Packaging structure

Abstract

The application discloses a packaging structure, which comprises a substrate comprising a plurality of terminals, an active element arranged on the substrate, a mold sealing layer arranged on the substrate, covering the active element and exposing the plurality of terminals, and a protective adhesive layer arranged on the substrate, covering the plurality of terminals, and the mold sealing layer and the protective adhesive layer have a height difference. The above technical scheme can at least improve the overall process yield and avoid material waste.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically, to a packaging structure. Background Technology

[0002] See Figure 1A As shown, the FOPOP (Fan-Out Package on Package) structure has poor heat dissipation and needs to be changed to a side-by-side package of DRAM (Dynamic Random Access Memory) 10 and SOC (System on Chip) 20. Figure 1B As shown, the existing FOMCM (Fan-Out Multi-Chip Module) structure packages DRAM 10 and SOC 20 side-by-side to incorporate DRAM requirements into the overall packaged product. However, by packaging DRAM together, it cannot be purchased and assembled by the assembly plant like a FOPOP product. Furthermore, considering the higher price of DRAM and process yield, as well as the assembly plant's requirements for heat dissipation and DRAM placement, a DRAM back-end structure needs to be developed to improve overall process yield and avoid material waste. Utility Model Content

[0003] To address the above issues, this application proposes a packaging structure to improve overall process yield and avoid material waste.

[0004] According to one aspect of this application, a packaging structure is provided, comprising: a substrate including a plurality of terminals; an active element disposed on the substrate; a molding layer disposed on the substrate, covering the active element and exposing the plurality of terminals; and a protective adhesive layer disposed on the substrate, covering the plurality of terminals, wherein the molding layer and the protective adhesive layer have a height difference.

[0005] In some embodiments, the protective adhesive layer has a lower surface facing the substrate and an upper surface facing away from the substrate, wherein the upper surface and the lower surface of the protective adhesive layer have different adhesive properties.

[0006] In some embodiments, the lower surface of the protective adhesive layer is more viscous than the upper surface.

[0007] In some embodiments, the sealing layer defines a cavity, and a protective adhesive layer is located within the cavity.

[0008] In some embodiments, the protective adhesive layer contacts the lower portion of the sidewall of the molding seal layer, and the upper portion of the sidewall of the molding seal layer is exposed by the protective adhesive layer, with the height of the upper portion being greater than the height of the lower portion.

[0009] In some embodiments, the active element and the protective adhesive layer are laterally spaced apart by the molding layer.

[0010] In some embodiments, the packaging structure further includes an adhesive element comprising: a height-raising layer placed in the cavity; and a removal adhesive layer adhered to the height-raising layer, wherein the adhesiveness of the removal adhesive layer is less than the adhesiveness of the protective adhesive layer facing the lower surface of the substrate and greater than the adhesiveness of the protective adhesive layer facing the upper surface of the substrate.

[0011] In some embodiments, the thickness of the height-enhancing layer is not less than the depth of the cavity above the protective adhesive layer.

[0012] In some embodiments, the sealing layer is not disposed above the protective adhesive layer.

[0013] In some embodiments, the upper surface of the molding layer is flush with the upper surface of the active element.

[0014] The technical solution of this application protects the terminals on the substrate from oxidation or contamination by a protective adhesive layer, and also facilitates the structural reinforcement of the substrate. The protective adhesive layer can be removed later to allow for the installation of subsequent components, thereby improving the overall process yield and avoiding material waste, and also facilitating the customer's customization needs. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1A This is a cross-sectional schematic diagram of an existing FOPOP structure.

[0017] Figure 1B This is a cross-sectional schematic diagram of an existing FOMCM structure.

[0018] Figure 2A This is a cross-sectional schematic diagram of the packaging structure according to an embodiment of this application.

[0019] Figure 2B This is a cross-sectional schematic diagram of the packaging structure according to an embodiment of this application at the post-installation stage.

[0020] Figures 3 to 5 , Figure 6A , Figures 7 to 12 A cross-sectional schematic diagram is shown at several stages forming the packaging structure according to an embodiment of this application.

[0021] Figure 6B It shows Figure 6AA planar schematic diagram of the section line X1-X1 in the diagram. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0023] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of elements and arrangements will be described below to simplify the present invention. These are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include embodiments where the first and second components are in direct contact, or embodiments where an additional component is formed between the first and second components such that the first and second components are not in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of the present invention. Such repetition is merely for brevity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0024] Furthermore, where there is no conflict, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] Figure 2A This is a cross-sectional schematic diagram of the packaging structure according to an embodiment of this application. Figure 2B This is a cross-sectional schematic diagram of the packaging structure according to an embodiment of this application at the post-installation stage.

[0026] Combination Figure 2A and Figure 2B As shown, the packaging structure may include a substrate 110, an active component 220, and a protective adhesive layer 150 disposed on the substrate 110. The substrate 110 may include a plurality of terminals 112 (see...). Figure 2B The protective adhesive layer 150 can cover multiple terminals 112. After the protective adhesive layer 150 is removed, as... Figure 2B As shown, a plurality of terminals 112 on the substrate 110 can be exposed. The terminals 112 can be used to electrically connect to the subsequent active components 280 after the protective adhesive layer 150 is removed. In some embodiments, the protective adhesive layer 150 can be removed and the active components 280 can be connected at the assembly plant.

[0027] In some embodiments, the rear active element 280 may be a memory device, such as DRAM. The active element 220 may be, for example, a SOC or ASIC (Application Specific Integrated Circuit). In this embodiment, terminal 112 is a pad. It should be understood that in other embodiments, terminal 112 may be other types of terminals suitable for electrical connection to the rear active element 280, such as solder bumps.

[0028] See also Figure 2A As shown, a molding layer 240 is disposed on the substrate 110. The molding layer 240 covers the active component 220 and exposes a plurality of terminals 112, and may also expose a protective adhesive layer 150. The molding layer 240 and the protective adhesive layer 150 have a height difference. Specifically, the upper surface of the molding layer 240 is higher than the upper surface of the protective adhesive layer 150. In this embodiment, the upper surface of the molding layer 240 is flush with the upper surface of the active component 220. In other embodiments, the molding layer 240 may cover the upper surface of the active component 220.

[0029] The space above the terminal 112 surrounded by the molding layer 240 can be used to place the rear active component 280. After removing the protective adhesive layer 150, the rear active component 280 is connected by the terminal 112 reserved below the protective adhesive layer 150. Thus, the technical solution of this application provides a packaging structure with reserved terminal encapsulation, which allows the active component to be placed in the rear. The protective adhesive layer 150 can be used to protect the terminal 112 from oxidation or contamination, and can also facilitate the structural reinforcement of the substrate 110. The protective adhesive layer 150 can be removed in the subsequent assembly plant, thereby improving the overall process yield and avoiding material waste, and also facilitating customer customization needs. In addition, the side-by-side arrangement of the active component 220 and the rear active component 280 is more conducive to heat dissipation than FOPOP.

[0030] More specifically, the molding seal 240 defines a cavity 242, and the protective adhesive layer 150 is located at the bottom of the cavity 242. The active element 220 and the protective adhesive layer 150 are laterally spaced apart by the molding seal 240. The molding seal 240 is not disposed above the protective adhesive layer 150, that is, the cavity 242 above the protective adhesive layer 150 is an empty cavity. Thus, due to the height difference between the molding seal 240 and the protective adhesive layer 150, a portion of the cavity 242 is disposed above the protective adhesive layer 150 to allow the protective adhesive layer 150 to be removed. In some embodiments, the lateral width of the cavity 242 is not less than the lateral width of the active element 220, so that the cavity 242 has sufficient width to accommodate the rear active element 280 to be placed. The active element 220 is disposed in another cavity defined by the molding seal 240.

[0031] The protective adhesive layer 150 has a lower surface 150b facing the substrate 110 and an upper surface 150u facing away from the substrate 110. In some embodiments, the upper surface 150u and the lower surface 150b of the protective adhesive layer 150 have different adhesive properties. Utilizing the different adhesive properties of the upper surface 150u and the lower surface 150b facilitates adhesion of the protective adhesive layer 150 to the substrate 110. In some embodiments, the lower surface 150b of the protective adhesive layer 150 has a greater adhesive property than the upper surface 150u. Specifically, the protective adhesive layer 150 includes a bottom adhesive layer 152 adjacent to the substrate 110 and a top adhesive layer 156 away from the substrate 110. The protective adhesive layer 150 may also include an intermediate base layer 154 sandwiched between the bottom adhesive layer 152 and the top adhesive layer 156. The adhesive layer 152 has a stronger tack than the top adhesive layer 156, so that the lower surface 150b of the protective adhesive layer 150 has a stronger tack than the upper surface 150u. Because the lower surface 150b has a stronger tack than the upper surface 150u, the protective adhesive layer 150 can adhere more firmly to the substrate 110 to cover the multiple terminals 112.

[0032] Figures 3 to 5 , Figure 6A , Figures 7 to 12 A cross-sectional schematic diagram is shown at multiple stages of forming the packaging structure according to an embodiment of this application. First, as... Figure 3 As shown, a carrier plate 302 is provided, which may be, for example, a glass carrier plate. A substrate 110 is formed on the carrier plate 302. The substrate 110 may include a plurality of dielectric layers 111 and conductive lines 113 disposed in the plurality of dielectric layers 111. The conductive lines 113 may include laterally extending traces and vertically extending vias. In some embodiments, the substrate 110 may be referred to as a wiring layer or a redistribution layer (RDL).

[0033] In addition, pads 115 and 117 are formed on the upper surface of substrate 110. Pad 115 is used to connect active components (such as the active component 220 mentioned above) in subsequent processes, and pad 117 can be used to connect downstream active components (such as the downstream active component 280 mentioned above) in subsequent processes.

[0034] Then see Figure 4 As shown, the active component 220 is bonded to the pad 115. Specifically, the active surface 220a of the active component 220 faces the substrate 110 and is connected to the pad 115 on the substrate 110 via a plurality of connectors 222 at the active surface 220a. The pad 115 serves as a terminal for connection with the active component 220. In this embodiment, since the active surface 220a of the active component 220 faces downward toward the substrate 110, this can also be referred to as flip chip bonding (FCB).

[0035] See Figure 5 As shown, solder 119 is formed on pad 117. In this embodiment, pad 117 and solder 119 can be collectively referred to as solder bumps and can be used together as terminals for subsequent connection to the rear active component 280.

[0036] Then see Figure 6A and Figure 6B As shown, where, Figure 6B It shows Figure 6A A planar schematic diagram at section line X1-X1. A protective adhesive layer 150 is applied to pads 117 and solder 119. In some embodiments, the thickness of the protective adhesive layer 150 may be greater than the total height of pads 117 and solder 119 to ensure that the protective adhesive layer 150 completely covers pads 117 and solder 119. In some embodiments, the upper surface of the protective adhesive layer 150 may not be lower than the active surface 220a of the active component 220 to ensure that the protective adhesive layer 150 completely covers pads 117 and solder 119.

[0037] Specifically, in some embodiments, the top adhesive layer 156 of the protective adhesive layer 150 is adhered to the lower surface of the height enhancement layer 312, and then the bottom adhesive layer 152 of the protective adhesive layer 150 is adhered to the substrate 110, and the protective adhesive layer 150 covers the pads 117 and the solder 119. In some embodiments, the height enhancement layer 312 may be an adhesive layer.

[0038] See Figure 7 As shown, a molding seal layer 240 is formed, which covers the active component 220, the protective adhesive layer 150, and the height enhancement layer 312. The upper surface of the molding seal layer 240 can be flush with the upper surfaces of the active component 220 and the height enhancement layer 312.

[0039] See Figure 8 As shown, remove carrier plate 302. See also Figure 9 As shown, solder balls 116 electrically connected to the substrate 110 are formed on the lower surface of the substrate 110 facing away from the active element 220.

[0040] See Figure 10 As shown, the height-lifting layer 312, originally located in the cavity 242, is removed. In some embodiments, a removal adhesive layer 314 is adhered to the upper surface of the height-lifting layer 312. The thickness of the height-lifting layer 312 may be no less than the depth of the cavity 242 above the protective adhesive layer 150, so that the upper surface of the height-lifting layer 312 is no lower than the upper surface of the molding layer 240, in order to facilitate the adhesion of the removal adhesive layer 314 to the height-lifting layer 312.

[0041] The adhesive strength of the removeable adhesive layer 314 can be less than that of the bottom adhesive layer 152 of the protective adhesive layer 150, but greater than that of the top adhesive layer 156 of the protective adhesive layer 150. Because the adhesive strength of the removeable adhesive layer 314 is greater than that of the top adhesive layer 156, the height-enhancing layer 312 can be adhered and removed using the removeable adhesive layer 314, while the height-enhancing layer 312 can detach from the top adhesive layer 156. Furthermore, because the adhesive strength of the removeable adhesive layer 314 is less than that of the bottom adhesive layer 152 of the protective adhesive layer 150, when the height-enhancing layer 312 is adhered and removed using the removeable adhesive layer 314, the bottom adhesive layer 152 remains adhered to the substrate 110. By forming a molding layer 240 around the height-enhancing layer 312, a cavity 242 of sufficient depth can be formed after removing the height-enhancing layer 312 to accommodate subsequent components.

[0042] See Figure 11 As shown, with Figure 10 Similarly, as described, the remaining height-raising layer 312 is removed using adhesive removal layer 314, leaving protective adhesive layer 150 adhered to the substrate 110. Height-raising layer 312 and adhesive removal layer 320 can be collectively referred to as an adhesive element. Therefore, as... Figure 6A and Figure 10 , Figure 11 As shown, a protective adhesive layer 150 is formed within the cavity 242 and adhered to the substrate 110 using a height-lifting layer 312 and a removal adhesive layer 314. The cavity 242 is defined by the sidewalls 240s of the molding seal layer 240, which may extend vertically. The protective adhesive layer 150 contacts the lower portion of the sidewalls 240s of the molding seal layer 240, while the upper portion of the sidewalls 240s of the molding seal layer 240 is exposed by the protective adhesive layer 150. The sidewalls of the protective adhesive layer 150 and the sidewalls 240s may be vertically aligned. The height h1 of the upper portion of the sidewalls 240s may be greater than the height h2 of the lower portion to provide a cavity 242 of sufficient depth to accommodate subsequent components.

[0043] Then you can follow Figure 11 The dashed line Lc in the diagram cuts through the resulting structure to form... Figure 12 The individual packaging structure is shown.

[0044] In summary, this application proposes a packaging structure that includes a cavity 242 for subsequent components after packaging an active component 220 (e.g., an ASIC). Specifically, a protective adhesive layer 150 is attached to the terminals (e.g., pads 117 and solder 119) of the substrate 110, and space is reserved above the protective adhesive layer 150 for a sacrificial layer (height-boosting layer 312). The protective adhesive layer 150 can be removed later, for example, in the assembly plant, which can improve the overall process yield and avoid material waste.

[0045] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A packaging structure, characterized in that, include: The substrate includes multiple terminals; Active components are disposed on the substrate; A molding layer is disposed on the substrate, covering the active components and exposing the plurality of terminals; as well as A protective adhesive layer is disposed on the substrate, covering the plurality of terminals, and the molding layer and the protective adhesive layer have a height difference.

2. The packaging structure according to claim 1, characterized in that, The protective adhesive layer has a lower surface facing the substrate and an upper surface facing away from the substrate, wherein the upper surface and the lower surface of the protective adhesive layer have different adhesive properties.

3. The packaging structure according to claim 2, characterized in that, The lower surface of the protective adhesive layer is more viscous than the upper surface.

4. The packaging structure according to claim 1, characterized in that, The sealing layer defines a cavity, and the protective adhesive layer is located within the cavity.

5. The packaging structure according to claim 4, characterized in that, The protective adhesive layer contacts the lower portion of the sidewall defining the cavity by the molding layer, and the upper portion of the sidewall of the molding layer is exposed by the protective adhesive layer, the height of the upper portion being greater than the height of the lower portion.

6. The packaging structure according to claim 1, characterized in that, The active element and the protective adhesive layer are laterally separated by the molding layer.

7. The packaging structure according to claim 4, characterized in that, It also includes an adhesive element, which comprises: A height-enhancing layer is placed within the cavity; and Remove the adhesive layer and adhere it to the height-enhancing layer. The adhesiveness of the removed adhesive layer is less than the adhesiveness of the protective adhesive layer facing the lower surface of the substrate, and greater than the adhesiveness of the protective adhesive layer facing away from the upper surface of the substrate.

8. The packaging structure according to claim 7, characterized in that, The thickness of the height-enhancing layer is not less than the depth of the cavity above the protective adhesive layer.

9. The packaging structure according to claim 1, characterized in that, The sealing layer is not positioned above the protective adhesive layer.

10. The packaging structure according to claim 1, characterized in that, The upper surface of the molding layer is flush with the upper surface of the active element.

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