Wafer carrier apparatus and semiconductor apparatus

Abstract

A wafer carrying device and a semiconductor device, the wafer carrying device comprising: a rotary transmission mechanism; a linear guide mechanism fixed on the rotary transmission mechanism and rotating under the driving of the rotary transmission mechanism; and a wafer carrying disc arranged on the linear guide mechanism and performing translational motion along a translational direction corresponding to the linear guide mechanism, the wafer carrying disc comprising a carrying surface for carrying a wafer, the carrying surface being parallel to a plane in which the translational direction lies. The rotary transmission mechanism drives the linear guide mechanism to rotate, and the wafer carrying disc can perform translational motion along the translational direction corresponding to the linear guide mechanism on the linear guide mechanism, so that the wafer carrying disc can perform rotational and translational motion, the wafer can rotate with any point on the surface as the center, the measured part of the wafer can be measured from more angles, the data comprehensiveness of the measured part of the wafer is improved, and the measurement accuracy of the measured part of the wafer is improved.

Description

Technical Field

[0001] This utility model relates to the semiconductor field, and in particular to a wafer carrier device and semiconductor equipment. Background Technology

[0002] In the semiconductor industry, wafer surface morphology inspection and pattern size inspection are crucial for product yield and process control. High-precision, comprehensive measurement of the tiny structures on the wafer (such as surface morphology measurement or optical critical dimension measurement) has become a key link in improving product yield and process control.

[0003] When it is necessary to measure the surface morphology or critical dimensions of the tiny structures on a wafer, the wafer is usually placed on the wafer carrier of the measurement device, and the tiny structures on the wafer are measured from a specific perspective.

[0004] However, the accuracy of current measuring devices in measuring the parts to be measured on wafers needs to be improved. Utility Model Content

[0005] The problem solved by this utility model embodiment is to provide a wafer carrier device and semiconductor equipment to improve the measurement accuracy of the part of the wafer to be measured.

[0006] To address the aforementioned problems, this utility model provides a wafer carrier device, comprising: a rotary transmission mechanism; a linear guide mechanism fixed on the rotary transmission mechanism and rotating under the drive of the rotary transmission mechanism; and a wafer carrier disk disposed on the linear guide mechanism and used for translating along the translation direction corresponding to the linear guide mechanism. The wafer carrier disk includes a carrier surface for carrying the wafer, and the carrier surface of the wafer carrier disk is parallel to the plane containing the translation direction.

[0007] Optionally, the linear guide mechanism includes a guide rail, which is fixed on the rotary transmission mechanism, and the extension direction of the guide rail is parallel to the translation direction corresponding to the linear guide mechanism; the wafer carrier disk is slidably disposed on the guide rail and is used to perform translational movement along the linear guide mechanism on the guide rail.

[0008] Optionally, a sliding component is fixedly provided on the bottom surface of the wafer carrier disk. The sliding component is slidably disposed on the guide rail and drives the wafer carrier disk to move in a translational direction corresponding to the linear guide mechanism on the guide rail. The bottom surface of the wafer carrier disk is disposed opposite to the bearing surface.

[0009] Optionally, the bottom surface of the wafer carrier disk is in contact with the sliding component; or, the wafer carrier device includes: a fixed base, on the bottom surface of which the sliding component is fixedly disposed; the wafer carrier disk is a rotatable carrier disk, disposed on the fixed base and located on the side of the fixed base opposite to the sliding component.

[0010] Optionally, the sliding component includes a slot-type structure, which includes a slot for adapting to the guide rail. The slot is fitted onto the guide rail so that the slot-type structure is slidably mounted on the guide rail via the slot.

[0011] Optionally, the wafer carrier further includes a transmission device located between the outer wall of the guide rail and the inner wall of the slot, the transmission device being used to drive the slot-type structure to translate on the guide rail.

[0012] Optionally, the guide rail has a hollow structure, and a groove is provided in the top surface of the guide rail. The hollow space inside the guide rail serves as a first arrangement channel, and the connected first arrangement channel and groove are used to arrange one or both of gas pipelines and power supply cables.

[0013] Optionally, the rotary transmission mechanism includes: a rotary base; one or more support columns, vertically disposed on the rotary base and fixedly connected to the rotary base; and a linear guide mechanism fixed on the support columns, such that the linear guide mechanism is fixed on the rotary transmission mechanism, and the linear guide mechanism is suspended above the rotary base.

[0014] Optionally, the rotary transmission mechanism further includes: a first rotary drive mechanism, the output end of which is connected to the bottom of the rotary base, and the first rotary drive mechanism is used to drive the rotary base to rotate.

[0015] Optionally, the support column includes a central support column, the projection of which on the rotating base is located at the rotation center of the rotating base.

[0016] Optionally, the guide rail has a hollow structure, and a groove is provided on the top surface of the guide rail. The hollow space inside the guide rail serves as a first arrangement channel, and the first arrangement channel is connected to the groove. The central support column has a hollow structure, and the hollow space inside the central support column serves as a second arrangement channel, and the second arrangement channel is connected to the first arrangement channel. The groove, the first arrangement channel, and the second arrangement channel are used to arrange one or both of gas pipelines and power supply cables.

[0017] Optionally, the bottom surface of the linear guide mechanism is fixed to the top of the support column away from the rotating base, and the diameter of the support column is smaller than the width of the guide rail.

[0018] Optionally, the number of the support columns ranges from one to three.

[0019] Optionally, the rotating base is circular in shape; when there are multiple support columns, the multiple support columns are equidistantly distributed on the same diameter of the rotating base.

[0020] Optionally, the rotary transmission mechanism has a rotation center, the guide rail has a central axis extending along the translation direction, and the projection position of the rotation center of the rotary transmission mechanism on the guide rail is located on the central axis of the guide rail.

[0021] Optionally, the wafer carrier device further includes: a second rotation drive mechanism, the output end of which is connected to the bottom surface of the wafer carrier disk, and the end of which is not connected to the wafer carrier disk is fixedly connected to the fixed base. The second rotation drive mechanism is used to drive the wafer carrier disk to rotate, and the bottom surface of the wafer carrier disk is disposed opposite to the carrier surface.

[0022] Optionally, the wafer carrier disk includes an electrostatic chuck or a vacuum chuck.

[0023] Accordingly, this utility model embodiment also provides a semiconductor device, including the wafer carrier device described in any embodiment of this utility model.

[0024] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:

[0025] The wafer carrier device provided in this embodiment includes: a rotary transmission mechanism; a linear guide mechanism fixed on the rotary transmission mechanism and rotating under the drive of the rotary transmission mechanism; and a wafer carrier disk disposed on the linear guide mechanism and used for translating along the translation direction corresponding to the linear guide mechanism. The wafer carrier disk includes a carrier surface for carrying the wafer, and the carrier surface of the wafer carrier disk is parallel to the plane containing the translation direction. In this embodiment, the rotary transmission mechanism can drive the linear guide mechanism to rotate, and the wafer carrier disk can translate along the translation direction corresponding to the linear guide mechanism. Therefore, the wafer carrier disk can not only rotate but also translate. Through these two movement modes, when the wafer is carried by the wafer carrier disk, the wafer can rotate around any point on the wafer surface as the center. This facilitates the measurement of the part of the wafer to be measured from more angles, thereby improving the comprehensiveness of the data for the part of the wafer to be measured and thus improving the measurement accuracy of the part of the wafer to be measured.

[0026] Accordingly, this utility model embodiment provides a semiconductor device, which includes the wafer carrier device described in this utility model embodiment. Since the wafer carrier device integrates a rotary transmission mechanism, a linear guide mechanism, and a wafer carrier disk, it can realize the rotation of the wafer with any point on the wafer surface as the center. This is beneficial for measuring the part of the wafer to be measured from more angles, thereby improving the comprehensiveness of the data for measuring the part of the wafer to be measured, and further improving the measurement accuracy of the part of the wafer to be measured. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of the wafer carrier device according to the first embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of the wafer carrier disk and the linear guide mechanism in the wafer carrier device of the first embodiment of this utility model;

[0029] Figure 3 This is a schematic diagram of the structure of the wafer carrier disk and sliding component in the wafer carrier device according to the first embodiment of this utility model;

[0030] Figure 4 This is a top view of the wafer carrier disk in the wafer carrier device according to the first embodiment of this utility model;

[0031] Figure 5 This is a schematic diagram of the structure of the wafer carrier device according to the second embodiment of the present invention. Detailed Implementation

[0032] As can be seen from the background technology, the measurement accuracy of current measuring devices for the parts to be measured on wafers needs to be improved.

[0033] Specifically, when measuring the surface morphology or critical dimensions of the part to be measured on a wafer, the wafer is placed on the wafer carrier disk of the measuring device and the part to be measured on the wafer is measured from a specific viewpoint. Therefore, only measurement information from a single viewpoint can be obtained, and more information cannot be collected, resulting in low measurement accuracy of the part to be measured on the wafer.

[0034] Research has shown that multi-angle measurements of the part to be measured are beneficial for obtaining more information, thereby improving measurement accuracy. However, during the measurement process, the wafer's position on the wafer carrier disk does not change. Therefore, it is impossible to move the part to be measured, which is not currently at the rotation center of the wafer carrier disk, to that position. Consequently, rotation around the part to be measured cannot be performed, making multi-angle measurements of the part impossible.

[0035] To address the aforementioned problems, this utility model provides a wafer carrier device, comprising: a rotary transmission mechanism; a linear guide mechanism fixed on the rotary transmission mechanism and rotating under the drive of the rotary transmission mechanism; and a wafer carrier disk disposed on the linear guide mechanism and used for translating along the translation direction corresponding to the linear guide mechanism. The wafer carrier disk includes a carrier surface for carrying the wafer, and the carrier surface of the wafer carrier disk is parallel to the plane containing the translation direction.

[0036] In the wafer carrier device provided in this embodiment of the utility model, the rotary transmission mechanism can drive the linear guide mechanism to rotate, and the wafer carrier disk can translate along the translation direction corresponding to the linear guide mechanism. Therefore, the wafer carrier disk can not only rotate but also translate. Through these two movement modes, when the wafer is carried by the wafer carrier disk, the wafer can rotate around any point on the wafer surface as the center. This is beneficial for measuring the part of the wafer to be measured from more angles, thereby improving the comprehensiveness of the data for measuring the part of the wafer to be measured, and further improving the measurement accuracy of the part of the wafer to be measured.

[0037] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0038] Figure 1 This is a schematic diagram of the structure of the wafer carrier device according to the first embodiment of the present invention; Figure 2This is a schematic diagram of the structure of the wafer carrier disk and the linear guide mechanism in the wafer carrier device of the first embodiment of this utility model; Figure 3 This is a schematic diagram of the structure of the wafer carrier disk and sliding component in the wafer carrier device according to the first embodiment of this utility model; Figure 4 This is a top view of the wafer carrier disk in the wafer carrier device of the first embodiment of this utility model.

[0039] Reference Figures 1 to 4 A wafer carrier device includes: a rotary transmission mechanism 10; a linear guide mechanism 20, fixed on the rotary transmission mechanism 10 and rotating under the drive of the rotary transmission mechanism 10; and a wafer carrier disk 30, disposed on the linear guide mechanism 20 and used to perform translational movement along the translational direction corresponding to the linear guide mechanism 20. The wafer carrier disk 30 includes a carrier surface 31 for carrying the wafer, and the carrier surface 31 of the wafer carrier disk 30 is parallel to the plane where the translational direction is located.

[0040] In this embodiment, the rotary transmission mechanism 10 can drive the linear guide mechanism 20 to rotate, and the wafer carrier disk 30 is disposed on the linear guide mechanism 20 and can translate along the translation direction corresponding to the linear guide mechanism 20. Therefore, the wafer carrier disk 30 can not only rotate but also translate. Through these two movement modes, when the wafer is carried by the wafer carrier disk 30, the wafer can rotate around any point on the wafer surface as the center. This is beneficial for measuring the part of the wafer to be measured from more angles, thereby improving the comprehensiveness of the data of the part of the wafer to be measured, and further improving the measurement accuracy of the part of the wafer to be measured.

[0041] The wafer carrier disk 30 is used to support and fix the wafer, effectively suppressing accidental displacement of the wafer on the wafer carrier disk 30, thereby effectively suppressing the positional shift of the wafer to be tested, which in turn helps to improve the measurement accuracy of the wafer to be tested.

[0042] In this embodiment, the wafer carrier disk 30 includes a carrier surface 31 for carrying wafers.

[0043] In this embodiment, the wafer carrier 30 fixes the wafer by adsorption. Therefore, the wafer carrier 30 supports and fixes the wafer through the bearing surface 31. Specifically, the wafer carrier 30 includes an electrostatic chuck or a vacuum chuck. The electrostatic chuck fixes the wafer by electrostatic adsorption, while the vacuum chuck fixes the wafer by vacuum adsorption.

[0044] As an example, the wafer carrier disk 30 is a vacuum chuck that provides vacuum suction force to the back side of the wafer.

[0045] Therefore, in this embodiment, the bearing surface 31 of the vacuum chuck has multiple vacuum suction ports 311 (e.g., ... Figure 4 As shown, the vacuum chuck provides vacuum adsorption force to the wafer through the vacuum adsorption port 311, and the multiple vacuum adsorption ports 311 are evenly distributed circumferentially around the center of the vacuum chuck. This helps to improve the uniformity of the vacuum adsorption force provided by the vacuum chuck to the wafer, effectively suppressing the problem of wafer deformation and warping caused by uneven force, thereby improving the reliability of the wafer carrying device.

[0046] refer to Figure 4 As an example, the vacuum chuck has three vacuum suction ports 311 on its bearing surface 31. This reduces the cost and structural complexity of the wafer carrier device. Furthermore, the three vacuum suction ports 311 are evenly distributed circumferentially around the center of the vacuum chuck, improving the uniformity of the vacuum suction force provided by the chuck to the wafer and effectively suppressing wafer deformation and warping caused by uneven force, thereby enhancing the reliability of the wafer carrier device. In other embodiments, the number of vacuum suction ports on the bearing surface of the vacuum chuck can be any number greater than three.

[0047] In other embodiments, the wafer carrier disk can also use other methods to fix the wafer, for example, the sidewalls of the wafer can be fixed by clamping elements on the wafer carrier disk.

[0048] The linear guide mechanism 20 is used to define the linear movement path of the wafer carrier disk 30, so that the wafer carrier disk 30 moves along the translation direction corresponding to the linear guide mechanism 20 on the linear guide mechanism 20.

[0049] In this embodiment, the bearing surface 31 of the wafer carrier disk 30 is parallel to the plane where the translation direction is located, so that the wafer placed on the wafer carrier disk 30 can smoothly translate along the translation direction corresponding to the linear guide mechanism 20.

[0050] In this embodiment, the linear guide mechanism 20 is fixed on the rotary transmission mechanism 10, so that it can rotate under the drive of the rotary transmission mechanism 10.

[0051] like Figure 1 and Figure 2As shown, in this embodiment, the linear guide mechanism 20 includes a guide rail 21, which is fixed on the rotary transmission mechanism 10. The extension direction of the guide rail 21 is parallel to the translation direction corresponding to the linear guide mechanism 20. The wafer carrier disk 30 is slidably disposed on the guide rail 21 and is used to perform translational movement along the linear guide mechanism 20 on the guide rail 21.

[0052] The guide rail 21 is used to support the wafer carrier disk 30 and to allow the wafer carrier disk 30 to translate along the linear guide mechanism 20.

[0053] As an example, the guide rail 21 and the rotating base 11 of the rotary transmission mechanism 10 can be an integrated structure, which facilitates the rotary transmission mechanism 10 to drive the guide rail 21 to rotate and improves the structural stability of the wafer carrier device. In other embodiments, the guide rail can also be fixedly connected to the rotary transmission mechanism in other ways, such as threaded connection, riveting, or welding.

[0054] In this embodiment, the wafer carrier 30 is slidably disposed on the guide rail 21. Through sliding motion, the guide rail 21 provides high-precision linear motion guidance for the wafer carrier 30, effectively suppressing yaw and translation errors during movement, thereby improving the reliability of the wafer carrier device. Furthermore, the guide rail 21 ensures that the wafer carrier 30 maintains a high degree of flatness during movement. In summary, the slidable placement of the wafer carrier 30 on the guide rail 21 improves the stability of its movement and effectively suppresses the problem of positional shift of the wafer under test caused by unexpected displacement introduced by movement.

[0055] In other embodiments, the wafer carrier disk may also be disposed on the guide rail in other ways and move in a translational direction corresponding to the linear guide mechanism. For example, a conveyor belt may be provided on the guide rail, and the wafer carrier disk may be fixed on the conveyor belt, thereby driving the wafer carrier disk to move in a translational manner via the conveyor belt.

[0056] refer to Figure 2 In this embodiment, the guide rail 21 is a hollow structure, and the top surface of the guide rail 21 has a groove 211. The hollow space inside the guide rail 21 serves as a first arrangement channel (not shown). The first arrangement channel is connected to the groove 211. The connected first arrangement channel and the groove 211 are used to arrange one or both of gas pipelines and power supply cables.

[0057] The first arrangement channel and trench 211 provide space for connecting the required gas pipes and / or power cables to the wafer carrier 30 (for example, the gas pipes and / or power cables in the first arrangement channel are connected to the wafer carrier 30 through the trench 211), which helps to improve the space utilization of the wafer carrier device, thereby improving the structural rationality and structural integration of the wafer carrier device. Moreover, this also facilitates the movement of the wafer carrier 30 while reducing the difficulty of arranging gas pipes and / or power cables.

[0058] In some embodiments, the groove 211 is located in the guide rail 21 of a certain thickness, which helps to improve the overall stability of the guide rail.

[0059] In this embodiment, a sliding component 32 is fixedly provided on the bottom surface of the wafer carrier disk 30. The sliding component 32 is slidably disposed on the guide rail 21 and drives the wafer carrier disk 30 to move in a translational motion along the translational direction corresponding to the linear guide mechanism 20 on the guide rail 21. The bottom surface of the wafer carrier disk 30 is disposed opposite to the carrier surface 31.

[0060] The sliding component 32 moves on the guide rail 21, which provides good guidance for the sliding component 32, facilitating the translational movement of the wafer carrier 30 along the translational direction corresponding to the linear guide mechanism 20 on the guide rail 21. The sliding component 32 can effectively suppress instability such as skewing and shaking of the wafer carrier 30 during translation, thereby improving the stability of the wafer carrier 30's movement on the guide rail 21. Furthermore, the sliding component 32 is fixedly disposed on the bottom surface of the wafer carrier 30, which is opposite to the bearing surface 31, thus avoiding interference with other functional components in the wafer carrier 30.

[0061] It should be noted that, depending on performance requirements, the wafer carrier 30 can be a rotatable carrier with rotation function or a non-rotating carrier without rotation function. For example, if the wafer has been pre-aligned and positioned in advance before being placed on the wafer carrier 30, the wafer carrier may not have a rotation function.

[0062] like Figure 3 As shown, in this embodiment, taking the wafer carrier disk 30 as an example where it does not have a rotation function, the bottom surface of the wafer carrier disk 30 is in contact with the sliding component 32, that is, the bottom surface of the wafer carrier disk 30 is directly connected to the sliding component 32.

[0063] refer to Figure 3 In this embodiment, the sliding component 32 includes a slot-type structure 33, which includes a slot 34 for adapting to the guide rail 21. The slot 34 is sleeved on the guide rail 21 so that the slot-type structure 33 is slidably disposed on the guide rail 21 through the slot 34.

[0064] In this embodiment, the slot 34 is sleeved on the guide rail 21, which helps to limit the sliding component 32 in the vertical and horizontal directions, effectively suppressing the sliding component 32 from accidentally jumping off or detaching from the guide rail 21, thus improving the safety of the wafer carrier device. Furthermore, the slot 34 of the slot structure 33 is sized to match the guide rail 21, effectively suppressing the wafer carrier disk 30 from tilting or swaying during movement, thereby further improving the stability of the wafer carrier device.

[0065] refer to Figure 2 In this embodiment, the wafer carrier device further includes: a transmission device 23, located between the outer sidewall 22 of the guide rail 21 and the inner sidewall 331 of the slot 34 (e.g., Figure 3 As shown, the transmission device 23 is used to drive the slotted structure 33 to translate on the guide rail 21.

[0066] The transmission device 23 is disposed between the outer side wall 22 of the guide rail 21 and the inner side wall 331 of the slot 34, which helps to free up space on the top and bottom surfaces of the guide rail 21. This facilitates operations such as wiring using the top surface or fixing using the bottom surface of the guide rail 21, and improves the structural rationality of the wafer carrier device. In other embodiments, the transmission device may also be disposed at other positions on the guide rail.

[0067] As an example, the transmission device 23 may include a chain, a rack and pinion transmission structure, or a lead screw transmission structure, etc.

[0068] For example, a chain is provided on the outer wall 22 of the guide rail 21, and the inner wall of the slot 34 is fixed to the chain, so that the slot 34 can be moved by the chain.

[0069] For example, taking the transmission device 23 as a gear and rack transmission structure, a rack is provided on the outer side wall 22 of the guide rail 21, and a gear is provided on the inner side wall 331 of the slot 34, so that the slot 34 can be moved by driving the gear to roll along the rack.

[0070] It should be noted that in some other embodiments, the guide rail may also be a solid structure, or the guide rail may not have the groove provided, and the wafer carrier disk may be connected to the required gas pipeline and power supply cable through external connection or other means.

[0071] It should also be noted that in other embodiments, the sliding component may adopt other types of structures. For example, the sliding component may be a slider, which is slidably disposed in the groove of the guide rail. The slider moves along the groove of the guide rail, thereby driving the wafer carrier disk to move.

[0072] In this embodiment, the rotary transmission mechanism 10 has a rotation center, and the rotary transmission mechanism 10 rotates around the rotation center, thereby driving the linear guide mechanism 20 to rotate.

[0073] In this embodiment, the rotary transmission mechanism 10 includes: a rotary base 11; and one or more support columns 12, which are disposed on the rotary base 11 and fixedly connected to the rotary base 11. Correspondingly, the linear guide mechanism 20 is fixed on the support column 12, so that the linear guide mechanism 20 is fixed on the rotary transmission mechanism 10, and the linear guide mechanism 20 is suspended above the rotary base 11.

[0074] Specifically, the linear guide mechanism 20 includes a guide rail 21, which is fixed on the support column 12 and suspended above the rotating base 11.

[0075] The rotating base 11 is used to support the linear guide mechanism 20 and the wafer carrier disk 30.

[0076] As an example, the rotating base 11 is circular in shape, which helps save space during rotation, thereby improving the space utilization of the wafer carrier. In other embodiments, the rotating base can also adopt other shapes, as long as it can rotate. For example, the rotating base can also be triangular, square, pentagonal, hexagonal, octagonal, etc. Preferably, the rotating base can be a centrally symmetrical structure.

[0077] The support column 12 is used to support the linear guide mechanism 20, thereby suspending the linear guide mechanism 20 above the rotating base 11.

[0078] In this embodiment, the support column 12 is vertically disposed on the rotating base 11, which avoids the support column 12 bearing lateral force, reduces the stress concentration point of the support column 12, and effectively suppresses the problem of structural deformation, thereby improving the reliability of the wafer carrier device. In other embodiments, the support column can also be disposed on the rotating base at other angles, for example, the angle between the extension direction of the support column and the top surface of the rotating base can be 75 degrees, 60 degrees, or 45 degrees, etc.

[0079] In this embodiment, the support column 12 is fixedly connected to the rotating base 11, which is beneficial for the rotating base 11 to drive the support column 12 to rotate, and also helps to improve the stability of the structural connection between the support column 12 and the rotating base 11.

[0080] As an example, the support column 12 and the rotating base 11 are an integrated structure, which helps to further improve the stability of the structural connection between the support column 12 and the rotating base 11, thereby improving the structural rigidity and stability of the wafer carrier device. In other embodiments, the support column can also be connected to the rotating base in other ways, such as wedge connection, threaded connection, or welding.

[0081] In this embodiment, the guide rail 21 is fixedly connected to the support column 12, which is beneficial to enable the support column 12 to drive the guide rail 21 to rotate simultaneously under the drive of the rotating base 11, and also helps to improve the stability of the structural connection between the support column 12 and the guide rail 21.

[0082] As an example, the guide rail 21 and the support column 12 are an integrated structure, which effectively suppresses minor slippage between the support column 12 and the guide rail 21. This helps to further improve the stability of the structural connection between the support column 12 and the guide rail 21, thereby improving the structural rigidity and stability of the wafer carrier device. In other embodiments, the guide rail can also be connected to the rotating base in other ways, such as threaded connection, hinge connection, or welding.

[0083] In this embodiment, the bottom surface of the guide rail 21 is fixed to the top of the support column 12 away from the rotating base 11, and the diameter of the support column 12 is smaller than the width of the guide rail 21.

[0084] The wafer carrier disk 30 is connected to the guide rail 21 via the slot-type structure 33. The diameter of the support column 12 is smaller than the width of the guide rail 21, which helps to free up the edge portion of the bottom surface of the guide rail 21, providing space for the slot 34 to be fitted onto the guide rail 21, thereby improving the structural rationality of the wafer carrier device. In other embodiments, when the wafer carrier disk and the guide rail are connected by other structures, the diameter of the support column can be equal to or greater than the width of the guide rail.

[0085] In this embodiment, the number of support columns 12 ranges from 1 to 3.

[0086] The number of support pillars 12 is controlled between one and three, so that there are a corresponding number of fixed support points between the guide rail 21 and the rotating base 11, which helps to improve the structural stability of the wafer carrier device. Furthermore, the fact that the number of support pillars 12 does not exceed three helps to reduce the structural complexity and manufacturing cost of the wafer carrier device. Moreover, the range of one to three support pillars 12 also facilitates the sliding of the wafer carrier disk 30 onto the guide rail 21 via the slot-type structure 33.

[0087] refer to Figure 1 As an example, the number of support pillars 12 is three. This reduces the structural complexity and manufacturing cost of the wafer carrier while maximizing the number of fixed support points between the guide rail 21 and the rotating base 11, thus further improving the structural stability of the wafer carrier. In other embodiments, the number of support pillars can be one or two. In other embodiments, the number of support pillars can be even greater.

[0088] In this embodiment, when there are multiple support columns 12, the multiple support columns 12 are equidistantly distributed on the same diameter of the rotating base 11.

[0089] The support column 12 is fixedly connected to the guide rail 21. The equidistant distribution of multiple support columns 12 helps to improve the uniformity of the force on the guide rail 21 and effectively suppresses the problem of deformation or damage to the guide rail 21 due to uneven stress, thereby improving the structural stability and reliability of the wafer carrier device.

[0090] refer to Figure 1In this embodiment, the support column 12 includes a central support column 121, the projection of which is located at the rotation center of the rotating base 11. The central support column 121 provides support to the guide rail 21 and is fixedly connected to it, which improves the stability of the guide rail 21, thereby enhancing the structural stability and reliability of the wafer carrier device. In other embodiments, for example, if there are two support columns, the central support column may be omitted, and the support columns may be provided only at the two edges on the same diameter of the rotating base.

[0091] In some embodiments, the central support column 121 is a hollow structure, and the hollow space inside the central support column 121 serves as a second arrangement channel (not shown in the figure). The second arrangement channel is connected to the first arrangement channel. The trench 211, the first arrangement channel, and the second arrangement channel are used to arrange one or both of gas pipelines and power supply cables.

[0092] In other embodiments, the central support column may also be a solid structure.

[0093] refer to Figure 1 As an example, the three support columns 12 are equidistantly distributed on the same diameter of the rotating base 11, with the middle support column 12 being the central support column 121.

[0094] The central support column 12 provides support to the central portion of the guide rail 21, while the support columns 12 on both sides provide support to the edge portions of the guide rail 21. This helps to further improve the uniformity of stress on the guide rail 21 and effectively suppresses deformation or damage to the guide rail 21 caused by uneven stress, thereby improving the structural stability and reliability of the wafer carrier device. In other embodiments, the multiple support columns can also be arranged in other ways on the rotating base.

[0095] In this embodiment, the rotary transmission mechanism 10 has a rotation center, the guide rail 21 has a central axis extending along the translation direction, and the projection position of the rotation center of the rotary transmission mechanism 10 on the guide rail 21 is located on the central axis of the guide rail 21.

[0096] Under the action of the rotary transmission mechanism 10 and the linear guide mechanism 20, the wafer carrier disk 30 can not only rotate but also translate. Through these two movement modes, when measuring the part of the wafer to be measured, the center of the outer circle of the part to be measured can be set on the central axis of the guide rail 21. The guide rail 21 drives the wafer carrier disk 30 to translate along the translation direction corresponding to the linear guide mechanism 20, so that the projection position of the center of the outer circle of the part to be measured on the guide rail 21 coincides with the projection position of the rotation center of the rotary transmission mechanism 10 on the guide rail 21. Under the drive of the rotary transmission mechanism 10, the wafer can rotate around the part to be measured as the center, which is beneficial to measuring the part of the wafer to be measured from more angles, thereby improving the comprehensiveness of the data of the part to be measured and thus improving the measurement accuracy of the part to be measured.

[0097] As an example, before placing the wafer on the wafer carrier 30, the wafer can be pre-aligned and rotated to position it so that the center of the circumscribed circle of the portion of the wafer to be measured is aligned with the central axis of the guide rail 21. Correspondingly, after placing the wafer on the wafer carrier 30, the center of the circumscribed circle of the portion of the wafer to be measured is positioned on the central axis of the guide rail 21.

[0098] In this embodiment, the rotary transmission mechanism 10 further includes a rotary drive mechanism (not shown), the output end of which is connected to the bottom of the rotary base 11, and the rotary drive mechanism is used to drive the rotary base 11 to rotate.

[0099] The rotary drive mechanism drives the rotary base 11 to rotate, the rotary base 11 drives the support column 12 to rotate, the rotation of the support column 12 drives the guide rail 21 to rotate, thereby driving the wafer carrier disk 30 to rotate through the rotation of the linear guide mechanism 20, and thus driving the wafer to rotate.

[0100] As an example, the connection point between the output end of the rotary drive mechanism and the rotary base 11 is located at the rotation center of the rotary base 11. In other embodiments, depending on the number or shape of the output ends of the rotary drive mechanism, or depending on the specific type of the rotary drive mechanism, the output ends of the rotary drive mechanism may also be connected to other locations on the rotary base.

[0101] As an example, the rotary drive mechanism is a rotary motor (not shown in the figure). The rotary motor operates at a stable speed during rotation, which improves the stability of the wafer carrier's rotation, thereby enhancing the measurement accuracy of the wafer under test. Furthermore, the rotary motor can control the rotation speed in real time, allowing it to adjust the rotation speed of the wafer carrier according to measurement requirements during the measurement process, further improving the measurement effect and accuracy of the wafer under test. In other embodiments, the rotary drive mechanism may also employ other devices such as a pneumatic turbine or a hydraulic gear system.

[0102] Figure 5 This is a schematic diagram of the structure of the wafer carrier device according to the second embodiment of the present invention.

[0103] The similarities between this embodiment and the previous embodiments will not be repeated here. The difference between this embodiment and the previous embodiments is that the wafer carrier device includes: a fixed base 402, on the bottom surface of which the sliding member 511 is fixedly disposed; the wafer carrier disk 401 is a rotatable carrier disk, which is disposed on the fixed base 402 and located on the side of the fixed base 402 opposite to the sliding member 511.

[0104] By employing a rotatable wafer carrier 401, it is convenient to place the wafer on the wafer carrier 401 and then rotate and position the wafer so that the projection position of the outer circle center of the part of the wafer to be measured on the guide rail 51 is set on the central axis of the guide rail 51.

[0105] In this embodiment, the wafer carrier device may further include: a second rotation drive mechanism 41, the output end of the second rotation drive mechanism 41 being connected to the bottom surface of the wafer carrier disk 401, and the end of the second rotation drive mechanism 41 not connected to the wafer carrier disk 401 being fixedly connected to the fixed base 402. The second rotation drive mechanism 41 is used to drive the wafer carrier disk 401 to rotate, and the bottom surface of the wafer carrier disk 401 is disposed opposite to the carrier surface 42.

[0106] It should be noted that the wafer carrier disk 401 can rotate under the driving action of the second rotation driving mechanism 41. Therefore, after the wafer is placed on the carrier surface 42, the wafer carrier disk 401 can be driven to rotate by the second rotation driving mechanism 41, so that the projection position of the outer circle center of the part of the wafer to be measured on the guide rail 51 is set on the central axis of the guide rail 51.

[0107] The wafer carrier 401 can rotate under the driving action of the second rotation drive mechanism 41, thereby eliminating the need for pre-alignment to rotate and position the wafer, and is beneficial to meeting the needs of adjusting the angle and rotating the wafer around a specific position.

[0108] As an example, the connection point between the output end of the second rotary drive mechanism 41 and the wafer carrier disk 401 is located at the rotation center of the wafer carrier disk 40. In other embodiments, depending on the number or shape of the output ends of the second rotary drive mechanism, or depending on the specific type of the first rotary drive mechanism, the output ends of the second rotary drive mechanism may also be connected to other locations on the wafer carrier disk.

[0109] As an example, the second rotary drive mechanism 41 is a brushless DC motor (not shown). This brushless DC motor has high rotational angle accuracy. After determining the projection position of the circumscribed circle of the wafer's measurement portion onto the guide rail 51 and rotating it to the required angle on the central axis of the guide rail 51, the brushless DC motor performs high-precision angle rotation, correspondingly adjusting the wafer's angle with high precision. Furthermore, the brushless DC motor has a stable rotational speed, thus avoiding unexpected wafer offset or over-rotation due to large fluctuations in rotational speed during rotation. In summary, the brushless DC motor effectively suppresses angular errors between the projection position of the circumscribed circle of the wafer's measurement portion onto the guide rail 51 and the central axis of the guide rail 51 during rotation, which helps improve the accuracy of the wafer's rotation angle on the wafer carrier disk 40.

[0110] In other embodiments, the second rotary drive mechanism may also employ other rotary drive mechanisms such as a reluctance motor.

[0111] Accordingly, this utility model embodiment also provides a semiconductor device, which includes the wafer carrier device described in any of the foregoing embodiments.

[0112] Because this wafer carrier device integrates a rotary transmission mechanism, a linear guide mechanism, and a wafer carrier disk, it can enable the wafer to rotate with any point on the wafer surface as the center. This allows for measurement of the part of the wafer to be measured from more angles, thereby improving the comprehensiveness of the data for measuring the part of the wafer to be measured, and further improving the measurement accuracy of the part of the wafer to be measured.

[0113] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wafer carrier device, characterized in that, include: Rotary transmission mechanism; A linear guide mechanism is fixed to the rotary transmission mechanism and rotates under the drive of the rotary transmission mechanism; A wafer carrier disk is disposed on the linear guide mechanism and is used to perform translational movement on the linear guide mechanism along the translational direction corresponding to the linear guide mechanism. The wafer carrier disk includes a carrier surface for carrying the wafer, and the carrier surface of the wafer carrier disk is parallel to the plane containing the translational direction.

2. The wafer carrier device as described in claim 1, characterized in that, The linear guide mechanism includes a guide rail, which is fixed on the rotary transmission mechanism, and the extension direction of the guide rail is parallel to the translation direction corresponding to the linear guide mechanism. The wafer carrier disk is slidably disposed on the guide rail and is used to perform translational movement along the linear guide mechanism on the guide rail.

3. The wafer carrier device as described in claim 2, characterized in that, A sliding component is fixedly provided on the bottom surface of the wafer carrier disk. The sliding component is slidably disposed on the guide rail and drives the wafer carrier disk to move in a translational direction corresponding to the linear guide mechanism on the guide rail. The bottom surface of the wafer carrier disk is disposed opposite to the bearing surface.

4. The wafer carrier device as described in claim 3, characterized in that, The bottom surface of the wafer carrier disk is in contact with the sliding component; or, The wafer carrier includes: a fixed base, on the bottom surface of which the sliding component is fixedly disposed; The wafer carrier is a rotatable carrier, which is mounted on the fixed base and located on the side of the fixed base opposite to the sliding component.

5. The wafer carrier device as described in claim 3, characterized in that, The sliding component includes a slot-type structure, which includes a slot for fitting with the guide rail. The slot is fitted onto the guide rail so that the slot-type structure is slidably mounted on the guide rail via the slot.

6. The wafer carrier device as described in claim 5, characterized in that, The wafer carrier further includes a transmission device located between the outer wall of the guide rail and the inner wall of the slot, the transmission device being used to drive the slot-type structure to translate on the guide rail.

7. The wafer carrier device as described in claim 2, characterized in that, The guide rail has a hollow structure and a groove is provided on the top surface of the guide rail. The hollow space inside the guide rail serves as a first arrangement channel. The connected first arrangement channel and the groove are used to arrange one or both of gas pipelines and power supply cables.

8. The wafer carrier device according to any one of claims 2 to 7, characterized in that, The rotary transmission mechanism includes: a rotary base; and one or more support columns, which are disposed on the rotary base and fixedly connected to the rotary base. The linear guide mechanism is fixed to the support column so that it is fixed to the rotary transmission mechanism, and the linear guide mechanism is suspended above the rotary base.

9. The wafer carrier device as described in claim 8, characterized in that, The rotary transmission mechanism further includes a first rotary drive mechanism, the output end of which is connected to the bottom of the rotary base, and the first rotary drive mechanism is used to drive the rotary base to rotate.

10. The wafer carrier device as claimed in claim 8, characterized in that, The support column includes a central support column, the projection of which on the rotating base is located at the rotation center of the rotating base.

11. The wafer carrier device as claimed in claim 10, characterized in that, The guide rail has a hollow structure, and a groove is provided on the top surface of the guide rail. The hollow space inside the guide rail serves as a first arrangement channel, and the first arrangement channel is connected to the groove. The central support column is a hollow structure, and the hollow space inside the central support column serves as a second arrangement channel, which is connected to the first arrangement channel. The trench, the first arrangement channel, and the second arrangement channel are used to arrange one or both of the gas pipeline and the power supply cable.

12. The wafer carrier device as claimed in claim 8, characterized in that, The bottom surface of the linear guide mechanism is fixed to the top of the support column away from the rotating base, and the diameter of the support column is smaller than the width of the guide rail.

13. The wafer carrier device as described in claim 8, characterized in that, The number of support columns ranges from 1 to 3.

14. The wafer carrier device as claimed in claim 8, characterized in that, The rotating base is circular in shape; when there are multiple support columns, the multiple support columns are equidistantly distributed on the same diameter of the rotating base.

15. The wafer carrier device as claimed in claim 2, characterized in that, The rotary transmission mechanism has a rotation center, the guide rail has a central axis extending along the translation direction, and the projection position of the rotation center of the rotary transmission mechanism on the guide rail is located on the central axis of the guide rail.

16. The wafer carrier device as claimed in claim 4, characterized in that, The wafer carrier device further includes: a second rotation drive mechanism, the output end of which is connected to the bottom surface of the wafer carrier disk, and the end of the second rotation drive mechanism not connected to the wafer carrier disk is fixedly connected to the fixed base. The second rotation drive mechanism is used to drive the wafer carrier disk to rotate, and the bottom surface of the wafer carrier disk is disposed opposite to the carrier surface.

17. The wafer carrier device as claimed in claim 1, characterized in that, The wafer carrier disk includes an electrostatic chuck or a vacuum chuck.

18. A semiconductor device, characterized in that, Includes the wafer carrier device as described in any one of claims 1 to 17.

Images