Epoxy resin gradient temperature control automatic packaging equipment for smart card avoidance process
CN224689439UActive Publication Date: 2026-08-28NINGXIA CHIP CARD INTELLIGENT TECH CO LTD
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Patent Information
- Application Number
- CN202521429873.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-09
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-07-09
AI Technical Summary
Technical Problem
[0003]然而,现有的封装设备自动化程度较低,智能卡在放入模具板时需要工作人员手动操作,无法直接将智能卡输送至模具板内,从而难以满足大规模连续化生产的需求,导致生产效率低下
Benefits of technology
[0016]1、本实用新型设置了送料组件和推料组件,通过送料组件和推料组件能够将待封装的智能卡自动运输到下模具板内,这种全自动的送料方式能够让智能卡在封装的时候更加快捷有序。
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Figure CN224689439U_ABST
Abstract
The utility model discloses an epoxy resin gradient temperature control automatic packaging equipment for intelligent card emptying process belongs to the field of intelligent card automatic packaging, including base plate, the top right side of base plate is fixedly installed with support column, and the top of support column is provided with feeding assembly, and feeding assembly includes electric slide rail fixedly installed on the top of support column, and the slider top of electric slide rail is fixedly installed with concave material conveying plate, and the back of concave material conveying plate is provided with push material assembly, and the top left side of base plate is fixedly installed with four vertical rods that are rectangular array distribution, and the surface of vertical rod is fixedly sleeved with lower mould plate, and gradient temperature control solidification subassembly is arranged in lower mould plate, and the utility model sets up feeding assembly and push material assembly, and through feeding assembly and push material assembly can automatically transport the intelligent card of waiting for packaging to lower mould plate, and this full -automatic feeding mode can make the intelligent card more fast and orderly when packaging.
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