A cyclone bernoulli finger

CN224670272UActive Publication Date: 2026-08-21SINTAIKE SEMICON EQUIP (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202521983396.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-16
Publication Date
2026-08-21
Estimated Expiration
2035-09-16

AI Technical Summary

Technical Problem

[0005]针对现有技术中手指上的伯努利吸盘更换过程中可能出现粘胶污染或者损伤手指的问题,本实用新型的目的在于提供一种旋风伯努利手指,以便于至少部分地解决上述问题

Benefits of technology

[0016]采用上述技术方案,本实用新型的有益效果在于:本实用新型提供的旋风伯努利手指,通过涡旋通道合气流通道的设置,使得气流仅在平行于手指表面的涡旋通道中呈旋风状流动,由于其流速较高,使得涡旋通道内会产生负压,进而对晶圆形成负压吸引作用,实现晶圆的吸附搬运。相比于现有技术,本实用新型提供的旋风伯努利手指无需进行吸盘的更换,既能够避免粘胶对晶圆的污染,同时又能够避免因为更换吸盘而对手指造成损伤的情况发生。

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Abstract

The utility model discloses a cyclone bernoulli finger belongs to wafer handling technical field, including finger body, the surface of finger body is provided with several annular vortex channel, the inside of finger body still is equipped with airflow channel, and the airflow channel includes the air inlet and exhaust flow channel that communicate with the vortex channel with the tangential mode, and the air inlet and exhaust flow channel form air inlet hole and exhaust hole respectively on the surface of finger body. The utility model discloses through the setting of vortex channel and airflow channel, make the airflow only in parallel to the vortex channel of finger surface cyclone flow, because its flow rate is higher, make the vortex channel in will produce negative pressure, and then form negative pressure suction effect to wafer, realize the adsorption of wafer and carry. Compared with the prior art, the cyclone bernoulli finger provided by the utility model does not need to replace the suction cup, can avoid the pollution of wafer by adhesive, and can avoid the damage of finger caused by replacing the suction cup.
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Description

Technical Field

[0001] This utility model relates to the field of wafer handling technology, and in particular to a whirlwind Bernoulli finger. Background Technology

[0002] A wafer refers to a silicon chip used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit component structures can be fabricated on silicon chips to create IC products with specific electrical functions. Semiconductor production and manufacturing have developed into a complete production process. Generally, this involves chip circuit design, wafer fabrication, wafer testing, wafer dicing and grinding, chip packaging, and final chip testing. The process from wafer to chip requires many steps, and each step requires transferring the wafer from one piece of equipment to another. This wafer transfer necessitates specialized handling robots, and fingers are the part of these robots that directly contact the wafer; therefore, fingers play a crucial role in wafer handling.

[0003] Bernoulli fingers are fingers designed for handling thin, extremely precise, and fragile wafers. They are equipped with suction cups that operate based on Bernoulli's principle. When compressed air is applied to the suction cups, a uniform and thin, strong airflow is generated on the working surface of the suction cups. At this time, the gas flow rate on the side of the wafer facing the suction cups is greater than the gas flow rate on the other side. Utilizing the principle that the faster the fluid velocity, the lower the pressure, a pressure difference is generated on both sides of the wafer, thereby adhering the wafer to the fingers.

[0004] However, these finger-mounted Bernoulli suction cups have the problem of needing to be replaced after long-term use. Existing Bernoulli suction cups are either fixed by adhesive or by inserting them into the chip. The adhesive method may contaminate the wafer with adhesive, while the inserting method may cause wear and even damage to the finger. Summary of the Invention

[0005] In view of the problems that may occur during the replacement of Bernoulli suction cups on fingers in the prior art, such as adhesive contamination or finger damage, the purpose of this utility model is to provide a cyclone Bernoulli finger, so as to at least partially solve the above problems.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows: A cyclone Bernoulli finger includes a finger body with an annular vortex channel on its surface and an airflow channel inside the finger body. The airflow channel includes an inlet channel and an exhaust channel that are tangentially connected to the vortex channel. The inlet channel and the exhaust channel form an inlet hole and an exhaust hole on the surface of the finger body, respectively.

[0007] In some preferred embodiments, a circular groove is formed on the surface of the finger body, and a circular boss is concentrically formed at the bottom of the groove. The vortex channel is formed between the circumferential sidewall of the boss and the circumferential sidewall of the groove.

[0008] In some preferred embodiments, an airflow guide block is also installed in the vortex channel, and the airflow guide block is arranged between the two connecting points formed by the airflow channel and the vortex channel.

[0009] In some preferred embodiments, a touch pad is provided on the protrusion, and the surface of the touch pad protrudes from the surface of the finger body.

[0010] In some preferred embodiments, the outer circular sidewall of the boss is provided with a slot along the axial direction for mounting the airflow guide block, and the contact pad is used to press the airflow guide block.

[0011] In some preferred embodiments, the opposite surface of the finger body is provided with a connecting hole that penetrates the boss, and the connecting hole is provided with a connector for fixing the touch pad.

[0012] In some preferred embodiments, the touch pad is made of an anti-slip and anti-static material.

[0013] In some preferred embodiments, the surface of the finger body is provided with at least one arc-shaped step for positioning the wafer.

[0014] In some preferred embodiments, the surface of the finger body is provided with a mounting groove, which is located at the center of the arc-shaped step, and a sensor for detecting whether the wafer is in place is installed in the mounting groove.

[0015] In some preferred embodiments, the vortex channels are multiple and symmetrically distributed about the axis of symmetry of the arcuate steps.

[0016] The beneficial effects of this invention using the above technical solution are as follows: The cyclone Bernoulli finger provided by this invention, through the setting of the vortex channel and airflow channel, allows the airflow to flow in a cyclone shape only in the vortex channel parallel to the finger surface. Due to its high flow velocity, a negative pressure is generated within the vortex channel, thereby creating a negative pressure attraction effect on the wafer and achieving wafer adsorption and handling. Compared with the prior art, the cyclone Bernoulli finger provided by this invention does not require replacement of the suction cup, which can avoid adhesive contamination of the wafer and also avoid damage to the finger caused by replacing the suction cup. Attached Figure Description

[0017] Figure 1 This is a front view of a whirlwind Bernoulli finger according to this utility model; Figure 2This is a cross-sectional view of a whirlwind Bernoulli finger according to this utility model; Figure 3 For along Figure 2 A cross-sectional view along line AA in the middle.

[0018] In the diagram: 1-finger body, 2-vortex channel, 21-groove, 22-protrusion, 23-airflow guide block, 3-airflow channel, 31-inlet airflow channel, 32-exhaust airflow channel, 33-inlet hole, 34-exhaust hole, 4-touch pad, 41-cylindrical body, 42-connecting sleeve, 43-connector, 5-arc step, 6-sensor. Detailed Implementation

[0019] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding of this utility model, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0020] It should be noted that in the description of this utility model, the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the description of the structure of this utility model shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] The terms "first" and "second" in this technical solution are merely designations for corresponding structures that are identical or similar, or that perform similar functions. They do not represent an arrangement of the importance of these structures, nor do they imply any ranking, comparison of size, or other meaning.

[0022] Furthermore, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two structures. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the overall concept and the specific context of the solution.

[0023] Example 1 A type of whirlwind Bernoulli finger, such as Figure 1-3 As shown, it includes a finger body 1, a vortex channel 2, and an airflow channel 3.

[0024] The finger body 1 is flat and is made of high-strength ceramic material by 3D printing. The finger body 1 includes two opposing surfaces and a circumferential side. The two opposing surfaces are defined as the front and back sides, respectively. When in use, the front side of the finger body 1 faces the wafer to be transported.

[0025] The front of the finger body 1 is provided with an annular vortex channel 2, and the inside of the finger body 1 is also provided with an airflow channel 3. The airflow channel 31 includes an inlet channel 31 and an exhaust channel 32. The inlet channel 31 and the exhaust channel 32 are connected to the vortex channel 2 in a tangential manner. The inlet channel 31 forms an air inlet hole 33 on the front of the finger body 1, and the exhaust channel 32 forms an exhaust hole 34 on the circumferential side of the finger body.

[0026] In this embodiment, a circular groove 21 is provided on the front side of the finger body 1. A circular boss 22 is concentrically provided at the bottom of the groove 21. The vortex channel 2 is formed between the circumferential sidewall of the boss 22 and the circumferential sidewall of the groove 21. At the vortex channel 2, the angle between the air intake direction of the air intake channel 31 and the air exhaust direction of the exhaust channel 32 is configured to be 180°, that is, the airflow goes around half a circle in the vortex channel 2 before being exhausted. Of course, in other embodiments, this angle can also be configured to other angles, such as 90°, 120°, 210°, etc.

[0027] It is easy to understand that, in order to ensure that the airflow flows stably from the intake channel 31 to the exhaust channel 32 in the vortex channel 2, an airflow guide block 23 is also installed in the vortex channel 2. The airflow guide block 23 is arranged between the intake channel 31 (the connection point formed with the vortex channel 2) and the exhaust channel 32 (the connection point formed with the vortex channel 2). The airflow guide block 23 is generally arc-shaped, with its inner edge diameter matching the inner diameter of the vortex channel 2, its outer edge diameter matching the outer diameter of the vortex channel 2, and its thickness matching the thickness of the boss 22. Thus, the vortex channel 2 is cut off by the airflow guide block 23, so that the airflow can flow stably from the intake channel 31 to the exhaust channel 32 in the vortex channel 2, avoiding interference between the intake airflow and the exhaust airflow.

[0028] It is easy to understand that, regardless of the direction in which the airflow flows in the vortex channel 2, a negative pressure adsorption effect will be generated during the airflow process. That is, the inlet airway 31, the exhaust airway 32, the inlet port 33, and the exhaust port 34 are only used to provide channels for airflow and do not restrict the direction of airflow.

[0029] It also includes a contact pad 4 for contacting the wafer, made of an anti-slip and anti-static material, such as anti-static fluororubber. The contact pad 4 has a disc-shaped body, and a coaxial, small-diameter columnar body 41 is integrally formed on one side of the back of the contact pad 4 body. A connecting hole is provided on the back of the finger body 1, which can pass through the boss 22. The diameter of the columnar body 41 is adapted to the connecting hole, so that when the contact pad 4 is placed on the surface of the boss 22, the columnar body 41 can just pass through the connecting hole. Then, the columnar body 41 is fixed from the back of the finger body 1 by a connector 43 (e.g., a screw). For example, a metal connecting sleeve 42 is coaxially embedded in the columnar body 41. The connecting sleeve 42 has an internal thread that mates with the connector 43. The connecting hole is usually configured as a stepped countersunk hole to prevent the connector 43 from protruding from the back of the finger body 1.

[0030] Each of the protrusions 22 in the vortex channel 2 is provided with a touch pad 4. The touch pad 4 has a certain thickness and the surface of the touch pad 4 protrudes from the front of the finger body 1.

[0031] Simultaneously, the contact pad 4 is also used to press and fix the airflow guide block 23. For example, the outer circular sidewall of the boss 22 has a slot along the axial direction for installing the airflow guide block 23, and the root of the corresponding airflow guide block 23 (i.e., the side facing the center) has a protrusion that matches the slot. The contact pad 4 has the same size as the boss 22 and is installed concentrically, so that it can completely cover the slot and press the protrusion at the root of the airflow guide block 23 into the slot, thereby achieving the pressing and fixing effect of the airflow guide block 23.

[0032] Example 2 In this embodiment, the front side of the finger body 1 is also provided with an arc-shaped step 5 for positioning the wafer. The arc-shaped step 5 has a diameter equivalent to that of the wafer to be transported, so that the wafer is positioned at a designated position on the finger body 1 by means of the arc-shaped step 5.

[0033] Meanwhile, a mounting groove is provided on the front of the finger body 1, located at the center of the arc-shaped step 5. A sensor 6 for detecting whether the wafer is in place is installed in the mounting groove. Specifically, the detection probe of the sensor 6 is located at the center of the arc-shaped step 5. When the detection probe of the sensor 6 detects the wafer, it is considered that the edge of the wafer is completely in contact with the arc-shaped step 5, and the wafer is in place.

[0034] It is easy to understand that there are usually multiple vortex channels 2. These vortex channels 2 are symmetrically distributed about the axis of symmetry of the arc-shaped step 5, and the airflow directions in two vortex channels 2 opposite to each other are set in opposite directions so as to cancel out the torsional torque generated by the airflow and prevent the wafer from rotating.

[0035] Typically, the finger body 1 is not only suitable for handling wafers of a single size. In this case, the arc-shaped steps 5 on the front side of the finger body 1 are provided with two or more steps of different diameters, and these arc-shaped steps 5 have the same axis of symmetry. The mounting groove is provided along the axis of symmetry. A sensor 6 is provided at the intersection of the mounting groove and each arc-shaped step 5, or each detection probe of the sensor 6 is arranged at the intersection of the mounting groove and each arc-shaped step 5.

[0036] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model, and these variations still fall within the protection scope of this utility model.

Claims

1. A whirlwind Bernoulli finger, characterized in that: The device includes a finger body, the surface of which is provided with an annular vortex channel, and the interior of which is provided with an airflow channel. The airflow channel includes an inlet channel and an exhaust channel that are tangentially connected to the vortex channel. The inlet channel and the exhaust channel respectively form an air inlet hole and an exhaust hole on the surface of the finger body.

2. The whirlwind Bernoulli finger according to claim 1, characterized in that: The surface of the finger body is provided with a circular groove, and a circular boss is provided concentrically at the bottom of the groove. The vortex channel is formed between the circumferential sidewall of the boss and the circumferential sidewall of the groove.

3. The whirlwind Bernoulli finger according to claim 2, characterized in that: An airflow guide block is also installed in the vortex channel, and the airflow guide block is arranged between the two connecting points formed by the airflow channel and the vortex channel.

4. The whirlwind Bernoulli finger according to claim 3, characterized in that: A touch pad is provided on the protrusion, and the surface of the touch pad protrudes from the surface of the finger body.

5. The whirlwind Bernoulli finger according to claim 4, characterized in that: The outer circular sidewall of the boss is provided with a slot along the axial direction for installing the airflow guide block, and the contact pad is used to press the airflow guide block.

6. The whirlwind Bernoulli finger according to claim 5, characterized in that: The finger body has a connecting hole through the boss on its opposite surface, and a connector for fixing the touch pad is provided in the connecting hole.

7. The whirlwind Bernoulli finger according to claim 4, characterized in that: The touch pad is made of anti-slip and anti-static material.

8. The whirlwind Bernoulli finger according to claim 1, characterized in that: The surface of the finger body is provided with at least one arc-shaped step for positioning the wafer.

9. The whirlwind Bernoulli finger according to claim 8, characterized in that: The surface of the finger body is provided with a mounting groove, which is located at the center of the arc-shaped step. A sensor for detecting whether the wafer is in place is installed in the mounting groove.

10. The whirlwind Bernoulli finger according to claim 8, characterized in that: The vortex channels are multiple and symmetrically distributed about the axis of symmetry of the arc-shaped steps.