Wafer edge alignment device

Abstract

The utility model provides a kind of wafer flat edge alignment device, it is related to wafer processing technical field, and it includes: fixed backplate, linear pneumatic module is fixed on fixed backplate;Wafer alignment piece, wafer alignment piece is fixed on linear pneumatic module, including gyro wheel and the limit plate of liftable setting in the side of gyro wheel in wafer alignment piece, gyro wheel and the edge contact of wafer to be aligned carry out flat edge alignment.There is beneficial effect by the ingenious cooperation of limit plate and gyro wheel, forcibly rotate the flat edge of all wafers in wafer box to preset direction (such as directly above).This fundamentally eliminates the uncertainty of flat edge position.Greatly reduce the risk of wafer sliding, vibrating ( "jumping piece") or deviating from the center position in carrier due to flat edge position random.It significantly improves the stability and reliability of subsequent transmission steps (especially chuck / grasp wafer), reduces the risk of grasping failure, wafer falling or positioning error, and lays the foundation for stable feeding and discharging.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer flat edge alignment device. Background Technology

[0002] Cleaning is a crucial step in semiconductor manufacturing and a vital component of wafer fabrication, significantly impacting semiconductor device yield. Currently, mainstream semiconductor cleaning equipment falls into two main categories: single-wafer cleaning systems and tank-type systems. With the continuous growth of domestic wafer production capacity, wafer fabs are increasingly demanding wafer cleaning equipment. Currently, tank-type cleaning equipment is generally used for processes above 40nm. For 6-inch wafers, tank-type cleaning equipment, whether cassette-less or cassette-type, requires a matching wafer alignment and flat-edge device to ensure stable wafer loading and unloading. While there are many wafer alignment and flat-edge mechanisms available, ensuring effective wafer cleaning is paramount for cleaning equipment. Therefore, developing a device suitable for tank-type equipment that improves wafer transport stability is essential.

[0003] Currently, in existing slotted conveying equipment, the flat edge of a 6-inch wafer is prone to "wafer skipping" and deviating from the center of the carrier during the transmission process due to the uncertainty of its position in the circumferential direction, such as in Cassette and Guide. This can also have an adverse effect on the gripping of Chucks. Therefore, in order to solve this problem, a mechanism will be invented that can unify the orientation of the flat edge of the wafer. Utility Model Content

[0004] To address the problems existing in the prior art, this utility model provides a wafer flat edge alignment device, comprising:

[0005] A fixed backplate, on which a linear pneumatic module is fixed;

[0006] A wafer alignment component is fixed on the linear pneumatic module. The wafer alignment component includes a roller and a lifting limit plate disposed on one side of the roller. The roller contacts the edge of the wafer to be aligned for flat edge alignment.

[0007] Preferably, the wafer alignment member includes:

[0008] Alignment fixing plate, the back of which is fixedly connected to the linear pneumatic module;

[0009] Two roller support plates are respectively fixed on both sides of the front of the alignment member fixing plate, and a roller is installed between the roller fixing ends of the two roller support plates.

[0010] A roller drive component is fixed to the front side of the alignment component fixing plate and is connected to the roller drive.

[0011] A limiting plate is provided on one side of the roller, and the limiting plate is liftable.

[0012] Preferably, the roller drive component includes:

[0013] A drive motor is mounted on one of the roller support plates, and the drive shaft of the drive motor extends from the roller support plate;

[0014] A timing belt, which drives the timing pulley fitted on the roller shaft to the timing pulley fitted on the drive shaft.

[0015] Preferably, the wafer alignment element further includes:

[0016] The limit plate lifting cylinder is fixed to the front of the alignment member fixing plate and is fixedly connected to the limit plate through the limit plate connecting plate, and is used to drive the limit plate to lift.

[0017] Preferably, the linear pneumatic module includes:

[0018] A lifting cylinder, wherein a first slider is sleeved on the sliding rod of the lifting cylinder;

[0019] A sliding groove is provided, in which a slidable second slider is installed. The second slider and the first slider are fixed and slide synchronously. The wafer alignment member is fixed on the second slider.

[0020] Preferably, the middle part of the groove is provided with a protrusion, and the second slider is provided with a groove that matches the protrusion.

[0021] Preferably, the roller support plate has an opening at the roller fixing end, and a bearing is installed in the opening, with the roller shaft of the roller cooperating with the bearing.

[0022] Preferably, the roller drive further includes:

[0023] A drive component protective cover is provided on the outer side of the roller support plate on which the drive motor is installed, covering the synchronous belt and the synchronous pulley.

[0024] Preferably, the wafer alignment component further includes a structural support plate, which is fixedly connected to the two roller support plates and located directly below the rollers.

[0025] Preferably, the wafer alignment component further includes a right-angle fixing component, wherein the two right-angle surfaces of the right-angle fixing component are fixedly connected to the bottom surface of the limiting plate lifting cylinder and the front surface of the alignment component fixing plate, respectively, and the side surface of the right-angle fixing component forms a reinforcing surface integral with the right-angle surface.

[0026] The above technical solution has the following advantages or beneficial effects:

[0027] 1. Through the ingenious combination of the limiting plate and rollers, the flat edges of all wafers in the wafer cassette are forced to rotate uniformly to a preset direction (such as directly above). This fundamentally eliminates the uncertainty of the flat edge position. After the wafer flat edges are uniformly oriented, their position and orientation in the transport carrier (such as Cassette or Guide) are highly consistent and stable, greatly reducing the risk of wafers sliding, vibrating ("wafer skipping"), or deviating from the center position in the carrier due to random flat edge positions.

[0028] 2. Because all wafers have the same flat edge orientation and a fixed position, the transfer equipment (such as robotic arms and chucks) can perform precise positioning and operation based on this unified reference point. The wafer's position in the carrier is more stable, reducing shaking and offset during the gripping process. This significantly improves the stability and reliability of subsequent transfer steps (especially chuck / guzzle wafer gripping), reduces the risk of gripping failure, wafer drops, or inaccurate positioning, and lays the foundation for stable loading and unloading. Attached Figure Description

[0029] Figure 1 A schematic diagram of the structure of a wafer flat edge alignment device is shown in a preferred embodiment of the present invention.

[0030] Figure 2 An exploded view of a wafer flat edge alignment device in a preferred embodiment of this utility model;

[0031] Figure 3-4 In a preferred embodiment of this utility model, a diagram showing the positional relationship of a wafer flat-edge alignment device installed in a wafer cassette of a slotted equipment transport device is provided.

[0032] Figure 5 This is a schematic diagram of the wafer alignment component in a preferred embodiment of the present invention.

[0033] Figure 6 This is a schematic diagram of the structure of the linear pneumatic module in a preferred embodiment of the present invention. Detailed Implementation

[0034] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The present invention is not limited to this embodiment; other embodiments that conform to the spirit of the present invention may also fall within its scope.

[0035] In a preferred embodiment of this utility model, based on the above-mentioned problems existing in the prior art, a wafer flat edge alignment device is now provided, such as... Figure 1-2 As shown, it includes:

[0036] Fixed backplate 1, with linear pneumatic module 2 fixed on the fixed backplate;

[0037] The wafer alignment component 3 is fixed on the linear pneumatic module 2. The wafer alignment component 3 includes a roller 31 and a lifting limit plate 32 disposed on one side of the roller. The roller 31 contacts the edge of the wafer to be aligned for flat edge alignment.

[0038] Specifically, such as Figure 3 and Figure 4 As shown, in this embodiment, a wafer flat edge alignment device is installed below the wafer cassette of the slotted equipment transport device. Its principle for achieving wafer flat edge alignment is as follows:

[0039] First, the limiting plate is raised. Then, the linear pneumatic module fixed on the back plate drives the wafer alignment assembly to move up and down. This causes the rollers in the wafer alignment assembly to contact the edge of the wafer in the wafer cassette and lift the wafer from the cassette. Then, the rollers are driven to rotate, causing the wafer to rotate. During the rotation, the flat edge of the wafer will abut against the limiting plate and be limited. However, the round edge of the wafer is curved and will not be abutted by the limiting plate. So when the flat edge rotates to directly under the wafer itself, it cannot rotate due to the abutment of the limiting plate. However, wafers whose flat edges have not yet rotated to directly under themselves can still rotate. Through the limiting cooperation with the limiting plate, all the flat edges of the wafers are rotated to directly under themselves.

[0040] After all the flat edges of the wafers are aligned (directly downwards), the limiting plate lowers, and the rollers continue to rotate. After a preset time, all the flat edges of the wafers are aligned directly upwards, completing the flat edge alignment. The preset time is calculated based on the roller diameter, the wafer diameter, and the roller rotation speed, and its purpose is to rotate the flat edges of the wafers from facing directly downwards to facing directly upwards. In other embodiments, the preset time can be adjusted so that the flat edges of the wafers face any other direction.

[0041] And as Figure 1As shown, the wafer flat edge alignment device in this embodiment has a simple and compact structure. A linear pneumatic module is fixed on the fixed back plate by a platform-shaped fixing plate (composed of two fixing plates perpendicular to the fixed back plate and one fixing plate parallel to the fixed back plate). The wafer alignment component is fixed on the linear pneumatic module. It has a highly integrated structure, occupies little space, and is suitable for installation in slotted equipment transmission equipment. Furthermore, a tank chain and fixing plate are also installed on the side of the wafer flat edge alignment device for fixed connection with the components of the slotted equipment transmission equipment.

[0042] The advantages of this wafer flat-edge alignment device include the following:

[0043] 1. Completely solve the problem of randomness in the flat edge direction, and eliminate the risk of "skipping pieces" and deviation from the center:

[0044] Existing technologies suffer from the problem that "the uncertain position of the flat edge of a 6-inch wafer in its circumferential direction easily leads to 'wafer skipping' and deviation from the center of the carrier during transport." This invention, through the ingenious cooperation of a limiting plate and rollers, forcibly rotates all the flat edges of the wafers in the wafer cassette to a preset direction (such as directly upward). This fundamentally eliminates the uncertainty of the flat edge position. After the wafer flat edges are aligned, their position and orientation in the transport carrier (such as Cassette or Guide) are highly consistent and stable, greatly reducing the risk of wafers sliding, vibrating ("wafer skipping"), or deviating from the center position in the carrier due to random flat edge positions.

[0045] 2. Significantly improves transmission stability and capture reliability:

[0046] Existing technologies suffer from the technical problem of uncertain flat edge positions, which can negatively impact the gripping of chucks. In this invention, because all wafer flat edges are aligned and positioned precisely, the transfer equipment (such as robotic arms or chucks) can perform accurate positioning and operation based on this unified reference point. The wafer's position within the carrier is more stable, reducing shaking and offset during the gripping process. This significantly improves the stability and reliability of subsequent transfer steps (especially wafer gripping by chucks / suction cups), reducing the risk of gripping failures, wafer drops, or inaccurate positioning, laying the foundation for stable loading and unloading.

[0047] 3. Highly integrated and compact design, perfectly adaptable to the space constraints of slotted equipment:

[0048] The background technology suggests that "developing a device suitable for slotted equipment to improve wafer transport stability is essential." Slotted equipment loading modules typically have limited space, and existing solutions may be bulky or difficult to integrate. This invention employs a design combining a fixed backplate, a linear pneumatic module, and compact wafer alignment components (rollers and limiting plates), with optimized layout through a platform-type fixing plate, resulting in a highly integrated and compact overall structure. The side-mounted tank chain and fixing plates facilitate integration and fixation with the slotted transport equipment body. This allows the device to be easily installed within the limited space of slotted equipment transport equipment (especially below wafer cassettes), meeting the stringent requirements of slotted cleaning equipment (especially 6-inch wafer equipment) for miniaturized and easily integrated supporting devices.

[0049] 4. An automated and controllable alignment process improves efficiency and consistency:

[0050] Existing technologies require "stable wafer loading and unloading" and improved transmission stability. In this invention, the entire alignment process (lifting, rotation, limiting, and secondary rotation) is automatically completed by a linear pneumatic module and roller motor, requiring no manual intervention. A preset time (precisely calculated based on roller diameter, wafer diameter, and rotation speed) ensures that all wafer edges are accurately rotated to the target orientation (e.g., directly above). This achieves efficient, fast, and consistent wafer orientation operation, improves the overall throughput and automation level of the LOAD module, guarantees high repeatability of each alignment result, and further strengthens transmission stability.

[0051] Furthermore, different processes or equipment may have specific requirements for the orientation of the flat edge. In this invention, by adjusting the preset time (controlling the angle of the secondary rotation), the orientation of the final wafer flat edge (directly upward, directly downward, or any other direction) can be flexibly set without modifying the hardware. This enhances the versatility and adaptability of the device, meeting the specific needs of different tank-type equipment or process flows.

[0052] In summary, the core value of this wafer edge alignment device lies in its direct and efficient solution to key transmission stability issues in the background technology, such as wafer skipping, off-centering, and poor gripping caused by the randomness of the wafer edge orientation. It unifies the wafer edge orientation through an automated process, and combined with a highly compact integrated design, perfectly adapts to the space constraints and stable loading / unloading requirements of the LOAD module in tank cleaning equipment. Ultimately, it significantly improves the reliability and efficiency of wafer transmission, providing an important prerequisite for ensuring cleaning results (yield).

[0053] In a preferred embodiment of this utility model, such as Figure 5 As shown, the wafer alignment component 3 includes:

[0054] Alignment fixing plate 33, the back of alignment fixing plate 33 is fixedly connected to linear pneumatic module 2;

[0055] Two roller support plates 34 are fixed on the two sides of the front of the alignment member fixing plate 33 respectively, and a roller 31 is installed between the roller fixing ends of the two roller support plates 34.

[0056] Roller drive component 35 is fixed on the front side of the alignment component fixing plate 33 and is connected to the roller 31 for transmission.

[0057] The limiting plate 32 is vertically adjustable and is mounted on one side of the roller 31.

[0058] In a preferred embodiment of this utility model, the roller drive component 35 includes:

[0059] A drive motor 351 is mounted on one of the roller support plates 34, and the drive shaft of the drive motor extends from the roller support plate 34.

[0060] The timing belt 352 connects the timing pulley 353 mounted on the roller shaft to the timing pulley 353 mounted on the drive shaft.

[0061] Specifically, in this embodiment, the specific structural design of the wafer alignment component achieves a high degree of compactness and miniaturization, perfectly adapting to the space-constrained environment of slotted equipment.

[0062] The alignment plate serves as the core load-bearing and mounting base, with all key components directly or indirectly fixed to its front and back sides. The back of the alignment plate is directly fixed to the linear pneumatic module, achieving a simple connection with the drive source.

[0063] The front of the alignment plate has the following integrated features:

[0064] The roller drive unit (drive motor) is directly fixed to the central area of ​​the front of the alignment plate.

[0065] Two roller support plates are vertically mounted on the two sides of the front of the fixed plate. This layout makes full use of the Z-axis space (the direction of the normal to the alignment plate) above the plane of the fixed plate, rather than spreading it out on the plane.

[0066] The rollers are mounted between the tops of the two roller support plates. This is equivalent to "supporting" the rollers on top of the fixed plate.

[0067] Two roller support plates are fixed to the two sides of the front of the fixed plate. This design provides the roller with stable support and resists the torque during rotation. The roller support plates are located on the outermost side, and the roller is mounted between them, so that the width (X direction) of the entire roller assembly is only slightly larger than the length of the roller itself, avoiding the need to add a large additional support structure on both sides of the roller.

[0068] The drive motor is mounted on the side of one of the roller support plates. The motor no longer needs a separate mounting base or occupies a large area in the center of the fixed plate, but is "parasitic" on the existing support plate structure, making full use of the side space (Y direction) of the support plate.

[0069] The rollers and the drive motor are connected by a synchronous belt drive. The synchronous belt drive itself has a very flat structure, with very little protrusion of the synchronous belt pulleys on the drive shaft and roller shaft, achieving flatness and lightweight design. If a gearbox or chain drive were used, it would typically require a larger volume and a more complex support structure. Moreover, the synchronous belt system is lighter than gearboxes, which helps to reduce the overall structural size and inertia.

[0070] The limiting plate is positioned close to the roller, directly utilizing the potentially unused space next to the roller for lifting and lowering. It does not require a separate, bulky support and drive mechanism located far from the roller; its lifting mechanism (such as a small cylinder or linear bearing) can be very compactly integrated near the roller support plate or the alignment plate.

[0071] All the key functional components that enable wafer lifting, rotation, and positioning (rollers, motors, timing belts, and positioning plates) are highly integrated into a small frame consisting of an alignment plate and two support plates. There are no redundant frames, housings, or large connectors in the design. Each component has a clearly defined structural or functional role and is connected via the most direct path (e.g., the motor is mounted on the support plate, and the support plate is mounted on the mounting plate).

[0072] This design makes the entire wafer alignment unit a highly integrated functional module with almost no wasted space. Its cross-sectional area (XY plane) depends mainly on the length of the rollers and the thickness of the support plate, while its depth (Z direction) compactly accommodates all components from drive to execution, perfectly meeting the installation requirements of the limited space under the slotted equipment.

[0073] In a preferred embodiment of this utility model, such as Figure 4 As shown, the wafer alignment component 3 also includes:

[0074] The limit plate lifting cylinder 36 is fixed on the front of the alignment component fixing plate 33 and is fixedly connected to the limit plate 32 through the limit plate connecting plate 37. It is used to drive the limit plate 32 to lift.

[0075] Preferably, the wafer alignment component further includes a right-angle fixing component 38, the two right-angle surfaces of which are fixedly connected to the bottom surface of the limit plate lifting cylinder and the front surface of the alignment component fixing plate, respectively, and the side surface of the right-angle fixing component forms a reinforcing surface integral with the right-angle surface.

[0076] like Figure 1-4As shown, a right-angle fastener secures the lifting cylinder of the limiting plate to the front of the alignment plate, enabling the limiting plate to move up and down. The side of the right-angle fastener forms a reinforcing surface integrated with the right-angle face, which improves the fixing effect.

[0077] In a preferred embodiment of this utility model, such as Figure 6 As shown, the linear pneumatic module 2 includes:

[0078] A lifting cylinder 21, with a first slider 23 fitted on the slide rod 22 of the lifting cylinder 21;

[0079] The slide 24 contains a sliding second slider 25, which is fixed to and slides synchronously with the first slider. The wafer alignment component 3 is fixed on the second slider 25.

[0080] Preferably, the middle part of the slide groove 24 is provided with a protrusion 26, and the second slider 25 is provided with a groove that matches the protrusion 26.

[0081] Specifically, in this embodiment, the first slider 23 of the lifting cylinder 21 drives the second slider 25 in the slide groove 24 to achieve the overall lifting and lowering of the wafer alignment component. The overall lifting and lowering is more stable through the cooperation of the groove in the second slider 25 and the protrusion 26 in the slide groove 24.

[0082] Preferably, the roller support plate 34 has an opening at the roller fixing end, and a bearing is installed in the opening, with the roller shaft and the bearing being fitted together.

[0083] Specifically, if sliding friction is used directly between the roller and the support plate (such as a metal-hole fit without bearings), high frictional resistance will be generated during rotation. In this embodiment, the roller and the roller support plate are connected by a bearing.

[0084] Bearings (such as ball bearings) convert sliding friction into rolling friction, reducing the coefficient of friction to 1 / 10 to 1 / 50 of that in direct contact. This significantly reduces the load on the drive motor and lowers energy consumption; the rollers rotate more smoothly, avoiding speed fluctuations caused by friction.

[0085] In a preferred embodiment of this utility model, such as Figure 5 As shown, the roller drive also includes:

[0086] The drive component protective cover 39 covers the outer side of the roller support plate 34 on which the drive motor 351 is installed, and covers the timing belt 352 and the timing pulley 353.

[0087] Specifically, in this embodiment, the timing belt and timing pulley are protected by a protective cover for the drive components, which prevents the drive roller from being interfered with by external parts when it rotates, and also prevents workers' limbs from being caught in it.

[0088] In a preferred embodiment of this utility model, such as Figure 5 As shown, the wafer alignment component also includes a structural support plate 30, which is fixedly connected to two roller support plates 34 and is located directly below the rollers 31.

[0089] Specifically, in this embodiment, the structural support plate 30 can enhance the structural strength between the roller support plates 34.

[0090] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made using the content of this specification and illustrations should be included within the protection scope of the present utility model.

Claims

1. A wafer flat-edge alignment device, characterized in that, include: A fixed backplate, on which a linear pneumatic module is fixed; A wafer alignment component is fixed on the linear pneumatic module. The wafer alignment component includes a roller and a lifting limit plate disposed on one side of the roller. The roller contacts the edge of the wafer to be aligned for flat edge alignment.

2. The wafer flat-edge alignment device according to claim 1, characterized in that, The wafer alignment device also includes: Alignment fixing plate, the back of which is fixedly connected to the linear pneumatic module; Two roller support plates are respectively fixed on both sides of the front of the alignment member fixing plate, and a roller is installed between the roller fixing ends of the two roller support plates. A roller drive component is fixed to the front side of the alignment member fixing plate and is connected to the roller drive.

3. The wafer flat edge alignment device according to claim 2, characterized in that, The roller drive component includes: A drive motor is mounted on one of the roller support plates, and the drive shaft of the drive motor extends from the roller support plate; A timing belt, which drives the timing pulley fitted on the roller shaft to the timing pulley fitted on the drive shaft.

4. The wafer flat-edge alignment apparatus according to claim 2, characterized in that, The wafer alignment device further includes: The limit plate lifting cylinder is fixed to the front of the alignment member fixing plate and is fixedly connected to the limit plate through the limit plate connecting plate, and is used to drive the limit plate to lift.

5. The wafer flat-edge alignment apparatus according to claim 1, characterized in that, The linear pneumatic module includes: A lifting cylinder, wherein a first slider is sleeved on the sliding rod of the lifting cylinder; A sliding groove is provided, in which a slidable second slider is installed. The second slider and the first slider are fixed and slide synchronously. The wafer alignment member is fixed on the second slider.

6. The wafer flat-edge alignment apparatus according to claim 5, characterized in that, The groove has a raised strip in the middle, and the second slider has a groove that matches the raised strip.

7. The wafer flat-edge alignment apparatus according to claim 2, characterized in that, The roller support plate has an opening at the fixed end of the roller, and a bearing is installed in the opening. The roller shaft is installed in conjunction with the bearing.

8. The wafer flat-edge alignment apparatus according to claim 3, characterized in that, The roller drive component also includes: A drive component protective cover is provided on the outer side of the roller support plate on which the drive motor is installed, covering the synchronous belt and the synchronous pulley.

9. The wafer flat-edge alignment apparatus according to claim 2, characterized in that, The wafer alignment component also includes a structural support plate, which is fixedly connected to the two roller support plates and located directly below the rollers.

10. The wafer flat-edge alignment apparatus according to claim 4, characterized in that, The wafer alignment component also includes a right-angle fixing component. The two right-angle surfaces of the right-angle fixing component are fixedly connected to the bottom surface of the limiting plate lifting cylinder and the front surface of the alignment component fixing plate, respectively. The side surface of the right-angle fixing component forms a reinforcing surface integral with the right-angle surface.

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