Infrared heat press bonding device

CN224689794UActive Publication Date: 2026-08-28WUHAN DR LASER TECH CORP LTD
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Patent Information

Application Number
CN202521775345.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-20
Publication Date
2026-08-28
Estimated Expiration
2035-08-20

AI Technical Summary

Technical Problem

[0004]以上热压复合过程中,加热系统需要对整个热压平台、腔体以及叠层结构的所有材料(包括对热不敏感的背板和导电金属层)进行整体加热,其热量传导路径长,热损失严重,导致能耗大

Benefits of technology

[0026]本申请的有益效果是:叠层结构依次经过红外加热机构、压合机构,红外加热机构发射红外光束穿透背板直接作用在热熔胶上对热熔胶加热,使得热熔胶具有粘性,其能量损失小,能量利用率高;当经红外加热机构加热后的叠层结构的前端传送至压合辊下方,压合辊以预设压力辊压叠层结构,直至叠层结构的后端经过压合辊,使得导电金属层和背板通过加热后具有粘性的热熔胶粘合在一起制得导电背板,从而实现导电背板的连续化生产,提高生产效率。本申请的红外热压贴合装置结构紧凑,集成性好,无需设计庞大的加热腔体和保温结构,简化结构设计,占地面积小,便于集成到现有的导电背板自动化生产线中。

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Abstract

The application provides an infrared heat pressing and adhering device, which comprises a conveying mechanism, an infrared heating mechanism arranged above a running path of a laminated structure and a pressing mechanism, the pressing mechanism comprises a pressing roller, the laminated structure comprises a conductive metal layer, hot melt adhesive and a back plate which are sequentially stacked from bottom to top, the pressing mechanism is arranged downstream of the infrared heating mechanism along a conveying direction of the laminated structure, the conveying mechanism drives the laminated structure to sequentially pass through the infrared heating mechanism and the pressing mechanism, the infrared heating mechanism emits an infrared light beam to heat the hot melt adhesive through the back plate, along the conveying direction of the laminated structure, when a front end of the laminated structure is conveyed below the pressing roller, the pressing roller rolls the laminated structure at a preset pressure, until a rear end of the laminated structure passes through the pressing roller, so that the conductive metal layer and the back plate are adhered together through the hot melt adhesive to obtain a conductive back plate, continuous, high-speed and high-quality automatic production of the conductive back plate is realized, the production efficiency and energy utilization rate are high, and the temperature control precision is high.
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