A packaging structure and a power conversion device

Abstract

The application provides a packaging structure and a power conversion device. The packaging structure comprises a metal cold plate and at least one embedded structure unit. Any embedded structure unit is stacked with the metal cold plate. Any embedded structure unit comprises a substrate and at least one pre-packaging body embedded in the substrate. Any pre-packaging body comprises an insulating bottom plate, an electronic element and a heat-conducting metal plate. The electronic element and the heat-conducting metal plate are arranged on two sides of the thickness direction of the insulating bottom plate respectively. The surface of the heat-conducting metal plate, which is away from the insulating bottom plate, is exposed to the surface of the substrate, which faces the metal cold plate. The heat-conducting metal plate comprises a heat-conducting flow channel, which is isolated from the surface of the heat-conducting metal plate, which faces the insulating bottom plate. The metal cold plate is connected with any heat-conducting metal plate. The metal cold plate comprises a cooling flow channel, which is communicated with the heat-conducting flow channel of any heat-conducting metal plate to form a cooling loop for the circulation of a cooling working medium. The packaging structure is used to enhance the heat dissipation capacity of the module.

Description

Technical Field

[0001] This application relates to the field of packaging structure technology, and in particular to a packaging structure and a power conversion device. Background Technology

[0002] Compared to traditional wire bonding (WB) interconnects, embedded interconnects can shorten interconnect paths and thermal links, improving system parasitics and thermal resistance. Embedded component packaging (ECP) technology is used to embed electronic components within a substrate, enabling higher power levels, more compact designs, and greater integration depth.

[0003] In embedded electronic component packaging, thermal coupling between laminates exists between electronic components in different layers, resulting in low thermal conductivity of the package. Utility Model Content

[0004] This application provides a packaging structure and a power conversion device to enhance the heat dissipation capability of the module and increase power density.

[0005] In a first aspect, embodiments of this application provide a packaging structure, which includes a metal cold plate and at least one embedded structural unit, wherein any embedded structural unit is stacked with the metal cold plate; any embedded structural unit includes a substrate and at least one pre-packaged body embedded in the substrate; any pre-packaged body includes an insulating base plate, electronic components, and a thermally conductive metal plate, wherein the electronic components and the thermally conductive metal plate are respectively disposed on both sides of the insulating base plate in the thickness direction, and the surface of the thermally conductive metal plate facing away from the insulating base plate is exposed above the surface of the substrate facing the metal cold plate, the thermally conductive metal plate includes a thermally conductive channel, and the thermally conductive channel is isolated from the surface of the thermally conductive metal plate facing the insulating base plate; the metal cold plate is connected to any one of the thermally conductive metal plates, and the metal cold plate includes a cooling channel, the cooling channel being connected to the thermally conductive channel of any one of the thermally conductive metal plates to form a cooling circuit for the flow of cooling working fluid.

[0006] In the above packaging structure, any pre-packaged component can dissipate heat through a circulating cooling system using a metal cold plate. In this heat transfer path, the cooling medium can penetrate into the interior of the pre-packaged component, shortening the heat transfer path, reducing thermal resistance, and thus improving heat transfer efficiency. The connection between the thermally conductive metal plate and the metal cold plate reduces the number of thermal interfaces and the use of traditional thermal interface materials during heat dissipation, avoiding the defects associated with traditional thermal interface materials. It also reduces the module volume in the thickness direction of the substrate, which is beneficial for device miniaturization design. The connection between the thermally conductive metal plate and the metal cold plate can form a metal-metal barrier, which is simpler, easier to implement, and has good sealing properties. This reduces the penetration and diffusion of the cooling medium, preventing it from intruding into electronic components or other circuit structures and causing electrical risks.

[0007] In one embodiment, each heat-conducting channel includes an inlet and an outlet, both located on the surface of the heat-conducting metal plate facing away from the insulating base plate. The cooling channel includes at least one pair of connection ports, each pair used to connect to the inlet and outlet of a heat-conducting channel. A cold metal plate can cool a heat-conducting channel through a pair of connection ports, ensuring sufficient cooling fluid flows within each channel. Heat-conducting channels of different heat-conducting metal plates can be arranged in parallel. For schemes involving adding a pre-encapsulated body and dissipating heat from the added pre-encapsulated body, additional structures are required, offering strong scalability, wider application range, and easier implementation.

[0008] In one embodiment, a pair of sealing rings are provided between any one of the heat-conducting metal plates and the cold metal plate. One of the sealing rings is located between one of the connection ports and the inlet of the heat-conducting channel, and the other sealing ring is located between the other connection port and the outlet of the heat-conducting channel. Sealing the connection between the heat-conducting channel and the cooling channel separately can improve the sealing performance of the cooling circuit formed by the pre-packaged body and the cold metal plate.

[0009] In one embodiment, a sealing ring is provided between any pre-packaged component and the heat-conducting metal plate, the sealing ring surrounding the heat-conducting metal plate. This seals the entire cooling circuit formed by the pre-packaged component and the cold metal plate, improving the airtightness of the cooling circuit. The sealing ring and sealing ring effectively form a double seal between the pre-packaged component and the cold metal plate, further enhancing the airtightness of the cooling circuit.

[0010] In one embodiment, a capillary bottom filler is used to fill the gap between any pre-packaged body and the metal cold plate. The capillary bottom filler can flow into the gap between the pre-packaged body and the metal cold plate by capillary action, thereby achieving the purpose of filling and sealing.

[0011] In one embodiment, along the thickness direction of the substrate, the orthographic projection of the heat-conducting channel in any pre-packaged component onto the insulating substrate at least partially overlaps with the electronic component. This can further reduce the heat dissipation path of the electronic component and improve the heat dissipation effect. The heat exchange area between the cooling medium in the heat-conducting channel and the heat-conducting metal plate can also be increased, thereby improving the heat exchange capacity.

[0012] In one embodiment, the heat-conducting channel includes multiple sub-channels distributed along the thickness direction of the substrate, with any two adjacent sub-channels interconnected. This gives the heat-conducting channel a three-dimensional structure, increasing the inner surface area of ​​the heat-conducting channel and thus increasing the heat exchange area between the heat-conducting channel and the cooling medium to improve heat dissipation.

[0013] In one embodiment, each sub-channel includes multiple spaced-apart holes, and the holes in adjacent sub-channels are staggered along a direction parallel to the insulating substrate; two holes in the same sub-channel are connected through one or more holes in an adjacent sub-channel. This thermally conductive metal layer can be fabricated using additive manufacturing, formed by stacking multiple perforated plate structures, resulting in a more complex thermally conductive channel that improves heat dissipation.

[0014] In one embodiment, any pre-packaged body includes a connecting metal layer disposed on the surface of an insulating substrate facing away from a thermally conductive metal plate, and electronic components are disposed on the connecting metal layer; along the thickness direction of the substrate, the thickness of the thermally conductive metal plate is greater than the thickness of the connecting metal layer. The connecting metal layer is used for circuit connection of electronic components, and the greater thickness of the thermally conductive metal plate than the connecting metal layer facilitates the formation of heat conduction channels.

[0015] In one embodiment, the radial dimension of each hole is greater than 1 mm in the inner part parallel to the substrate, so as to keep the cooling working fluid flowing smoothly in the heat conduction channel.

[0016] In one embodiment, any metal cold plate includes a top plate, a bottom plate, and a connecting plate, which are stacked sequentially along the thickness direction of the substrate. The top plate is used to connect the pre-packaged body and includes at least one pair of first through holes, each of which penetrates the top plate along the thickness direction of the substrate. Any pair of first through holes serves as a pair of connection ports. The connecting plate includes a hollow structure that penetrates the connecting plate along the thickness direction of the substrate. The hollow structure, together with the top and bottom plates, forms a cooling channel. The multi-layer plate structure of the metal cold plate can realize various forms of cooling channels, facilitating its fabrication.

[0017] In one embodiment, the metal cold plate is cooled by an external cold source. The base plate includes a pair of second through holes, each second through hole penetrating the base plate along the thickness direction of the substrate, and the pair of second through holes are used to connect to the external cold source.

[0018] In one embodiment, any one of the embedded structural units includes multiple pre-packaged bodies arranged in a rectangular or ring array in a plane parallel to the substrate. This regular arrangement of the pre-packaged bodies facilitates the design of the cooling circuit's liquid path.

[0019] In one embodiment, the packaging structure includes two embedded structural units, with a metal cold plate stacked between the two embedded structural units along the thickness direction of the substrate. The pre-packaged components in the two embedded structural units can share the metal cold plate for heat dissipation, and the heat dissipation path between the pre-packaged components and the metal cold plate in the two embedded structural units is relatively short, which can improve the heat dissipation effect.

[0020] Secondly, this application provides a power conversion device comprising multiple packaging structures as described in the first aspect above, with cooling circuits of at least two packaging structures connected together. Multiple packaging structures can be cooled by a single external cold source, thus optimizing the cooling structure design.

[0021] In one embodiment, at least two package structures are stacked along the thickness direction of the substrate. This can improve the power and integration of the power conversion device, and also makes it easier to miniaturize the device.

[0022] The specific implementation of the power conversion device provided in this application embodiment can refer to the implementation in the packaging structure of the first aspect above, and the repeated parts will not be described again. Attached Figure Description

[0023] Figure 1a This is a schematic diagram of the structure of an electric vehicle provided in an embodiment of this application;

[0024] Figure 1b A schematic diagram of the connection structure of a powertrain for an electric vehicle provided in an embodiment of this application;

[0025] Figure 2 This is a cross-sectional structural schematic diagram of a power conversion device provided in an embodiment of this application;

[0026] Figure 3a This is a cross-sectional view of a packaging structure provided in an embodiment of this application;

[0027] Figure 3b This is a cross-sectional view of a packaging structure provided in an embodiment of this application;

[0028] Figure 4a This is a cross-sectional view of a packaging structure provided in an embodiment of this application;

[0029] Figure 4b This is a cross-sectional view of a packaging structure provided in an embodiment of this application;

[0030] Figure 5 This is a schematic diagram of the structure of a thermally conductive metal plate for an encapsulation structure provided in an embodiment of this application;

[0031] Figure 6a A cross-sectional schematic diagram of a thermally conductive metal plate for an encapsulation structure provided in an embodiment of this application;

[0032] Figure 6b A cross-sectional schematic diagram of a thermally conductive metal plate for an encapsulation structure provided in an embodiment of this application;

[0033] Figure 6c A cross-sectional schematic diagram of a thermally conductive metal plate for an encapsulation structure provided in an embodiment of this application;

[0034] Figure 7a A schematic diagram of a perforated plate structure of a thermally conductive metal plate for an embodiment of this application;

[0035] Figure 7b This is a schematic diagram of a stacked two-layer perforated plate structure of a thermally conductive metal plate for an embodiment of the present application.

[0036] Figure 7c This is a schematic diagram of a stacked two-layer perforated plate structure of a thermally conductive metal plate for an embodiment of the present application.

[0037] Figure 7d This is a schematic diagram of a stacked two-layer perforated plate structure of a thermally conductive metal plate for an embodiment of the present application.

[0038] Figure 8a This is a schematic diagram of the structure of a thermally conductive metal plate for an encapsulation structure provided in an embodiment of this application;

[0039] Figure 8b This is a cross-sectional view of a packaging structure provided in an embodiment of this application;

[0040] Figure 9a This is a schematic diagram of the structure of a metal cold plate with a packaging structure provided in an embodiment of this application;

[0041] Figure 9b An exploded view of a metal cold plate with a packaging structure provided in an embodiment of this application;

[0042] Figure 10a This is a cross-sectional view of a packaging structure provided in an embodiment of this application;

[0043] Figure 10b This is a schematic diagram of a cooling circuit for a packaging structure provided in an embodiment of this application;

[0044] Figure 10cThis is a schematic diagram of a cooling circuit for a packaging structure provided in an embodiment of this application;

[0045] Figure 10d This is a schematic diagram of a cooling circuit for a packaging structure provided in an embodiment of this application;

[0046] Figure 11a This is a schematic diagram of a cooling circuit for a packaging structure provided in an embodiment of this application;

[0047] Figure 11b This is a schematic diagram of a cooling circuit for a packaging structure provided in an embodiment of this application;

[0048] Figure 12 This is a cross-sectional structural schematic diagram of a power conversion device provided in an embodiment of this application;

[0049] Figure 13a This is a schematic diagram of a cooling circuit for a packaging structure provided in an embodiment of this application;

[0050] Figure 13b This is a schematic diagram of a cooling circuit for a packaging structure provided in an embodiment of this application;

[0051] Figure 14 This is a cross-sectional view of a packaging structure provided in an embodiment of this application;

[0052] Figure 15 This is a cross-sectional structural schematic diagram of a power conversion device provided in an embodiment of this application.

[0053] Figure label:

[0054] 1000 - Powertrain; 2000 - Transmission mechanism; 3000 - Wheels; 4000 - Power battery;

[0055] 100 - Motor controller; 200 - Motor;

[0056] 10, 10a, 10b, 10c, 10d, 10e - Package structures;

[0057] 1-Metal cold plate; 11-Top plate; 111-First through hole; 12-Connecting part; 121-Hollow structure; 13-Bottom plate; 131-Second through hole; 2-Pre-packaged body; 21-Insulating base plate; 22-Electronic component; 23-Heat-conducting metal plate; 231-Protrusion; 232-Bottom layer; 24-Connecting metal layer; 25-Interconnection structure; 26-Connector; 27-Molding material; 3-Substrate; 31-Sealing ring; 32-Sealing ring;

[0058] d0, d01, d02 - Holes; d1 - Inlet; d2 - Outlet; t - Connection port; K - External port; D - Heat conduction channel; D0 - Sub-channel; L1 - First channel; L2 - Second channel; T - Cooling channel; T1 - Cooling delivery channel; T10 - Main cooling channel; T101 - Cooling branch channel; T102 - Annular cooling channel; T11 - Cooling sub-channel; T2 - Cooling return channel; T20 - Main cooling channel; T201 - Cooling branch channel; T202 - Annular cooling return channel; T21 - Cooling return channel; V - Module unit. Detailed Implementation

[0059] Embedded electronic component packaging technology is used to embed electronic components such as capacitors, resistors and chips inside a substrate. This can shorten the connection path between components, reduce transmission loss, improve product integration, reduce module size, and improve product reliability and electrothermal performance. However, because embedding technology reduces the thermal conductivity of the package, the heat dissipation capability of embedded packaging faces challenges in applications with high power and high voltage requirements.

[0060] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0061] It should be noted that the same reference numerals in the accompanying drawings of this application denote the same or similar structures, and therefore repeated descriptions of them will be omitted. Terms expressing position and direction described in this application are illustrative based on the accompanying drawings, but may be modified as needed, and all such modifications are included within the scope of protection of this application. The accompanying drawings of this application are for illustrating relative positional relationships only and do not represent actual scale.

[0062] Figure 1a This is a schematic diagram of the structure of an electric vehicle provided as an embodiment of this application. Figure 1a As shown, the electric vehicle includes a powertrain 1000, a transmission mechanism 2000, and wheels 3000. The powertrain 1000 drives the wheels 3000 through the transmission mechanism 2000. The powertrain 1000 converts electrical energy into mechanical energy. The transmission mechanism 2000 connects the powertrain 1000 and the wheels 3000. It should be understood that other major functional components of this electric vehicle can be implemented using existing technology, and therefore will not be described further here.

[0063] like Figure 1b As shown, the powertrain 1000 includes a motor controller 100 and a motor 200. The motor controller 100 receives DC power from the power battery 4000 and outputs AC power to the motor 200. The motor 200 receives the AC power output from the motor controller 100 and drives the wheels 3000 of the electric vehicle.

[0064] This application provides a power conversion device that can be used to convert electrical energy. It should be understood that the motor controller 100 described above is one specific implementation of the power conversion device.

[0065] In one embodiment, the power conversion device includes, as shown below: Figure 2 The packaging structure 10 shown includes a substrate 3, a metal cold plate 1, and at least one pre-packaged body 2, which is embedded in the substrate 3. The pre-packaged body 2 includes power electronic devices such as power chips. The substrate 3 and the at least one pre-packaged body 2 embedded in the substrate 3 can form an embedded structural unit, which is stacked with the metal cold plate 1.

[0066] The package structure 10 is used to realize power conversion. The power electronic devices in the pre-package 2 included in the package structure 10 are used for electrical connection to form a functional circuit. Specifically, it can be used to realize the function of AC to DC, DC to AC, or high voltage DC to low voltage DC. The pre-package 2 is embedded in the substrate 3, which can improve power and integration, and also makes it easier to achieve device miniaturization.

[0067] During the operation of the power conversion device, the power electronic devices in the pre-package 2 generate heat. Thermal coupling between different power electronic devices in an embedded power conversion device can lead to low thermal conductivity. The heat dissipation capacity of the pre-package 2 affects the high-voltage compatibility, current-carrying capacity, and thermal performance of the power conversion device. The packaging structure 10 provided in this embodiment is equipped with a metal cold plate 1, which can be used to dissipate heat from the pre-package 2.

[0068] like Figure 3aA cross-sectional view of a packaging structure 10 is provided, which can dissipate heat through a circulating cooling medium. In one embodiment, the packaging structure 10 includes at least one pre-packaged body 2, with one pre-packaged body 2 being used as an example. Any pre-packaged body 2 includes an insulating base plate 21, an electronic component 22, and a thermally conductive metal plate 23. Along the thickness direction of the substrate 3, the electronic component 22 and the thermally conductive metal plate 23 are respectively disposed on both sides of the insulating base plate 21 in the thickness direction, and the two are insulated by the insulating base plate 21. The thermally conductive metal plate 23 includes a thermally conductive channel D, which is isolated from the surface of the thermally conductive metal plate 23 facing the insulating base plate 21, and the thermally conductive channel D does not contact the insulating base plate 21. The thermally conductive channel D has an inlet d1 and an outlet d2, both of which are located on the surface of the thermally conductive metal plate 23 away from the insulating base plate 21. Correspondingly, the metal cold plate 1 includes a cooling channel T, which is connected to the inlet d1 and outlet d2 of the heat-conducting channel D to form a cooling circuit for the flow of cooling medium. When the cooling medium flows in the cooling circuit, it can carry away the heat of the pre-encapsulated body 2 to achieve heat dissipation. The position and arrangement of the inlet d1 and outlet d2 of the heat-conducting channel D are only examples.

[0069] like Figure 3a As shown, the electronic components 22 in the pre-packaged body 2 generate heat during operation, and the heat can be dissipated through, for example, by means of... Figure 3a The dashed arrows indicate that the heat transfer occurs sequentially to the insulating base plate 21 and the thermally conductive metal plate 23. When the cooling medium flows within the thermally conductive channel D, it can contact the thermally conductive metal plate 23 for heat exchange, thereby carrying away the heat generated by the electronic components 22 in the pre-packaged body 2, achieving heat dissipation for the pre-packaged body 2. In this heat transfer chain, the cooling medium enters the internal structure of the pre-packaged body 2, which can shorten the heat transfer path, reduce thermal resistance, and thus improve the heat transfer effect. The connection between the thermally conductive metal plate 23 and the metal cold plate 1 reduces the number of thermal interfaces and the application of traditional thermal interface materials during heat dissipation, avoiding the defects associated with the use of traditional thermal interface materials. It also reduces the module volume in the thickness direction of the substrate 3, which is beneficial for device miniaturization design. The structural integration of the thermally conductive metal plate 23 and the metal cold plate 1 can form a metal barrier with metal-metal connection, which is simpler, easier to implement, and has good sealing performance. This can reduce the penetration and diffusion of the cooling medium, preventing the cooling medium from intruding into the electronic components 22 or other circuit structures and causing electrical risks.

[0070] In one embodiment, the metal cold plate 1 includes at least a pair of connection ports t, each connection port t communicating with the cooling channel T and the surface of the metal cold plate 1 facing the heat-conducting metal plate 23. Figure 3aAs shown, the surface of the thermally conductive metal plate 23 of the pre-encapsulated body 2 facing away from the insulating base plate 21 is connected to the metal cold plate 1. The metal cold plate 1 can circulate liquid to a thermally conductive channel D through a pair of connection ports t. Specifically, one connection port t is connected to the inlet d1 of the thermally conductive channel D, and the other connection port t is connected to the outlet d2 of the thermally conductive channel D.

[0071] In one embodiment, along the thickness direction of the substrate 3, the orthographic projection of the heat-conducting channel D in any pre-package 2 onto the insulating base plate 21 at least partially overlaps with the electronic component 22, which can further reduce the heat dissipation path of the electronic component 22 and improve the heat dissipation effect. The heat exchange area between the cooling medium in the heat-conducting channel D and the heat-conducting metal plate 23 can also be increased, thereby improving the heat exchange capacity.

[0072] Taking electronic component 22 as an example, the chip is an electronic component with power conversion function: high-power transistor, thyristor, bidirectional thyristor, metal-oxide-semiconductor field-effect transistor (MOSFET), insulated-gate bipolar transistor (IGBT), diode, silicon controlled rectifier (SCR), SiC, GaN, etc.

[0073] In one embodiment, the packaging structure 10 provided in this application includes a plurality of pre-packages 2, each pre-package 2 including one or more chips, which can be connected in series or in parallel to form a functional circuit. The topology of the plurality of chips can be a single transistor, half-bridge, H-bridge, three-phase full-bridge, three-level, etc. In one embodiment, each pre-package 2 includes at least two chips, which can be electrically connected to form a half-bridge of bridge arm circuits.

[0074] In one embodiment, the pre-packaged body 2 further includes a connecting metal layer 24, which is disposed on the surface of the insulating base plate 21 facing away from the heat-conducting metal plate 23. Electronic components 22 are disposed on the connecting metal layer 24, and the connecting metal layer 24 can be used to implement bottom circuit traces for the electronic components 22. The connecting metal layer 24 can be a copper metal layer. Chip-shaped electronic components 22 are disposed on the connecting metal layer 24. The chips can be disposed face-up or flip-chip.

[0075] In this embodiment, the insulating base plate 21 can be a ceramic plate or an insulating resin plate. Taking a ceramic plate as an example, the thermally conductive metal plate 23 and the connecting metal layer 24 are two metal layers coated on the insulating base plate 21. Specifically, the structure of the insulating base plate 21 with the thermally conductive metal plate 23 and the connecting metal layer 24 can be a double-sided copper-clad ceramic substrate (which can be a DBC board or a DCB board), an active metal bonding (AMB) ceramic board, or other packaging substrates. Here, DBC is short for direct bond copper, and DCB is short for direct copper bonding.

[0076] The thermally conductive metal plate 23 provided in this application embodiment needs to form a thermally conductive flow channel D inside. In one embodiment, the thickness of the thermally conductive metal plate 23 is greater than the thickness of the connecting metal layer 24. The materials of the thermally conductive metal plate 23 and the connecting metal layer 24 can be the same or different. When the packaging structure 10 uses a double-sided copper-clad ceramic substrate to form an insulating base plate 21 with the thermally conductive metal plate 23 attached and the connecting metal layer 24 attached, the bottom copper layer of the double-sided copper-clad ceramic substrate can be directly used as the thermally conductive metal plate 23, or the bottom copper layer can be removed and the thermally conductive metal plate 23 can be remade.

[0077] In one embodiment, the pre-package 2 further includes an interconnect structure 25, which is disposed on the side of the electronic component 22 away from the insulating base plate 21 and connected to the electronic component 22. The electronic component 22 can realize the circuit traces on the top through the interconnect structure 25.

[0078] In one embodiment, the pre-package 2 further includes a connector 26, which is connected to the connecting metal layer 24. The electronic component 22 can be electrically connected to an external circuit via the interconnect structure 25 and the connector 26. The connector 26 and the interconnect structure 25 can be metal pillars, metal pads, clips, or bonding wires. The bonding wires can be made of metal materials such as aluminum, copper, or silver, or metal alloys. The clip structure can be made of materials such as copper, silver, or aluminum.

[0079] In one embodiment, the pre-packaged body 2 further includes a molding compound 27, which encapsulates the insulating substrate 21, electronic component 22, thermally conductive metal layer 23, connecting metal layer 24, interconnect structure 25, and connector 26. This prevents short circuits between the electronic component 22, thermally conductive metal layer 23, connecting metal layer 24, interconnect structure 25, and connector 26 and other conductors with which they are not necessarily connected, ensuring good insulation performance. The surface of the thermally conductive metal layer 23 facing away from the insulating substrate 21 exposes the molding compound 27, facilitating connection between the thermally conductive metal layer 23 and the metal cold plate 1. One end of the interconnect structure 25 facing away from the electronic component 22 exposes the molding compound 27, and the other end of the connector 26 facing away from the electronic component 22 also exposes the molding compound 27, facilitating connection between the interconnect structure 25 and the connector 26 and external circuit traces. The molding compound 27 in this embodiment may include materials such as silicone gel, epoxy molding compound, and epoxy potting compound.

[0080] In the encapsulation structure 10 provided in this application embodiment, the cooling medium used for heat dissipation achieves heat dissipation and temperature control functions through its own thermodynamic changes during the flow process. Specifically, the cooling medium can be a liquid cooling medium or a phase change cooling medium. The phase change cooling medium can absorb or release heat through a phase change during the flow of the cooling channel T and the heat conduction channel D, thereby dissipating heat from the pre-encapsulated body 2. For liquid cooling media, an external cold source needs to be configured for the encapsulation structure 10. Coolant is circulated from the external cold source to the cooling channel T of the metal cold plate 1 of the cooling plate assembly 1. The coolant, which is at a lower temperature, is supplied through the cooling channel T to the heat conduction channel D, where it exchanges heat with the heat-conducting metal plate 23, causing its temperature to rise. The cooled coolant, after its temperature rises, returns to the cold source through the cooling channel T for cooling. For example... Figure 3b As shown, the metal cold plate 1 is provided with a pair of external ports K for connecting to an external cold source. As a structural example, the external ports K connect the cooling channel T to the surface of the metal cold plate 1 opposite to the pre-encapsulated body 2.

[0081] In one embodiment, such as Figure 4aAs shown, a pair of sealing rings 31 are provided between any one of the pre-encapsulated bodies 2 and the metal cold plate 1. Each pair of sealing rings 31 is located between the heat-conducting metal plate 23 and the metal cold plate 1 of the pre-encapsulated body 2. One of the sealing rings 31 is located between one of the two connection ports t and the inlet d1 of the heat-conducting channel D, surrounding the inlet d1 and the connection port t. The inner diameter of the sealing ring 31 is greater than or equal to the inner diameter of the connection port t and the inner diameter of the inlet d1. The other sealing ring 31 is located between the other connection port t and the outlet d2 of the heat-conducting channel D, surrounding the outlet d2 and the connection port t. The inner diameter of the sealing ring 31 is greater than or equal to the inner diameter of the connection port t and the inner diameter of the outlet d2. When the heat-conducting metal plate 23 is connected to the cold metal plate 1, the sealing ring 31 located between the heat-conducting metal plate 23 and the cold metal plate 1 is compressed and deformed, thereby forming a good sealing contact by tightly fitting with the heat-conducting metal plate 23 and the cold metal plate 1. Seal the connection between the pair of connection ports t and the inlet d1 and outlet d2 respectively, that is, seal the connection between the heat-conducting flow channel D and the cooling flow channel T respectively, which can improve the sealing performance of the cooling circuit formed by the pre-encapsulated body 2 and the cold metal plate 1.

[0082] To fix the sealing ring 31 relatively between the heat-conducting metal plate 23 and the cold metal plate 1, an annular groove is provided on at least one of the heat-conducting metal plate 23 and the cold metal plate 1. The annular groove is used to at least partially accommodate the sealing ring 31. Specifically, taking the sealing ring 31 between the connection port t and the inlet d1 as an example, an annular groove surrounding the connection port t can be provided on the surface of the heat-conducting metal plate 23 facing the cold metal plate 1. The sealing ring 31 is embedded in the annular groove. When the heat-conducting metal plate 23 and the cold metal plate 1 are connected, the sealing ring 31 abuts against the surface of the cold metal plate 1 facing the heat-conducting metal plate 23, and the sealing ring 31, the annular groove, and the cold metal plate 1 are tightly fitted to achieve a seal. Alternatively, an annular groove surrounding the inlet d1 can be provided on the surface of the cold metal plate 1 facing the heat-conducting metal layer 23. The sealing ring 31 is embedded in this annular groove. When the heat-conducting metal plate 23 is connected to the cold metal plate 1, the sealing ring 31 abuts against the surface of the heat-conducting metal plate 23 facing the cold metal plate 1, and the sealing ring 31, the annular groove, and the heat-conducting metal plate 23 are tightly fitted together to achieve a seal. Alternatively, an annular groove surrounding the inlet d1 can be provided on the surface of the cold metal plate 1 facing the heat-conducting metal layer 23, and a corresponding annular groove surrounding the connection port t can be provided on the surface of the heat-conducting metal plate 23 facing the cold metal plate 1. The sealing ring 31 is embedded in either annular groove. When the heat-conducting metal plate 23 is connected to the cold metal plate 1, the two annular grooves are opposite each other along the thickness direction of the substrate 3. The portion of the sealing ring 31 exposed in the embedded annular groove can be embedded in the other annular groove, allowing the sealing ring 31 to tightly fit with both annular grooves to achieve a seal. In another embodiment, as... Figure 4b As shown, a sealing ring 32 is provided between any one of the pre-packaged body 2 and the metal cold plate 1, and the sealing ring 32 surrounds the heat-conducting metal plate 23. The sealing ring 32 is located between the molding compound 27 of the pre-packaged body 2 and the metal cold plate 1, and the inner diameter of the sealing ring 32 is larger than the outer diameter of the heat-conducting metal plate 23. When the molding compound 27 is connected to the metal cold plate 1, the sealing ring 32 located between the molding compound 27 and the metal cold plate 1 is compressed and deformed, thereby forming a good sealing contact by tightly fitting with the molding compound 27 and the metal cold plate 1. The entire cooling circuit formed by the pre-packaged body 2 and the metal cold plate 1 is sealed, improving the sealing performance of the cooling circuit formed by the pre-packaged body 2 and the metal cold plate 1. In order to fix the sealing ring 31 relatively between the pre-packaged body 2 and the metal cold plate 1, an annular groove is provided on at least one of the molding compound 27 of the pre-packaged body 2 and the metal cold plate 1, and the annular groove is used to at least partially accommodate the sealing ring 32.

[0083] The sealing rings 31 and 32 can be made of materials such as silicone, rubber, or engineering plastics. A pair of sealing rings 31 and 32 forms a double seal between the pre-encapsulated body 2 and the metal cold plate 1, which can further improve the sealing performance of the cooling circuit.

[0084] Combination Figure 4a and Figure 4b As shown, the packaging structure 10 provided in this embodiment combines the pre-packaged body 2 and the metal cold plate 1. Heat exchange between the cooling medium and the heat-conducting metal plate 23 is achieved through direct contact, thus dissipating heat from the electronic component 22. The heat dissipation path between the electronic component 22 and the cooling medium is short, resulting in strong heat dissipation capacity for the entire module structure and improved module performance. The sealing ring 31 and sealing ring 32 ensure the sealing and isolation between the heat conduction channel height D and the cooling flow channel T, preventing the cooling medium from intruding into the pre-packaged body 2 and causing electrical risks.

[0085] In this design, the thermally conductive metal plate 23 and the cold metal plate 1 of the pre-packaged body 2 can be bonded together using a metal lamination process to form a metal connection interface. The molding compound 27 of the pre-packaged body 2 and the cold metal plate 1, after lamination, can form a non-metallic-metal bonding interface to maintain good connectivity and sealing. Depending on the metal material chosen, the thermally conductive metal plate 23 and the cold metal plate 1 can be bonded together using silver (Ag) sintering or copper sintering, or through diffusion welding. When the thermally conductive metal plate 23 and the cold metal plate 1 are bonded through diffusion welding, the metal connection interface between them may be a copper-tin (Sn) interface, a copper-indium (In) interface, an indium-nickel (Ni) interface, a tin-nickel interface, or a nickel-indium (In) interface.

[0086] In some embodiments, after the pre-packaged body 2 is connected to the metal cold plate 1, a capillary bottom filler is filled between the pre-packaged body 2 and the metal cold plate 1. The capillary bottom filler can diffuse into the gaps between the heat-conducting metal plate 23 and the metal cold plate 1, as well as the gaps between the molding compound 27 and the metal cold plate 1, improving the sealing effect. Here, the capillary bottom filler can be mainly composed of epoxy resin, with added spherical silica powder (SiO₂), curing agents, accelerators, surface treatment agents, etc. It can flow into the gaps between the pre-packaged body 2 and the metal cold plate 1 by capillary action, thereby achieving the purpose of filling and sealing.

[0087] In one embodiment, such as Figure 4b As shown, along the stacking direction of the pre-packaged body 2 and the metal cold plate 1, the orthographic projection of the surface of the pre-packaged body 2 facing the metal cold plate 1 onto the metal cold plate 1 falls within the range of the surface of the metal cold plate 1 facing the pre-packaged body 2, and the surface of the metal cold plate 1 facing the pre-packaged body 2 is larger than the surface of the pre-packaged body 2 facing the metal cold plate 1. In the packaging structure 10 provided in this embodiment, the heat-conducting metal plate 23 forms a heat-conducting channel D as follows: Figure 5 The heat-conducting flow channel D is located inside the heat-conducting metal plate 23. The inlet d1 and outlet d2 of the heat-conducting flow channel D connect the internal space of the heat-conducting metal plate 23 to its outer surface, respectively. The shape and position of the inlet d1 and outlet d2 are not limited.

[0088] As a structural example, the heat conduction channel D is a hollow chamber, the shape of which is similar to the structure of the heat-conducting metal plate 23. Figure 6a The diagram shows a cross-sectional structure of a heat-conducting metal plate 23. The heat-conducting metal plate 23 has a hollow shell structure, and its internal space forms a heat-conducting channel D.

[0089] In some embodiments, the heat conduction channel D of the heat-conducting metal plate 23 may include multiple sub-channels D0, such as... Figure 6b As shown, the multi-layer sub-channels D0 are distributed along the thickness direction of the heat-conducting metal plate 23. Any two adjacent sub-channels D0 can be connected by connecting holes or other means, so that the heat-conducting channel D has a three-dimensional structure, which increases the inner surface area of ​​the heat-conducting channel D, thereby increasing the heat exchange area between the heat-conducting channel D and the cooling medium to improve the heat dissipation effect.

[0090] As a structural example, Figure 6b Each sub-channel D0 shown is a cavity structure. Multiple adjacent sub-channels D0 are spaced apart, and any two adjacent sub-channels D0 can be connected by multiple connecting holes distributed between them. The structure, number, and distribution of the connecting holes are not limited.

[0091] like Figure 6cThe illustrated heat-conducting metal plate 23 has a heat-conducting channel D comprising multiple sub-channels D0, with any two sub-channels D0 arranged adjacently along the thickness direction of the heat-conducting metal plate 23. Each sub-channel D0 includes multiple spaced-apart holes d0, and the holes d0 of any two adjacent sub-channels D0 are staggered in a direction perpendicular to the heat-conducting metal layer 23. Two holes d0 in the same sub-channel D0 are connected through one or more holes d0 in an adjacent sub-channel D0. The multiple sub-channels D0 can be interconnected to form a three-dimensional cavity, increasing the contact area between the cooling medium and the heat-conducting metal plate 23 and improving heat dissipation.

[0092] In one embodiment, in order to ensure smooth flow of the cooling medium in the heat-conducting channel D, the radial dimension of each hole d0 in the plane perpendicular to the thickness direction of the heat-conducting metal plate 23 is greater than 1 mm.

[0093] The heat-conducting metal plate 23 provided in this application embodiment can be prepared in various ways, such as by multi-layer plate stacking, high-temperature gas pressure expansion forming, forging forming and other processes to form a heat-conducting metal plate 23 with heat-conducting flow channels D.

[0094] In one embodiment, the heat-conducting metal plate 23 is prepared using additive manufacturing (AM), specifically ultrasonic additive manufacturing (UAM). Additive manufacturing, also known as 3D printing, is a technology that slices a 3D model into two-dimensional layers and gradually stacks them to form a shape. It does not require molds, offers high freedom in forming complex structures, can achieve internal structures that are difficult to manufacture using traditional processes, has high material utilization, and is suitable for small-batch production. Figures 6a to 6c The heat conduction channel D of the heat-conducting metal plate 23 shown is easier to implement using additive manufacturing processes. Figure 6b as well as Figure 6c The relatively complex flow channels shown are beneficial for improving heat dissipation.

[0095] by Figure 6c The heat-conducting metal plate 23 shown is a structural schematic. The heat-conducting metal plate 23, manufactured using additive manufacturing, can be formed into multiple layers through multiple molding processes. Figure 7a The perforated plate structure shown is formed by stacking multiple perforated plate structures. Figure 6c The heat-conducting metal plate 23 shown has holes in each perforated plate structure. Figure 6c The holes d0 in each layer of the perforated plate structure form a sub-channel D0. It should be understood that each layer of the perforated plate structure is a layer of structure formed during the additive manufacturing process. The multi-layer perforated plate structure is actually a one-piece structure. The division here is only to illustrate the layer-by-layer structure in the manufacturing process.

[0096] like Figure 7a As shown, the perforated plate structure includes multiple holes d0, each hole d0 penetrating the entire structure. Taking a rectangular array arrangement of multiple holes d0 in a single-layer perforated plate structure as an example, the multiple holes d0 include multiple rows of holes d0 and multiple columns of holes d0. The shape of each hole d0 is typically circular, but it can also be triangular, quadrilateral, polygonal, or irregular. Of course, the multiple holes d0 in each layer of the perforated plate structure can also be distributed irregularly.

[0097] In the additive manufacturing process, perforated plate structures are formed layer by layer. Between any two adjacent perforated plate structures, multiple holes d0 of one perforated plate structure are connected to multiple holes d0 of the other perforated plate structure to form part of the heat conduction channel D. Figures 7b to 7d An example is provided of a structure in which multiple holes d0 are connected after two layers of perforated plate structure are stacked.

[0098] like Figure 7b As shown, in a two-layer perforated plate structure, each hole d01 of one layer of the perforated plate structure is connected to two holes d02 of the other layer of the perforated plate structure along the row direction, thus achieving row-direction perforation connectivity between the two layers. In this structural form, holes in different rows are not connected; holes in different rows can be connected through holes in other perforated plate structures, or each row of holes can be connected to the inlet d1 and outlet d2 of the heat conduction channel D, thereby achieving connectivity between sub-channels D0 of different layers.

[0099] like Figure 7c As shown, in a two-layer perforated plate structure, each hole d01 of one layer of the perforated plate structure is connected along the column direction to two holes d02 of the other layer of the perforated plate structure, thus achieving column-direction perforation communication between the two layers. In this structural form, holes in different columns are not connected, but holes in different columns can be connected through holes in other perforated plate structures, or each column of holes can be connected to the inlet d1 and outlet d2 of the heat conduction channel D, thereby achieving communication between the sub-channels D0 of different layers.

[0100] like Figure 7d As shown, in a two-layer perforated plate structure, each hole d01 of the first layer connects to two holes d02 of the second layer along the row direction, and also connects to two holes d02 of the second layer along the column direction, thus achieving hole connectivity between the two layers. The multiple holes included in the two layers are interconnected.

[0101] Figure 8a Another structural form of the thermally conductive metal plate 23 is illustrated. For example... Figure 8aAs shown, multiple interconnected grooves are formed on one side of the heat-conducting metal plate 23 along its thickness direction, forming a heat-conducting channel D. For illustration, the heat-conducting metal plate 23 is divided into a bottom layer 232 and multiple protrusions 231 along its thickness direction. The protrusions 231 are disposed on one surface of the bottom layer 232 and protrude from that surface, with the protrusions 231 spaced apart to form multiple interlaced grooves. The bottom layer 232 and the protrusions 231 can be a single integrated structure, formed by processes such as cutting or die casting. The bottom layer 232 and the protrusions 231 can also be connected together by processes such as welding. In this heat-conducting metal plate 23, the inlet d1 and outlet d2 of the heat-conducting channel D can each be the gap between any one of the protrusions 231. When the cooling medium flows through the grooves between the protrusions 231, the cooling medium can exchange heat with the protrusions 231 to achieve heat dissipation.

[0102] In one embodiment, the radial dimension of each protrusion 231 is 1-3 mm in the direction parallel to the bottom layer 232, that is, in the plane perpendicular to the thickness direction of the bottom layer 232. The cross-sectional shape of the protrusion 231 can be circular, quadrilateral, polygonal or other irregular shapes.

[0103] Figure 8b Examples include Figure 8a The cross-sectional structure of the encapsulation structure 10 of the heat-conducting metal plate 23 is shown. (See diagram below.) Figure 8b As shown, the bottom layer 232 of the heat-conducting metal plate 23, facing away from the plurality of protrusions 231, is connected to the insulating base plate 21, and the ends of the plurality of protrusions 231 facing away from the bottom layer 232 abut against the metal cold plate 1. At least two of the protrusions 231 have grooves that communicate with a connection port t, and at least two other protrusions 231 have grooves that communicate with another connection port t, forming a loop for the cooling medium to flow within the heat-conducting channel D of the heat-conducting metal plate 23.

[0104] The metal cold plate 1 provided in this embodiment is a multi-layer plate structure, such as... Figure 9a As shown, the metal cold plate 1 includes a top plate 11, a connecting plate 12, and a bottom plate 13, which are stacked and connected as a single unit along the thickness direction of the metal cold plate 1. In a specific manufacturing process, brazing can be used to weld the top plate 11, connecting plate 12, and bottom plate 13 together, which can reduce machining and stamping processes from the design stage, ensuring the low cost and long-term reliability of the liquid metal cold plate 1. The multi-layer plate structure of the metal cold plate 1 can achieve various forms of cooling channels by combining plates with different structures as needed, which is convenient for manufacturing.

[0105] In this design, any one of the top plate 11, connecting plate 12, and bottom plate 13 can be formed by stacking multiple plates of the same shape. The plates can be in various forms, including but not limited to sheet metal structures and composite solder structures. The stacked metal cold plate 1 has a smaller thickness, and the design of the internal flow channel D is also more cost-effective. In some embodiments, the top plate 11 and bottom plate 13 can be designed with grooves, which cooperate with the connecting plate 12 to form the heat conduction flow channel D.

[0106] Figure 9b An exploded view of a metal cold plate 1 provided in an embodiment of this application. (Combined with...) Figure 9a and Figure 9b As shown, specifically, the connecting plate 12 includes a hollow structure 121 that penetrates the connecting plate 12 along its thickness direction. The hollow structure 121 can be formed with the top plate 11 and the bottom plate 13 to create the aforementioned cooling channel T. Here, the shape of the hollow structure 12 is merely an example. The top plate 11 is used to connect the pre-packaged body 2. The top plate 11 includes at least one pair of first through holes 111, each of which penetrates the top plate 11 along its thickness direction. Any pair of first through holes 111 constitutes a pair of connection ports t.

[0107] In one embodiment, the metal cold plate 1 is cooled by an external cold source. The base plate 13 includes a pair of second through holes 131, each second through hole 131 penetrating the base plate 13 along the thickness direction of the base plate 13, and the pair of second through holes 131 are used as a pair of external ports K to connect to the external cold source.

[0108] The hollow structure 121 of the connecting plate 12 can be formed by punching, wire cutting or laser cutting. In order to enhance the sealing of the cooling channel T, the thickness of the top plate 11 and the bottom plate 13 can be increased.

[0109] Figure 10a This is a cross-sectional view of a packaging structure 10 provided in an embodiment of this application. Figure 10a As shown, the metal cold plate 1 is connected to the heat-conducting metal plates 23 of multiple pre-packaged bodies 2. Two pre-packaged bodies 2 are illustrated here, and for ease of illustration, only a portion of their structures are shown. The heat-conducting metal plates 23 of the two pre-packaged bodies 2 each include a heat-conducting channel D, and the two heat-conducting channels D are respectively supplied with cooling fluid through the cooling channel T of the metal cold plate 1.

[0110] exist Figure 10a In the encapsulation structure 10 shown, two pre-packaged bodies 2 are arranged in a two-dimensional plane along a direction parallel to the insulating base plate 21. The interconnect component 25 of one pre-packaged body 2 is connected to the connector 26 of the other pre-packaged body 2, which enables the electrical connection of the electronic components 22 of the two pre-packaged bodies 2, facilitating the electrical connection of the two electronic components 22 to form a functional circuit.

[0111] In one embodiment, the metal cold plate 1 includes two pairs of connection ports t. One pair of connection ports t is connected to the inlet d1 and outlet d2 of the heat conduction channel D of a pre-packaged body 2, respectively, and the other pair of connection ports t is connected to the inlet d1 and outlet d2 of the heat conduction channel D of another pre-packaged body 2, respectively.

[0112] In one embodiment, such as Figure 10b As shown, the cooling channel T of the metal cold plate 1 includes a cooling channel T1 and a cooling return channel T2. The cooling channel T1 is used to supply the coolant with a lower temperature to the heat conduction channel D of the multiple heat conduction metal plates 23, and the cooling return channel T2 is used to remove the coolant with a higher temperature from the heat conduction channel D of the multiple heat conduction metal plates 23.

[0113] For example, one end of the cooling channel T1 is connected to an external port K for the inflow of cooling medium, and the other end of the cooling channel T1 includes multiple cooling sub-channels T11. Each cooling sub-channel T11 is connected to the inlet d1 of the heat-conducting channel D of a heat-conducting metal plate 23 through a connection port t. One end of the return cooling channel T2 is connected to an external port K for the outflow of cooling medium, and the other end of the return cooling channel T2 includes multiple return cooling sub-channels T21. Each return cooling sub-channel T21 has a connection port t connected to the outlet d2 of the heat-conducting channel D of a heat-conducting metal plate 23. It can be understood that each cooling sub-channel T11 can be regarded as an outlet of the cooling medium within the cooling channel T1, and the cooling sub-channel T11 and the connection port t connected thereto can be a structure for the outflow of cooling medium in a specific structure. Similarly, each recooling sub-channel T21 can also be regarded as an inflow end of the cooling working fluid in the recooling sub-channel T2. The recooling sub-channel T21 and the connection port t connected to it can be a structure for the inflow of cooling working fluid in a specific structure.

[0114] based on Figure 10a and Figure 10b The structure of the packaging structure 10 and the cooling method shown are as follows: Figure 10c As shown, the structure of the cooling channel T supplying cooling to multiple heat conduction channels D can be expanded, allowing the cooling channel T of a single metal cold plate 1 to be cooled by multiple heat conduction channels D through a simple structural improvement. Specifically, the cooling channel T1 and the return channel T2 of a single metal cold plate 1 can supply cooling to a heat conduction channel D through a pair of connection ports t. Adding a pair of connection ports t to the cooling channel T1 and the return channel T2 increases the number of heat conduction channels D that can be cooled. The addition of connection ports t can be designed according to the structural form of the metal cold plate 1, for example, by forming connection ports t in the form of openings. Therefore, the cooling method of the encapsulation structure 10 provided in this application embodiment does not require additional structural additions for the scheme of adding a pre-encapsulated body 2 and dissipating heat from the added pre-encapsulated body 2, has strong scalability, a wider range of applications, and is easier to implement.

[0115] Refer to together Figures 10b to 10c As shown, when a metal cold plate 1 of the encapsulation structure 10 cools the heat-conducting metal plates 23 of multiple pre-encapsulated bodies 2, the multiple pre-encapsulated bodies 2 are arranged in a linear array in the shape of an "I". Of course, the multiple pre-encapsulated bodies 2 can also be arranged in an in-plane two-dimensional array, which can be considered as an interval arrangement of multiple linear arrays in the shape of an "I".

[0116] exist Figure 10d In the schematic diagram of a cooling method shown, multiple pre-packaged bodies 2 are arranged in a two-dimensional array with multiple rows and columns. For example... Figure 10d As shown, one end of the cooling channel T1 is connected to an external port K for the inflow of cooling medium. The cooling channel T1 is also connected to the inlet d1 of the heat-conducting channels D of the multiple heat-conducting metal plates 23 through multiple cooling sub-channels T11. One end of the return cooling channel T2 is connected to an external port K for the outflow of cooling medium. The return cooling channel T2 is also connected to the outlet d2 of the heat-conducting channels D of the multiple heat-conducting metal plates 23 through multiple return cooling sub-channels T21.

[0117] Based on the multi-row, multi-column two-dimensional array of the pre-packaged body 2, the heat conduction channels D of the multiple heat-conducting metal plates 23 are also arranged in a multi-row, multi-column two-dimensional array. In one embodiment, as... Figure 10d As shown, the cooling flow channel T1 includes a main cooling flow channel T10, which is connected to multiple sub-cooling flow channels T11 via multiple cooling branch channels T101. Each cooling branch channel T101 is connected to at least two sub-cooling flow channels T11. The multiple cooling branch channels T101 are connected in parallel, and the at least two cooling sub-flow channels T11 connected to each cooling branch channel T101 are also connected in parallel, thus realizing a two-stage parallel connection of the cooling flow channel T1. The return cooling flow channel T2 includes a main return cooling flow channel T20, which is connected to multiple return cooling sub-flow channels T21 via multiple return cooling branch channels T201. Each return cooling branch channel T201 is connected to at least two return cooling sub-flow channels T21, and the multiple return cooling branch channels T201 are connected in parallel. The at least two return cooling sub-flow channels T21 connected to each return cooling branch channel T201 are also connected in parallel, thus realizing a two-stage parallel connection of the return cooling flow channel T2.

[0118] It should be understood that Figure 10d This is just a schematic diagram of the flow channel distribution for cooling medium circulation. Connecting different heat conduction channels D in a multi-level parallel manner can ensure that each heat conduction channel D has sufficient flow rate and pressure of cooling medium, thereby achieving smooth flow of cooling medium and ensuring good heat dissipation effect.

[0119] like Figure 11aAs shown, in one embodiment, a ring array of multiple pre-packaged bodies 2 connected by the same metal cold plate 1, and a ring array of heat-conducting channels D for multiple heat-conducting metal plates 23 of the multiple pre-packaged bodies 2. When the cooling channel T of one metal cold plate 1 supplies cooling to the heat-conducting metal plates 23 of the multiple pre-packaged bodies 2, the cooling channel T1 of the cooling channel T includes a main cooling channel T10 and an annular cooling channel T102, which is connected to the inlet d1 of the multiple heat-conducting channels D respectively. The cooling channel T2 of the cooling channel T includes a main cooling channel T20 and an annular cooling channel T202, which is connected to the outlet d2 of the multiple heat-conducting channels D respectively.

[0120] In one embodiment, multiple pre-packaged bodies 2 connected to the same metal cold plate 1 are divided into multiple groups, each group including multiple pre-packaged bodies 2 arranged in a ring array. Figure 11b As shown, the heat conduction channels D of the multiple pre-packaged bodies 2 are also divided into multiple groups. Each group includes multiple annular array heat conduction channels D. The inlet d1 of each group of heat conduction channels D is connected to an annular cooling channel T102, and the inlet d1 of each group of heat conduction channels D is connected to an annular return cooling channel T202. The cooling channel T1 of the metal cold plate 1 includes a main cooling channel T10, which is connected to each annular cooling channel T102. The multiple annular cooling channels T102 are connected in parallel. The return cooling channel T2 of the metal cold plate 1 includes a main return cooling channel T20, which is connected to each annular cooling channel T102. The multiple annular cooling channels T102 are connected in parallel.

[0121] It should be understood that the multiple pre-packaged bodies 2 are arranged in a rectangular or circular array in a two-dimensional plane, and this relatively regular arrangement facilitates the design of the cooling circuit for the entire package structure 10. This application embodiment provides a method such as... Figure 12 The power conversion device shown includes multiple packaged structures 10, and the cooling circuits of at least two of the packaged structures 10 are connected, so that the multiple packaged structures 10 can be connected through the same cold source function, thus optimizing the cooling system design of the entire device.

[0122] In one embodiment, such as Figure 12 As shown, the power conversion device includes multiple sets of module units V, each set of module units V including at least one of the aforementioned packaging structures 10. As a structural example, the multiple sets of module units V included in the power conversion device are stacked along the thickness direction of the substrate 3. When each set of module units V includes two or more packaging structures 10, these two or more packaging structures 10 are arranged in the same layer. The multiple sets of module units V are arranged in a three-dimensional stacked manner, which can reduce the trace length between circuit connections of different packaging structures 10 and improve the power density of the module.

[0123] In one embodiment, the cooling circuits of different packaging structures 10 are interconnected and can share a single cold source. For example... Figure 12 As shown, the cooling channels T of multiple metal cold plates 1 are interconnected, and these multiple cooling channels T can be connected to an external cold source through the same external connection port K.

[0124] by Figure 12 The three two-layer stacked encapsulation structures 10 shown are examples. Encapsulation structures 10a and 10b are distributed in the same layer at the bottom layer, and encapsulation structure 10c is stacked on top of encapsulation structure 10a as the top layer. Encapsulation structures 10a and 10c each include two pre-encapsulated bodies 2 and a metal cold plate 1. Encapsulation structure 10b includes one pre-encapsulated body 2 and a metal cold plate 1. The cooling channels T of the three metal cold plates 1 are interconnected. The cooling channel T of encapsulation structure 10a is connected to an external cold source through a pair of external ports K. The cooling channels T of the bottom layer encapsulation structure 10a and the cooling channels T of encapsulation structure 10b are connected through a first channel L1, which is formed by connecting the channels on the metal cold plate 1 of encapsulation structure 10a and the channels on the metal cold plate 1 of encapsulation structure 10b. The cooling channels T of the packaging structure 10a and the cooling channel T of the packaging structure 10c, which are stacked along the thickness direction of the substrate 3, are connected by a second channel L2. The second channel L2 is formed by connecting the channels on the metal cold plate 1 of the packaging structure 10c, the channels on the plastic encapsulation body 3 of the packaging structure 10c, and the channels on the metal cold plate 1 of the packaging structure 10c.

[0125] In this design, package structures 10a and 10c are stacked. The surface of the pre-package 2 of package structure 10a facing away from the metal cold plate 1 faces the surface of the metal cold plate 1 of package structure 10c facing away from the pre-package 2. Interconnect structures, connectors, and other circuit traces in the pre-package 2 of package structure 10a must avoid the metal cold plate 1 of package structure 10c to prevent short circuits. Specific circuit avoidance methods include, but are not limited to, insulation material isolation and circuit trace avoidance design.

[0126] It should be understood that Figure 12 Only one stacking arrangement of multiple package structures 10 and one possible connection arrangement of the cooling circuit are shown. As a structural variation, package structure 10c can also be stacked on top of package structure 10b as the top layer, and the cooling channel T of package structure 10c can also be connected to the cooling channel T of package structure 10b. When the power conversion device includes more package structures 10, the cooling channels T included in different package structures 10 can be connected in series, parallel, or mixed manner.

[0127] As a structural example, taking each module unit V as an example, which includes one packaging structure 10, the cooling method for multiple packaging structures 10 is as follows: Figure 13a and Figure 13b As shown. Each package structure 10 includes multiple pre-packaged bodies 2, with different module units V stacked and arranged along a direction perpendicular to the substrate 3.

[0128] in, Figure 13a Each package structure 10 shown includes a plurality of pre-packaged bodies 2 with their heat-conducting channels D arranged linearly in a direction parallel to the substrate 3. The inlets d1 of the heat-conducting channels D of the plurality of pre-packaged bodies 2 in the same package structure 10 are connected to a cooling channel T1 of the cooling channel T of the metal cold plate 1, and the outlets d2 of the heat-conducting channels D of the plurality of pre-packaged bodies 2 in the same package structure 10 are connected to a cooling return channel T2 of the cooling channel T of the metal cold plate 1. The cooling channels T1 of the metal cold plate 1 in different package structures 10 are directly or indirectly connected to an external port K for the inflow of cooling medium, and the cooling return channels T2 of the metal cold plate 1 in different package structures 10 are directly or indirectly connected to an external port K for the outflow of cooling medium.

[0129] Figure 13b Each package structure 10 shown includes a plurality of pre-packaged bodies 2 with their heat-conducting channels D arranged in a ring array parallel to the substrate 3. The inlets d1 of the heat-conducting channels D of the plurality of pre-packaged bodies 2 in the same package structure 10 are connected to the cooling channel T1 of the same metal cold plate 1 via a ring-shaped cooling channel T102, and the outlets d2 of the heat-conducting channels D of the plurality of pre-packaged bodies 2 in the same package structure 10 are connected to the return cooling channel T2 of the same metal cold plate 1 via a ring-shaped return cooling channel T202. The cooling channels T1 of the metal cold plates 1 in different package structures 10 are directly or indirectly connected to the external port K for the inflow of cooling medium, and the return cooling channels T2 of the metal cold plates 1 in different package structures 10 are directly or indirectly connected to the external port K for the outflow of cooling medium.

[0130] like Figure 14 Another packaging structure 10 is shown, which includes two embedded structural units. Each embedded structural unit includes a substrate 3 and at least one pre-packaged body 2 embedded in the substrate 3. Along the thickness direction of the metal cold plate 1, the two embedded structural units are respectively disposed on both sides of the metal cold plate 1. The heat conduction channels D of the pre-packaged bodies 2 of the two embedded units are respectively connected to the cooling channels T of the metal cold plate 1. The two embedded structural units can dissipate heat through a single metal cold plate 1. Here, each embedded unit includes one pre-packaged body 2 as a structural example. The heat conduction channels D of the two pre-packaged bodies 2 are respectively connected to the cooling channels T of the metal cold plate 1 through a pair of connection ports t. The pre-packaged bodies 2 in the two embedded structural units can share the metal cold plate 1 for heat dissipation. The heat dissipation path between the pre-packaged bodies 2 and the metal cold plate 1 in the two embedded structural units is relatively short, which can improve the heat dissipation effect.

[0131] In this packaging structure 10, if the heat conduction channel T is cooled by an external cold source, the external ports of the heat conduction channel T need to avoid the two substrates 3. As a structural example, the two external ports of the heat conduction channel T are respectively connected to the circumferential side of the metal cold plate 1 perpendicular to the thickness direction, which can avoid the two embedded structural units connected along the thickness direction of the metal cold plate 1.

[0132] Figure 14 In the encapsulation structure 10 shown, the pre-packaged bodies 2 included in the two embedded structural units are simply embedded in different substrates 3. The structural connection between each pre-packaged body 2 and the metal cold plate 1, as well as the liquid channel connection between the heat conduction channel D and the cooling channel T, can be referred to Figures 10b to 10d as well as Figure 11a and Figure 11b As shown, it will not be elaborated further here.

[0133] Figure 15 An example of a partial structure of a power conversion device, the power conversion device comprising at least two Figure 14 The encapsulation structure 10 is shown. In one embodiment, an encapsulation structure 10d and an encapsulation structure 10e are stacked. Each encapsulation structure 10 in encapsulation structure 10d and encapsulation structure 10e includes a metal cold plate 1 and two embedded structural units. The two embedded structural units are respectively disposed on both sides of the thickness direction of the metal cold plate 1. Each embedded structural unit includes at least two pre-encapsulated bodies 2 disposed in the same layer. The pre-encapsulated bodies 2 in the encapsulation structure 10 dissipate heat through the same metal cold plate 1. The cooling channel T of the encapsulation structure 10d and the cooling channel T of the encapsulation structure 10e are connected by a second channel L2. The second channel L2 is formed by connecting the channels on the metal cold plate 1 of the encapsulation structure 10d, the channels on the substrate 3 of the upper embedded structural unit, and the channels on the metal cold plate 1 of the encapsulation structure 10e and the channels on the substrate 3 of the lower embedded structural unit.

[0134] In this design, package structure 10d and package structure 10e are stacked. The interconnect structures, connectors, or other circuit traces of the lower embedded structural unit in package structure 10d must avoid the interconnect structures, connectors, or other circuit traces of the upper embedded structural unit in package structure 10e to prevent short circuits. Specific circuit avoidance methods include, but are not limited to, isolation with insulating materials and circuit trace avoidance design.

[0135] Please continue to refer to Figure 15 As shown, packaging structures 10d and 10e are two stacked sets of module units V. The cooling circuit connection of these two sets of module units V can be referred to... Figure 13a and Figure 13b The examples provided will not be repeated here.

[0136] In summary, the packaging structure 10 provided in this application combines a pre-packaged body 2 with a heat-conducting channel D with a metal cold plate 1. The cooling channel T of the metal cold plate 1 supplies cooling to the heat-conducting channel D, allowing the cooling medium to directly contact the pre-packaged body 2 for heat exchange. This reduces the heat dissipation path length of the heat-generating element in the pre-packaged body 2, reduces thermal resistance, and thus improves heat dissipation performance. The metal connection interface formed between the conductive metal layer 23 of the pre-packaged body 2 and the metal cold plate 1, combined with the sealing structure and capillary bottom filler, ensures the sealing of the flow channel, preventing the cooling medium from seeping into or diffusing into the pre-packaged body 2 and causing electrical safety problems. The pre-packaged body 2 in the packaging structure 10 can be integrated into the substrate 3 as a whole component structure by embedding. This allows for more flexible mechanical structure design, enabling the construction of larger modules with small components and achieving large-size manufacturing. As a whole structure, the pre-packaged body 2 can be tested to achieve yield and fluid channel sealing before being embedded into the substrate 3, ensuring the reliability of the module formed after embedding into the substrate 3.

[0137] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0138] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the spirit and scope of the embodiments of this application. Therefore, if these modifications and variations to the embodiments of this application fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations.

Claims

1. A packaging structure, characterized in that, The packaging structure includes a metal cold plate and at least one embedded structural unit, wherein any one of the embedded structural units is stacked with the metal cold plate. Each of the embedded structural units includes a substrate and at least one pre-packaged body embedded in the substrate. Each of the pre-packaged bodies includes an insulating base plate, electronic components, and a thermally conductive metal plate. The electronic components and the thermally conductive metal plate are respectively disposed on both sides of the insulating base plate in the thickness direction. The surface of the thermally conductive metal plate facing away from the insulating base plate is exposed on the surface of the substrate facing the metal cold plate. The thermally conductive metal plate includes a thermal channel, and the thermal channel is isolated from the surface of the thermally conductive metal plate facing the insulating base plate. The cold metal plate is connected to any one of the heat-conducting metal plates. The cold metal plate includes a cooling channel, and the cooling channel is connected to the heat-conducting channel of any one of the heat-conducting metal plates to form a cooling circuit for the flow of cooling fluid.

2. The packaging structure as described in claim 1, characterized in that, Each of the heat-conducting channels includes an inlet and an outlet, both of which are located on the surface of the heat-conducting metal plate opposite to the insulating base plate; The cooling channel includes at least one pair of connection ports, and any pair of connection ports is used to connect the inlet and outlet of one of the heat conduction channels, respectively.

3. The packaging structure as described in claim 2, characterized in that, A pair of sealing rings is provided between any one of the heat-conducting metal plates and the metal cold plate. One of the sealing rings is located between one of the connection ports of the pair of connection ports and the inlet of the heat-conducting channel, and the other sealing ring is located between the other connection port of the pair of connection ports and the outlet of the heat-conducting channel.

4. The packaging structure as described in claim 3, characterized in that, At least one of the heat-conducting metal plate and the cold metal plate is provided with an annular groove for accommodating the sealing ring.

5. The packaging structure as described in claim 1, characterized in that, A sealing ring is provided between any of the pre-packaged bodies and the thermally conductive metal plate, and the sealing ring surrounds the thermally conductive metal plate.

6. The packaging structure as described in claim 1, characterized in that, A capillary bottom filler is filled between any of the pre-packaged bodies and the metal cold plate.

7. The packaging structure as described in claim 1, characterized in that, Along the thickness direction of the substrate, the orthographic projection of the heat-conducting channel in any of the pre-packaged bodies onto the insulating substrate at least partially overlaps with the electronic component.

8. The packaging structure as described in claim 1, characterized in that, The heat-conducting channel includes multiple sub-channels, which are distributed along the thickness direction of the substrate, and any two adjacent sub-channels are connected to each other.

9. The packaging structure as described in claim 8, characterized in that, Each layer of the sub-channel includes a plurality of holes spaced apart from each other, and the plurality of holes in two adjacent layers of the sub-channel are staggered in a direction perpendicular to the insulating base plate; The two holes of the sub-channel in the same layer are connected by one or more holes of the sub-channel in an adjacent layer.

10. The packaging structure as described in claim 1, characterized in that, The metal cold plate includes a top plate, a bottom plate, and a connecting plate, wherein the top plate, the connecting plate, and the bottom plate are stacked sequentially along the thickness direction of the substrate; The top plate is used to connect the pre-packaged body. The top plate includes at least one pair of first through holes. Each first through hole penetrates the top plate along the thickness direction of the substrate. Any pair of first through holes is used to connect the inlet and outlet of one of the heat conduction channels, respectively. The connecting plate includes a hollow structure that penetrates the connecting plate along the thickness direction of the substrate, and the hollow structure, together with the top plate and the bottom plate, forms the cooling channel.

11. The packaging structure as described in claim 10, characterized in that, The base plate includes a pair of second through holes, each of which penetrates the base plate along the thickness direction of the substrate, and the pair of second through holes are used to connect to an external cold source.

12. The packaging structure as described in claim 1, characterized in that, Each of the pre-packaged bodies includes a connecting metal layer disposed on the surface of the insulating base plate opposite to the thermally conductive metal plate, and the electronic components are disposed on the connecting metal layer; Along the thickness direction of the substrate, the thickness of the thermally conductive metal plate is greater than the thickness of the connecting metal layer.

13. The packaging structure as described in claim 1, characterized in that, Any of the embedded structural units includes a plurality of pre-packaged bodies, which are arranged in a rectangular or ring array in a plane parallel to the substrate.

14. The packaging structure according to any one of claims 1-13, characterized in that, The packaging structure includes two embedded structural units, and the metal cold plate is stacked between the two embedded structural units along the thickness direction of the substrate.

15. A power conversion device, characterized in that, The power conversion device includes a plurality of packaging structures as described in any one of claims 1-14, wherein the cooling circuits of at least two of the packaging structures are connected.

16. The power conversion device as claimed in claim 15, characterized in that, At least two of the encapsulation structures are stacked along the thickness direction of the substrate.

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