A transmission device, a transmission mechanism, and a semiconductor device

Abstract

The application relates to the field of semiconductor processing equipment, and particularly relates to a conveying device, a conveying mechanism and a semiconductor device. The conveying system is arranged to divide the conveying of materials into three stages, each stage is provided with an independent wheel group and a belt to realize the transfer of the materials. The conveying mechanism arranged in the detection stage is provided with a belt movable assembly which can move in the vertical direction to make the belt have an adjusting space in the vertical direction, so that the height relationship between the materials and the detection module is changed, the problem of inaccurate focusing caused by different thicknesses of the materials is avoided, and the problem of inaccurate detection results is reduced. Compared with the prior art, the semiconductor device provided by the embodiment of the application can be applied to the detection of materials with different height sizes, and has high compatibility and detection accuracy.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing equipment, specifically to a semiconductor testing device, and more specifically, to a transmission device, a transmission mechanism, and a semiconductor equipment. Background Technology

[0002] The semiconductor industry in China is currently in a phase of rapid development, and semiconductor-related manufacturing equipment is of paramount importance.

[0003] Especially when visually inspecting semiconductor products, the platform is not compatible with products of all thicknesses available on the market. Furthermore, the manual handling of semiconductor products during visual inspection can easily lead to inaccurate positioning and testing results, and manual transport is also inefficient. Summary of the Invention

[0004] To address the aforementioned technical problems, embodiments of this application provide a transmission device, a transmission mechanism, and a semiconductor device, which can be directly mounted on the semiconductor device body and can adjust the transmission limit scale according to materials of different thicknesses.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0006] In a first aspect, a conveying device is provided, the device comprising: a transmission wheel assembly disposed in a connecting structure, including at least one main transmission wheel and at least one synchronous wheel, wherein a belt is mounted on the main transmission wheel and the synchronous wheel, the belt forming a rotation loop; the rotation loop including an upper transmission branch and a lower rotation branch, wherein material moves along a first direction via the upper transmission branch; and a belt adjusting assembly including a movable member disposed relative to the upper transmission branch, the movable member contacting the upper transmission branch based on an external force and squeezing the upper transmission branch to move it in the direction of the force.

[0007] In another possible implementation, the length of the movable element in the first direction is not less than the length of the upper transmission branch.

[0008] In another possible implementation, the belt adjustment assembly further includes a power component connected to the movable element, which provides external power to the movable element to move it.

[0009] In another possible implementation, the transmission wheel assembly includes a main transmission wheel and four synchronous wheels, with the four synchronous wheels positioned at four different locations in the connection structure, forming a quadrilateral space with the main transmission wheel.

[0010] In another possible implementation, the movable element moves vertically and may selectively contact the upper belt.

[0011] In another possible implementation, the power component is a cylinder, including a cylinder wall fixedly connected to the connecting structure, and a column that moves within the cylinder body, the column being connected to a movable component.

[0012] In another possible implementation, the number of power components includes at least two, each connected to the moving part.

[0013] In another feasible embodiment, a connector is also included, which is connected to the column and the movable member, and the column provides external power to the connector to cause the connector to move the movable member.

[0014] In a second aspect, a conveying mechanism is provided, comprising a first side plate and a second side plate disposed opposite to each other, and a clamping plate is provided on the upper edge of both the first side plate and the second side plate, wherein a passage space for material to pass through is formed between the clamping plate and the upper edge of the first side plate and the second side plate; the first side plate and the second side plate are connected by a conveying device as described in any of the preceding claims being disposed inside them, wherein the material is disposed on the belt of the conveying device and moves along a first direction in the passage space, and the distance between the material and the clamping plate is adjusted by the conveying device.

[0015] Thirdly, a semiconductor device is provided for semiconductor processing, including a transport system, the transport system including multiple transfer mechanisms, and at least one of the multiple transfer mechanisms includes the transport mechanism described above; it also includes a processing system corresponding to the transport mechanism for processing materials on the transport mechanism.

[0016] In another possible implementation, a sensor is provided at the rear end of the conveying mechanism along the direction of material movement to obtain the relative position of the material.

[0017] The embodiments of the present invention bring the following beneficial effects:

[0018] In the technical solution provided by this application embodiment, the material transfer is divided into three stages by setting up a transfer system. Each stage is equipped with an independent wheel set and belt to realize the transfer of materials. Furthermore, the transfer mechanism in the detection stage includes a belt movable component, which can move vertically, allowing the belt to have adjustment space in the vertical direction. This changes the height relationship between the material and the detection module, avoiding the problem of inaccurate focusing caused by different material thicknesses and reducing the inaccuracy of detection results. Compared with the prior art, the semiconductor device provided by this application embodiment can be applied to the detection of materials of different heights and dimensions, and has high compatibility and detection accuracy.

[0019] Other features and advantages of this disclosure will be set forth in the following description, or some features and advantages may be inferred from the description or determined without doubt, or may be learned by practicing the techniques described above.

[0020] To make the above-mentioned objects, features and advantages of this disclosure more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] The system shown in the accompanying drawings will be further described according to exemplary embodiments. These exemplary embodiments will be described in detail with reference to the drawings. These exemplary embodiments are non-limiting exemplary embodiments, wherein example figures represent similar mechanisms in the various views of the drawings.

[0023] Figure 1 This is a schematic diagram of the transmission system structure provided in an embodiment of this application.

[0024] Figure 2 This is a schematic diagram of the transmission device structure provided in an embodiment of this application.

[0025] Figure 3 This is a schematic diagram of the transmission wheel assembly structure provided in an embodiment of this application.

[0026] Figure 4 This is a schematic diagram of the belt adjustment assembly provided in an embodiment of this application.

[0027] Illustration:

[0028] 10 - Conveying system; 20 - Material tray;

[0029] 11-Side plate; 12-Feeding conveyor section; 13-Detection section; 14-Discharge conveyor section; 100-Conveying mechanism;

[0030] 110 - Pressure plate; 120 - Through space; 130 - Drive pulley set; 140 - Belt; 150 - Belt adjustment assembly;

[0031] 131-Main drive wheel; 132-Synchronizer wheel; 133-Quadrilateral space; 151-Moving part; 152-Connecting part; 153-Cylinder; 154-Groove. Detailed Implementation

[0032] To better understand the above technical solutions, the technical solutions of this application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of this application and the specific features in the embodiments are detailed descriptions of the technical solutions of this application, rather than limitations on the technical solutions of this application. In the absence of conflict, the embodiments of this application and the technical features in the embodiments can be combined with each other.

[0033] In the detailed description below, numerous specific details are illustrated with examples to provide a comprehensive understanding of the relevant guidance. However, it will be apparent to those skilled in the art that this application can be practiced without these details. In other instances, well-known methods, procedures, systems, components, and / or circuits have been described at a relatively high level without detail to avoid unnecessarily obscuring aspects of this application.

[0034] This application provides a semiconductor device for semiconductor processing, specifically for optical inspection of semiconductor products. In this embodiment, "semiconductor product" primarily refers to packaged IC products. It can be understood that the semiconductor device in this embodiment is used for optical inspection of packaged IC products. The semiconductor device includes a semiconductor device body and a transmission system disposed within the semiconductor device body.

[0035] Specifically, an optical inspection device is also configured within the semiconductor device body, positioned at a detection station in the transmission system to perform optical inspection on materials transmitted to that station. The materials at the detection station are fed into the semiconductor device from the outside via a loading process and then transported to the corresponding detection station via the transmission system. The loading process refers to transferring the external semiconductor material to be inspected to the detection station via a transmission method, where a detection module is configured. In this embodiment, the detection module is an optical module. The semiconductor product is conveyed to the optical module via the transmission system, which acquires an image of the semiconductor product. A processing algorithm then uses this image to determine whether the semiconductor product has defects. Semiconductor products with different inspection results are then correspondingly unloaded; in this embodiment, different inspection results represent normal results and defective results.

[0036] See Figure 1 The semiconductor device in this embodiment includes a semiconductor device body (not shown) and a transmission system 10 disposed within the semiconductor device body. The semiconductor product in this embodiment is a packaged IC chip, with multiple IC chips placed in a material tray 20. The transmission system is used to transport the material tray from the feeding end to the unloading end, and during the transmission process, a detection module performs image acquisition and detection of the materials on the tray.

[0037] In this embodiment, the transmission system includes a first side plate and a second side plate, which form a transmission plane. Multiple motors (not shown) and wheels (not shown) cooperating with the motors are arranged inside the first and second side plates. The wheels are connected by belts to form a conveyor belt, which is used to transfer the material tray. Because the first and second side plates are mirror images of each other and are both plate-like structures, they are collectively referred to as side plate 11 in this embodiment and are given consistent reference numerals.

[0038] Furthermore, in this embodiment, the transmission system is divided into multiple transfer mechanisms according to different functions, and each transfer mechanism is equipped with the aforementioned independent transmission module and conveyor belt. The advantage of this arrangement is that the multiple transfer mechanisms can be independently controlled and maintained, reducing the overall impact of faults or abnormal situations on the system. Specifically, the multiple transfer mechanisms are further divided into a feeding transfer section 12, a detection section 13, and a discharging transfer section 14 based on function. The detection sections are correspondingly set with the detection modules, and the field of view of the detection modules is the range of the detection sections.

[0039] Among them, the transfer mechanism in the detection segment is not only used for the transfer of materials, but also needs to limit the material to be detected because the detection module is set up.

[0040] Specifically, the detection module employs an optical solution for image acquisition of the material. It is equipped with a light source and an image acquisition device. The field of view should cover the entire space of the detection area, and the focal length of the image acquisition device should be consistent with the height of the material to ensure a clear and complete image. However, to address issues such as inaccurate material positioning due to equipment vibration or placement deviations during transport, and defocusing problems caused by differences in height between batches or different models of material, components are needed in the detection area to accommodate position adjustments and height changes. This ensures that the spatial position of the material meets the requirements of the detection module for image acquisition.

[0041] Therefore, in this embodiment, a transmission mechanism 100 configured in the detection bit segment is also provided to solve the above problems.

[0042] For details, please refer to Figure 2 As shown, this transmission mechanism includes clamping plates 110 disposed on the upper edges of the first and second side plates. The first and second side plates are collectively referred to as side plates 11. A passage space 120 for material passage is formed between the clamping plates and the upper edges of the first and second side plates. In this embodiment, the clamping plates serve to provide lateral limiting points for the material, allowing the material transported by the previous transfer mechanism to be positioned by the clamping plates as the transmission mechanism enters. Furthermore, in another possible embodiment, adjusting components can be provided for the two clamping plates to adjust their lateral displacement, thereby further adjusting the position of the material.

[0043] The side plate is also equipped with a transmission device for adjusting the height of the material relative to the detection module.

[0044] See Figure 2 , Figure 3 and Figure 4 The conveying device includes a drive pulley set 130 and a belt adjusting assembly 150 disposed on the inner sides of the first and second side plates. The drive pulley set includes at least one main drive pulley 131 and at least one synchronous pulley 132. A belt 140 is mounted between the main drive pulley and the synchronous pulley, forming a rotation loop between them. The material moves in a first direction based on the rotation of this belt. The belt adjusting assembly is used to adjust the height of the belt, thereby adjusting the height of the material above the belt.

[0045] The rotating loop formed by the belt includes an upper transmission branch and a lower rotation branch. The material moves along a first direction due to the rotation of the upper transmission branch. In this embodiment, the belt adjustment assembly 150 includes a movable member 151 disposed relative to the upper transmission branch. The movable member contacts the upper transmission branch based on external force and squeezes the upper transmission branch to move it in the direction of the force. The direction of the force is the vertical direction. This can be understood as the movable member moving vertically by external force, causing the upper transmission branch of the belt to move accordingly, thereby moving the material vertically and adjusting the height between the material and the detection module.

[0046] Furthermore, in order to ensure that the belt is evenly stressed and thus the material is lifted as a whole, the length of the moving part in the first direction in this embodiment should not be less than the length of the upper transmission branch, thereby lifting the entire belt.

[0047] In this embodiment, the belt adjustment assembly further includes a power component connected to the movable component, used to provide external power to the movable component to move it in the vertical direction. The power component is a cylinder 153, including a cylinder wall fixedly connected to the first side plate and the second side plate, and a column disposed within the cylinder body. The column can be directly connected to the movable component.

[0048] Furthermore, since the material in this embodiment has a certain length, in order to ensure uniform force distribution, the number of power components should include at least two, symmetrically arranged at both ends of the movable component. In other possible embodiments, multiple components can be provided to ensure that the external force received by the movable component is uniform in the lateral direction, reducing the problem of uneven force distribution causing fluctuations in material height.

[0049] Furthermore, to ensure the movable component corresponds with the belt in position, thereby enabling the movable component to drive the belt, grooves 154 are provided on the first and second side plates for accommodating the cylinder, reducing the spatial inconsistency caused by directly placing the cylinder on the side plates. Moreover, to further optimize the structure and reduce the difficulty of component manufacturing, the movable component in this embodiment includes at least one crossbeam, which contacts the upper transmission branch. The column can be directly connected to the crossbeam to achieve height adjustment of the movable component.

[0050] Preferably, to optimize structure and stability, the moving part includes a crossbeam and a vertical beam connected to the cylinder, wherein the vertical beam is connected to the cylinder column via a connector 152. The connector is L-shaped, including a platform connected to the column and a connecting surface for the vertical beam. The vertical beam and the connecting surface can be fixed together with bolts; this structure is simple and allows for easy replacement of components in case of failure.

[0051] Furthermore, due to the required dimensions of the cylinder and the moving parts, there should be sufficient space between the upper transmission branch and the lower rotation branch for the moving parts to move. Therefore, the transmission wheel assembly in this embodiment includes one main transmission wheel 131 and four synchronous wheels 132, with the four synchronous wheels positioned at four different locations on the first side plate / second side plate, forming a quadrilateral space 133 with the main transmission wheel. The vertical travel within this quadrilateral space should be greater than the overall height of the moving parts, thus allowing the moving parts space to move vertically.

[0052] The vertical movement of the moving part is controlled based on the height of the material to be detected. The moving part has an initial position corresponding to the minimum height of the material to be detected. At this initial position, the moving part is not in contact with the upper transmission branch. When the height of the material being detected in real-time is greater than the minimum height, the corresponding adjustment height is determined based on the height difference and the focal length. This adjustment height, combined with the initial height difference of the moving part's initial position, determines the moving distance of the moving part. The column of the moving part is then raised by this moving distance, thereby raising the upper transmission branch to the height required by the focal length of the detection module.

[0053] Furthermore, sensors (not shown) are provided at the front and rear ends of the conveying mechanism along the material's movement direction and the first direction in this embodiment. These sensors are used to acquire the relative position of the material. That is, the sensors can determine whether the material tray has entered the current conveying mechanism and its corresponding specific position, thereby achieving automated control.

[0054] The semiconductor device provided in this application embodiment divides material transport into three stages through a transmission system. Each stage has an independent set of wheels and a belt to move the material. Furthermore, the transmission mechanism in the detection stage includes a belt movable component, which can move vertically, allowing the belt to have adjustment space in the vertical direction. This changes the height relationship between the material and the detection module, avoiding inaccurate focusing caused by different material thicknesses and reducing inaccurate detection results. Compared with the prior art, the semiconductor device provided in this application embodiment is applicable to the detection of materials of different heights and dimensions, exhibiting high compatibility and detection accuracy.

[0055] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A transmission device, characterized in that, The device includes: A transmission wheel assembly, disposed in a connecting structure, includes at least one main transmission wheel and at least one synchronous wheel, and a belt is mounted on the main transmission wheel and the synchronous wheel, the belt forming a rotation loop; the rotation loop includes an upper transmission branch and a lower rotation branch, the material moves along a first direction via the upper transmission branch; The belt adjustment assembly includes a movable member disposed relative to the upper transmission branch, the movable member contacting the upper transmission branch based on an external force and squeezing the upper transmission branch to move it in the direction of the force.

2. The transmission device according to claim 1, characterized in that, The length of the movable component in the first direction is not less than the length of the upper transmission branch.

3. The transmission device according to claim 1, characterized in that, The belt adjustment assembly also includes a power component, which is connected to the movable component and provides external power to the movable component to move it.

4. The transmission device according to claim 1, characterized in that, The transmission wheel assembly includes a main transmission wheel and four synchronous wheels, with the four synchronous wheels positioned at four different locations on the connecting structure, forming a quadrilateral space with the main transmission wheel.

5. The transmission device according to claim 4, characterized in that, The movable component moves vertically and can selectively contact the upper transmission branch.

6. The transmission device according to claim 3, characterized in that, The power component is a cylinder, including a cylinder wall fixedly connected to the connecting structure, and a column that moves within the cylinder body, the column being connected to a movable component.

7. The transmission device according to claim 6, characterized in that, The number of power components includes at least two, each connected to the moving part.

8. The transmission device according to claim 7, characterized in that, It also includes a connector that is connected to the column and the movable part, and the column provides external power to the connector so that the connector drives the movable part to move.

9. A transmission mechanism, characterized in that, The device includes a first side plate and a second side plate arranged opposite to each other, and a clamping plate is provided on the upper edge of both the first side plate and the second side plate. A passage space for material to pass through is formed between the clamping plate and the upper edge of the first side plate and the second side plate. The first side plate and the second side plate are connected by a conveying device as described in any one of claims 1-8. The material is placed on the belt of the conveying device and moves in the passage space along a first direction. The distance between the material and the clamping plate is adjusted by the conveying device.

10. A semiconductor device for semiconductor processing, characterized in that, The system includes a transmission system comprising multiple transfer mechanisms, wherein at least one of the multiple transfer mechanisms is a transmission mechanism as described in claim 9; and a processing system corresponding to the transmission mechanism for processing the material on the transmission mechanism.

11. The semiconductor device according to claim 10, characterized in that, A sensor is installed at the rear end of the conveying mechanism along the direction of material movement to obtain the relative position of the material.

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