High-heat-resistant and high-flame-retardant phenolic resin-based SMC plate

Abstract

The utility model relates to a kind of high heat-resistant, high flame-retardant phenolic resin-based SMC plate material.It solves the problem that phenolic resin-based composite material in prior art is not good in mechanical properties, and is not stable enough in structure under high temperature environment.It includes polyester film layer arranged on both sides, fiber paste structure is arranged in the inside of polyester film layer, high-temperature-resistant connecting mechanism is arranged in the periphery of fiber paste structure, and penetration type flame-retardant structure is arranged between high-temperature-resistant connecting mechanism and fiber paste structure.The utility model has the advantages of realizing heat-resistant stability, improving flame retardancy and structural stability.

Description

Technical Field

[0001] This utility model relates to the field of sheet technology, specifically to a high heat-resistant and high flame-retardant phenolic resin-based SMC sheet. Background Technology

[0002] With the increasing demands for material performance in fields such as rail transportation, aerospace, and construction, traditional sheet molding compounds (SMCs) can no longer meet the requirements of high-end applications in terms of heat resistance, flame retardancy, and mechanical properties. Phenolic resins, with their excellent heat resistance, flame retardancy, and dimensional stability, have become an ideal matrix for developing high-performance SMC materials. However, traditional phenolic resin-based composites have poor flame retardancy; in addition, they suffer from poor mechanical properties and structural instability at high temperatures.

[0003] To address the shortcomings of existing technologies, people have conducted long-term explorations and proposed various solutions. For example, Chinese patent literature discloses a flame-retardant SMC ceiling [CN202023034385.3], which includes a ceiling body, a first anti-corrosion layer on the ceiling body, a second anti-corrosion layer at the bottom of the first anti-corrosion layer, a fixing layer at the bottom of the second anti-corrosion layer, a heat insulation layer at the bottom of the fixing layer, a flame-retardant layer at the bottom of the heat insulation layer, and an installation groove on the ceiling body, with a mounting base fixedly installed inside the installation groove.

[0004] The above solution has solved the problem of poor flame retardancy of phenolic resin-based composite materials in the prior art to a certain extent. However, the solution still has many shortcomings, such as poor mechanical properties and insufficient structural stability at high temperatures. Summary of the Invention

[0005] The purpose of this invention is to address the above-mentioned problems by providing a high heat resistance and high flame retardant phenolic resin-based SMC board.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a high heat-resistant and high flame-retardant phenolic resin-based SMC board, comprising polyester film layers disposed on both sides, a fiber paste structure disposed on the inner side of the polyester film layers, a high-temperature resistant connecting mechanism disposed circumferentially on the fiber paste structure, and an interpenetrating flame-retardant structure disposed between the high-temperature resistant connecting mechanism and the fiber paste.

[0007] In the aforementioned high heat-resistant and high flame-retardant phenolic resin-based SMC board, the polyester film layer includes an anti-oxidation layer disposed on the outer wall, and the anti-oxidation layer contains a phenolic resin layer.

[0008] In the aforementioned high heat-resistant and high flame-retardant phenolic resin-based SMC board, the fiber paste structure includes at least two fiber cloth structural layers, with resin paste layers disposed on both sides of the fiber cloth structural layers.

[0009] In the aforementioned high heat resistance and high flame retardant phenolic resin-based SMC board, the fiber cloth structural layer includes a fiber cloth middle layer, and flame retardant bonding layers are provided on both sides of the fiber cloth middle layer.

[0010] In the aforementioned high heat-resistant and high flame-retardant phenolic resin-based SMC board, the high-temperature resistant connecting mechanism includes a high-temperature resistant positioning frame disposed on the circumferential outer wall of the fiber paste structure, and a connecting frame body passing through the high-temperature resistant positioning frame.

[0011] In the aforementioned high heat-resistant and high flame-retardant phenolic resin-based SMC board, the two ends of the connecting frame and located on both sides of the fiber paste structure are connected by a high-temperature resistant structural layer, and the high-temperature resistant structural layer is tightly bonded to the resin paste layer.

[0012] In the aforementioned high heat-resistant and high flame-retardant phenolic resin-based SMC board, the interpenetrating flame-retardant structure includes a flexible flame-retardant layer interpenetrating within the resin paste layer, and at least two flame-retardant connecting layers interpenetrating within the fiber cloth middle layer. The flexible flame-retardant layer and the flame-retardant connecting layer are circumferentially connected to the connecting frame.

[0013] In the aforementioned high heat-resistant and high flame-retardant phenolic resin-based SMC board, the flame-retardant connecting layers are connected by several heat-insulating parts, which are inserted into the middle layer of the fiber cloth.

[0014] In the aforementioned high heat-resistant and high flame-retardant phenolic resin-based SMC board, a positioning cavity is provided on the fiber cloth middle layer for the insertion of the flame-retardant connecting layer.

[0015] In the above-mentioned high heat-resistant and high flame-retardant phenolic resin-based SMC board, a positioning slot is provided on the side of the phenolic resin layer away from the anti-oxidation outer layer, and a plugging protrusion is provided on one side of the resin paste layer corresponding to the positioning slot. The high-temperature resistant structural layer is sandwiched between the plugging protrusion and the positioning slot.

[0016] Compared with existing technologies, the advantages of this invention are as follows: It constructs a preliminary high-temperature barrier using layers such as an antioxidant layer and a phenolic resin layer; it strengthens internal support and forms multi-layered flame retardancy using an interlocking structure; and it prevents interlayer separation by employing a high-temperature resistant positioning frame and a plug-in structure. This not only effectively resists structural damage from high temperatures and avoids delamination failure, but also improves overall shear and bending resistance, achieving simultaneous optimization of heat resistance stability, flame retardancy, and mechanical properties, resulting in enhanced heat resistance, high flame retardancy, and strong mechanical properties. Attached Figure Description

[0017] Figure 1 This is a cross-sectional view of the present invention; Figure 2 This is a cross-sectional view of the fiber paste structure of this utility model; Figure 3 This is a schematic diagram of the end face structure of the fiber cloth structure layer in this utility model; Figure 4 This is a partial exploded view of the structure of this utility model; In the figure: Polyester film layer 1, Polyester film layer 1, Antioxidant layer 11, Phenolic resin layer 12, Positioning slot 13, Fiber paste structure 2, Fiber cloth structure layer 21, Fiber cloth middle layer 211, Flame retardant bonding layer 212, Positioning cavity 213, Resin paste layer 22, Insertion protrusion 221, High temperature resistant connection mechanism 3, High temperature resistant positioning frame 31, Connection frame 32, High temperature resistant structural layer 33, Insertion flame retardant structure 4, Flexible flame retardant layer 41, Flame retardant connection layer 42, Heat insulation part 43. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0019] like Figure 1-4 As shown, a high heat-resistant and high flame-retardant phenolic resin-based SMC board includes a polyester film layer 1 disposed on both sides, a fiber paste structure 2 disposed on the inner side of the polyester film layer 1, a high-temperature resistant connecting mechanism 3 disposed circumferentially on the fiber paste structure 2, and an interpenetrating flame-retardant structure 4 disposed between the high-temperature resistant connecting mechanism 3 and the fiber paste.

[0020] The board is made of Resol-type phenolic resin with a resin content of 10-40wt%, combined with 20-50wt% aramid fiber, 10-30wt% phosphorus and nitrogen flame retardant, 1-3wt% thickener, and 1-9wt% wetting and dispersing agents. While meeting mechanical strength requirements, the molded board meets UL94V0 standards, has a thickness of 1.6mm, low smoke density and toxicity, and an extremely high heat distortion temperature. The polyester film layer 1 includes an antioxidant layer 11 disposed on the outer wall, and a phenolic resin layer 12 is disposed within the antioxidant layer 11.

[0021] Modified phenolic resin was selected as the matrix material, and heat-resistant additives and toughening agents were added to the phenolic resin layer 12 to improve the heat distortion temperature and long-term service temperature of the material, while also improving its toughness and molding processability.

[0022] UV-resistant additives and antioxidants are added to the polyester film layer 1 to improve the material's aging resistance under long-term high temperature and outdoor environment, ensuring its long-term stability.

[0023] As can be seen, the fiber paste structure 2 includes at least two fiber cloth structure layers 21, and resin paste layers 22 are provided on both sides of the fiber cloth structure layer 21.

[0024] The resin paste layer 22 is used to ensure better fiber wettability and avoid the occurrence of dry glass fiber. The paste is controlled by the scraper interval and linear speed, and the sheet weight of the product is controlled within 5%.

[0025] Furthermore, the fiber cloth structural layer 21 includes a fiber cloth middle layer 211, and flame-retardant bonding layers 212 are provided on both sides of the fiber cloth middle layer 211.

[0026] The middle layer 211 of the fiber cloth uses modified aramid fiber as a reinforcing material. By optimizing the fiber content and distribution, the tensile strength, flexural strength and modulus of the material are improved, ensuring its mechanical properties in high-temperature environments.

[0027] The surface of aramid fibers is treated with a sizing agent and combined with a suitable resin impregnating agent to improve the originally poor wetting system, and the interlayer properties of the material reach the standard of general composite materials.

[0028] Furthermore, the high-temperature resistant connecting mechanism 3 includes a high-temperature resistant positioning frame 31 disposed on the outer periphery of the fiber paste structure 2, and a connecting frame 32 passing through the high-temperature resistant positioning frame 31.

[0029] The high-temperature resistant positioning frame 31 serves to stabilize the overall structure and improve the circumferential high-temperature resistance.

[0030] Specifically, the two ends of the connecting frame 32 and located on both sides of the fiber paste structure 2 are connected by a high-temperature resistant structural layer 33, and the high-temperature resistant structural layer 33 is tightly bonded to the resin paste layer 22.

[0031] The high-temperature resistant structural layer 33 is used to provide high-temperature protection for the resin paste layer 22.

[0032] More specifically, the interpenetrating flame-retardant structure 4 includes a flexible flame-retardant layer 41 inserted within the resin paste layer 22, and at least two flame-retardant connecting layers 42 inserted within the fiber cloth middle layer 211. The flexible flame-retardant layer 41 and the flame-retardant connecting layers 42 are circumferentially connected to the connecting frame 32.

[0033] In detail, the flame-retardant connecting layers 42 are connected by a number of heat-insulating parts 43, which are inserted into the middle layer 211 of the fiber cloth.

[0034] Preferably, the fiber cloth middle layer 211 is provided with a positioning cavity 213 into which the flame-retardant connecting layer 42 can be inserted.

[0035] In addition, the phenolic resin layer 12 has a positioning slot 13 on the side away from the anti-oxidation outer layer, and the resin paste layer 22 has an insertion protrusion 221 on one side corresponding to the positioning slot 13. The high-temperature resistant structural layer 33 is sandwiched between the insertion protrusion 221 and the positioning slot 13.

[0036] In summary, the principle of this embodiment is as follows: the polyester film layer 1 forms an outer protective layer through the outer anti-oxidation layer 11 and the inner phenolic resin layer 12, improving heat resistance, toughness and molding processability; the fiber cloth structure layer 21 uses modified aramid fiber to improve high-temperature mechanical properties and interlayer properties, and the resin paste layers 22 on both sides assist in fixing and ensure the wettability of the fiber; the high-temperature resistant positioning frame 31 stabilizes the overall structure and improves circumferential heat resistance, and the connecting frame 32, together with the high-temperature resistant structural layer 33, connects the two sides of the fiber paste structure 2 to enhance the overall integrity and high-temperature protection; the flexible flame-retardant layer 41, the flame-retardant connecting layer 42 and the heat insulation part 43 form a three-dimensional flame-retardant and heat-insulating network and are connected to the connecting frame 32 to strengthen the structure and improve the flame-retardant and heat-insulating effects.

[0037] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.

[0038] Although this document frequently uses terms such as polyester film layer 1, polyester film layer 1, anti-oxidation layer 11, phenolic resin layer 12, positioning slot 13, fiber paste structure 2, fiber cloth structure layer 21, fiber cloth middle layer 211, flame-retardant bonding layer 212, positioning cavity 213, resin paste layer 22, plug-in protrusion 221, high-temperature resistant connecting mechanism 3, high-temperature resistant positioning frame 31, connecting frame 32, high-temperature resistant structural layer 33, interlocking flame-retardant structure 4, flexible flame-retardant layer 41, flame-retardant connecting layer 42, and heat insulation part 43, the possibility of using other terms is not excluded. The use of these terms is merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

Claims

1. A high heat-resistant and high flame-retardant phenolic resin-based SMC board, comprising polyester film layers (1) disposed on both sides, characterized in that, The inner side of the polyester film layer (1) is provided with a fiber paste structure (2), the fiber paste structure (2) is provided with a high temperature resistant connecting mechanism (3) in the circumferential direction, and an interpenetrating flame retardant structure (4) is provided between the high temperature resistant connecting mechanism (3) and the fiber paste.

2. The high heat resistance and high flame retardant phenolic resin-based SMC board according to claim 1, characterized in that, The polyester film layer (1) includes an antioxidant layer (11) disposed on the outer wall, and a phenolic resin layer (12) is disposed inside the antioxidant layer (11).

3. The high heat resistance and high flame retardant phenolic resin-based SMC board according to claim 2, characterized in that, The fiber paste structure (2) includes at least two fiber cloth structure layers (21), and resin paste layers (22) are provided on both sides of the fiber cloth structure layer (21).

4. The high heat resistance and high flame retardant phenolic resin-based SMC board according to claim 3, characterized in that, The fiber cloth structure layer (21) includes a fiber cloth middle layer (211), and flame-retardant bonding layers (212) are provided on both sides of the fiber cloth middle layer (211).

5. The high heat resistance and high flame retardant phenolic resin-based SMC board according to claim 4, characterized in that, The high-temperature resistant connecting mechanism (3) includes a high-temperature resistant positioning frame (31) disposed on the circumferential outer wall of the fiber paste structure (2), and a connecting frame (32) is inserted inside the high-temperature resistant positioning frame (31).

6. The high heat resistance and high flame retardant phenolic resin-based SMC board according to claim 5, characterized in that, The two ends of the connecting frame (32) and the two sides of the fiber paste structure (2) are connected by a high-temperature resistant structural layer (33), and the high-temperature resistant structural layer (33) is tightly attached to the resin paste layer (22).

7. The high heat resistance and high flame retardant phenolic resin-based SMC board according to claim 5, characterized in that, The interpenetrating flame-retardant structure (4) includes a flexible flame-retardant layer (41) inserted into the resin paste layer (22), and at least two flame-retardant connecting layers (42) inserted into the fiber cloth middle layer (211). The flexible flame-retardant layer (41) and the flame-retardant connecting layer (42) are circumferentially connected to the connecting frame (32).

8. The high heat resistance and high flame retardant phenolic resin-based SMC board according to claim 7, characterized in that, The flame-retardant connecting layers (42) are connected by a number of heat-insulating parts (43), which are inserted into the fiber cloth middle layer (211).

9. The high heat resistance and high flame retardant phenolic resin-based SMC board according to claim 7, characterized in that, The fiber cloth middle layer (211) is provided with a positioning cavity (213) into which the flame-retardant connecting layer (42) can be inserted.

10. A high heat-resistant, high flame-retardant phenolic resin-based SMC board according to claim 6, characterized in that, The phenolic resin layer (12) has a positioning slot (13) on the side away from the anti-oxidation outer layer. The resin paste layer (22) has an insertion protrusion (221) on one side corresponding to the positioning slot (13). The high-temperature resistant structural layer (33) is sandwiched between the insertion protrusion (221) and the positioning slot (13).

Images