A silicon wafer cutting machine

Abstract

The utility model is suitable for the technical field of silicon wafer cutting, provides a kind of silicon wafer cutting machine, it includes lifting platform, cutting component and at least two nozzles being arranged in the lower of lifting platform, lifting platform is connected with the silicon rod to be cut, in the working process to adjust the cutting position of the silicon rod to be cut.Cutting component includes cutting line, cutting line is used to cut the silicon rod to be cut.Two nozzles are fixed respectively in the both sides of lifting platform, nozzle includes liquid outlet, in the case where lifting platform works, the drop point of cutting fluid flowing from liquid outlet is always located above cutting line.Through the setting of lifting platform, cutting component and nozzle, since nozzle is fixed in the both sides of lifting platform, so in the process of lifting platform lifting, can make the drop point of cutting fluid always be located on cutting line, so solve the problem of insufficient cutting fluid coverage, have the advantages of improving cutting fluid supply stability, improving silicon wafer cutting quality, reducing the broken edge angle defective rate and prolonging diamond wire service life.

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