Semiconductor chip plastic encapsulation device

Abstract

The utility model provides a kind of semiconductor chip plastic encapsulation device, it is related to the technical field of semiconductor packaging, including base, lower mould, movable upper mould, injection molding component, base is equipped with locking mechanism, lower mould is set up along vertical direction movably relative to base, locking mechanism is in locking state when vertical limiting lower mould, upper mould is close to lower mould until closing mould, upper mould and lower mould form a closed injection molding cavity, upper mould is equipped with the injection port being communicated with injection molding cavity, injection molding component is equipped with movable pressing portion and injection portion, pressing portion is used to press upper mould downward, and injection portion is inserted with injection port when pressing portion presses upper mould. The utility model provides a kind of semiconductor chip plastic encapsulation device can improve the convenience of plastic encapsulation mould disassembly, and then improves plastic encapsulation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a semiconductor chip molding device. Background Technology

[0002] Semiconductor chip molding is an important step in the semiconductor packaging process. It involves placing the semiconductor chip in a mold and injecting packaging material to protect and fix the chip.

[0003] Currently, common semiconductor chip molding and encapsulation devices typically use bolts to mount the mold onto the device. Specifically, operators need to use tools such as wrenches to tighten or loosen multiple bolts to complete the disassembly and installation of the mold. This fixing structure is characterized by its simple structure and stable connection, and is widely used in traditional production.

[0004] However, the aforementioned fixing structure has the following drawbacks: Mold replacement requires external tools, making the process cumbersome and time-consuming, especially in continuous production scenarios with frequent mold changes, severely reducing work efficiency. Furthermore, manual tightening of bolts can easily lead to uneven mold installation deviations due to uneven force, affecting packaging accuracy. Utility Model Content

[0005] Therefore, the purpose of this utility model is to provide a semiconductor chip molding device, which aims to improve the ease of assembly and disassembly of semiconductor chip molding molds, thereby improving molding efficiency.

[0006] To achieve the above objectives, this utility model proposes a semiconductor chip molding device, including a base, a lower mold, a movable upper mold, and an injection molding assembly. The base is provided with a locking mechanism. The lower mold is vertically movable relative to the base. When the locking mechanism is in the locked state, it vertically limits the lower mold. When the upper mold approaches the lower mold until the mold is closed, a sealed injection cavity is formed between the upper mold and the lower mold. The upper mold is provided with an injection port communicating with the injection cavity. The injection molding assembly is provided with a movable pressing part and an injection part. The pressing part is used to press the upper mold downwards, and the injection part is inserted into the injection port when the pressing part presses the upper mold.

[0007] In addition, the semiconductor chip encapsulation device described above according to this utility model may also have the following additional technical features:

[0008] Furthermore, the base is provided with a positioning groove, and the lower mold is provided with a positioning block on the side near the base. When the positioning groove matches the positioning block, the lower mold is horizontally limited to the base.

[0009] Furthermore, the locking mechanism includes clamping blocks and a first reset mechanism arranged opposite to each other. Both clamping blocks are movably disposed on the base in the horizontal direction. The first reset mechanism is disposed between the clamping blocks and the base and is used to provide an elastic force that brings the two clamping blocks close to the lower mold and vertically limits the lower mold.

[0010] Furthermore, the clamping block is provided with a first slot, and the lower mold is provided with insert plates on opposite sides. Under the elastic force of the first reset mechanism, the insert plates are inserted into the first slot.

[0011] Furthermore, the base is provided with a sliding groove, and the clamping block is slidably disposed in the sliding groove.

[0012] Furthermore, the injection molding assembly includes a movable mounting plate, an injection tube, and a nozzle. The end of the injection tube is fixed to the mounting plate to move synchronously with the mounting plate. The feed end of the injection tube is used to convey the injection plastic. The nozzle is detachably connected to the end of the injection tube.

[0013] Furthermore, the injection molding assembly also includes a hopper, which is connected to the feed end of the injection tube.

[0014] Furthermore, a tube is provided through the base, the end of the injection tube is connected to the tube, and the end of the tube away from the injection tube is detachably connected to the nozzle.

[0015] Furthermore, the end of the insertion tube away from the injection tube is provided with a second slot, the nozzle is provided with a plug that mates with the second slot, a pin is slidably disposed on the insertion tube, and the plug is provided with a pin hole; or the end of the insertion tube away from the injection tube is provided with a plug, the nozzle is provided with a second slot that mates with the plug, the nozzle is slidably disposed with a pin, and the plug is provided with a pin hole; a second reset mechanism is provided between the insertion tube and the nozzle, and the pin is inserted into the pin hole under the elastic force of the second reset mechanism.

[0016] Furthermore, the mounting plate moves vertically relative to the base via a vertical lifting assembly.

[0017] The beneficial effects of this utility model include at least the following: the locking mechanism can stably clamp the lower mold that moves vertically, and facilitates quick release of the lower mold that moves vertically. Compared with the prior art, there is no need to tighten bolts with tools such as wrenches, simplifying the mold change process. It is suitable for high-efficiency production lines that require frequent mold changes and improves the molding efficiency. At the same time, by matching the horizontal limiting mode of the lower mold and combining it with the vertical limiting function of the locking mechanism, the mold offset problem caused by uneven manual operation force in traditional bolt fixing is effectively avoided, ensuring the airtightness and sealing accuracy of the injection cavity when the mold is closed. In addition, through the coordinated action of the pressing part and the injection part of the injection component, while pressing the upper mold to complete the mold closing, the injection part automatically and precisely docks with the injection port, realizing the integrated operation of mold closing and injection, reducing the process interval time and improving the production cycle. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a semiconductor chip encapsulation device in one embodiment of the present invention;

[0019] Figure 2 This is an exploded view of a semiconductor chip encapsulation device according to an embodiment of the present invention;

[0020] Figure 3 This is an assembly diagram of the mounting plate and injection molding tube in one embodiment of the present utility model;

[0021] Figure 4 for Figure 3 A magnified view of a section at point A in the middle;

[0022] Explanation of key component symbols:

[0023] Base 100, positioning groove 110, slide 120, lower mold 200, positioning block 210, insert plate 220, docking hole 230, upper mold 300, injection port 310, docking rod 320, mounting plate 410, insert tube 411, second slot 4111, pin 4112, injection tube 420, nozzle 430, insert block 431, pin hole 4311, rubber ring 432, material box 440, clamping block 510, first slot 511, first reset mechanism 520, second reset mechanism 600, vertical lifting assembly 700;

[0024] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0025] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0026] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] Please refer to Figures 1 to 4 This invention provides a semiconductor chip encapsulation device, comprising a base 100, a lower mold 200, a movable upper mold 300, and an injection molding assembly. Specifically, the base 100 is equipped with a locking mechanism. The lower mold 200 is vertically movable relative to the base 100, meaning that the lower mold 200 cannot move horizontally relative to the base 100. When the locking mechanism is in the locked state, it vertically limits the lower mold 200, thus stably fixing it to the base 100. During injection molding, the upper mold 300 gradually approaches the lower mold 200. When the upper mold 300 and lower mold 200 close together, a sealed injection cavity is formed between them. The upper mold 300 is provided with an injection port 310 communicating with the injection cavity. The injection assembly is provided with a movable pressing part and an injection part. During injection, the pressing part presses down on the upper mold 300, causing the upper mold 300 to gradually approach the lower mold 200. When the pressing part presses down on the upper mold 300, the injection part inserts into the injection port 310. After insertion, the injection part injects plastic into the injection cavity. After injection is completed, the injection assembly is removed first, and then the mold is opened.

[0029] In some alternative embodiments, such as Figure 2As shown, a docking rod 320 is provided on the lower end face of the upper mold 300, and a docking hole 230 is provided on the upper end face of the lower mold 200. When it is necessary to close the upper mold 300 and the lower mold 200, the docking rod 320 is inserted into the docking hole 230. After insertion, the upper outer surface of the lower mold 200 is pressed by the pressing part, so that the upper mold 300 and the lower mold 200 can be tightly closed together.

[0030] In some alternative embodiments, such as Figure 2 , Figure 3 As shown, the base 100 is provided with a positioning groove 110, and the lower mold 200 is provided with a positioning block 210 on the side near the base 100. When the positioning groove 110 and the positioning block 210 are inserted, the lower mold 200 is horizontally limited to the base 100, but at this time the lower mold 200 can move up and down in a direction perpendicular to the upper surface of the base 100.

[0031] Preferably, the positioning groove 110 is a cross-shaped groove and the positioning block 210 is a cross-shaped block. The cooperation between the cross-shaped block and the cross-shaped groove can prevent the lower mold 200 from moving to the left, right, forward and backward on the upper surface of the base 100, so that the lower mold 200 remains stable when it is inserted into the base 100.

[0032] In some alternative embodiments, such as Figure 1 , Figure 2 As shown, the locking mechanism includes clamping blocks 510 and a first reset mechanism 520 arranged opposite each other. Specifically, both clamping blocks 510 are movably mounted on the base 100 in a horizontal direction, and are located on the left and right sides of the lower mold 200. The two clamping blocks 510 can then move linearly on the upper surface of the base 100. The first reset mechanism 520 is located between the clamping blocks 510 and the base 100. When the first reset mechanism 520 is not subjected to external force, the two sets of first reset mechanisms 520 provide opposing elastic forces. These opposing elastic forces cause the two clamping blocks 510 to approach the lower mold 200 and abut against the left and right sides of the two clamping blocks 510, thereby vertically limiting the lower mold 200 on the base 100. Thus, the lower mold 200 is stably fixed on the base 100.

[0033] It is understandable that the two clamping blocks 510 can also be set on the front and rear sides of the lower mold 200, or a set of clamping blocks 510 can be set on the front and rear sides, and the left and right sides of the lower mold 200.

[0034] In some alternative embodiments, such as Figure 2As shown, the clamping block 510 is provided with a first slot 511, and the lower mold 200 is provided with insert plates 220 on opposite sides. Under the elastic force of the first reset mechanism 520, the insert plates 220 are inserted into the first slot 511. For example, the first slot 511 is a rectangular groove, and the internal dimensions of the rectangular groove are adapted to the external dimensions of the insert plates 220. When the insert plates 220 are inserted into the first slot 511, the lower mold 200 cannot move up and down relative to the base 100.

[0035] In some alternative embodiments, such as Figure 2 , Figure 3 As shown, the base 100 is provided with a slide groove 120, and the clamping block 510 is slidably disposed in the slide groove 120. Preferably, the first reset mechanism 520 is a spring, with both ends of the spring abutting against one side surface of the clamping block 510 and the inner wall surface of the slide groove 120, respectively. When an external force is applied, the clamping block 510 can move towards the lower mold 200 within the slide groove 120. When the external force is removed, under the elastic force of the spring, the clamping block 510 moves in the opposite direction until it returns to its initial position.

[0036] In some alternative embodiments, such as Figures 1 to 3 As shown, the injection molding assembly includes a movable mounting plate 410, an injection tube 420, and a nozzle 430. Specifically, the end of the injection tube 420 is fixed to the mounting plate 410, so that the injection tube 420 can move synchronously with the mounting plate 410. The nozzle 430 is detachably connected to the end of the injection tube 420. During injection molding, the injection material is conveyed from the feed end of the injection tube 420.

[0037] In this embodiment, the nozzle 430 and the injection tube 420 can be disassembled and assembled, which facilitates the cleaning or replacement of the nozzle 430, and also facilitates the installation of the cleaned or brand-new nozzle 430 to the discharge end of the injection tube 420.

[0038] In some alternative embodiments, such as Figure 1 , Figure 3 As shown, the injection molding assembly also includes a hopper 440, which stores injection molding material. The hopper 440 is connected to the inlet end of the injection tube 420. During injection molding, the injection molding material is conveyed from the hopper 440 into the injection tube 420, then from the outlet end of the injection tube 420 into the nozzle 430, and finally ejected from the nozzle 430.

[0039] In some alternative embodiments, such as Figures 1 to 3 As shown, a tube 411 is provided through the mounting plate 410. The end of the injection molding tube 420 is connected to the tube 411, and the end of the tube 411 away from the injection molding tube 420 is detachably connected to the nozzle 430. In this embodiment, the tube 411 can easily fix the end of the injection molding tube 420 to the mounting plate 410, and at the same time, the tube 411 also provides a stable rigid mounting point for the nozzle 430.

[0040] In some alternative embodiments, such as Figure 4 As shown, the end of the insertion tube 411 away from the injection tube 420 is provided with a second slot 4111, and the nozzle 430 is provided with a plug 431 that mates with the second slot 4111. A pin 4112 is slidably disposed on the insertion tube 411 in the radial direction, and the plug 431 is provided with a pin hole 4311. A second reset mechanism 600 is provided between the insertion tube 411 and the nozzle 430. When no external force is applied, the pin 4112 is inserted into the pin hole 4311 under the action of the elastic force of the second reset mechanism 600. When an external force is applied to counteract the elastic force of the second reset mechanism 600, the pin 4112 can be pushed to move outward in the radial direction of the insertion tube 411 until the pin 4112 disengages from the pin hole 4311. It is understandable that a plug block 431 can be provided at the end of the insertion tube 411 away from the injection tube 420, a second slot 4111 that mates with the plug block 431 can be provided on the nozzle 430, a pin 4112 can be slidably provided on the nozzle 430 in the radial direction, and a pin hole 4311 can be provided on the plug block 431.

[0041] Preferably, the second reset mechanism 600 is a spring, which is sleeved on the pin 4112, and the two ends of the spring abut against the inner wall surface of the pin 4112 and the second slot 4111, respectively.

[0042] In this embodiment, the nozzle 430 is connected to the tube 411 via a quick-connect structure consisting of the insert block 431, the second slot 4111, and the pin 4112. This supports tool-free disassembly, facilitates cleaning of residual materials, or replacement of nozzles 430 with different specifications, reduces maintenance costs, and enhances equipment adaptability.

[0043] In some alternative embodiments, such as Figure 4 As shown, a rubber ring 432 is fixedly connected to the outer surface of the upper end of the nozzle 430. In this embodiment, by providing the rubber ring 432, leakage of the injection plastic from the gap between the insertion tube 411 and the nozzle 430 can be prevented.

[0044] In some alternative embodiments, such as Figure 2 As shown, the mounting plate 410 moves vertically relative to the base 100 via the vertical lifting assembly 700. Preferably, the vertical lifting assembly 700 is a lifting motor, and the mounting plate 410 is fixedly mounted on the telescopic rod of the lifting motor.

[0045] In some alternative embodiments, such as Figure 3 As shown, in order to save the length of the injection tube 420 and to avoid collisions and wear caused by the dynamic movement of the injection tube 420, the material box 440 is also fixedly installed on the telescopic rod of the lifting motor.

[0046] The working principle of the semiconductor chip encapsulation device proposed in this application is described in detail below using the preferred embodiment:

[0047] First, pull the clamping block 510 outward until the insert plate 220 disengages from the first slot 511. At this point, remove the upper mold 300 and the lower mold 200 as a whole from the upper outer surface of the base 100.

[0048] Next, place the lower mold 200 of the corresponding specifications on the outer surface of the upper end of the base 100, and insert the cross-shaped block at the bottom of the lower mold 200 into the cross-shaped groove at the upper end of the base 100. Then, release the clamping block 510, so that the clamping block 510 moves to the lower mold 200 side under the elastic force of the spring, until the insert plate 220 on the new lower mold 200 is inserted into the first slot 511 on the clamping block 510.

[0049] Next, the docking rod 320 is inserted into the docking hole, so that the upper mold 300 and the lower mold 200 are closed.

[0050] Next, the electric lifting motor is started, so that the material box 440, injection tube 420 and mounting plate 410 move downward synchronously until the nozzle 430 on the mounting plate 410 is inserted into the injection port 310 and the lower surface of the mounting plate 410 is completely attached to the outer surface of the lower mold 200.

[0051] Next, the injection plastic inside the material box 440 is transported to the nozzle 430 through the injection tube 420, and the nozzle 430 injects the injection plastic evenly into the injection cavity.

[0052] After the device is finished, pull the pin 4112 outward so that one end of the pin 4112 is disengaged from the pin hole 4311. Then pull the nozzle 430 downward so that the nozzle 430 is disengaged from the tube 411. At this time, the nozzle 430 can be cleaned or replaced.

[0053] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0054] The above-described embodiments are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of protection of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the appended claims.

Claims

1. A semiconductor chip molding and encapsulation device, characterized in that, The semiconductor chip encapsulation apparatus includes: The base is equipped with a locking mechanism; The lower mold is vertically movable relative to the base, and the locking mechanism vertically limits the lower mold when it is in the locked state. A movable upper mold, when the upper mold approaches the lower mold until the mold is closed, forms a closed injection cavity between the upper mold and the lower mold, and the upper mold is provided with an injection port communicating with the injection cavity; The injection molding assembly includes a movable pressing part and an injection part. The pressing part is used to press the upper mold downwards, and the injection part is inserted into the injection port when the pressing part presses the upper mold.

2. The semiconductor chip encapsulation apparatus according to claim 1, characterized in that, The base is provided with a positioning groove, and the lower mold is provided with a positioning block on the side near the base. When the positioning groove matches the positioning block, the lower mold is horizontally limited to the base.

3. The semiconductor chip encapsulation apparatus according to claim 1, characterized in that, The locking mechanism includes: The two clamping blocks are arranged opposite each other, and both of the clamping blocks are movably mounted on the base in the horizontal direction; A first reset mechanism is provided between the clamping block and the base, and is used to provide an elastic force that brings the two clamping blocks close to the lower mold and vertically limits the lower mold.

4. The semiconductor chip encapsulation apparatus according to claim 3, characterized in that, The clamping block is provided with a first slot, and the lower mold is provided with insert plates on opposite sides. Under the elastic force of the first reset mechanism, the insert plates are inserted into the first slot.

5. The semiconductor chip encapsulation apparatus according to claim 4, characterized in that, The base is provided with a sliding groove, and the clamping block is slidably disposed in the sliding groove.

6. The semiconductor chip encapsulation apparatus according to any one of claims 1 to 5, characterized in that, The injection molding assembly includes: Removable mounting plate; Injection tube, the end of which is fixed to the mounting plate to move synchronously with the mounting plate, and the feed end of the injection tube is used to convey the injection plastic; The nozzle is detachably connected to the end of the injection tube.

7. The semiconductor chip encapsulation apparatus according to claim 6, characterized in that, The injection molding assembly also includes a material bin, which is connected to the feed end of the injection tube.

8. The semiconductor chip encapsulation apparatus according to claim 6, characterized in that, A tube is provided through the mounting plate, the end of the injection tube is connected to the tube, and the end of the tube away from the injection tube is detachably connected to the nozzle.

9. The semiconductor chip encapsulation apparatus according to claim 8, characterized in that, The insertion tube is provided with a second slot at one end away from the injection tube, the nozzle is provided with a plug block that mates with the second slot, the insertion tube is slidably provided with a pin, and the plug block is provided with a pin hole; or the insertion tube is provided with a plug block at one end away from the injection tube, the nozzle is provided with a second slot that mates with the plug block, the nozzle is slidably provided with a pin, and the plug block is provided with a pin hole. A second reset mechanism is provided between the insertion tube and the nozzle, and the pin is inserted into the pin hole under the elastic force of the second reset mechanism.

10. The semiconductor chip encapsulation apparatus according to claim 6, characterized in that, The mounting plate moves vertically relative to the base via a vertical lifting assembly.

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