Semiconductor film-coated carrier mounting structure

Abstract

The utility model discloses a kind of semiconductor film coating carrier mounting structures, including vacuum component being mounted on film coating machine workstation, detachably set on the vacuum component on film carrier, the film carrier is equipped with a plurality of limiting grooves for placing semiconductor, each the limiting groove is equipped with the receiving hole being communicated with the vacuum component, the top of the vacuum component is located in the receiving hole, base and adjusting mechanism are also equipped on film coating machine workstation, the vacuum component is fixed on film coating machine workstation by the base and is adjusted by the combination with the adjusting mechanism in horizontal position Micro-adjustment and limiting. Both can solve the two major core problems of semiconductor non-damage reliable fixation and self-adaptive fitting guarantee flatness, and the position of semiconductor can be accurately adjusted and limited, to adapt to the precision manufacturing of high-performance semiconductor film coating.

Description

Technical Field

[0001] This utility model relates to the technical field of coating machines, and specifically to a semiconductor coating carrier mounting structure. Background Technology

[0002] Semiconductors are key components in photonic energy cells (such as radioisotope cells), commonly used to convert energy generated from radioactive decay into electrical energy. During their manufacturing process, a coating process is typically performed on the semiconductor surface to form functional coatings (such as transducer materials, electrodes, or passivation layers). This coating process demands extremely high uniformity, consistency, and integrity of the coating; differences in the coating effect directly determine the final output performance, conversion efficiency, and long-term stability of the photonic energy cell.

[0003] In semiconductor coating processes, the semiconductor must be firmly and stably fixed to prevent displacement or vibration during coating, thus ensuring coating accuracy. Currently, the commonly used fixing methods are mechanical tray clamps or vacuum suction cup clamps. However, when the semiconductor is thin and small in area, the existing fixing methods have significant drawbacks, making them unable to meet the requirements of high-quality semiconductor coating. Specifically, this is reflected in the following two aspects: First, due to the inherent brittleness and low mechanical strength of semiconductors, when the wafer is thin (e.g., around 0.5mm), uneven or excessive clamping force applied when using a mechanical pallet can easily cause stress concentration at the wafer edges, leading to microcracks or even complete breakage. Similarly, uneven suction or excessively strong instantaneous suction during vacuum chuck adsorption can also cause invisible microscopic damage to the wafer, reducing product yield and increasing production costs.

[0004] Secondly, due to the microscopic undulations or warpage that may exist on the surface of semiconductors during fabrication or pre-processing, they are not perfectly flat. Existing rigid fixtures (whether trays or suction cups) cannot adaptively conform to such uneven surfaces. When fixing such wafers, local gaps may exist between the fixture and the back of the wafer, causing the wafer to experience internal stress or slight deformation in its fixed state. During coating, this uneven fixing state directly leads to regional differences in coating thickness, forming mottled or uneven film layers. This uneven coating can cause problems such as uneven current distribution, localized overheating, or efficiency degradation, severely degrading the overall performance and lifespan of the photonic energy cell.

[0005] Third, in the fabrication process of photonic energy cells, fluorescent enhancement materials need to be coated on both sides of the semiconductor. During the coating process, one side is coated first and then dried, followed by coating of the other side. When coating the second side, the already coated side needs to be fixed. When using structures such as suction cups for adsorption and fixation, if the adsorption is too tight, it may cause mechanical damage or interface peeling of the coated material layer; if the adsorption is too loose, it is easy to cause displacement or vibration of the semiconductor during the coating process, resulting in uneven coating, edge defects or thickness fluctuations, which seriously affect the coating quality and device performance. Even when the adsorption force is within the allowable range, there is still a problem that imprints are easily formed at the adsorption site, and these imprints become more obvious as the adsorption force increases.

[0006] Fourth, when coating semiconductors, the substrate needs to be precisely fixed in position to ensure the accuracy of the coating position. However, the existing mounting structure does not have enough adjustment direction or limiting structure when fine-tuning the horizontal position of the substrate and positioning it after adjustment. This makes position adjustment troublesome and the position can be affected by vibration and other reasons during operation, which will affect the coating range and reduce the product qualification rate. Summary of the Invention

[0007] In order to solve one or more technical problems existing in the prior art, the purpose of this application is to provide a semiconductor coating carrier mounting structure that can simultaneously solve the two core problems of non-destructive and reliable fixing of semiconductors and adaptive bonding to ensure flatness, and can also precisely adjust and limit the position of semiconductors to adapt to the precision manufacturing of high-performance semiconductor coatings.

[0008] To solve the aforementioned technical problems, this application adopts the following technical solution: A semiconductor coating carrier mounting structure includes a vacuum assembly mounted on a coating machine worktable and a detachable film carrier seat mounted on the vacuum assembly. The film carrier seat has several limiting grooves for placing semiconductors, and each limiting groove has a receiving hole communicating with the vacuum assembly. The top of the vacuum assembly is located in the receiving hole. The coating machine worktable also has a base and an adjustment mechanism. The vacuum assembly is fixed to the coating machine worktable by the base and its horizontal position is finely adjusted and limited by combination with the adjustment mechanism.

[0009] Preferably, the base includes a base plate, a plurality of support blocks disposed on the base plate, four fixing holes disposed on the base plate, and fixing bolts disposed in the fixing holes, wherein the diameter of the fixing bolts is smaller than the diameter of the fixing holes.

[0010] Preferably, the adjustment mechanism includes an L-shaped adjustment seat located on the outer side of the corner of the base plate and two adjustment bolts located on the L-shaped adjustment seat.

[0011] Preferably, the vacuum assembly includes a vacuum plate fixed on the base, a vacuum pipe arranged horizontally in the vacuum plate, a plurality of mounting holes on the upper end of the vacuum plate, and a detachable suction cup assembly arranged in the mounting holes. The vacuum assembly adsorbs the semiconductor by inserting the suction cup assembly into the receiving hole (6).

[0012] Preferably, the suction cup assembly includes a detachable fixed suction cup and a soft, breathable pad disposed on the fixed suction cup. The top of the soft, breathable pad passes through the storage hole and is located in the limiting groove. The semiconductor in the storage groove is supported by the soft, breathable pad and then adsorbed onto the fixed suction cup.

[0013] Preferably, the bottom of the carrier film holder is provided with several support feet, and the upper end surface of the carrier film holder is provided with several grooves, which are distributed on both sides of the limiting groove.

[0014] Preferably, each corner of the carrier film holder is provided with an H-shaped positioning hole, one end of the support foot is fixed to the bottom of the H-shaped positioning hole, and the top of the H-shaped positioning hole is used to limit the position of the support foot when the carrier film holders are stacked.

[0015] Preferably, the side of the vacuum plate is provided with a limiting groove, and at least one of the support feet of the carrier film seat is limited by the limiting groove.

[0016] Preferably, the vacuum plate is further provided with an upwardly protruding limiting block at both ends, and the limiting block is provided with a guide surface.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: When clamping and positioning semiconductors for coating, a negative pressure adsorption method is used for fixation, which can effectively avoid edge damage to the semiconductor itself caused by clamping. The combination of suction cups and soft, breathable pads can effectively prevent invisible microscopic damage to the semiconductor caused by suction force and the flatness of the supporting surface when adsorbed by suction cups. At the same time, it also avoids the problem of mechanical damage or interface peeling of the coated material layer that is easily caused by adsorption fixation using suction cups and other structures. This improves the product yield, reduces the presence of adsorption marks, and ensures uniform coating thickness distribution when coating both sides, without forming mottled or uneven film layers. It is suitable for coating most sheet materials that are inherently brittle and easily damaged. Attached Figure Description

[0018] Figure 1 This is a combined diagram of the present utility model; Figure 2 This is an exploded view of the present invention; Figure 3This is a schematic diagram of the internal structure of the vacuum component in this utility model, showing the distribution structure of the vacuum pumping pipeline; Figure 4 This is a schematic diagram of the suction cup assembly in this utility model; In the diagram: 1. Limiting block; 2. Support foot; 3. Carrier film holder; 4. Vacuum assembly; 41. Vacuum extraction pipeline; 411. Evacuation port; 412. Series hole; 413. Airflow channel; 42. Vacuum plate; 43. Mounting hole; 44. Suction cup assembly; 441. Fixed suction cup; 442. Soft breathable pad; 45. End cap; 5. Limiting groove; 6. Storage hole; 7. Base; 71. Base plate; 72. Supporting block; 73. Fixing hole; 74. Fixing bolt; 8. Adjustment mechanism; 81. L-shaped adjustment seat; 82. Adjustment bolt; 9. Limiting slot; 10. Groove; 11. Guide surface; 12. H-shaped positioning hole; 100. Semiconductor. Detailed Implementation

[0019] The present application will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0020] In the description of this application, it should be understood that the terms "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] The terms "first," "second," etc., used in this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class, without limiting the number of objects; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0022] like Figures 1-4As shown, a semiconductor coating carrier mounting structure includes a vacuum assembly 4 mounted on a coating machine worktable and a detachable film carrier seat 3 mounted on the vacuum assembly 4. The film carrier seat 3 is provided with a plurality of limiting grooves 5 for placing a semiconductor 100. Each limiting groove 5 is provided with a receiving hole 6 communicating with the vacuum assembly 4. The top of the vacuum assembly 4 is located in the receiving hole 6. The coating machine worktable is also provided with a base 7 and an adjustment mechanism 8. The vacuum assembly 4 is fixed to the coating machine worktable by the base 7 and is finely adjusted and limited in horizontal position by combination with the adjustment mechanism 8.

[0023] In actual production, the vacuum assembly 4 is precisely mounted on the coating machine's worktable via the base 7 and the adjustment mechanism 8. The base 7 allows for rapid horizontal adjustment within a certain range, while the adjustment mechanism 8 enables fine-tuning of the base 7's position (front, back, left, and right) under a certain clamping force, ensuring precise installation. The combination of the adjustment mechanism 8 and the base 7 allows for precise adjustment and fixation of the vacuum assembly 4 and the film carrier 3 on the coating machine's worktable, ensuring the semiconductor 100 maintains precise coating position during coating. Even when subjected to horizontal forces or vertical vibrations, there will be no positional shift. The vacuum assembly 4 is mounted on the base 7 and connected to a pump or other suction power equipment. The film carrier 3 is mounted on the vacuum assembly 4, with the suction portion of the vacuum assembly 4 extending into the limiting groove 5 through the receiving hole 6. When coating semiconductor 100 is required, semiconductor 100 is placed in limiting groove 5 for horizontal positioning. The vacuum level of vacuum component 4 is then controlled to ensure the bottom surface of semiconductor 100 is stably adhered to the plane formed by limiting groove 5 and vacuum component 4 for coating. After coating, the coated semiconductor 100 is directly detached from vacuum component 4 via film carrier 3 for drying. A new film carrier 3 is then used to fix the coating of semiconductor 100. Throughout the operation, the adsorption area of ​​vacuum component 4 protrudes upwards through receiving hole 6 to support the adsorption area. This solves both the problem of potential damage to semiconductor 100 after clamping and the problem of uneven bottom adhesion when using a suction cup structure for adsorption. This allows for reliable, damage-free fixation and self-adaptive adhesion to ensure flatness during coating, resulting in higher precision in semiconductor 100 coating.

[0024] A further improvement is made to the base 7, which includes a base plate 71, a plurality of support blocks 72 disposed on the base plate 71, four fixing holes 73 disposed on the base plate 71, and fixing bolts 74 disposed in the fixing holes 73, wherein the diameter of the fixing bolts 74 is smaller than the diameter of the fixing holes 73.

[0025] Vacuum plate 42 is mounted on support block 72, while base 7 is pressed and fixed on the worktable of coating machine by fixing bolt 74. Since the diameter of fixing bolt 74 is smaller than the diameter of fixing hole 73, base 7 can be finely adjusted on the worktable of coating machine, making it easier to adjust the position of semiconductor 100 and avoiding uneven coating caused by semiconductor 100 being placed tilted.

[0026] A further improvement is made to the adjustment mechanism 8, which includes an L-shaped adjustment seat 81 located on the outer side of the corner of the base plate 71 and two adjustment bolts 82 located on the L-shaped adjustment seat 81.

[0027] L-shaped adjusting seats 81 are fixed to the coating machine worktable by screws, etc. The base plate 71 is installed between the four L-shaped adjusting seats 81. The adjusting bolts 82 on both sides abut against the sides of the base plate 71. By adjusting the adjusting bolts 82, the position of the base plate 71 can be finely adjusted. When the base plate 71 is moved into position, the horizontal direction of the base plate 71 can be limited by tightening the adjusting bolts. And the upper and lower limits can be achieved by pressing the fixing bolts 74, so that it is firmly and accurately installed on the coating machine worktable.

[0028] Further improvements based on any of the above embodiments are as follows: the vacuum assembly 4 includes a vacuum plate 42 fixed on the base 7, a vacuum pipe 41 arranged horizontally in the vacuum plate 42, a plurality of mounting holes 43 provided on the upper end of the vacuum plate 42, and a detachable suction cup assembly 44 provided in the mounting holes 43. The vacuum assembly 4 is inserted into the receiving hole (6) through the suction cup assembly 44 to adsorb the semiconductor 100.

[0029] An interconnected vacuum tube 41 is formed inside the vacuum plate 42, and the suction cup assembly 44 is connected to the vacuum tube 41 after being installed in the mounting hole 43. This makes it more convenient to perform adsorption and inflation operations on multiple suction cup assemblies 44. Furthermore, since the vacuum tube 41 is located inside the vacuum plate 42, it has better concealment, and the number of air tubes can be reduced to a minimum. In particular, the suction cup assembly 44 is detachably connected to the mounting hole 43, making replacement easier and less costly when the suction cup assembly 44 is damaged.

[0030] A further improvement is made in that the suction cup assembly 44 includes a detachable fixed suction cup 441 and a soft breathable pad 442 disposed on the fixed suction cup 441. The top of the soft breathable pad 442 passes through the storage hole 6 and is located in the limiting groove 5. The semiconductor 100 in the storage groove is supported by the soft breathable pad 442 and then adsorbed onto the fixed suction cup 441.

[0031] A self-adaptive suction cup assembly 44 is formed by combining a fixed suction cup 441 and a soft, breathable pad 442. The bottom of the fixed suction cup 441 is inserted into the mounting hole 43 for fixation, and a soft silicone sleeve can be used to form a sealed connection between the two. A soft, breathable pad 442 is installed on the fixed suction cup 441, so that when the suction cup assembly 44 is inserted into the receiving hole 6, the top surface of the soft, breathable pad 442 is slightly raised into the limiting groove 5. The soft, breathable pad 442 and the receiving hole 6 are in a gap fit. When the semiconductor 100 is inserted, the bottom is supported by the soft, breathable pad 442 and limited by the limiting groove 5. The suction cup assembly 44 uses the fixed suction cup 441 to seal and maintain the structure, and the soft, breathable pad 442 to provide ventilation and self-adaptive fit. The two materials each perform their respective functions to achieve safe and reliable fixation. When coating is required, the semiconductor 100 is vacuumed by the suction cup assembly 44 and then pressed firmly against the bottom of the limiting groove 5. Simultaneously, the downward pressure of the semiconductor 100 causes the soft, breathable pad 442 to self-adjust, thus creating a stable planar support effect for the bottom of the semiconductor 100 through the soft, breathable pad 442 and the limiting groove 5. The suction force generated by the fixed suction cup 441 stably adheres and fixes the semiconductor 100, ensuring that there are no suction marks on the surface of the semiconductor 100, and preventing stress damage to the semiconductor 100 due to height differences in the suction cup area.

[0032] A further improvement is that the fixed suction cup 441 is a hollow and sealed soft material, and the soft breathable pad 442 has a strength greater than that of the fixed suction cup 441.

[0033] The combination of a fixed suction cup 441 and a soft, breathable pad 442, made of a soft material, enables the suction cup assembly 44 to have an adaptive function. The strength of the fixed suction cup 441 is greater than that of the soft, breathable pad 442, allowing the suction cup assembly 44 to adaptively expand and contract according to the thickness and flatness of the semiconductor 100, ensuring that the bottom of the semiconductor 100 is flatly attached to the limiting groove 5. The soft, breathable pad 442 is preferably made of sponge, and the fixed suction cup 441 is preferably made of silicone. Under the action of negative pressure adsorption, the microstructure of the soft, breathable pad 442 will compress and deform, perfectly fitting any minor unevenness that may exist on the back of the semiconductor 100, resulting in a more uniform distribution of adsorption force. This avoids damage to the workpiece (such as the semiconductor) caused by localized stress concentration points during the coating process. The deformation of the silicone fixed suction cup 441 to adapt to the unevenness of the vacuum assembly 4 and eliminate stress concentration better protects brittle workpieces such as semiconductors. The strength of the fixed suction cup 441 is greater than that of the soft breathable pad 442, which facilitates support and also improves the service life of the suction cup assembly 44.

[0034] A further improvement is made to the vacuum pipeline 41, which includes several horizontally arranged airflow channels 413, a longitudinally arranged series hole 412, and an air extraction hole 411. The airflow channels 413 adopt a countersunk hole structure, and the series hole 412 adopts a countersunk hole or through hole structure. Several airflow channels 413 are connected through the series hole 412. One end of the air extraction hole 411 is connected to the series hole 412. The end of the series hole 412 is provided with a plug 45. Several mounting holes 43 are connected to each of the branch pipelines.

[0035] The airflow channels 413 and the series holes 412 are arranged in a crisscross pattern. Multiple airflow channels 413 can be interconnected through the series holes 412, and their ends are sealed with plugs 45. This allows for rapid air extraction from all suction cup assemblies 44 using only one extraction tube during extraction, creating negative pressure. The number of extraction tubes is small, resulting in a simple structure. The airflow channels 413 employ a countersunk hole structure. During extraction, the internal airflow enters the extraction hole 411 along the series holes 412 and is extracted, achieving the suction effect of the installed suction cup assemblies 44. When extraction stops, each airflow channel 413 is rapidly inflated through an opening at one end to create normal pressure, allowing the semiconductor 100 to release immediately upon extraction stop. This achieves stable air pressure within the suction cup assemblies 44 without active inflation, preventing the semiconductor 100 from failing to detach in time.

[0036] The series hole 412 is located in the middle of the vacuum plate 42 along its length. When the vacuum plate 42 is relatively short and easy to drill, a countersunk hole is preferred. When the channel is long, a through-hole structure can be formed by opening holes at both ends. The airflow channel 413 extends along its width, with multiple airflow channels 413 distributed in parallel. This allows the airflow channels 413 to intersect and connect with the series hole 412 after being opened, facilitating airflow. The countersunk hole structure reduces the vacuum pressure required for evacuation. The evacuation hole 411 is located near the middle and connects with the series hole 412. During evacuation, it allows for more uniform airflow extraction from the airflow channels 413 on both sides. To ensure evacuation efficiency, the ends of the series hole 412 are sealed with plugs 45. Generally, one airflow channel 413 corresponds to 2 to 4 mounting holes 43, and each limiting groove 5 has an airflow channel 413 at its bottom. When adsorbing and fixing the semiconductor 100, multiple suction cup assemblies 44 are used for adsorption and fixing, effectively ensuring the adhesion.

[0037] A further improvement is that the bottom of the film carrier 3 is provided with several support feet 2, and the upper end surface of the film carrier 3 is provided with several grooves 10, which are distributed on both sides of the limiting groove 5.

[0038] To facilitate handling by operators when inserting and removing the semiconductor 100, downward-facing recesses 10 are formed on both sides of each limiting groove 5. These recesses 10 allow for easy gripping of both sides of the semiconductor 100, facilitating temporary replacement. This effectively solves the problem of difficulty in removing a damaged semiconductor 100 after it has been placed in the limiting groove 5. Furthermore, several support feet 2 are symmetrically provided at the bottom of the film carrier 3. When disassembled, the support feet 2 allow the film carrier 3 to be suspended in the air, making it easier to handle, especially after subsequent drying.

[0039] A further improvement is made in that each corner of the carrier film holder 3 is provided with an H-shaped positioning hole 12, one end of the support foot 2 is fixed to the bottom of the H-shaped positioning hole 12, and the top of the H-shaped positioning hole 12 is used to limit the support foot 2 when the carrier film holder 3 is stacked.

[0040] H-shaped positioning holes are formed at the four corners of the carrier film holder 3. The top of the support foot 2 is inserted into the bottom of the H-shaped positioning hole for fixation. The bottom can adopt a threaded hole structure. The support foot 2 is more secure after being connected by threads. The top of the H-shaped positioning hole is recessed and can be used as a limit. When multiple carrier film holders 3 are stacked, the support foot 2 can be inserted to achieve a firm fixation and avoid the problem of tipping over during the stacking process.

[0041] A further improvement is that the side of the vacuum plate 42 is provided with a limiting groove 9, and at least one of the support feet 2 of the carrier film seat 3 is limited by the limiting groove 9.

[0042] When the carrier film holder 3 is installed on the vacuum plate 42, it can be quickly positioned by inserting the support foot 2 into the limiting slot 9. The vacuum plate 42 has a recessed limiting slot 9 on both sides, with the limiting slot 9 located in the middle. The bottom side of the carrier film holder 3 has three support feet 2, and the middle support foot 2 is inserted into the limiting slots 9 on both sides for quick positioning.

[0043] The vacuum plate 42 is provided with an upwardly protruding limiting block 1 at both ends, and the limiting block 1 is provided with a guide surface 11.

[0044] During the installation of the carrier film holder 3, as the middle support foot 2 is inserted along the limiting slot 9, after being inserted to a certain height, the two sides can be quickly guided by the guide surface 11 and accurately stacked onto the vacuum plate 42. After installation, the limiting blocks 1 on both sides can be used for positioning to avoid shaking or displacement.

[0045] The above embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of protection of this application. Any non-substantial changes and substitutions made by those skilled in the art based on this application shall fall within the scope of protection claimed by this application.

Claims

1. A semiconductor coating carrier mounting structure, characterized in that: The system includes a vacuum assembly (4) mounted on the worktable of a coating machine and a detachable film carrier (3) mounted on the vacuum assembly (4). The film carrier (3) has several limiting grooves (5) for placing semiconductors (100). Each limiting groove (5) has a receiving hole (6) communicating with the vacuum assembly (4). The top of the vacuum assembly (4) is located in the receiving hole (6). The worktable of the coating machine is also provided with a base (7) and an adjustment mechanism (8). The vacuum assembly (4) is fixed to the worktable of the coating machine by the base (7) and its horizontal position is finely adjusted and limited by the combination with the adjustment mechanism (8).

2. The semiconductor coating carrier mounting structure according to claim 1, characterized in that: The base (7) includes a base plate (71), a plurality of support blocks (72) provided on the base plate (71), four fixing holes (73) provided on the base plate (71), and fixing bolts (74) provided in the fixing holes (73), wherein the diameter of the fixing bolts (74) is smaller than the diameter of the fixing holes (73).

3. The semiconductor coating carrier mounting structure according to claim 2, characterized in that: The adjustment mechanism (8) includes an L-shaped adjustment seat (81) located on the outer side of the corner of the base plate (71) and two adjustment bolts (82) located on the L-shaped adjustment seat (81).

4. A semiconductor coating carrier mounting structure according to any one of claims 1 to 3, characterized in that: The vacuum assembly (4) includes a vacuum plate (42) fixed on the base (7), a vacuum tube (41) arranged horizontally in the vacuum plate (42), a plurality of mounting holes (43) on the upper end of the vacuum plate (42), and a suction cup assembly (44) detachably arranged in the mounting holes (43). The vacuum assembly (4) adsorbs the semiconductor (100) by inserting the suction cup assembly (44) into the receiving hole (6).

5. The semiconductor coating carrier mounting structure according to claim 4, characterized in that: The suction cup assembly (44) includes a detachable fixed suction cup (441) and a soft breathable pad (442) disposed on the fixed suction cup (441). The top of the soft breathable pad (442) passes through the storage hole (6) and is located in the limiting groove (5). The semiconductor (100) in the limiting groove (5) is supported by the soft breathable pad (442) and then adsorbed onto the fixed suction cup (441).

6. The semiconductor coating carrier mounting structure according to claim 5, characterized in that: The bottom of the film carrier (3) is provided with several support feet (2), and the upper surface of the film carrier (3) is provided with several grooves (10), which are distributed on both sides of the limiting groove (5).

7. The semiconductor coating carrier mounting structure according to claim 6, characterized in that: The corners of the carrier film holder (3) are provided with H-shaped positioning holes (12). One end of the support foot (2) is fixed to the bottom of the H-shaped positioning hole (12). The top of the H-shaped positioning hole (12) is used to limit the support foot (2) when the carrier film holder (3) is stacked.

8. The semiconductor coating carrier mounting structure according to claim 7, characterized in that: The side of the vacuum plate (42) is provided with a limiting groove (9), and at least one of the support feet (2) of the carrier film seat (3) is limited by the limiting groove (9).

9. A semiconductor coating carrier mounting structure according to claim 8, characterized in that: The vacuum plate (42) is also provided with an upwardly protruding limiting block (1) at both ends, and the limiting block (1) is provided with a guide surface (11).

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