic diagram of the crystal boat placement device removing the crystal boat;

[0029] In the picture:

[0030] 1. Base; 11. Base plate; 12. Mounting platform; 13. First limiting component; 131. First slot; 132. Second slot; 133. Third slot; 134. Fourth slot; 14. Second limiting component; 5. Anti-slip pad; 101. Second locking component; 2. Positioning post; 3. Guide plate; 31. Guide groove; 32. Antistatic layer; 301. First locking component; 100. Crystal boat; 200. Box cover. Detailed Implementation

[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0032] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0033] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0034] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] refer to Figures 1 to 9 This application provides a wafer loading device for a wafer boat 100. This device assists in placing wafers into the wafer boat 100 and prevents the wafer from contacting the wafer boat 100 or other wafers during placement, thereby reducing the risk of wafer scratches. The wafer boat 100 loading device includes a substrate 1, multiple positioning posts 2, and two guide plates 3. The positioning posts 2 are disposed on the substrate 1 and are used to position the wafer boat 100 placed on the substrate 1. The guide plates 3 are disposed on the substrate 1 and located on both sides of the wafer boat 100. The guide plates 3 are provided with guide grooves 31 corresponding to the grooves of the wafer boat 100. The guide plates 3 can rotate relative to the substrate 1 to connect the guide grooves 31 with the corresponding grooves. In use, the operator first places the wafer boat 100 on the substrate 1. The positioning post 2 positions the wafer boat 100 to prevent it from moving during wafer placement. After the wafer boat 100 is in place, the two guide plates 3 are rotated so that the guide grooves 31 of the two guide plates 3 connect with the corresponding grooves in the wafer boat 100. Then, the operator transfers the wafer, inserting one end into the guide groove 31 and sliding it into the corresponding groove under the guidance of the guide groove 31. The guide plates 3 guide the wafer when it is placed into the wafer boat 100, preventing the wafer from contacting the wafer boat 100 or other wafers, thereby reducing the risk of wafer scratches.

[0037] In some embodiments, the rotation axis of the guide plate 3 is perpendicular to the depth direction of the trench. Specifically, the guide plate 3 is mounted on the substrate via a pivot, and the guide plate 3 is rotatable about this pivot, the axis of which is perpendicular to the depth direction of the trench in the boat 100 placed on the substrate. Of course, in other embodiments, the guide plate 3 may also rotate along a rotation axis in other directions. For example, the rotation axis of the guide plate 3 may be parallel to the depth direction of the trench.

[0038] In some embodiments, the guide plate 3 has a first position and a second position that rotate relative to the substrate 1. In the first position, the guide groove 31 of the guide plate 3 is connected to the corresponding groove. In the second position, the guide plate 3 is offset from the wafer boat 100 to provide mounting space for the cover 200 of the wafer boat 100. That is, when wafers need to be placed, the two guide plates 3 can rotate and come closer to the sides of the wafer boat 100 to guide the wafers into the wafer boat 100; after the wafers are placed, the two guide plates 3 can rotate in the opposite direction to offset the wafer boat 100 and provide mounting space for the cover 200 of the wafer boat 100. Compared to the method of first removing the wafer boat 100 and then installing the cover 200, this design can reduce the steps of removing and placing the wafer boat 100, which helps to improve shipping efficiency.

[0039] In some embodiments, the guide plate 3 rotates 90° when switching from the first position to the second position. For example, as... Figure 9 As shown, the guide plates 3 on both sides of the crystal boat 100 are in the second position. When the two guide plates 3 rotate 90° to the left and right respectively, they rotate to the first position. Of course, in other embodiments, the guide plates 3 can also rotate at other angles to achieve position switching. For example, 45°, 60°, and 75°, etc.

[0040] refer to Figures 1 to 3 In some embodiments, the guide plate 3 is provided with a first locking member 301, and the base 1 is provided with a second locking member 101. The first locking member 301 and the second locking member 101 can cooperate to limit the guide plate 3 to a first position and / or a second position. In this embodiment, the first locking member 301 can cooperate with the second locking member 101 at the first position and the second position respectively to limit the guide plate 3 to the first position and the second position respectively. This arrangement can prevent the guide plate 3 from rotating arbitrarily during the placement or removal of the wafer boat 100, thus avoiding affecting the auxiliary effect of the device.

[0041] In some embodiments, the first locking member 301 is provided with a locking tongue, and the second locking member 101 is provided with a slot conforming to the locking tongue. The locking tongue can be inserted into the slot in a first position / second position to limit the guide plate 3. In this embodiment, the second locking member 101 is provided with two slots, one for the locking tongue to be inserted in the first position and the other for the locking tongue to be inserted in the second position, thus limiting the guide plate 3 to the first position and the second position respectively. It should be understood that in specific implementations, the locking tongue can be configured to automatically spring into the slot in the first position, such as by using the elastic force of an elastic member to spring the locking tongue into the slot, which can improve the convenience of operation.

[0042] In some embodiments, the locking tongue can disengage from the slot when the guide plate 3 is rotated under force. That is, after the sheet is placed, the operator can release the locking relationship between the first locking member 301 and the second locking member 101 by rotating the guide plate 3, without needing to perform an additional unlocking action before rotating the guide plate 3. This design improves operational convenience. It should be understood that in specific implementations, the first locking member 301 can also be equipped with a spring. When no external force is applied, the spring uses its own elasticity to push the locking tongue out and insert it into the slot. When the operator pushes the guide plate 3 to rotate, the thrust acts on the inclined surface of the locking tongue, compressing the spring and disengaging it from the slot, thereby achieving unlocking.

[0043] refer to Figures 1 to 2 In some embodiments, an antistatic layer 32 is provided on the surface of the guide plate 3, and the guide groove 31 is disposed on the antistatic layer 32. This arrangement can prevent electrostatic damage to the wafer due to friction between the wafer and the guide plate 3 when the wafer slides through the guide groove 31. Of course, in other embodiments, the antistatic layer 32 may also be provided on the surface of the guide plate 3 where the guide groove 31 is processed, or the guide plate 3 may be directly processed from an antistatic material.

[0044] refer to Figures 1 to 3 In some embodiments, the substrate 1 includes a base plate 11 and a mounting platform 12. The base plate 11 has a first end and a second end opposite to each other. The mounting platform 12 is disposed at the first end of the base plate 11. The mounting platform 12 is rotatable relative to the base plate 11 to achieve tilting. The positioning post 2 and the guide plate 3 are disposed on the mounting platform 12. Specifically, by rotating the mounting platform 12 relative to the base plate 11, the mounting platform 12 can be tilted, and the wafer boat 100 can be tilted at the same time. This allows adjustment of the wafer placement angle and the operator's observation angle, making operation more convenient for the operator and helping to reduce the risk of wafer scratches.

[0045] refer to Figures 1 to 3 In some embodiments, the base plate 11 is provided with a first limiting member 13, and the mounting platform 12 is provided with a second limiting member 14. The first limiting member 13 and the second limiting member 14 can cooperate to limit the mounting platform 12 to different tilt angles, such as 0°, 15°, 22.5°, and 30°. This arrangement allows the tilt angle of the mounting platform 12 to be adjusted by the first limiting member 13 and the second limiting member 14, so that operators of different heights can observe the angle at which the film is placed, thus improving the applicability of the device. Of course, when the device is installed at different heights, the tilt angle of the mounting platform 12 can also be adjusted by the first limiting member 13 and the second limiting member 14 to ensure the operator's observation angle.

[0046] In some embodiments, the first limiting member 13 is disposed on the side of the base plate 11 facing the mounting platform 12, and the surface of the first limiting member 13 facing the second limiting member 14 is provided with a plurality of slots, which are spaced apart from the first end to the second end of the base plate 11. The second limiting member 14 is a rod-shaped structure, and one end of the second limiting member 14 is rotatably disposed on the side of the mounting platform 12 facing the base plate 11. The second limiting member 14 can rotate relative to the mounting platform 12 so that its other end can be respectively engaged in different slots, thereby limiting the mounting platform 12 to different tilt angles. For example, as Figure 2 , Figures 4 to 7 As shown, there are four slots. From the second end to the first end of the base plate 11, the four slots are defined as the first slot 131, the second slot 132, the third slot 133, and the fourth slot 134. When the end of the second limiting member 14 is engaged in the first slot 131, the angle between the mounting platform 12 and the horizontal plane is 0°. When the end of the second limiting member 14 is engaged in the second slot 132, the angle between the mounting platform 12 and the horizontal plane is 15°. When the end of the second limiting member 14 is engaged in the third slot 133, the angle between the mounting platform 12 and the horizontal plane is 22.5°. When the end of the second limiting member 14 is engaged in the fourth slot 134, the angle between the mounting platform 12 and the horizontal plane is 30°.

[0047] refer to Figure 3 In some embodiments, the bottom surface of the substrate 1 is provided with anti-slip pads 5. Specifically, the side of the base plate 11 facing away from the mounting platform 12 is provided with anti-slip pads 5. This arrangement can ensure the stability of the device and prevent slippage during the installation of the crystal boat 100, thus affecting the installation efficiency.

[0048] refer to Figure 8 The wafer loading process of the wafer loading device of the wafer boat 100 in this application embodiment includes:

[0049] 1. Adjust the installation platform 12 to a suitable tilt angle according to the installation location or the height of the operator;

[0050] 2. Rotate the guide plate 3 to the working position (first position), and use the first locking member 301 and the second locking member 101 to limit the position of the guide plate 3;

[0051] 3. Place the crystal boat 100 (the lower cover of the octagonal box) on the installation platform 12, and use the positioning post 2 to position the crystal boat 100;

[0052] 4. Place the wafers into different grooves of the crystal boat 100 through different guide slots 31;

[0053] 5. Rotate the guide plate 3 to the position shown in the figure below (second position), and use the first locking member 301 and the second locking member 101 to limit the position of the guide plate 3;

[0054] 6. Place the box cover 200 (octagonal box cover) of the crystal boat 100 on the installation platform 12 and fasten and fix it to the crystal boat 100;

[0055] 7. Remove the crystal boat 100 (the complete octagonal box) after the wafer has been inserted, completing one cycle.

[0056] When removing the crystal boat 100, the installation platform 12 is first adjusted to the position as follows: Figure 9 In the vertical position shown, first lift the crystal boat 100 upwards, then move the crystal boat 100 outwards to remove it.

[0057] The wafer loading apparatus of the wafer boat 100 in this embodiment of the application has a guide plate 3 that can guide the wafer when it is placed into the wafer boat 100, so as to avoid the wafer from contacting the wafer boat 100 or other wafers, thereby reducing the risk of wafer scratches. In addition, since the substrate 1 and the positioning post 2 can position the wafer boat 100, the wafer boat 100 will not move randomly during the loading process, avoiding contact with the wafer due to the movement of the wafer boat 100, thereby further reducing the risk of wafer scratches.

[0058] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.

[0059] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A wafer loading device for a crystal boat, characterized in that, include: The device comprises a substrate, multiple positioning posts, and two guide plates. The positioning posts are disposed on the substrate and are used to position a crystal boat placed on the substrate. The guide plates are disposed on the substrate and located on both sides of the crystal boat. The guide plates are provided with guide grooves corresponding to the grooves of the crystal boat. The guide plates are rotatable relative to the substrate so that the guide grooves are connected to the corresponding grooves.

2. The wafer loading apparatus according to claim 1, characterized in that, The guide plate has a first position and a second position that rotate relative to the substrate. In the first position, the guide groove of the guide plate is connected to the corresponding groove. In the second position, the guide plate is offset from the crystal boat to provide installation space for the box cover of the crystal boat.

3. The wafer unloading apparatus according to claim 2, characterized in that, The guide plate is provided with a first locking member, and the base is provided with a second locking member. The first locking member and the second locking member can cooperate to limit the guide plate to the first position and / or the second position.

4. The wafer loading apparatus according to claim 3, characterized in that, The first locking member is provided with a locking tongue, and the second locking member is provided with a slot conforming to the locking tongue. The locking tongue can be inserted into the slot in the first position / second position to limit the guide plate.

5. The wafer loading apparatus according to claim 4, characterized in that, The locking tongue can disengage from the slot when the guide plate is rotated under force.

6. The wafer unloading apparatus according to claim 1, characterized in that, The guide plate has an antistatic layer on its surface, and the guide groove is disposed on the antistatic layer.

7. The wafer unloading apparatus according to claim 1, characterized in that, The base includes a base plate and a mounting platform. The mounting platform is disposed on the base plate and can rotate relative to the base plate to achieve tilting. The positioning column and the guide plate are disposed on the mounting platform.

8. The wafer unloading apparatus according to claim 7, characterized in that, The base plate is provided with a first limiting member, and the installation platform is provided with a second limiting member. The first limiting member and the second limiting member can cooperate to limit the installation platform to different tilt angles.

9. The wafer unloading apparatus according to claim 8, characterized in that, The first limiting member is disposed on the side of the base plate facing the installation platform, and the surface of the first limiting member facing the second limiting member is provided with multiple slots; The second limiting member is rotatably disposed on the side of the mounting platform facing the base plate. The second limiting member can rotate relative to the mounting platform to engage with different slots, thereby limiting the mounting platform to different tilt angles.

10. The wafer unloading apparatus according to claim 1, characterized in that, The bottom surface of the substrate is provided with anti-slip pads.

Images