Semiconductor wafer paster

Abstract

The utility model discloses a kind of semiconductor wafer patching devices, it relates to electronic product processing technical field, the device includes support block, the inside of support block is equipped with first electric push rod, the inside of support block is slidably connected with limiting rod around;The periphery of support block is equipped with four adjusting assemblies, the adjusting assembly includes support frame, the periphery of support block is installed in support frame, the inside of support frame is equipped with second electric push rod, the output end of second electric push rod is equipped with sliding frame, sliding frame is slidably connected in the inside of support frame, the side of sliding frame is equipped with second electric turntable.The utility model is cooperated by vacuum assembly and adsorption assembly, to facilitate the stable adsorption fixation of semiconductor wafer, avoid the problem that single suction cup adsorption firmness and stability are not good, simultaneously avoid the problem that falling occurs in adsorption process, improve the practicality and convenience of the device.

Description

Technical Field

[0001] This utility model relates to the field of electronic product processing technology, specifically a semiconductor wafer mounting device. Background Technology

[0002] In the upstream processing of sapphire wafers, the common practice is to attach the sapphire wafers to a ceramic disk using a wax solution. In automated attachment processes, a crucial step is ensuring the wax-coated wafer is properly adhered to the ceramic disk. Traditionally, a right-angled metal rod with a central through-hole connects to a suction cup to hold the uncoated side of the wafer, which is then rotated 180° to press the wax-coated wafer surface onto the ceramic disk.

[0003] Existing patent CN213988855U discloses a semiconductor wafer mounting device, including a base, a slide rail mounted on the base, a slider that slides back and forth above the slide rail, a lifting cylinder mounted above the slider, and a mounting assembly mounted above the lifting cylinder. The mounting assembly includes a circular rotating seat. This invention reduces the scrap rate of semiconductor wafers.

[0004] However, this mounting device still has some drawbacks. During use, the stability is poor because it only uses suction cups to adsorb semiconductor wafers, and the adsorption force of a single suction cup is not strong enough, which can easily cause the semiconductor wafer to fall off. In addition, although the device is easy to adsorb semiconductor wafers, it is not easy for the suction cups to detach from the semiconductor wafers, thus affecting its use.

[0005] Based on this, a semiconductor wafer mounting device is now provided, which can eliminate the drawbacks of existing devices. Utility Model Content

[0006] The purpose of this invention is to provide a semiconductor wafer mounting device to solve the problems of insufficient convenience and poor adsorption effect in the prior art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A semiconductor wafer mounting device includes a support block, a first electric push rod installed inside the support block, and limit rods slidably connected around the inside of the support block;

[0009] Four adjustment components are installed around the support block. Each adjustment component includes a support frame, which is installed around the support block. A second electric actuator is installed inside the support frame. A sliding frame is installed at the output end of the second electric actuator. The sliding frame is slidably connected inside the support frame. A second electric turntable is installed on one side of the sliding frame. A connecting block is installed on one side of the second electric turntable.

[0010] Four support components are installed on both sides of the connecting block;

[0011] A vacuum assembly is installed on the top of the connecting block.

[0012] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0013] In one alternative: a support plate is mounted on the output end of the first electric actuator, and the support plate is connected to the bottom of the limiting rod.

[0014] In one alternative: a movable component is mounted on the bottom of the support plate.

[0015] In one alternative: the moving component includes a first electric turntable mounted on the bottom of a support plate, a sliding block mounted on the bottom of the first electric turntable, the sliding block being slidably connected inside an electric slide rail, and a base plate mounted on the bottom of the electric slide rail.

[0016] In one alternative: the support component includes a fixing frame, which is installed on both sides of the connecting block, and the fixing frame has sliding holes inside.

[0017] In one alternative: the vacuum assembly includes a negative pressure pump mounted on top of the connecting block, a high-pressure hose installed at the inlet end of the negative pressure pump, and two vacuum tubes installed on both sides of the high-pressure hose, the vacuum tubes being slidably connected inside a sliding hole.

[0018] In one alternative: an adsorption assembly is installed at the bottom of the vacuum tube.

[0019] In one alternative embodiment: the adsorption assembly includes a support ring mounted at the bottom of a vacuum tube, a spring mounted at the top of the support ring, a bellows mounted at the bottom of the support ring, and a suction cup mounted at the bottom of the bellows.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] 1. This utility model uses a combination of vacuum components and adsorption components to facilitate the stable adsorption and fixation of semiconductor wafers, avoiding the problems of poor adsorption strength and stability of a single suction cup, and preventing the problem of detachment during adsorption. This improves the practicality and convenience of the device, making it easier to adsorb and release semiconductor wafers.

[0022] 2. This utility model, through the coordinated use of the adjustment component, support component, and moving component, facilitates the adjustment of the adsorption component, thereby improving the practicality of the device and making it easier to perform chip mounting on semiconductor wafers. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0024] Figure 2 This is a schematic diagram of the support block and the moving component of this utility model.

[0025] Figure 3 This is a schematic diagram of the adjustment component and support component of this utility model.

[0026] Figure 4 This is a schematic diagram of the vacuum component and adsorption component of this utility model.

[0027] Figure reference numerals: 1. Support block; 11. First electric actuator; 12. Limiting rod; 13. Support plate; 14. First electric turntable; 15. Sliding block; 16. Electric slide rail; 17. Base plate; 2. Support frame; 21. Second electric actuator; 22. Sliding frame; 23. Second electric turntable; 24. Connecting block; 25. Fixing frame; 26. Sliding hole; 3. Negative pressure pump; 31. High-pressure hose; 32. Vacuum tube; 33. Support ring; 34. Spring; 35. Corrugated pipe; 36. Suction cup. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0029] In one embodiment, such as Figure 1 - Figure 4 As shown, a semiconductor wafer mounting device includes a support block 1, a first electric push rod 11 is installed inside the support block 1, and limit rods 12 are slidably connected around the inside of the support block 1.

[0030] Four adjustment components are installed around the support block 1. Each adjustment component includes a support frame 2, which is installed around the support block 1. A second electric actuator 21 is installed inside the support frame 2. A sliding frame 22 is installed at the output end of the second electric actuator 21. The sliding frame 22 is slidably connected inside the support frame 2. A second electric turntable 23 is installed on one side of the sliding frame 22. A connecting block 24 is installed on one side of the second electric turntable 23.

[0031] Four support components are installed on both sides of the connecting block 24;

[0032] A vacuum assembly is installed on the top of the connecting block 24.

[0033] In this embodiment, the operation of the first electric push rod 11 drives the support block 1 to rise and fall, and the limit rod 12 limits the support block 1, thereby improving the stability of the device. The operation of the second electric push rod 21 causes the sliding frame 22 to slide inside the support frame 2, so as to adjust the position of the adsorption component. The operation of the second electric turntable 23 drives the connecting block 24 to rotate, thereby improving the convenience and practicality of the device.

[0034] In one embodiment, such as Figure 1 and Figure 2 As shown, a support plate 13 is installed at the output end of the first electric actuator 11. The support plate 13 is connected to the bottom of the limiting rod 12 and is supported by the support plate 13.

[0035] In one embodiment, such as Figure 1 and Figure 2 As shown, a movable component is installed at the bottom of the support plate 13, which allows for adjustment of the device's position.

[0036] In one embodiment, such as Figure 1 and Figure 2 As shown, the moving component includes a first electric turntable 14, which is mounted on the bottom of the support plate 13. A sliding block 15 is mounted on the bottom of the first electric turntable 14, and the sliding block 15 is slidably connected to the inside of the electric slide rail 16. A base plate 17 is mounted on the bottom of the electric slide rail 16, which supports the bottom of the device. The operation of the electric slide rail 16 drives the sliding block 15 to slide and adjust its position inside the slide rail. The electric turntable 14 drives the support block 1 to rotate and adjust its position.

[0037] In one embodiment, such as Figure 1 and Figure 3 As shown, the support assembly includes a fixed frame 25, which is installed on both sides of the connecting block 24. The fixed frame 25 has a sliding hole 26 inside, through which the vacuum tube 32 slides.

[0038] In one embodiment, such as Figure 1 , Figure 3 and Figure 4 As shown, the vacuum assembly includes a negative pressure pump 3, which is installed on the top of the connecting block 24. A high-pressure hose 31 is installed at the air inlet end of the negative pressure pump 3. Two vacuum tubes 32 are installed on both sides of the high-pressure hose 31. The vacuum tubes 32 are slidably connected inside the sliding hole 26. The connection between the high-pressure hose 31 and the vacuum tubes 32 facilitates the evacuation of the vacuum tubes 32. The vacuum tubes 32 are connected to the corrugated pipe 35 and the suction cup 36, thereby generating negative pressure inside the suction cup 36.

[0039] In one embodiment, such as Figure 1 and Figure 4 As shown, an adsorption assembly is installed at the bottom of the vacuum tube 32, which adsorbs and clamps the semiconductor wafer.

[0040] In one embodiment, such as Figure 1 and Figure 4 As shown, the adsorption assembly includes a support ring 33, which is installed at the bottom of the vacuum tube 32. A spring 34 is installed at the top of the support ring 33, and a bellows 35 is installed at the bottom of the support ring 33. A suction cup 36 is installed at the bottom of the bellows 35. By contracting the spring 34, the vacuum tube 32 slides upward inside the sliding hole 26, which has a buffering effect.

[0041] The above embodiment discloses a semiconductor wafer mounting device, wherein the operation of the electric slide rail 16 causes the sliding block 15 to slide inside, thereby adjusting the position of the sliding block 15. The operation of the first electric turntable 14 on the top of the sliding block 15 causes the adsorption component to rotate. The operation of the first electric push rod 11 adjusts the height of the adsorption component. The limiting rod 12, which is slidably connected around the inside of the support block 1, limits the support block 1, improving the stability of the lifting and lowering of the support block 1. The support block 1 supports four adjustment components. The operation of the second electric push rod 21 inside the support frame 2 pushes the sliding frame 22 to slide inside the support frame 2, so as to adjust the position of the adsorption component. The operation of the second electric turntable 23 drives the adsorption component to rotate 180 degrees. The device rotates to facilitate the mounting of semiconductor wafers. Four suction cups 36 adhere to the adhesive-free side of the semiconductor wafer, improving the stability of the wafer clamping. The contraction of the bellows 35 and spring 34 provides a buffering effect, preventing damage to the semiconductor wafer due to excessive pressure. The contraction of spring 34 allows the vacuum tube 32 to slide within the sliding hole 26 inside the fixing frame 25, thus providing a limiting effect. The operation of the negative pressure pump 3 creates a vacuum inside the vacuum tube 32 through the high-pressure hose 31, drawing air into the suction cups 36 and improving the adhesion between the suction cups 36 and the semiconductor wafer. After the negative pressure pump 3 is turned off, air enters the suction cups 36, causing the semiconductor wafer to detach. This enhances the convenience and practicality of the device.

[0042] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A semiconductor wafer mounting apparatus, comprising a support block (1), characterized in that, The support block (1) is equipped with a first electric push rod (11), and a limit rod (12) is slidably connected around the inside of the support block (1); Four adjustment components are installed around the support block (1). Each adjustment component includes a support frame (2). The support frame (2) is installed around the support block (1). A second electric push rod (21) is installed inside the support frame (2). A sliding frame (22) is installed at the output end of the second electric push rod (21). The sliding frame (22) is slidably connected inside the support frame (2). A second electric turntable (23) is installed on one side of the sliding frame (22). A connecting block (24) is installed on one side of the second electric turntable (23). Four support components are installed on both sides of the connecting block (24); A vacuum assembly is mounted on the top of the connecting block (24).

2. The semiconductor wafer mounting apparatus according to claim 1, characterized in that, The output end of the first electric actuator (11) is equipped with a support plate (13), which is connected to the bottom of the limiting rod (12).

3. A semiconductor wafer mounting apparatus according to claim 2, characterized in that, A movable component is installed at the bottom of the support plate (13).

4. A semiconductor wafer mounting apparatus according to claim 3, characterized in that, The moving component includes a first electric turntable (14) which is mounted on the bottom of a support plate (13). A sliding block (15) is mounted on the bottom of the first electric turntable (14). The sliding block (15) is slidably connected to the inside of an electric slide rail (16). A base plate (17) is mounted on the bottom of the electric slide rail (16).

5. A semiconductor wafer mounting apparatus according to claim 1, characterized in that, The support assembly includes a fixing frame (25), which is installed on both sides of the connecting block (24), and a sliding hole (26) is provided inside the fixing frame (25).

6. A semiconductor wafer mounting apparatus according to claim 1, characterized in that, The vacuum assembly includes a negative pressure pump (3), which is installed on the top of the connecting block (24). A high-pressure hose (31) is installed at the air inlet end of the negative pressure pump (3). Two vacuum tubes (32) are installed on both sides of the high-pressure hose (31). The vacuum tubes (32) are slidably connected inside the sliding hole (26).

7. A semiconductor wafer mounting apparatus according to claim 6, characterized in that, An adsorption assembly is installed at the bottom of the vacuum tube (32).

8. A semiconductor wafer mounting apparatus according to claim 7, characterized in that, The adsorption assembly includes a support ring (33) which is installed at the bottom of the vacuum tube (32). A spring (34) is installed at the top of the support ring (33), and a bellows (35) is installed at the bottom of the support ring (33). A suction cup (36) is installed at the bottom of the bellows (35).

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