Heat sink, heat dissipation structure and chip module

Abstract

The application provides a heat sink, a heat dissipation structure and a chip module. The heat sink comprises a one-way vibration assembly and a heat conduction piece. One side of the heat conduction piece is used for being connected with a heat generating piece. The one-way vibration assembly is connected to the side of the heat conduction piece away from the heat generating piece. A cavity is arranged between the one-way vibration assembly and the heat conduction piece, and the cavity is used for containing a cooling medium. The one-way vibration assembly is used for driving the cooling medium in the cavity to flow. The heat sink of the application connects the heat conduction piece with the heat generating piece, so that the heat of the heat generating piece can be quickly conducted to the heat conduction piece, and the heat conduction piece can quickly spread the heat generated by the heat generating piece to the cavity. Meanwhile, the one-way vibration of the one-way vibration assembly is utilized to make the cooling medium flow in one direction quickly. Therefore, the cooling medium can quickly take away the heat generated by the heat generating piece, and the heat dissipation efficiency of the heat sink is improved.

Description

Technical Field

[0001] This application relates to the field of chip heat dissipation technology, specifically to heat sinks, heat dissipation structures, and chip modules. Background Technology

[0002] With the continuous advancement of integrated circuit manufacturing processes, the integration density and computing speed of chips have significantly improved, and their power density has increased exponentially. Especially in fields such as high-performance computing, artificial intelligence, and 5G communications, the heat flux density of chips has exceeded 100W / cm², and the temperature of local hot spots can even reach over 150°C. If heat cannot be dissipated in time, it will lead to chip performance degradation (such as frequency reduction), decreased reliability (such as accelerated electromigration), and even permanent thermal damage.

[0003] Currently, heat sinks remain the mainstream solution for chip cooling. However, the heat dissipation efficiency of heat sinks in related technologies needs improvement. Utility Model Content

[0004] Embodiments of this application provide a heat sink, a heat dissipation structure, and a chip module.

[0005] In a first aspect, embodiments of this application provide a heat sink, including a unidirectional vibration assembly and a heat-conducting element. One side of the heat-conducting element is connected to a heat-generating element, and the unidirectional vibration assembly is connected to the side of the heat-conducting element opposite to the heat-generating element. A cavity is provided between the unidirectional vibration component and the heat-conducting component, the cavity being used to contain a cooling medium; The unidirectional vibration component is used to drive the flow of cooling medium within the cavity.

[0006] In one embodiment, the heat-conducting element includes a first diamond film, one side of which is connected to the heating element, and the side of the first diamond film opposite to the heating element is arranged with the unidirectional vibration assembly to form the cavity.

[0007] In one embodiment, the unidirectional vibration component includes a piezoelectric thin film disposed opposite to the first diamond film, and a cavity is formed between the piezoelectric thin film and the first diamond film. The side of the first diamond film facing away from the piezoelectric thin film is used to connect with the heating element.

[0008] In one embodiment, the unidirectional vibration component includes a piezoelectric film and a second diamond film, wherein the piezoelectric film is stacked on the second diamond film.

[0009] In one embodiment, the unidirectional vibration component further includes a transition layer located between the piezoelectric film and the second diamond film, the transition layer connecting the piezoelectric film and the second diamond film.

[0010] In one embodiment, the transition layer is made of at least one of ternary transition metal borides, titanium, and titanium oxide.

[0011] In one embodiment, the heat sink further includes a bracket disposed between the unidirectional vibration component and the heat-conducting element, so that the cavity is formed between the unidirectional vibration component and the heat-conducting element.

[0012] In one embodiment, the heat-conducting element has a flow channel formed on the side facing the unidirectional vibration assembly, and the flow channel and the unidirectional vibration assembly surround to form at least a portion of the cavity.

[0013] In one embodiment, the heat-conducting element has a plurality of flow channels, and the unidirectional vibration component includes a plurality of piezoelectric films. At least one piezoelectric film is disposed at each flow channel, and the piezoelectric film is used to drive the flow of cooling medium within the flow channel.

[0014] In one embodiment, the heat-conducting element has an input channel, the inlet of the flow channel is connected to the input channel, and the input channel is used to connect the flow channel to the outside world so that external cooling medium can enter the flow channel through the input channel.

[0015] In one embodiment, multiple flow channels arranged side by side are provided on both sides of the input channel.

[0016] In one embodiment, the piezoelectric film is provided at the inlet of the flow channel; and / or, The piezoelectric film is located at the middle position of the flow channel; and / or, The piezoelectric film is provided at the outlet of the flow channel.

[0017] In one embodiment, the thickness of the thermally conductive element is between 80 μm and 120 μm; and / or, Along the thickness direction of the heat-conducting component, the depth of the flow channel is between 40 μm and 60 μm.

[0018] In one embodiment, the heat sink further includes a protective layer located on the same side of the heat-conducting element as the unidirectional vibration component, and the protective layer covers at least one of the unidirectional vibration component and the heat-conducting element.

[0019] Secondly, embodiments of this application provide a heat dissipation structure for use in a heat sink, comprising a piezoelectric thin film and a second diamond film, wherein the piezoelectric thin film is stacked on the second diamond film, and the piezoelectric thin film can vibrate unidirectionally so that the heat dissipation structure can be used to drive the cooling medium to flow unidirectionally.

[0020] In one embodiment, the heat dissipation structure further includes a transition layer located between the piezoelectric thin film and the second diamond film, the transition layer connecting the piezoelectric thin film and the second diamond film.

[0021] Thirdly, embodiments of this application provide a chip module, including a heat-generating component and a heat sink as described above, wherein the heat-generating component includes a chip, and the chip is connected to the heat-conducting component.

[0022] The beneficial effects of the embodiments of this application are as follows: In the embodiments of this application, the heat-conducting component is connected to the heat-generating component, so that the heat from the heat-generating component can be conducted to the cavity through the heat-conducting component. The unidirectional vibration component drives the cooling medium within the cavity to flow unidirectionally, which can quickly remove heat from the cavity and the heat from the heat-conducting component, improving the heat dissipation efficiency of the heat-generating component. In other words, this application connects the heat-conducting component to the heat-generating component, allowing the heat from the heat-generating component to be quickly conducted to the heat-conducting component, ensuring that the heat-conducting component can quickly diffuse the heat generated by the heat-generating component into the cavity. Simultaneously, the unidirectional vibration of the unidirectional vibration component causes the cooling medium to flow rapidly in one direction, allowing the cooling medium to quickly remove the heat generated by the heat-generating component, thereby improving the heat dissipation efficiency of the radiator. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the heat sink provided in an embodiment of this application; Figure 2 This is a schematic diagram illustrating the application of the heat sink provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of a unidirectional vibration component provided in an embodiment of this application; Figure 4 This is an exploded view of the structure of the heat sink provided in an embodiment of this application. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0026] The following is combined with Figures 1 to 4 This application describes the heat sink, heat dissipation structure, and chip module.

[0027] According to the embodiments of the first aspect of this application, such as Figure 1 and Figure 2 The radiator includes a unidirectional vibration component 1 and a heat-conducting component 2. One side of the heat-conducting component 2 is used to connect to the heating element 3, and the unidirectional vibration component 1 is connected to the side of the heat-conducting component 2 away from the heating element 3.

[0028] A cavity 4 is provided between the unidirectional vibration component 1 and the heat-conducting component 2, and the cavity 4 is used to contain the cooling medium.

[0029] The unidirectional vibration component 1 is used to drive the flow of the cooling medium inside the cavity 4.

[0030] According to the heat sink of this application embodiment, the heat-conducting element 2 is connected to the heat-generating element 3, so the heat of the heat-generating element 3 can be conducted to the cavity 4 through the heat-conducting element 2. The unidirectional vibration assembly 1 drives the cooling medium inside the cavity 4 to flow unidirectionally, which can quickly remove the heat inside the cavity 4 and the heat from the heat-conducting element 2, improving the heat dissipation efficiency of the heat-generating element 3. In other words, this application connects the heat-conducting element 2 and the heat-generating element 3, allowing the heat from the heat-generating element 3 to be quickly conducted to the heat-conducting element 2, ensuring that the heat-conducting element 2 can quickly diffuse the heat generated by the heat-generating element 3 to the cavity 4. Simultaneously, the unidirectional vibration of the unidirectional vibration assembly 1 causes the cooling medium to flow rapidly in one direction, allowing the cooling medium to quickly remove the heat generated by the heat-generating element 3, thereby improving the heat dissipation efficiency of the heat sink.

[0031] It is understandable that when the heat sink of this application is applied to the chip field, that is, when the heat-generating component 3 is a chip, the technical solution of this application can effectively improve the heat dissipation speed of the chip and avoid the chip from experiencing performance degradation or even damage due to excessive temperature.

[0032] It is understandable that the cavity 4 has a corresponding inlet and outlet, and the cooling medium can enter the cavity 4 from the inlet and leave the cavity 4 from the outlet.

[0033] In some examples, a cavity 4 is provided between the unidirectional vibration component 1 and the heat-conducting component 2. This can mean that the heat-conducting component 2 has a cavity 4 formed therein, and the cavity 4 is located between the unidirectional vibration component 1 and the heat-conducting component 2; it can also mean that the unidirectional vibration component 1 has a cavity 4 formed therein, and the cavity 4 is located between the unidirectional vibration component 1 and the heat-conducting component 2; it can also mean that both the unidirectional vibration component 1 and the heat-conducting component 2 have cavities 4 formed therein, and the cavity 4 of the unidirectional vibration component 1 is connected to the cavity 4 of the heat-conducting component 2; or it can mean that a cavity 4 is formed between the unidirectional vibration component 1 and the heat-conducting component 2, and the cavity 4 is independent of the unidirectional vibration component 1 and the heat-conducting component 2.

[0034] In some examples, the cooling medium can be a gas, a liquid, or any other suitable cooling medium.

[0035] In some embodiments, such as Figure 1 and Figure 2 The heat-conducting component 2 includes a first diamond film 21, one side of which is connected to the heating element 3, and the side of the first diamond film 21 facing away from the heating element 3 is arranged with the unidirectional vibration component 1 to form the cavity 4.

[0036] Understandably, attaching the first diamond film 21 to the heating element 3 allows the first diamond film 21 to quickly diffuse the heat generated by the heating element 3, transferring the heat generated by the heating element 3 to the first diamond film 21 and the cavity 4. Meanwhile, the unidirectional vibration component 1 can drive the cooling medium in the cavity 4 to flow rapidly, thereby quickly removing the heat in the cavity 4 and the heat on the first diamond film 21. This ensures that the heat generated by the heating element 3 can be continuously and quickly transferred to the first diamond film 21, guaranteeing the heat dissipation speed of the heating element 3.

[0037] In some embodiments, such as Figure 1 and Figure 2 The unidirectional vibration component 1 includes a piezoelectric film 11, which is disposed opposite to the first diamond film 21. A cavity 4 is formed between the piezoelectric film 11 and the first diamond film 21. The side of the first diamond film 21 facing away from the piezoelectric film 11 is used to connect with the heating element 3.

[0038] It is understandable that the piezoelectric thin film 11 can vibrate unidirectionally through the piezoelectric effect or the inverse piezoelectric effect, and the vibration frequency can reach the KHZ to GHZ level. This allows the piezoelectric thin film 11 to drive the cooling medium in the cavity 4 to flow rapidly, so that the cooling medium can flow quickly through the first diamond film 21, and can quickly dissipate the heat at the first diamond film 21, thereby achieving rapid heat dissipation of the heat-generating component 3.

[0039] In some embodiments, such as Figure 3 The unidirectional vibration component 1 includes a piezoelectric film 11 and a second diamond film 12, wherein the piezoelectric film 11 is stacked on the second diamond film 12.

[0040] It is understandable that the piezoelectric film 11 and the second diamond film 12 are stacked together to form a unidirectional vibration component 1. The piezoelectric film 11 can vibrate unidirectionally to drive the flow of the cooling medium in the cavity 4, while the diamond film has high stability, which is beneficial to improving the overall structural stability of the unidirectional vibration component 1, so that the unidirectional vibration component 1 can stably drive the flow of the cooling medium in the cavity 4.

[0041] In some examples, the piezoelectric film 11 is disposed opposite to the first diamond film 21, and the second diamond film 12 is located on the side of the piezoelectric film 11 away from the first diamond film 21.

[0042] In some examples, the second diamond film 12 is disposed opposite to the first diamond film 21, and the piezoelectric film 11 is located on the side of the second diamond film 12 away from the first diamond film 21.

[0043] In some embodiments, such as Figure 3 The unidirectional vibration component 1 further includes a transition layer 13, which is located between the piezoelectric film 11 and the second diamond film 12, and connects the piezoelectric film 11 and the second diamond film 12.

[0044] It is understandable that, due to the differences in interface thermal resistance, mechanical stress, and coefficient of thermal expansion between the piezoelectric film 11 and the second diamond film 12, adding one or more transition layers 13 between the piezoelectric film 11 and the second diamond film 12 can reduce and disperse stress, thereby enabling the unidirectional vibration component 1 to achieve stable operation at a sustained high frequency.

[0045] Specifically, the transition layer 13 is made of at least one of ternary transition metal borides, titanium, and titanium oxide.

[0046] In some examples, the material of the transition layer 13 is, for example, Fe2AlB2, Ti, or TiO2.

[0047] In some embodiments, such as Figure 1 and Figure 2 The radiator also includes a bracket 5, which is disposed between the unidirectional vibration component 1 and the heat-conducting component 2, so that the cavity 4 is formed between the unidirectional vibration component 1 and the heat-conducting component 2.

[0048] It is understandable that the bracket 5 separates the unidirectional vibration component 1 and the heat-conducting component 2, so that a cavity 4 is formed between the unidirectional vibration component 1 and the heat-conducting component 2. A cooling medium can then be placed between the unidirectional vibration component 1 and the heat-conducting component 2. The unidirectional vibration component 1 can drive the cooling medium to flow, so that the cooling medium can carry away the heat at the heat-conducting component 2, thereby achieving rapid heat dissipation of the heat-generating component 3.

[0049] In some embodiments, such as Figure 2 and Figure 4 The heat-conducting component 2 has a flow channel 22 on the side facing the unidirectional vibration component 1, and the flow channel 22 and the unidirectional vibration component 1 surround to form at least part of the cavity 4.

[0050] It is understandable that the flow channel 22 of the heat conductor 2 can be used to contain the cooling medium, so that the cooling medium can flow along the flow channel 22, which is beneficial for the cooling medium to carry away the heat of the heat conductor 2 and improve the heat dissipation speed of the heat conductor 2.

[0051] It is understandable that a flow channel 22 is formed at the heat-conducting component 2, and the flow channel 22 and the unidirectional vibration component 1 are arranged to form a cavity 4, that is, the unidirectional vibration component 1 is attached to the heat-conducting component 2, thereby improving the structural compactness of the heat sink and facilitating the miniaturization design of the heat sink.

[0052] In some examples, the unidirectional vibration component 1 can cover part of the flow channel 22, that is, the unidirectional vibration component 1 and the part of the flow channel 22 enclose a partial cavity 4, and the flow channel 22 not covered by the unidirectional vibration component 1 constitutes another part of the cavity 4.

[0053] In some examples, the unidirectional vibration component 1 can completely cover the flow channel 22, that is, the unidirectional vibration component 1 and the entire flow channel 22 enclose the entire cavity 4.

[0054] In some embodiments, such as Figure 2 and Figure 4 The heat-conducting component 2 has a plurality of flow channels 22, and the unidirectional vibration component 1 includes a plurality of piezoelectric films 11. At least one piezoelectric film 11 is provided at each flow channel 22. The piezoelectric film 11 is used to drive the cooling medium in the flow channel 22 to flow.

[0055] It is understandable that by forming multiple flow channels 22 at the heat-conducting component 2, the cooling medium can flow at different flow channels 22, which is beneficial to improving the heat dissipation speed of the heat-conducting component 2, and thus improving the heat dissipation speed of the heat-generating component 3.

[0056] By providing a piezoelectric film 11 at each flow channel 22, it is ensured that the cooling medium in each flow channel 22 can flow under the unidirectional vibration of the piezoelectric film 11, thus ensuring the heat dissipation speed of the heat-conducting component 2.

[0057] In some examples, multiple piezoelectric films 11 correspond one-to-one with multiple flow channels 22, that is, a piezoelectric film 11 is provided at each flow channel 22.

[0058] In some examples, the number of piezoelectric films 11 is greater than the number of channels 22, that is, at least two piezoelectric films 11 are provided at least some of the channels 22.

[0059] In some embodiments, such as Figure 2 and Figure 4 The heat-conducting component 2 has an input channel 23. The inlet of the flow channel 22 is connected to the input channel 23. The input channel 23 is used to connect the flow channel 22 with the outside world so that the cooling medium from the outside world can enter the flow channel 22 through the input channel 23.

[0060] It is understandable that by providing an input channel 23 at the heat-conducting component 2, cooling medium can be introduced into the input channel 23. Since the inlet of the flow channel 22 is connected to the input channel 23, the cooling medium can enter the flow channel 22 from the input channel 23.

[0061] If the unidirectional vibration component 1 is installed in the flow channel 22, the unidirectional vibration component 1 can drive the cooling medium in the flow channel 22 to flow away from the input channel 23, so that the cooling medium in the input channel 23 can continuously flow into the flow channel 22, so that the cooling medium can quickly remove the heat of the heat-conducting component 2.

[0062] Specifically, such as Figure 4 The input channel 23 has multiple flow channels 22 arranged side by side on both sides.

[0063] Understandably, by providing multiple flow channels 22, the heat dissipation rate of the heat-conducting component 2 can be increased. At the same time, the parallel arrangement of multiple flow channels 22 helps to improve the uniformity of heat dissipation of the heat-conducting component 2.

[0064] In some examples, multiple side-by-side flow channels 22 are evenly spaced to ensure the uniformity of heat dissipation of the heat-conducting component 2.

[0065] In some embodiments, the piezoelectric film 11 is provided at the inlet of the flow channel 22; and / or, The piezoelectric film 11 is provided at the middle position of the flow channel 22; and / or, The piezoelectric film 11 is provided at the outlet of the flow channel 22.

[0066] It is understood that a piezoelectric film 11 can be provided at the inlet and / or the middle position and / or the outlet of the flow channel 22, so that the piezoelectric film 11 can drive the cooling medium in the flow channel 22 to flow.

[0067] In some examples, piezoelectric films 11 can be provided at at least two of the following locations: the inlet of the flow channel 22, the middle of the flow channel 22, and the outlet of the flow channel 22. This is beneficial to increase the flow velocity of the cooling medium in the flow channel 22, thereby increasing the heat dissipation rate of the heat conductor 2.

[0068] In some embodiments, the thickness of the heat-conducting element 2 is between 80 μm and 120 μm; and / or, Along the thickness direction of the heat-conducting component 2, the depth of the flow channel 22 is between 40 μm and 60 μm.

[0069] It is understandable that if the thickness of the heat-conducting component 2 is less than 80um, it will easily lead to insufficient structural strength of the heat-conducting component 2; if the thickness of the heat-conducting component 2 is greater than 120um, it will easily lead to excessive volume of the heat sink; therefore, in this embodiment, the thickness of the heat-conducting component 2 is set between 80um and 120um.

[0070] It is understandable that if the depth of the flow channel 22 is less than 40um, the depth is too small and it is easy to affect the heat dissipation speed of the heat conductor 2; if the depth of the flow channel 22 is greater than 60um, it is easy to affect the structural stability of the heat conductor 2; therefore, in this embodiment, the depth of the flow channel 22 is set between 40um and 60um.

[0071] In some embodiments, such as Figure 2 and Figure 4 The heat sink further includes a protective layer 6, which is located on the same side of the heat-conducting element 2 as the unidirectional vibration component 1, and the protective layer 6 covers at least one of the unidirectional vibration component 1 and the heat-conducting element 2.

[0072] Understandably, the protective layer 6 can protect the unidirectional vibration component 1 and / or the heat-conducting component 2.

[0073] In some examples, the protective layer 6 completely covers both the unidirectional vibration component 1 and the heat-conducting component 2, thus protecting both simultaneously.

[0074] In some examples, the protective layer 6 is, for example, a mask (e.g., a yttrium oxide film or a thin film made of diamond) or a rigid layer (e.g., a hard shell).

[0075] According to an embodiment of the second aspect of this application, such as Figure 3 The heat dissipation structure is applied to the heat sink. The heat dissipation structure includes a piezoelectric film 11 and a second diamond film 12. The piezoelectric film 11 is stacked on the second diamond film 12. The piezoelectric film 11 can vibrate unidirectionally so that the heat dissipation structure can be used to drive the cooling medium to flow unidirectionally.

[0076] According to the heat dissipation structure of the embodiment of this application, the piezoelectric film 11 and the second diamond film 12 are stacked together to form a heat dissipation structure. The diamond film has high stability, which is beneficial to improving the overall structural stability of the heat dissipation structure, so that the heat dissipation structure can stably drive the flow of the cooling medium.

[0077] In some embodiments, such as Figure 3 The heat dissipation structure further includes a transition layer 13, which is located between the piezoelectric film 11 and the second diamond film 12, and connects the piezoelectric film 11 and the second diamond film 12.

[0078] It is understandable that, due to the differences in interface thermal resistance, mechanical stress, and coefficient of thermal expansion between the piezoelectric film 11 and the second diamond film 12, adding one or more transition layers 13 between the piezoelectric film 11 and the second diamond film 12 can reduce and disperse stress, thereby enabling the unidirectional vibration component 1 to achieve stable operation at a sustained high frequency.

[0079] According to the embodiments of the third aspect of this application, such as Figure 2 The chip module includes a heat-generating component 3 and the aforementioned heat sink. The heat-generating component 3 includes a chip, which is connected to the heat-conducting component 2.

[0080] According to the chip module of this application, the heat-conducting component 2 is connected to the heat-generating component 3, so the heat from the heat-generating component 3 can be conducted to the cavity 4 through the heat-conducting component 2. The unidirectional vibration component 1 drives the cooling medium inside the cavity 4 to flow unidirectionally, which can quickly remove the heat from the cavity 4 and the heat from the heat-conducting component 2, improving the heat dissipation efficiency of the heat-generating component 3. In other words, this application connects the heat-conducting component 2 and the heat-generating component 3, allowing the heat from the heat-generating component 3 to be quickly conducted to the heat-conducting component 2, ensuring that the heat-conducting component 2 can quickly diffuse the heat generated by the heat-generating component 3 to the cavity 4. Simultaneously, the unidirectional vibration of the unidirectional vibration component 1 causes the cooling medium to flow rapidly in one direction, which can quickly remove the heat generated by the heat-generating component 3, improving the heat dissipation efficiency of the heat sink and thus ensuring the chip's heat dissipation speed. This can prevent the chip from experiencing performance degradation or even damage due to excessive temperature.

[0081] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A radiator, characterized in that, It includes a unidirectional vibration component and a heat-conducting component. One side of the heat-conducting component is used to connect to a heating element, and the unidirectional vibration component is connected to the side of the heat-conducting component opposite to the heating element. A cavity is provided between the unidirectional vibration component and the heat-conducting component, the cavity being used to contain a cooling medium; The unidirectional vibration component is used to drive the flow of the cooling medium inside the cavity; The heat-conducting component includes a first diamond film, one side of which is connected to the heating element. The side of the first diamond film facing away from the heating element and the unidirectional vibration assembly form the cavity. The unidirectional vibration assembly includes a piezoelectric film, which is disposed opposite to the first diamond film. The cavity is formed between the piezoelectric film and the first diamond film. The side of the first diamond film facing away from the piezoelectric film is used to connect to the heating element; and / or, The unidirectional vibration component includes a piezoelectric film and a second diamond film, wherein the piezoelectric film is stacked on the second diamond film.

2. The radiator according to claim 1, characterized in that, The unidirectional vibration component further includes a transition layer located between the piezoelectric film and the second diamond film, and the transition layer connects the piezoelectric film and the second diamond film.

3. The radiator according to claim 2, characterized in that, The transition layer is made of one of the following materials: ternary transition metal borides, titanium, and titanium oxide.

4. The radiator according to any one of claims 1 to 3, characterized in that, The radiator also includes a bracket, which is disposed between the unidirectional vibration component and the heat-conducting component, so that the cavity is formed between the unidirectional vibration component and the heat-conducting component.

5. The radiator according to any one of claims 1 to 3, characterized in that, The heat-conducting component has a flow channel formed on the side facing the unidirectional vibration assembly, and the flow channel and the unidirectional vibration assembly surround to form at least part of the cavity.

6. The radiator according to claim 5, characterized in that, The heat-conducting component has multiple flow channels, and the unidirectional vibration component includes multiple piezoelectric films. At least one piezoelectric film is provided at each flow channel, and the piezoelectric film is used to drive the flow of cooling medium in the flow channel.

7. The radiator according to claim 5, characterized in that, The heat-conducting component has an input channel, and the inlet of the flow channel is connected to the input channel. The input channel is used to connect the flow channel with the outside world so that the cooling medium from the outside world can enter the flow channel through the input channel.

8. The radiator according to claim 7, characterized in that, Multiple flow channels are arranged side by side on both sides of the input channel.

9. The radiator according to claim 6, characterized in that, The piezoelectric film is provided at the inlet of the flow channel; and / or, The piezoelectric film is located at the middle position of the flow channel; and / or, The piezoelectric film is provided at the outlet of the flow channel.

10. The radiator according to claim 5, characterized in that, The thickness of the thermally conductive component is between 80µm and 120µm; and / or, Along the thickness direction of the heat-conducting component, the depth of the flow channel is between 40 μm and 60 μm.

11. The radiator according to claim 5, characterized in that, The heat sink also includes a protective layer located on the same side of the heat-conducting element as the unidirectional vibration component, and the protective layer covers at least one of the unidirectional vibration component and the heat-conducting element.

12. A heat dissipation structure, characterized in that, The device is used in heat sinks and includes a piezoelectric film and a second diamond film. The piezoelectric film is stacked on the second diamond film. The piezoelectric film can vibrate in one direction so that the heat dissipation structure can be used to drive the cooling medium to flow in one direction.

13. The heat dissipation structure according to claim 12, characterized in that, The heat dissipation structure further includes a transition layer located between the piezoelectric film and the second diamond film, and the transition layer connects the piezoelectric film and the second diamond film.

14. A chip module, characterized in that, It includes a heat-generating element and a heat sink as described in any one of claims 1 to 11, wherein the heat-generating element includes a chip connected to the heat-conducting element.

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