A device capable of fast access to wafers

CN224670269UActive Publication Date: 2026-08-21SUZHOU SITANDE PRECISION IND CO LTD
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Patent Information

Application Number
CN202520771002.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-23
Publication Date
2026-08-21
Estimated Expiration
2035-04-23

AI Technical Summary

Technical Problem

上述圆片承托组件采用边缘式承托方式,无法对晶圆的中心位置进行承托,这种承托方式会造成晶圆的变形,造成晶圆无法使用,针对上述问题因此需要一种能快速存取晶圆的装置

Benefits of technology

[0015]Compared with the prior art, the beneficial effects of this utility model are: 1. The layer plate installed on the inner side of the side plate can support the edge and center of the wafer. When the wafer is placed on the layer plate, the edge support and center support set on the layer plate support the wafer, which can prevent the wafer from deforming.

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Abstract

The utility model discloses a belong to wafer preparation technical field, concretely for a device that can quick access wafer, including support assembly, the support assembly includes and uploads the board and downloads the board, is installed with support assembly between the board and downloads the board, the support assembly includes the side plate, the side plate inboard is installed with the layer board, is installed with the isolating sleeve between the layer board, is installed with the anti -collision layer on the isolating sleeve outer wall, through the layer board of side plate inboard installation can support the edge and the center position of wafer, when wafer piece is put into the layer board, through the edge support and the center support of layer board top setting support wafer piece, can prevent wafer piece from deforming. Through the anti -collision layer of isolating sleeve top setting, can reduce the damage that takes place when taking out wafer piece and support assembly scratch, and the damage that wafer piece and anti -collision layer impact or scratch when taking out wafer piece can effectively reduce the damage that wafer piece receives due to the design of anti -collision layer.
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Description

Technical Field

[0001] This utility model relates to the field of wafer fabrication technology, specifically to a device that can quickly access wafers. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Silicon ingots are ground, polished, and sliced ​​to form silicon wafers, or wafers. Domestic wafer production lines mainly produce 8-inch and 12-inch wafers.

[0003] Prior art patent application number 202123258994.1 discloses a fully enclosed high-efficiency circular oven, including an oven support frame. The oven support frame includes a lower device plate and an upper device plate correspondingly arranged, and a circular plate support assembly is arranged between the upper device plate and the lower device plate. The circular plate support assembly includes components correspondingly arranged on the left side of the lower device plate. A set of support frames A on both sides, and a corresponding set of support frames A, are provided on the rear side of the lower device plate. The support frames A and B are arranged in a circular pattern on the front side of the lower device plate. The upper device plate is connected to the support frames A and B, forming a fully enclosed circular wafer support oven structure. This invention supports the wafers using an edge-support method that mimics the shape of a circular wafer, ensuring uniform heating during heat treatment and guaranteeing product quality. However, the aforementioned wafer support assembly uses an edge-support method, which cannot support the center of the wafer. This method can cause wafer deformation, rendering the wafer unusable. Therefore, a device capable of quickly storing and retrieving wafers is needed to address this problem. Utility Model Content

[0004] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be used to limit the scope of this utility model.

[0005] In view of the problems existing in the existing devices that can quickly access wafers, this utility model is proposed.

[0006] Therefore, the purpose of this utility model is to provide a device that can quickly access wafers. The wafer's edge and center can be supported by the shelf installed on the inner side of the side plate. When the wafer is placed on the shelf, the edge support and center support set on the shelf support the wafer, which can prevent the wafer from deforming.

[0007] By installing an anti-collision layer on the isolation sleeve, damage caused by scratching the wafer with the support assembly during wafer placement and removal can be reduced. When placing or removing wafers, the wafers may collide or scratch with the anti-collision layer, but the design of the anti-collision layer can effectively reduce the damage to the wafers.

[0008] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution: A device for rapidly accessing wafers, comprising a support assembly; The supporting component includes an upper plate and a lower plate. A support component is installed between the upper plate and the lower plate. The support component includes a side plate. A layer is installed on the inner side of the side plate. An isolation sleeve is installed between the layers. An anti-collision layer is installed on the outer wall of the isolation sleeve. An anti-slip component is provided on the right side of the support component.

[0009] In a preferred embodiment of the device for quickly accessing wafers according to this utility model, the support assembly further includes a mounting frame located on both sides of the support assembly, and the mounting frame is equipped with a handle.

[0010] In a preferred embodiment of the device for quickly accessing wafers according to this utility model, the side plates are located on both sides and the rear of the support assembly, and their two ends are fixedly connected to the upper plate and the lower plate, respectively.

[0011] In a preferred embodiment of the device for rapidly accessing wafers described in this utility model, the layers are multiple and evenly distributed between the upper plate and the lower plate, and placement cavities are formed between the multiple layers and between the layers and the upper plate and the lower plate, specifically 13-25 placement cavities.

[0012] In a preferred embodiment of the device for quickly accessing wafers described in this utility model, the layer includes edge supports and center supports.

[0013] In a preferred embodiment of the device for quickly accessing wafers according to this utility model, the anti-slip component includes a rotating rod, an anti-slip block is installed on the side wall of the rotating rod, and a rotating wheel is connected to the top of the rotating rod.

[0014] In a preferred embodiment of the device for quickly accessing wafers described in this utility model, the two ends of the rotating rod are rotatably connected to the upper plate and the lower plate, and the top of the rotating rod passes through the upper plate and is connected to the rotating wheel.

[0015] Compared with the prior art, the beneficial effects of this utility model are: 1. The layer plate installed on the inner side of the side plate can support the edge and center of the wafer. When the wafer is placed on the layer plate, the edge support and center support set on the layer plate support the wafer, which can prevent the wafer from deforming.

[0016] 2. By setting an anti-collision layer on the isolation sleeve, the damage caused by the wafer scraping against the support assembly during wafer placement and removal can be reduced. During wafer placement and removal, the wafer may collide or scrape against the anti-collision layer. The design of the anti-collision layer can effectively reduce the damage to the wafer. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them: Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a three-dimensional structural diagram of the support component of this utility model; Figure 3 This is a three-dimensional structural diagram of the support component of this utility model; Figure 4 This is a three-dimensional structural diagram of the anti-slip component of this utility model.

[0018] In the diagram: 100 Support assembly, 110 Loading plate, 120 Downloading plate, 130 Mounting bracket, 140 Handle, 200 Support assembly, 210 Side plate, 220 Shelf, 221 Edge support, 222 Center support, 230 Isolation sleeve, 240 Anti-collision layer, 250 Anti-slip assembly, 251 Rotating rod, 252 Anti-slip block, 253 Rotating wheel. Detailed Implementation

[0019] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0020] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0021] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views showing the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0023] This utility model provides the following technical solution: a device for quickly storing and retrieving wafers. During use, the wafer's edge and center are supported by a shelf installed on the inner side of the side plate. When the wafer is placed on the shelf, the edge and center supports on the shelf support the wafer, preventing deformation of the wafer.

[0024] By installing an anti-collision layer on the isolation sleeve, damage caused by scratching the wafer with the support assembly during wafer placement and removal can be reduced. When placing or removing wafers, the wafers may collide or scratch with the anti-collision layer, but the design of the anti-collision layer can effectively reduce the damage to the wafers.

[0025] Figures 1-4 The diagram below is a structural schematic of the first embodiment of the device for quickly accessing wafers according to this utility model. Please refer to [link / reference]. Figures 1-4 The device for quickly accessing wafers according to this embodiment includes a support assembly 100 in its main body. The support assembly 100 includes an upper plate 110 and a lower plate 120. A support assembly 200 is installed between the upper plate 110 and the lower plate 120. The support assembly 200 includes a side plate 210. A shelf 220 is installed inside the side plate 210. An isolation sleeve 230 is installed between the shelves 220. An anti-collision layer 240 is installed on the outer wall of the isolation sleeve 230. An anti-slip assembly 250 is provided on the right side of the support assembly 200. The support assembly 100 also includes mounting brackets 130 located on both sides of the support assembly 100, and handles 140 are mounted on the mounting brackets 130. The support assembly is used to support the support assembly 200 and the anti-slip assembly 250, the upper plate 110 and the lower plate 120 are used to support the mounting brackets 130, and the mounting brackets 130 are used to mount the handles 140 for easy access to the support assembly 100.

[0026] Side plates 210 are located on both sides and the rear of the support assembly 100, and are fixedly connected to the upper plate 110 and the lower plate 120 at both ends respectively. Multiple shelves 220 are evenly distributed between the upper plate 110 and the lower plate 120. Placement cavities are formed between the multiple shelves 220 and between the shelves 220 and the upper plate 110 and the lower plate 120. Specifically, there are 13-25 placement cavities. The shelf 110 includes edge supports 221 and center supports 222. The support assembly 200 supports the wafer, the side plate 210 surrounds the sides and rear of the layer plate 220 to prevent the wafer from slipping, the layer plate 220 supports the wafer, and through its edge support 221 and center support 222, it can support the wafer around its perimeter and center position. Compared with supporting only the edges, it can greatly reduce the deformation that occurs. The isolation sleeve 230 supports the layer plate 220 to prevent the layer plate 220 from deforming, and the anti-collision layer 240 is used to wrap the isolation sleeve 230, thereby reducing the damage to the wafer caused by collision and scratching between the wafer and the isolation sleeve 230. The anti-collision layer 240 is specifically made of rubber. The anti-slip assembly 250 includes a rotating rod 251, an anti-slip block 252 mounted on the side wall of the rotating rod 251, and a rotating wheel 253 connected to the top of the rotating rod 251. Both ends of the rotating rod 251 are rotatably connected to the upper plate 110 and the lower plate 120, and the top of the rotating rod 251 passes through the upper plate 110 and connects to the rotating wheel 253. The anti-slip assembly 250 is used to prevent the wafer from slipping off the front of the shelf 220. The rotating rod 251 carries the anti-slip block 252 and is connected to the rotating wheel 253. The anti-slip block 252 blocks the wafer, and the rotating wheel 253 drives the rotating rod 251 to rotate. When a wafer is placed on the shelf 220, the rotating wheel 253 drives the rotating rod 251 to rotate. When the rotating rod 251 rotates, it drives the anti-slip block 252 to rotate axially, which can block the wafer and prevent it from slipping off the shelf 220.

[0027] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A device for rapidly accessing wafers, characterized in that: Includes support components (100); The supporting component (100) includes an upper plate (110) and a lower plate (120). A support component (200) is installed between the upper plate (110) and the lower plate (120). The support component (200) includes a side plate (210). A shelf (220) is installed on the inner side of the side plate (210). An isolation sleeve (230) is installed between the shelves (220). An anti-collision layer (240) is installed on the outer wall of the isolation sleeve (230). An anti-slip component (250) is provided on the right side of the support component (200).

2. The device for rapidly accessing wafers according to claim 1, characterized in that: The support assembly (100) also includes a mounting bracket (130) located on both sides of the support assembly (100), and a handle (140) is mounted on the mounting bracket (130).

3. The device for rapidly accessing wafers according to claim 1, characterized in that: The side plate (210) is located on both sides and the rear of the support assembly (100), and its two ends are fixedly connected to the upper plate (110) and the lower plate (120) respectively.

4. The device for rapidly accessing wafers according to claim 1, characterized in that: The multiple shelves (220) are evenly distributed between the upper plate (110) and the lower plate (120). Placement cavities are formed between the multiple shelves (220) and between the shelves (220) and the upper plate (110) and the lower plate (120). Specifically, there are 13-25 placement cavities.

5. The device for rapidly accessing wafers according to claim 1, characterized in that: The shelf (220) includes edge supports (221) and center supports (222).

6. The device for rapidly accessing wafers according to claim 1, characterized in that: The anti-slip component (250) includes a rotating rod (251), an anti-slip block (252) is installed on the side wall of the rotating rod (251), and a rotating wheel (253) is connected to the top of the rotating rod (251).

7. The device for rapidly accessing wafers according to claim 6, characterized in that: The two ends of the rotating rod (251) are rotatably connected to the upper plate (110) and the lower plate (120), and the top of the rotating rod (251) passes through the upper plate (110) and is connected to the rotating wheel (253).

Citation Information

Patent Citations

  • Full-surrounding type efficient wafer oven

    CN216769994U