Wafer centering assembly and centering mechanism

Abstract

The utility model provides a kind of wafer centering assembly, including lifting drive mechanism, horizontal drive mechanism and centering support;Horizontal drive mechanism is fixed on lifting drive mechanism, the rear end of centering support is fixed on horizontal drive mechanism, and at least one centering pillar is equipped in the front end of centering support;Lifting drive mechanism drives horizontal drive mechanism to lift, and horizontal drive mechanism drives centering support to move horizontally and linearly.The utility model realizes the up-down height adjustment of centering support by setting lifting drive mechanism, and the front-rear linear movement of centering support is realized by setting horizontal drive mechanism to center wafer, structure and control are relatively simple, and cost is low and flexibility is high.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and in particular to a wafer alignment component and alignment mechanism. Background Technology

[0002] With the continuous advancement of semiconductor manufacturing processes, wafer sizes have gradually increased to 300mm and above, placing higher demands on every stage of the manufacturing process. Particularly in wafer handling, the edge washing step is crucial for ensuring wafer edge quality. To achieve efficient edge washing, the wafer must be precisely positioned at the center of the Chuck rotation axis to ensure uniform edge processing. Current technological trends require alignment accuracy at the ±0.1mm level, which is more challenging than ever before.

[0003] While existing motor-driven linear module mechanisms can achieve centering, their complex structure and control system not only increase equipment costs but also occupy significant installation space. This structure often involves multiple moving parts, making maintenance cumbersome and costly.

[0004] Traditional designs typically use a fixed installation height, which cannot be adjusted to meet different process requirements. This characteristic greatly limits the flexibility of the equipment and makes it unable to adapt to changing production environments or the processing needs of wafers of different sizes. Utility Model Content

[0005] Based on the above, this utility model provides a wafer alignment component and alignment mechanism, aiming to solve the technical problems of low flexibility in use, such as the inability to adjust the height of the wafer alignment mechanism in the prior art.

[0006] A wafer alignment assembly includes a lifting drive mechanism, a horizontal drive mechanism, and an alignment support.

[0007] The horizontal drive mechanism is fixed on the lifting drive mechanism, the rear end of the centering bracket is fixed on the horizontal drive mechanism, and the front end of the centering bracket is provided with at least one centering support column.

[0008] The lifting drive mechanism drives the horizontal drive mechanism to lift and lower, and the horizontal drive mechanism drives the centering bracket to move horizontally in a straight line.

[0009] Furthermore, the centering support has two branches at its front end, and each branch has a centering strut at its front end.

[0010] Furthermore, a first horizontal adjustment component is provided at the rear end of the centering bracket, which is used to adjust the centering bracket horizontally.

[0011] Furthermore, the first leveling component includes a leveling screw, and the rear end of the centering bracket is connected to the leveling drive mechanism via a connecting seat;

[0012] The centering bracket has at least four horizontal adjustment threaded holes at its rear end. The end of each horizontal adjustment screw is screwed into the corresponding horizontal adjustment threaded hole and contacts the connecting seat. The horizontal adjustment of the centering bracket is achieved by the screwing depth of each horizontal adjustment screw.

[0013] Furthermore, an angle adjustment component is provided at the rear end of the centering bracket, which is used to adjust the deflection angle of the centering bracket.

[0014] Furthermore, the angle adjustment component consists of two waist holes on the rear end of the centering bracket, and the connecting seat has a fixing threaded hole in the corresponding waist hole area. The waist holes limit the angle adjustment range of the centering bracket, and the centering bracket and the connecting seat are fixedly connected by bolts passing through the waist holes and fixing threaded holes.

[0015] Furthermore, the wafer alignment assembly also includes an adjustment base, a lifting drive mechanism is fixed on the adjustment base, and the adjustment base is provided with a second horizontal adjustment component, which is used to adjust the lifting drive mechanism horizontally.

[0016] Furthermore, the front end of the centering bracket is provided with mounting holes for mounting centering columns, and the centering columns are eccentrically positioned relative to the mounting holes of the centering columns.

[0017] Furthermore, the lifting drive mechanism adopts a linear cylinder or a linear motor;

[0018] The horizontal drive mechanism uses a linear cylinder or a linear motor.

[0019] A wafer alignment mechanism, characterized in that it comprises at least two of the aforementioned wafer alignment components.

[0020] The beneficial technical effects of this utility model are as follows: This utility model realizes the vertical height adjustment of the centering bracket by setting a lifting drive mechanism, and realizes the linear movement of the centering bracket back and forth for wafer centering by setting a horizontal drive mechanism. The structure and control are relatively simple, the cost is low and the flexibility is high. Attached Figure Description

[0021] Figure 1 This is a side view of a wafer alignment assembly according to the present invention.

[0022] Figure 2 This is a schematic diagram of the front structure of a wafer alignment component according to the present invention.

[0023] Figure 3 for Figure 1 Enlarged schematic diagram of a partial view C of the centered component in the middle wafer;

[0024] Figure 4 This is a top view of a wafer alignment assembly according to the present invention.

[0025] Figure 5 for Figure 4 Enlarged schematic diagram of a partial view B of the centered component in the middle wafer;

[0026] Figure 6 This is a three-dimensional structural diagram of a wafer alignment component according to the present invention;

[0027] Figure 7 This is a schematic diagram of the centering support structure of a wafer centering component according to the present invention;

[0028] Figure 8 This is a schematic diagram of a wafer alignment mechanism according to the present invention, which uses two alignment components to align a wafer.

[0029] in,

[0030] 1- Adjustable base;

[0031] 2- Lifting drive mechanism;

[0032] 3-Horizontal drive mechanism;

[0033] 4-Centering bracket;

[0034] 5-Center support; 51-Outer cylinder; 52-Needle part;

[0035] 6-Level adjusting screw;

[0036] 7-Connector;

[0037] 8-waist hole;

[0038] 9-Box. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0040] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0041] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0042] See Figure 1 , Figure 2 , Figure 4 and Figure 6 This utility model provides a wafer alignment assembly, including a lifting drive mechanism (2), a horizontal drive mechanism (3), and an alignment bracket (4);

[0043] The horizontal drive mechanism (3) is fixed on the lifting drive mechanism (3), the rear end of the centering bracket (4) is fixed on the horizontal drive mechanism (3), and the front end of the centering bracket (4) is provided with at least one centering support column (5).

[0044] The lifting drive mechanism (2) drives the horizontal drive mechanism (3) to lift and lower, and the horizontal drive mechanism (3) drives the centering bracket (4) to move horizontally in a straight line.

[0045] This invention achieves vertical height adjustment of the alignment bracket by setting a lifting drive mechanism, and enables linear forward and backward movement of the alignment bracket for wafer alignment by setting a horizontal drive mechanism. The height-adjustable mechanism can avoid interference between the alignment mechanism and the BOWL mechanism during the process. The structure and control are relatively simple, with low cost and high flexibility.

[0046] Furthermore, the centering support (4) has two branches at its front end, and each branch has a centering support (5) at its end.

[0047] Specifically, the centering support (4) has an axis of symmetry, and the two branches at the front end of the centering support are symmetrically arranged along the axis of symmetry of the centering support (4). The centering support column (5) at the end of the branch is symmetrically arranged along the axis of symmetry of the centering support (4).

[0048] The front end face of the centering bracket (4) is perpendicular to the axis of symmetry between the centering bracket and the centering bracket.

[0049] Specifically, the two branches of the centering bracket (4) extend in a direction perpendicular to the axis of symmetry of the centering bracket (4), and the two branches extend in opposite directions. Furthermore, a first horizontal adjustment component is provided at the rear end of the centering bracket (4), which is used to adjust the centering bracket (4) horizontally.

[0050] See Figure 3 Furthermore, the first leveling component includes a leveling screw (6), and the rear end of the centering bracket is connected to the leveling drive mechanism (3) via a connecting seat (7);

[0051] The centering bracket (4) has at least four horizontal adjustment threaded holes at its rear end. The end of each horizontal adjustment screw (6) is screwed into the corresponding horizontal adjustment threaded hole and contacts the connecting seat (7). The horizontal adjustment of the centering bracket is achieved by the screwing depth of each horizontal adjustment screw (6).

[0052] Specifically, the horizontal adjusting screw (6) is symmetrically arranged along the axis of symmetry of the centering bracket (4).

[0053] Furthermore, an angle adjustment component is provided at the rear end of the centering bracket (4), which is used to adjust the deflection angle of the centering bracket (4).

[0054] See Figure 5 Furthermore, the angle adjustment component consists of two waist holes (8) on the rear end of the centering bracket. The connecting seat (7) has a fixing threaded hole in the area corresponding to the waist hole (8). The waist hole (8) defines the angle adjustment range of the centering bracket. The centering bracket (4) and the connecting seat (7) are fixedly connected by bolts passing through the waist hole (8) and the fixing threaded hole. The fixing threaded hole can still be exposed in the opening area of ​​the corresponding waist hole (8) after a certain range of adjustment, thereby achieving fixation after fine adjustment.

[0055] Furthermore, the wafer alignment assembly also includes an adjustment base (1), a lifting drive mechanism (2) fixed on the adjustment base (1), and the adjustment base (1) is provided with a second horizontal adjustment component, which is used to adjust the lifting drive mechanism (2) horizontally.

[0056] In addition to the lifting drive mechanism and the horizontal drive mechanism, a first horizontal adjustment component, an angle adjustment component, and a second horizontal adjustment component have been added to the centering bracket, providing fine-tuning in the X, Y, and Z directions and facilitating mechanism debugging and installation.

[0057] The second level adjustment component is similar to the first level adjustment component, and it also uses screws to fine-tune the lifting drive mechanism (2).

[0058] See Figure 7 Furthermore, the front end of the centering bracket (4) is provided with a mounting hole for mounting the centering column (5), and the centering column (5) is eccentrically positioned relative to the mounting hole of the centering column (5).

[0059] Specifically, the mounting holes of the centering bracket (4) penetrate the upper and lower surfaces of the centering bracket (4).

[0060] The mounting holes of the centering support are generally perpendicular to the upper and lower surfaces of the centering support. The centering support designed in this invention includes an outer cylinder 51 with a through hole. The central axis of the hole and the central axis of the outer cylinder do not coincide, resulting in an eccentric structure. A needle 52 with its upper and lower ends protruding from the outer cylinder passes through the hole. The upper end of the needle passes through the mounting hole of the centering support (4) and is fixed by a nut. The needle and the mounting hole share a common central axis, so that the outer cylinder forms an eccentric structure relative to the mounting hole. The position of the centering support (5) in contact with the edge of the wafer can be adjusted by rotating the angle.

[0061] The addition of a first level adjustment component, an angle adjustment component, and a second level adjustment component allows for fine-tuning of the centering support. In addition, the centering pin adopts an eccentric structure to facilitate the debugging and installation of the centering components.

[0062] like Figure 6 As shown, specifically, it also includes a housing (9), the rear ends of the horizontal drive mechanism (3) and the centering bracket (4) are located inside the housing (9), and two branches on the centering bracket (4) extend out of the housing (9).

[0063] Specifically, the box (9) is a cuboid.

[0064] The housing structure protects the centering bracket (4) and the horizontal drive mechanism (3) to avoid adverse effects of the external environment on the first horizontal adjustment component and the angle adjustment component.

[0065] Furthermore, the lifting drive mechanism (2) adopts a linear cylinder or a linear motor;

[0066] The horizontal drive mechanism uses a linear cylinder or a linear motor.

[0067] See Figure 8 This utility model provides a wafer alignment mechanism, which consists of at least two wafer alignment components as described above.

[0068] When the robotic arm places the wafer, a centering mechanism is used to compensate for positional errors, ensuring that the wafer is concentric with the chuck.

[0069] When using a linear cylinder, only the cylinder is needed to drive the centering bracket and the centering support pin. The structure is relatively simple, the action efficiency is high, there is no motor drive, it is energy-saving, environmentally friendly and safe.

[0070] In one specific embodiment of the present invention, a linear motor can also be used as the driving method.

[0071] The method of using the wafer alignment component of the present invention is as follows.

[0072] Step 1: Place the wafer onto the vacuum chuck, and the chuck will hold the wafer in place.

[0073] Step 2: The lifting drive mechanism performs a lifting operation to position the centering component at the appropriate centering height.

[0074] Step 3: The horizontal drive mechanism pushes the centering bracket, which in turn drives the centering pillar to align the wafer center with the CHUCK center.

[0075] Step 4: Install and debug based on the comparison results. The installation and debugging process is as follows.

[0076] First, roughly install the centering module. The centering components on both sides of the suction cup can be roughly installed according to the design fixing hole positions.

[0077] Secondly, the position of the centering components on both sides of the suction cup is roughly adjusted, and the horizontal level of the lifting drive mechanism is roughly adjusted by adjusting the base.

[0078] Finally, the level and angle of the centering bracket are fine-tuned, and the centering pillar (5) that is eccentric to the mounting hole is fine-tuned to adjust the position of the centering pillar and the wafer contact point.

[0079] Step 5: After adjustment, use the alignment mechanism composed of alignment components to align the wafer after it is placed on the chuck.

[0080] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer alignment assembly, characterized in that, Includes a lifting drive mechanism, a horizontal drive mechanism, and a centering support; The horizontal drive mechanism is fixed on the lifting drive mechanism, the rear end of the centering bracket is fixed on the horizontal drive mechanism, and the front end of the centering bracket is provided with at least one centering support column. The lifting drive mechanism drives the horizontal drive mechanism to move up and down, and the horizontal drive mechanism drives the centering bracket to move horizontally in a straight line.

2. The wafer alignment assembly as described in claim 1, characterized in that, The centering bracket has two branches at its front end, and each branch has a centering support column at its front end.

3. A wafer alignment assembly as described in claim 1, characterized in that, The centering bracket is provided with a first horizontal adjustment component at its rear end, which is used to adjust the centering bracket horizontally.

4. A wafer alignment assembly as described in claim 3, characterized in that, The first leveling component includes a leveling screw, and the rear end of the centering bracket is connected to the leveling drive mechanism via a connecting seat; The centering bracket has at least four horizontal adjustment threaded holes at its rear end. The end of each horizontal adjustment screw is screwed into the corresponding horizontal adjustment threaded hole and contacts the connecting seat. The horizontal adjustment of the centering bracket is achieved by the screwing depth of each horizontal adjustment screw.

5. A wafer alignment assembly as described in claim 4, characterized in that, An angle adjustment component is provided at the rear end of the centering bracket, which is used to adjust the deflection angle of the centering bracket.

6. A wafer alignment assembly as described in claim 5, characterized in that, The angle adjustment component consists of two waist holes on the rear end of the centering bracket. The connecting seat has a fixing threaded hole in the area corresponding to the waist hole. The waist hole defines the angle adjustment range of the centering bracket. The centering bracket and the connecting seat are fixedly connected by bolts passing through the waist hole and the fixing threaded hole.

7. A wafer alignment assembly as described in claim 1, characterized in that, The wafer alignment assembly also includes an adjustment base, the lifting drive mechanism is fixed on the adjustment base, and the adjustment base is provided with a second horizontal adjustment component, which is used to adjust the lifting drive mechanism horizontally.

8. A wafer alignment assembly as described in claim 1, characterized in that, The centering bracket has a mounting hole at its front end for mounting the centering support column, and the centering support column is eccentrically positioned relative to the mounting hole of the centering support column.

9. A wafer alignment assembly as described in claim 1, characterized in that, The lifting drive mechanism adopts a linear cylinder or a linear motor; The horizontal drive mechanism is a linear cylinder or a linear motor.

10. A wafer alignment mechanism, characterized in that, It consists of at least two wafer alignment components as described in any one of claims 1-9.

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