Chip pick-up device and bonding apparatus

Abstract

The application discloses a chip pickup device and a bonding equipment, and belongs to the technical field of chip bonding, and is used for solving the problem that chips are easily damaged due to bearing excessive instantaneous impact load in the process of picking up the chips. The chip pickup device provided by the application comprises a lifting assembly, the lifting assembly has a lifting piece which performs lifting movement in the vertical direction, and the central axis of the lifting piece is parallel to the vertical direction; the pickup assembly is in transmission connection with the lifting piece and is used for sucking the chip; the elastic assembly is in elastic connection with the pickup assembly and the lifting piece, so as to apply an elastic force in the direction away from the lifting piece to the pickup assembly, and the direction of the elastic force is parallel to the vertical direction; the guide assembly is connected with the pickup assembly and the lifting piece, so that the pickup assembly and the lifting piece are relatively displaced along the vertical direction, and the guide assembly and the elastic assembly are arranged in the circumferential direction of the lifting piece.

Description

Technical Field

[0001] This application relates to the field of chip bonding technology, and in particular to a chip pickup device and bonding equipment. Background Technology

[0002] Chip pickup is a critical step in the chip manufacturing process, and some technologies typically use vacuum nozzles to transfer chips. However, in practice, when the pickup assembly has a rigid structure, its downward pressing process generates significant contact pressure, causing the chip to be subjected to excessive instantaneous impact loads during pickup, which can easily lead to damage. Utility Model Content

[0003] This application provides a chip pickup device and bonding equipment. Through the combined effect of the buffer protection of the elastic component and the precise positioning of the guiding component, rigid collisions between the pickup component and the chip caused by impact or deviation can be avoided to a certain extent, thereby at least partially solving the above-mentioned technical problems.

[0004] To achieve the above objectives, in a first aspect, the chip pickup device provided in this application includes: The lifting assembly has a lifting component that moves vertically, and the central axis of the lifting component is parallel to the vertical direction; The pickup component is connected to the lifting mechanism and used to pick up chips; An elastic component elastically connects the pickup component and the lifting component to apply an elastic force to the pickup component in a direction away from the lifting component, the direction of the elastic force being parallel to the vertical direction; A guide assembly connects the pickup assembly and the lifting component to allow the pickup assembly and the lifting component to move relative to each other in the vertical direction. The guide assembly and the elastic assembly are arranged circumferentially around the lifting component.

[0005] In some embodiments of this application, there are at least two elastic components and guide components, and both are connected to the lifting member; wherein the elastic components and guide components are arranged alternately around the lifting member.

[0006] In some embodiments of this application, the outer periphery of the lifting member is provided with a plurality of mounting portions, which are distributed at equal angles around the circumference of the lifting member and include a first mounting portion and a second mounting portion arranged alternately in sequence. Each first mounting portion is connected to an elastic component, and each second mounting portion is connected to a guide component.

[0007] In some embodiments of this application, each resilient component has a first distance from an adjacent guide component and a second distance from another adjacent guide component, the first distance and the second distance being equal.

[0008] In some embodiments of this application, the elastic component includes a first connector and an elastic element. The first connector is disposed on the outer periphery of the lifting component. The extension and retraction direction of the elastic element is parallel to the vertical direction. One end of the elastic element is connected to the first connector, and the other end abuts against the picking component.

[0009] In some embodiments of this application, the elastic component further includes an adjustment mechanism connected to the lifting member and the first connecting member to adjust the relative position of the lifting member and the first connecting member in the vertical direction, as well as the compression amount of the elastic element.

[0010] In some embodiments of this application, the adjustment mechanism includes a fastener, a first adjustment hole, and a second adjustment hole. The first adjustment hole is disposed on the side wall of the lifting member, and the second adjustment hole is disposed on the first connecting member. One of the first adjustment hole and the second adjustment hole is a circular hole, and the other is an oblong hole. The length direction of the oblong hole is parallel to the vertical direction. The fastener passes through the first adjustment hole and the second adjustment hole to connect the lifting member and the first connecting member.

[0011] In some embodiments of this application, the guide assembly includes a mounting base and a spring. The mounting base is disposed on the pickup assembly, and the spring is disposed perpendicular to the vertical direction and has a first end and a second end disposed opposite to each other in its extension direction. The first end is connected to a lifting member, and the second end is connected to the mounting base. The first end and / or the second end are capable of swinging in the vertical direction.

[0012] In some embodiments of this application, the reed has at least two pieces, which are arranged sequentially in a vertical direction, and the first end of each reed is connected to the lifting member, and the second end is connected to the mounting base.

[0013] In some embodiments of this application, the guide assembly further includes a second connector and a limiting member, the second connector being disposed on the outer periphery of the lifting member, and the limiting member being fixedly connected to the picking assembly; When the elastic component applies an elastic force to the pickup component in a direction away from the lifting component, the second connecting member abuts against the limiting member to restrict the pickup component from moving in a direction away from the lifting component.

[0014] In some embodiments of this application, the second connector has a contact surface facing away from the pickup component, and the limiting member has a limiting surface facing the contact surface. When the elastic component applies an elastic force to the pickup component in a direction away from the lifting component, the contact surface contacts the limiting surface.

[0015] In some embodiments of this application, one of the contact surface and the limiting surface is a plane and the other is a spherical convex surface. The plane is perpendicular to the vertical direction and the spherical convex surface protrudes towards the plane.

[0016] In some embodiments of this application, the pickup component includes an adapter, an air connector, and an adsorption unit. The adapter has a cavity, the air connector is in fluid communication with the cavity, and the adsorption unit is disposed on the side of the adapter facing away from the lifting component and is provided with a vacuum channel in fluid communication with the cavity. The vacuum channel is used to pick up the chip.

[0017] Secondly, this application provides a bonding device, including a chip pickup device as described in any of the above technical solutions.

[0018] The chip pickup device of this application embodiment has at least the following beneficial effects through the above technical solution: In this technical solution, the elastic component applies an elastic force away from the lifting component to the pickup component, forming a buffer layer at the moment the pickup component contacts the chip. When the contact force is too large, the elastic component absorbs the impact energy through controllable compression deformation, effectively buffering the contact impact force and reducing the instantaneous stress peak acting on the chip surface. Simultaneously, the guiding component constrains the pickup component and the lifting component to move synchronously in the vertical direction, preventing horizontal offset, tilting, or rotational deviations during pickup, ensuring accurate chip pickup positioning and stable movement trajectory. Therefore, through the synergistic effect of the elastic component's buffering protection and the guiding component's precise positioning, rigid collisions between the pickup component and the chip caused by impact or deviation can be avoided to a certain extent, effectively preventing chip damage.

[0019] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0021] Figure 1 This is a schematic diagram of the overall structure of the chip pickup device provided in an exemplary embodiment of this disclosure; Figure 2 yes Figure 1 An enlarged schematic diagram of part A in the middle; Figure 3 yes Figure 1 Enlarged schematic diagram of part B in the middle; Figure 4 This is a bottom view of the chip pickup device provided in an exemplary embodiment of this disclosure.

[0022] Explanation of reference numerals in the attached figures: 1-Lifting assembly; 11-Lifting component; 111-Mounting part; 12-Supporting component; 2-Pickup assembly; 21-Adapter; 22-Gas connector; 23-Adsorption unit; 3-Elastic component; 31-First connector; 32-Elastic element; 33-Adjusting mechanism; 331-First adjusting hole; 332-Second adjusting hole; 4-Guide assembly; 41-Mounting base; 42-Spring; 43-Connecting component; 44-Second connecting component; 441-Contact surface; 45-Limiting component; 451-Limiting surface; C - Central axis. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0027] This application provides a chip pickup device and a bonding apparatus, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0028] Chip pickup is a critical step in the chip manufacturing process, and some technologies typically use vacuum nozzles to transfer chips. However, in practice, when the pickup assembly has a rigid structure, its downward pressing process generates significant contact pressure, causing the chip to be subjected to excessive instantaneous impact loads during pickup, resulting in chip damage.

[0029] Specifically, assuming the pickup component is an elastic body with stiffness EA (E is the elastic modulus, A is the cross-sectional area), the downward pressure is F, and the downward distance is x. Here, F = EAx. Since EA is typically very large, even a small downward distance can generate a significant force. This can cause the chip to experience excessive instantaneous impact loads during pickup, potentially damaging the chip.

[0030] Please refer to Figure 1 The chip pickup device provided in this application includes a lifting assembly 1, a pickup assembly 2, an elastic assembly 3, and a guide assembly 4. The lifting assembly 1 has a lifting member 11 that moves vertically, with its central axis C parallel to the vertical direction. The pickup assembly 2 is drivenly connected to the lifting member 11 and is used to pick up the chip. The elastic assembly 3 elastically connects the pickup assembly 2 and the lifting member 11 to apply an elastic force to the pickup assembly 2 in a direction away from the lifting member 11, the direction of which is parallel to the vertical direction. The guide assembly 4 connects the pickup assembly 2 and the lifting member 11 to maintain relative displacement between them in the vertical direction. The guide assembly 4 and the elastic assembly 3 are circumferentially spaced around the lifting member 11.

[0031] In this technical solution, the elastic component 3 applies an elastic force away from the lifting component 11 to the pickup component 2, forming a buffer layer at the moment the pickup component 2 contacts the chip. When the contact force is too large, the elastic component 3 absorbs the impact energy through controllable compression deformation, effectively buffering the contact impact force and reducing the instantaneous stress peak acting on the chip surface. At the same time, the guide component 4 can constrain the pickup component 2 and the lifting component 11 to move synchronously in the vertical direction, avoiding horizontal offset, tilting, or rotational deviation during pickup, ensuring accurate chip pickup position and stable movement trajectory. Thus, through the synergistic effect of the buffer protection of the elastic component 3 and the precise positioning of the guide component 4, rigid collisions caused by impact or deviation between the pickup component 2 and the chip can be avoided to a certain extent, thereby effectively preventing chip damage.

[0032] Specifically, the elastic component 3 is pre-compressed by a certain distance (pre-compression), ensuring that the pickup component 2 is always subjected to an elastic force away from the lifting component 11, thus ensuring that the elastic component 3 is in an effective working state from the start of movement. When the pickup component 2 contacts the chip, the elastic component 3 already has pre-tension support and can immediately absorb impact energy through further compression, avoiding response delay caused by the initial gap, achieving zero-gap buffering, and significantly reducing the risk of rigid collisions. In addition, the guide component 4 and the elastic component 3 are circumferentially spaced around the lifting component 11. The guide component 4 constrains the movement trajectory, and the elastic component 3 buffers the impact force. The two are spatially spaced to balance the force on the pickup component 2 in all directions. For example, when the pickup component 2 contacts the chip with a slight offset, the guide component 4 and the elastic component 3 can share the impact load, avoiding local stress concentration, thereby significantly improving the stability of the downward pressure and the smoothness of chip contact.

[0033] For example, the pickup component 2 is spaced apart on one side of the lifting member 11 in the vertical direction, and the orthographic projection of the lifting member 11 in the vertical direction is located within the orthographic projection of the pickup component 2 in the vertical direction. That is, the pickup component 2 and the lifting member 11 are spaced apart in the vertical direction, and at least part of the elastic component 3 and at least part of the guide component 4 are arranged within the gap between the lifting member 11 and the pickup component 2, saving external space. Specifically, the lifting member 11 is a component that moves linearly in the vertical direction, such as driving the pickup component 2 to move up and down. When viewed from directly above (or along the vertical direction), the projected area of ​​the lifting member 11 is completely contained within the projected area of ​​the pickup component 2. Furthermore, the pickup component 2 and the lifting member 11 are not arranged vertically overlapping, but are staggered by a certain distance in the vertical direction. A portion of the structure of the elastic component 3 and the guide component 4 is cleverly arranged in the gap space between the lifting member 11 and the pickup component 2, saving external space.

[0034] Based on the above embodiments, there are at least two elastic components 3 and guide components 4, both connected to the lifting member 11. The elastic components 3 and guide components 4 are alternately arranged around the circumference of the lifting member 11, forming a multi-directional cooperative mechanical support structure. Each elastic component 3 works in cooperation with two adjacent guide components 4 in the circumferential direction, so that the force on the pickup component 2 is uniform in all directions in the plane. Specifically, when the pickup component 2 contacts the chip with a slight offset, the adjacent guide components 4 can suppress horizontal offset, tilt or rotational deviation, while the adjacent elastic components 3 synchronously absorb impact energy, forming a closed-loop control of constraint and buffering, avoiding local stress concentration. That is to say, the circumferentially adjacent guide components 4 and elastic components 3 can quickly adjust the constraint force and buffering force to maintain the overall mechanical balance.

[0035] Exemplarily, the accompanying drawings of this application illustrate a technical solution in which three elastic components 3 and three guide components 4 are arranged alternately in sequence. That is, each pair of adjacent components is of a different type, arranged in a cyclical sequence of elastic component 3, guide component 4, elastic component 3, guide component 4, elastic component 3, guide component 4, forming a structure in which six groups of functional units are arranged around the lifting member 11. Furthermore, when the lifting member 1 includes a drive motor, the aforementioned lifting member 11 is the output shaft of the drive motor. When the lifting member 1 includes a hydraulic cylinder, the aforementioned lifting member 11 is the piston rod of the hydraulic cylinder.

[0036] In some embodiments, the outer periphery of the lifting member 11 is provided with a plurality of mounting portions 111, which are distributed at equal angles around the circumference of the lifting member 11 and include first mounting portions and second mounting portions arranged alternately in sequence. Each first mounting portion is connected to an elastic component 3, and each second mounting portion is connected to a guide component 4. By arranging the mounting portions 111 at equal angles around the circumference, the elastic component 3 and the guide component 4 are uniformly arranged around the lifting member 11 in the circumferential direction. Taking the arrangement of six mounting portions 111 (three first mounting portions and three second mounting portions) as an example, the circumferential angle between adjacent mounting portions 111 is 60°. This symmetrical distribution allows the components to cover all directions of the pickup component 2 in the plane, ensuring uniform force distribution and avoiding problems such as local stress concentration or insufficient support.

[0037] For example, the first mounting part and the second mounting part can adopt the same structural design. That is, each mounting part 111 can be a mounting groove provided on the outer peripheral surface of the lifting member 11. The bottom of the mounting groove is flat to increase the contact area between the elastic component 3 and the guide component 4, which facilitates surface contact or larger area contact, thereby dispersing the force and improving the reliability and stability of the connection. At the same time, it can also provide a clear mounting surface and positioning reference for the elastic component 3 (first connector 31) and the guide component 4 (second connector 44), ensuring the consistency of the relative positions between the components and improving the overall accuracy of the chip picking device.

[0038] Furthermore, the positions of each first and second mounting part are precisely designed, and based on their circumferential angular distribution, the elastic component 3 and the guide component 4 can accurately act on the corresponding positions of the pickup component 2. When minor external force interference or positional deviation occurs during the pickup process, the circumferentially evenly distributed and sequentially alternating elastic component 3 and guide component 4 can respond quickly. Adjacent components can instantly link together through functional complementarity, dynamically adjusting the buffering and constraint forces to achieve adaptive adjustment.

[0039] In some embodiments, each elastic component 3 has a first distance from an adjacent guide component 4 and a second distance from another adjacent guide component 4, the first and second distances being equal. This equidistant layout simplifies the arrangement logic of the mounting portions 111 (the first and second mounting portions), allowing the mounting positions of the elastic components 3 and guide components 4 to be determined by a unified rule (e.g., fixed at 60° angular intervals), eliminating the need to adjust spacing parameters for different areas and reducing assembly complexity and debugging difficulty. Furthermore, the equidistant arrangement structure can quickly achieve dynamic balance through symmetrical mechanical feedback on both sides (guide components 4 suppress offset, elastic components 3 absorb energy), maintaining the stable movement state of the pickup component 2 and reducing the risk of additional impact due to uneven force.

[0040] Specifically, the first distance refers to the minimum straight-line distance between the elastic component 3 and an adjacent guide component 4. Similarly, the second distance refers to the minimum straight-line distance between the elastic component 3 and another adjacent guide component 4. Each elastic component 3 and each guide component 4 has a radial distance equal to the central axis C of the lifting member 11.

[0041] Please continue to refer to Figure 1 In this embodiment, the elastic component 3 includes a first connector 31 and an elastic element 32. The first connector 31 is disposed on the outer periphery of the lifting component 11. The extension and retraction direction of the elastic element 32 is parallel to the vertical direction. One end of the elastic element 32 is connected to the first connector 31, and the other end abuts against the pickup component 2. The extension and retraction direction of the elastic element 32 is parallel to the vertical direction (i.e., the downward pressing direction of the pickup component 2), ensuring that it only buffers the axial impact force during chip pickup and does not fail due to lateral force interference. Furthermore, by fixing the elastic element 32 to the outer periphery of the lifting component 11 through the first connector 31, and with the other end of the elastic element 32 directly abutting against the pickup component 2, energy loss and directional deviation in the intermediate transmission links are reduced, ensuring that the buffering force of the elastic element 32 is accurately applied to the pickup component 2, thus improving buffering efficiency. For example, the elastic element 32 can be a spring, a rubber elastomer, a pneumatic elastic element 32, a hydraulic elastic element 32, etc.

[0042] Please refer to the following at the same time Figure 1 and Figure 2In this embodiment, the elastic component 3 further includes an adjustment mechanism 33, which connects the lifting member 11 and the first connecting member 31 to adjust the relative position of the first connecting member 31 in the vertical direction and the compression amount of the elastic element 32. Since the compression amount of the elastic element 32 (such as a spring) directly determines the magnitude of its elastic force, by changing the compression amount of the elastic element 32, its initial preload (such as the initial elastic force of a spring) can be directly adjusted, thereby controlling the reaction force exerted by the elastic element 32 on the pickup component 2, and indirectly controlling the contact pressure or suction force between the pickup component 2 and the chip. Specifically, excessive suction force may damage the chip surface (especially for thin, flexible, or surface-sensitive chips), while adjusting the compression amount can ensure that the pickup component 2 has a suitable suction force, thereby firmly and gently adsorbing the chip, avoiding unstable suction or detachment, and protecting the chip from damage.

[0043] In other words, the adjusting mechanism 33 connects the lifting member 11 and the first connecting member 31, and can adjust the relative position of the first connecting member 31 in the vertical direction, thereby indirectly adjusting the distance between the first connecting member 31 and the picking component 2, so that the compression of the elastic element 32 can be adjusted.

[0044] Based on the above embodiments, the adjustment mechanism 33 includes a fastener, a first adjustment hole 331, and a second adjustment hole 332. The first adjustment hole 331 is located on the side wall of the lifting member 11, and the second adjustment hole 332 is located on the first connecting member 31. One of the first adjustment hole 331 and the second adjustment hole 332 is a circular hole, and the other is an oblong hole, with the length direction of the oblong hole parallel to the vertical direction. The fastener passes through the first adjustment hole 331 and the second adjustment hole 332 to connect the lifting member 11 and the first connecting member 31. Specifically, the first adjustment hole 331 is located on the side wall of the lifting member 11, and the second adjustment hole 332 is located on the first connecting member 31. One of the two adjustment holes is a circular hole, and the other is an oblong hole, with the length direction of the oblong hole parallel to the vertical direction. By loosening the fastener connecting the lifting member 11 and the first connecting member 31, the relative position of the two can be adjusted along the length direction of the oblong hole; after adjustment, tightening the fastener will fix the two relatively.

[0045] The accompanying drawings of this application only show an embodiment where the first adjustment hole 331 is a circular hole and the second adjustment hole 332 is an oblong hole. Fasteners pass through the circular hole on the lifting member 11 and the oblong hole on the first connecting member 31, allowing them to move relative to each other within a certain range in the vertical direction, thereby enabling fine-tuning of the position of the first connecting member 31. During equipment assembly or debugging, operators can precisely adjust the relative position of the first connecting member 31 in the vertical direction, thereby precisely adjusting the compression of the elastic element 32, and thus controlling the pickup (adsorption) height and pre-tightening force of the pickup assembly 2. Furthermore, this adjustment method does not require reprocessing parts or replacing components; fine-tuning can be completed simply by tightening or loosening a fastener (such as a screw), making the operation simple, flexible, and efficient, significantly improving the convenience of assembly and debugging.

[0046] Alternatively, one of the first adjusting hole 331 and the second adjusting hole 332 may include only one circular hole, while the other may include multiple circular holes spaced apart in the vertical direction. The fastener can be connected to the aforementioned circular hole through any one of the multiple circular holes, thereby achieving vertical position adjustment of both. Alternatively, the adjusting mechanism 33 may be a movable module mounted on the lifting member 11, used to drive the first connecting member 31 to move in the vertical direction.

[0047] Please combine Figure 1 and Figure 3 In this embodiment, the guide assembly 4 includes a mounting base 41 and a spring 42. The mounting base 41 is disposed on the pickup assembly 2. The spring 42 is disposed perpendicular to the vertical direction and has a first end and a second end opposite to each other in its extending direction. The first end is connected to the lifting member 11, and the second end is connected to the mounting base 41. The first end and / or the second end can swing in the vertical direction. Since the spring 42 is allowed to swing in a certain way in the vertical direction, it forms a flexible connection or elastic floating connection with the lifting member 11, rather than a completely rigid fixation, thereby avoiding additional constraints on the lifting movement of the pickup assembly 2 and ensuring smooth and stable movement. At the same time, the spring 42 has the ability to elastically deform in a specific direction. While allowing a certain degree of freedom, it can effectively suppress displacement or tilting in the direction perpendicular to the plane of the spring 42, thereby realizing flexible guidance and attitude control of the pickup assembly 2. Specifically, the reed 42 has controllable elastic deformation capability, provides adaptability within the allowed degrees of freedom (vertical direction), and generates elastic restoring force when the pickup assembly 2 is subjected to a force parallel to the plane of the reed 42 (horizontal direction) to limit undesired displacement, tilting or attitude changes, thereby achieving flexible guidance and attitude control.

[0048] Furthermore, compared to traditional guide rail components that typically require periodic lubrication to ensure smooth movement, the reed 42, as a purely elastic component, requires no lubrication. Simultaneously, the reed 42 employs a flexible contact method instead of traditional hard friction contact, not only avoiding direct metal-to-metal friction and the generation of wear debris, but also fundamentally eliminating the risk of particulate contamination introduced by lubricants, thereby significantly improving the cleanliness of the chip pickup device. This characteristic makes the reed 42 particularly suitable for applications with high requirements for particle control and product yield, such as semiconductor chip manufacturing, precision electronic assembly, and optical component packaging.

[0049] Based on the above embodiments, the spring 42 has at least two pieces, arranged sequentially in the vertical direction, with the first end of each spring 42 connected to the lifting member 11 and the second end connected to the mounting base 41. Multiple springs 42 can share the load and elastic force, with each spring 42 bearing less force, resulting in a more uniform, stable, and controllable overall elastic force output. In practical use, the number, thickness, material, or pre-compression of the springs 42 can be adjusted to achieve precise control and balanced distribution of the overall elastic force. Furthermore, in addition to providing elastic force, the springs 42 can also participate in the guiding function; multiple springs 42 can work together to achieve a more balanced guiding, restraining, and protective function. Exemplarily, the accompanying drawings of this application show a technical solution with two springs 42, spaced apart in the vertical direction, with an interval greater than or equal to 2.0 mm and less than or equal to 3.0 mm, and the thickness of each spring 42 is approximately 0.1 mm. A connecting component 43 is provided between two adjacent spring plates 42. The connecting component 43 connects the two adjacent spring plates 42 and is fixedly connected to the mounting base 41 with screws. Alternatively, the two adjacent spring plates 42 can form an integral structure with the connecting component 43. This design can avoid unnecessary interference, friction, or vibration coupling between the two spring plates 42, ensuring that the two spring plates 42 can perform their respective functions, while avoiding dynamic coupling or performance degradation caused by the two spring plates 42 being too close together.

[0050] For example, the vertical spacing between the two springs 42 can be 2.0mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm, 2.8mm, 2.9mm, or 3.0mm. Preferably, the vertical spacing between the two springs 42 is greater than or equal to 2.4mm and less than or equal to 2.6mm, which ensures that the two springs 42 have sufficient spacing to avoid mutual interference, while maintaining an appropriate degree of proximity to achieve coordinated elasticity and guiding function.

[0051] It is understood that a support member 12 is provided at the end of the lifting member 11 facing the picking component 2, and the thickness of the support member 12 in the vertical direction is approximately equal to the thickness of the connecting member 43 in the vertical direction. Specifically, in the two springs 42, the two ends of one spring 42 are rigidly connected to the end faces of the support member 12 and the connecting member 43 located on the same side (e.g., both on the upper or lower side) in the vertical direction; the two ends of the other spring 42 are rigidly connected to the end faces of the support member 12 and the connecting member 43 located on the other side (i.e., the opposite side to the aforementioned side; if the former is the upper side, then this one is the lower side) in the vertical direction. With the aforementioned design, the support member 12 and the connecting member 43 work together to effectively separate the two springs 42 in the vertical direction and provide reliable rigid support and fixation for the ends of each spring 42, ensuring the stability of the spring 42 connection and the functionality of the structure.

[0052] In some embodiments, the guide assembly 4 further includes a second connector 44 and a limiting member 45. The second connector 44 is disposed on the outer periphery of the lifting member 11, and the limiting member 45 is fixedly connected to the pickup assembly 2. When the elastic component 3 applies an elastic force to the pickup assembly 2 in a direction away from the lifting member 11, the second connector 44 abuts against the limiting member 45 to restrict the pickup assembly 2 from moving away from the lifting member 11. That is, when the second connector 44 abuts against the limiting member 45, the elastic component 3 is compressed between the pickup assembly 2 and the lifting member 11, and when the pickup assembly 2 contacts or picks up the chip, the second connector 44 moves downward and separates from the limiting member 45, at which point the elastic component 3 is further compressed. Since the second connector 44 separates from the limiting member 45, it can prevent the lifting member 11 from overshooting and transmitting excessive pressure through the limiting member 45 to the pickup assembly 2, thereby damaging the chip. Specifically, when the elastic component 3 applies an elastic force (e.g., a vertical thrust) to the pickup component 2 away from the lifting member 11, the contact / abutment between the second connector 44 and the limiting member 45 limits the elastic force from causing the limiting member 45 (and the pickup component 2 connected to it via the mounting base 41) to continue moving excessively away from the lifting member 11. This allows the elastic component 3 to continuously apply an elastic force to the pickup component 2 in the direction away from the lifting member 11. For example, the limiting member 45 can be directly and fixedly connected to the pickup component 2, or it can be fixedly mounted on the pickup component 2 via the mounting base 41.

[0053] Furthermore, by introducing a mechanical limiting structure, namely the limiting structure in which the second connecting member 44 and the limiting member 45 cooperate, even if the elastic force of the elastic element 32 fluctuates abnormally, the range of motion can be limited in time through physical contact, preventing the system from entering an undesigned state. Moreover, this mechanical limiting structure achieves the limiting function solely through the cooperation of the mechanical structure itself, and its structure is simple, its response is fast, and its maintenance is convenient.

[0054] The second connector 44 has a contact surface 441 facing away from the pickup assembly 2, and the limiting member 45 has a limiting surface 451 facing the contact surface 441. When the elastic component 3 applies an elastic force to the pickup assembly 2 in a direction away from the lifting component 11, the contact surface 441 contacts the limiting surface 451. Through the face-to-face contact between the contact surface 441 and the limiting surface 451, when the elastic force drives the limiting member 45 to move downward to a certain extent, the physical contact between the two surfaces forms a mechanical limit, restricting its further movement. Specifically, when the movement reaches a certain boundary, the two surfaces abut against each other, forming a clear limiting point, thereby precisely limiting the maximum displacement in that direction. Even if the elastic component 3 continues to apply an elastic force, the pickup assembly 2 will not continue to move downward.

[0055] For example, one of the contact surface 441 and the limiting surface 451 is a plane, and the other is a spherical convex surface. The plane is perpendicular to the vertical direction, and the spherical convex surface protrudes towards the plane. When they contact each other, it is not a direct collision between two rigid planes, but rather a point contact. When the limiting member 45 moves away from the lifting member 11 and contacts the plane, the highest point of the spherical convex surface will contact the plane. Based on this, even if the limiting member 45 or the second connecting member 44 connected to it has slight angular deviations, positional offsets, or incomplete alignment during assembly, the spherical convex surface can automatically adjust its contact position within a certain range based on its own curved surface characteristics, finding the optimal contact point with the horizontal plane, thereby achieving a certain degree of automatic alignment or correction effect and improving the adaptability and reliability of the limiting fit.

[0056] Alternatively, in some embodiments, the second connector 44 has a groove extending vertically, and the groove does not penetrate the second connector 44 at least at its bottom end, or neither the top nor the bottom end of the groove penetrates the second connector 44. The limiting member 45 has a limiting protrusion that slides within the groove. That is, the limiting protrusion is located on the side surface of the limiting member 45 facing the second connector 44 and protrudes towards the second connector 44. Simultaneously, when the elastic component 3 applies an elastic force to the pickup component 2 in a direction away from the lifting component 11, the limiting protrusion stops against the groove wall at the bottom end of the groove, preventing the limiting member 45 and the pickup component 2 connected thereto from continuing to move downwards.

[0057] Therefore, both of the above embodiments use mechanical limiting structures to restrict the movement of the limiting member 45 away from the lifting member 11. This limiting function is achieved entirely based on the cooperation relationship of the mechanical structure itself, without relying on electronic control components or sensor feedback. It has the characteristics of simple structure, fast response and high reliability.

[0058] The first connecting member 31 and the second connecting member 44 are both L-shaped. The first part (vertical part) of the L-shaped connecting member (first connecting member 31 and second connecting member 44) is fixedly installed at the mounting part 111 of the lifting member 11, and the second part (horizontal part) extends in a direction away from the central axis C of the lifting member 11. Specifically, the lower surface of the second part of the first connecting member 31 is used to connect the elastic element 32, and the upper surface of the second part of the second connecting member 44 is used to form the contact surface 441. Furthermore, the limiting member 45 has a connected main body and an extension. The bottom end of the main body is provided with a mounting base 41, and the extension is provided at the top end of the main body and extends relative to the main body towards the central axis C. The lower surface of the extension is used to form the limiting surface 451.

[0059] Please refer to Figure 1 and Figure 4 In this embodiment, the pickup component 2 includes an adapter 21, an air connector 22, and an adsorption unit 23. The adapter 21 has a cavity, and the air connector 22 is in fluid communication with the cavity. The adsorption unit 23 is located on the side of the adapter 21 facing away from the lifting component 11 and has a vacuum channel in fluid communication with the cavity. The vacuum channel is used to pick up the chip. The adapter 21 serves as both a mechanical support and a carrier for the airflow channel. The air connector 22, as a standard interface, is used to connect to an external vacuum source. The adsorption unit 23 directly contacts the chip and is the end-effector for realizing the pickup function. The cavity, as an intermediate transition chamber, also plays a role in buffering and uniformly distributing airflow, further improving the stability of the adsorption force. The air connector 22 can be arranged on the side of the adapter 21 or in a non-interference area to avoid conflict with the lifting component 11, while facilitating the connection and maintenance of external pipelines.

[0060] In some embodiments of this application, the bonding apparatus provided by this application includes a chip pickup device as described in any of the above technical solutions. Since the chip pickup device in this bonding apparatus has the same technical features as the chip pickup device described above, the two can solve the same technical problems and achieve the same technical effects. This application will not elaborate further here.

[0061] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0062] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. Furthermore, specific examples have been used in the specification to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application, and the content of this specification should not be construed as a limitation of this application.

Claims

1. A chip pickup device, characterized in that, include: A lifting assembly having a lifting member that moves vertically, the central axis of the lifting member being parallel to the vertical direction; The pickup component is connected to the lifting component via a transmission and is used to pick up the chip; An elastic component elastically connects the pickup component and the lifting member to apply an elastic force to the pickup component in a direction away from the lifting member, the direction of the elastic force being parallel to the vertical direction; A guide assembly connects the pickup assembly and the lifting member to allow the pickup assembly and the lifting member to undergo relative displacement along the vertical direction. The guide assembly and the elastic assembly are arranged circumferentially around the lifting member.

2. The chip pickup device according to claim 1, characterized in that, There are at least two of each of the elastic component and the guide component, and both are connected to the lifting member; wherein the elastic component and the guide component are arranged alternately around the lifting member.

3. The chip pickup device according to claim 2, characterized in that, The lifting component has multiple mounting portions on its outer periphery. These mounting portions are distributed at equal angles around the circumference of the lifting component and include first mounting portions and second mounting portions arranged alternately in sequence. Each first mounting portion is connected to the elastic component, and each second mounting portion is connected to the guide component.

4. The chip pickup device according to claim 2, characterized in that, Each of the resilient components has a first distance from an adjacent guide component and a second distance from another adjacent guide component, the first distance and the second distance being equal.

5. The chip pickup device according to any one of claims 1 to 4, characterized in that, The elastic component includes a first connector and an elastic element. The first connector is disposed on the outer periphery of the lifting component. The extension and retraction direction of the elastic element is parallel to the vertical direction. One end of the elastic element is connected to the first connector, and the other end abuts against the picking component.

6. The chip pickup device according to claim 5, characterized in that, The elastic component further includes an adjustment mechanism that connects the lifting member and the first connecting member to adjust the relative position of the lifting member and the first connecting member in the vertical direction, as well as the compression amount of the elastic element.

7. The chip pickup device according to claim 6, characterized in that, The adjustment mechanism includes a fastener, a first adjustment hole, and a second adjustment hole. The first adjustment hole is disposed on the side wall of the lifting member, and the second adjustment hole is disposed on the first connecting member. One of the first adjustment hole and the second adjustment hole is a circular hole, and the other is an oblong hole. The length direction of the oblong hole is parallel to the vertical direction. The fastener passes through the first adjustment hole and the second adjustment hole to connect the lifting member and the first connecting member.

8. The chip pickup device according to any one of claims 1 to 4, characterized in that, The guide assembly includes a mounting base and a spring. The mounting base is disposed on the pickup assembly. The spring is disposed perpendicular to the vertical direction and has a first end and a second end disposed opposite to each other in its extension direction. The first end is connected to the lifting member, and the second end is connected to the mounting base. The first end and / or the second end can swing along the vertical direction.

9. The chip pickup device according to claim 8, characterized in that, The spring has at least two pieces, which are arranged sequentially along the vertical direction, and the first end of each spring is connected to the lifting member, and the second end is connected to the mounting base.

10. The chip pickup device according to claim 8, characterized in that, The guide assembly further includes a second connector and a limiting member. The second connector is disposed on the outer periphery of the lifting member, and the limiting member is fixedly connected to the picking assembly. When the elastic component applies an elastic force to the pickup component in a direction away from the lifting member, the second connecting member abuts against the limiting member to restrict the pickup component from moving in a direction away from the lifting member.

11. The chip pickup device according to claim 10, characterized in that, The second connector has a contact surface facing away from the pickup assembly, and the limiting member has a limiting surface facing the contact surface. When the elastic component applies an elastic force to the pickup assembly in a direction away from the lifting component, the contact surface contacts the limiting surface.

12. The chip pickup device according to claim 11, characterized in that, One of the contact surface and the limiting surface is a plane and the other is a spherical convex surface. The plane is perpendicular to the vertical direction and the spherical convex surface protrudes towards the plane.

13. The chip pickup device according to claim 1, characterized in that, The pickup assembly includes an adapter, an air connector, and an adsorption unit. The adapter has a cavity, and the air connector is in fluid communication with the cavity. The adsorption unit is located on the side of the adapter facing away from the lifting component and has a vacuum channel in fluid communication with the cavity. The vacuum channel is used to pick up the chip.

14. A bonding apparatus, characterized in that, Includes the chip pickup device as described in any one of claims 1 to 13.

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