A vital signs monitor

CN224685832UActive Publication Date: 2026-08-28XIAMEN KUANGSHI TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520415327.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-11
Publication Date
2026-08-28
Estimated Expiration
2035-03-11

AI Technical Summary

Technical Problem

[0003]体征监测仪的壳体中设有若干工作元件和用于驱动若干工作元件工作的多个电路板,为了对电路板进行保护,壳体侧壁无法开设散热孔来对电路板之间的热量进行散热,因此,在实际工作过程中,内部电路板工作发热产生的热量会堆积在壳体内,从而导致体征监测仪死机或内部工作元件损坏,极大地影响了体征监测仪的使用寿命

Benefits of technology

[0023]1、通过散热部和导热凸台的增设,使得导热凸台不仅可以用于限位套接安装体征监测仪的一级电路板,且贯穿一级电路板后还可将端部暴露于一级电路板和二级电路板之间,以用于安装导热件并使其位于一级电路板和二级电路板之间的导热件,让导热件可直接将一级电路板和二级电路板工作时产生的热量依次通过导热凸台、散热部导热至散热区和散热孔以受散热装置出风散热,从而使得堆积于一级电路板和二级电路板之间的热量得以快速输出,避免体征监测仪的电路板工作发热使得热量堆积于壳体内导致死机或内部工作元件损坏的情况发生,极大地提高了壳体内部热量的输出效率,提高散热效率。

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Abstract

The utility model provides a kind of sign monitor, comprising: monitoring device;Primary circuit board and secondary circuit board;Shell, inside is equipped with mounting cavity and one side is the heat dissipation hole of heat dissipation part being equipped with, heat dissipation part inner wall is in and is provided with the heat conduction boss, primary circuit board mounting sleeve is set in the heat conduction boss outer periphery and is formed between with heat dissipation part heat dissipation area, secondary circuit board is installed in mounting cavity and spacing corresponds primary circuit board, heat conduction boss is installed with the heat conduction piece between primary circuit board and secondary circuit board, heat dissipation area is installed with the heat dissipation device of the air outlet end corresponding heat dissipation hole.Let heat conduction piece can directly the heat generated by primary circuit board and secondary circuit board work in turn through heat dissipation area and heat dissipation hole with heat dissipation part heat conduction to heat dissipation device air outlet heat dissipation, to make the heat accumulated between primary circuit board and secondary circuit board be able to be quickly output, greatly improve the output efficiency of installation shell interior heat, improve heat dissipation efficiency.
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