A thermal transfer printing head having semiconductor refrigeration plates and a thermal transfer printer

Abstract

The utility model relates to a kind of thermal transfer printing head and thermal transfer printer with semiconductor refrigeration sheet, and thermal transfer printing head includes print head body and print head backplate, the side surface of print head backplate is opened with assembly through slot along the length direction of print head backplate, the groove bottom of assembly through slot is opened with the limiting through slot extending arrangement along the length direction of print head backplate, copper pipe is inlaid in the limiting through slot, the copper pipe has flush contact surface with the groove bottom of assembly through slot, and the both ends of copper pipe are respectively provided with first joint and second joint;Multiple semiconductor refrigeration sheets are equipped in assembly through slot, print head body is installed in the side surface of print head backplate and is fixedly connected with print head backplate, and print head body covers assembly through slot and is in contact with semiconductor refrigeration sheet.The utility model has the thermal transfer printing head with semiconductor refrigeration sheet, can realize the high-precision linear regulation of temperature, inertia-free fast regulation and other advantages.

Description

Technical Field

[0001] This utility model relates to the field of thermal transfer technology, specifically to a thermal transfer printhead with a semiconductor cooling chip and a thermal transfer printer. Background Technology

[0002] Thermal transfer printing technology, with its high precision and high quality, is widely used in many fields such as label printing, barcode printing, and industrial marking. Its core working principle is to transfer ink from the ribbon to the substrate surface by heating the heating element (such as a thermistor) inside the thermal print head (TPH). In this process, the temperature control of the print head plays a decisive role in the transfer effect, directly affecting key indicators such as image clarity, color uniformity, and printing speed. Currently, print head heat dissipation mainly uses two methods: air cooling (heat sink + fan) and water cooling. However, these two traditional temperature control technologies have many drawbacks: firstly, the temperature control accuracy is low, making it difficult to meet the stringent temperature stability requirements of high-precision printing; secondly, the response speed is slow, unable to promptly cope with temperature changes caused by periodic fluctuations in print head power; thirdly, the reliability is poor, with severely insufficient heat dissipation efficiency under high power density and high load conditions, easily leading to localized overheating of the print head (temperature difference > 5℃), which in turn causes problems such as uneven ink transfer and shortened lifespan of the heating element, seriously affecting print quality and the normal operation of the equipment. Utility Model Content

[0003] The technical problem this invention aims to solve is that the printhead power fluctuates periodically during the thermal transfer process. Traditional air-cooling and water-cooling temperature control methods suffer from lag in response and cannot adjust the temperature quickly and accurately, resulting in overshoot or under-adjustment. This ultimately manifests in the printed product as uneven print depth and misregistration >0.1mm, severely affecting print quality and production efficiency.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: This utility model provides a thermal transfer printhead with a semiconductor cooling chip, including a printhead body and a printhead back plate. An assembly slot is formed on one side of the printhead back plate along its length. A limiting slot extending along the length of the printhead back plate is formed at the bottom of the assembly slot. A copper tube is embedded in the limiting slot, and the copper tube has a contact surface flush with the bottom of the assembly slot. A first connector and a second connector are respectively provided at both ends of the copper tube. Multiple semiconductor cooling chips are provided in the assembly slot. The printhead body is mounted on one side of the printhead back plate and fixedly connected to it. The printhead body covers the assembly slot and contacts the semiconductor cooling chips.

[0005] The beneficial effects of this utility model are as follows: This utility model has a thermal transfer printhead with a semiconductor cooling chip, which has the following advantages: (1) High-precision linear adjustment: The cooling capacity of the semiconductor cooling chip is in strict linear relationship with the input current. By precisely controlling the current, an ultra-high temperature control accuracy of ±0.1℃ can be achieved, which meets the strict requirements of high-precision printing for temperature stability.

[0006] (2) Inertia-free rapid adjustment: The semiconductor cooling chip has the characteristic of inertia-free dynamic adjustment. It can instantly change the cooling / heating state by switching the current. The response time is <1 second, which is very suitable for special printing jobs that require rapid heating / cooling or temperature cycling.

[0007] (3) Miniaturization and integration advantages: Semiconductor cooling chips are small in size, with the smallest size being millimeter-level (e.g., 5mm×5mm), making them easy to integrate into small devices or space-constrained printing devices, thus providing the possibility for miniaturization and integration design of devices.

[0008] (4) High reliability and long life: The semiconductor cooling chip used in this utility model only needs power supply to drive it, without the need for easily worn mechanical moving parts such as fans and water pumps, which greatly reduces the risk of equipment failure. Its service life can reach more than 100,000 hours, which significantly improves the reliability and service life of the equipment.

[0009] Based on the above technical solution, the present invention can be further improved as follows.

[0010] Furthermore, the cold side of the semiconductor cooling chip contacts the printhead body via thermally conductive silicone grease, and the hot side of the semiconductor cooling chip contacts the bottom of the mounting slot and the contact surface of the copper tube via thermally conductive silicone grease.

[0011] The beneficial effect of adopting the above-mentioned further solution is that by applying thermally conductive silicone grease to both the cold and hot sides of the semiconductor cooling chip, thermally conductive contact between the chip and the printhead body and the copper tube can be achieved, thereby accelerating heat transfer.

[0012] Furthermore, the assembly channel is also provided with heat insulation pads, and at least one heat insulation pad is provided between two adjacent semiconductor cooling chips. The heat insulation pads are in contact with the printhead body and the bottom of the assembly channel, respectively.

[0013] The beneficial effect of adopting the above-mentioned further solution is that by setting up heat insulation pads, heat transfer between the printhead body and the printhead backplate can be reduced, and the heat transfer path can be blocked.

[0014] Furthermore, the printhead body, heat insulation pad, and printhead back plate are fixed together by bolts.

[0015] Furthermore, a raised strip is integrally connected to one side of the printhead back plate near the edge. The raised strip extends along the length of the printhead back plate and is located on one side of the mounting through groove. A through hole for introducing cold water is opened in the printhead back plate at the position corresponding to the raised strip. The through hole is arranged parallel to the copper pipe.

[0016] The beneficial effect of adopting the above-mentioned further solution is that by setting a protrusion on one side of the printhead back plate and setting a through hole in the protrusion, a small amount of heat passing through the copper tube can be carried away by the circulating water in the through hole.

[0017] Furthermore, the middle part of the printhead body is in contact with the semiconductor cooling chip and the heat insulation pad, respectively, and the two sides of the printhead body are in contact with one side of the printhead back plate and the protrusion through heat insulation films.

[0018] The beneficial effect of adopting the above-mentioned further solution is that the heat insulation film can reduce the heat dissipation to both sides of the printhead body.

[0019] Furthermore, the printhead body integrates a temperature sensor electrically connected to a semiconductor cooling chip.

[0020] The advantages of adopting the above-mentioned further solutions are: combining temperature sensors, thermoelectric coolers and PID controllers provides excellent constant temperature stability; the thermoelectric coolers can dynamically compensate for temperature fluctuations in real time, which is especially suitable for complex printing scenarios that require long-term stable temperature control, ensuring the consistency and stability of print quality.

[0021] Furthermore, the bottom of the assembly channel is provided with two parallel and spaced limiting channels, and a copper tube is embedded in each limiting channel.

[0022] The beneficial effect of adopting the above-mentioned further solution is that by setting two copper pipes, the heat of the hot surface can be effectively controlled between the two copper pipes.

[0023] Furthermore, it also includes a chiller, with the two ends of the copper pipe connected to the chilled water outlet and return water outlet of the chiller via a first connector and a second connector, respectively.

[0024] This utility model also provides a thermal transfer printer, including a thermal transfer printhead with a semiconductor cooling chip as described above, and further including a printhead roller, a printhead connector and a cylinder. The cylinder is connected to the printhead back plate through the printhead connector, and the printhead roller is fixed to the wall plate and located below the printhead body.

[0025] The beneficial effects of this utility model are: the thermal transfer printer of this utility model can ensure the rapid dissipation of printing heat, with high heat dissipation efficiency and good heat dissipation effect. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the main structure of the thermal transfer printhead assembly with a semiconductor cooling chip of this utility model. Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure of AA; Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure of BB; Figure 4 for Figure 1 Schematic diagram of the cross-sectional structure of DD; Figure 5 for Figure 1 A schematic diagram of the cross-sectional structure of the C-C section; Figure 6 This is a side view of the thermal transfer printhead assembly with a semiconductor cooling chip according to the present invention. Figure 7 This is a top view schematic diagram of the thermal transfer printhead assembly with a semiconductor cooling chip according to this utility model.

[0027] The attached diagram lists the components represented by each number as follows: 1. Printhead body; 11. Heating wire; 12. Printhead roller; 13. Printhead connector; 2. Printhead backplate; 21. Assembly slot; 22. Copper tube; 23. Raised strip; 24. Through hole; 25. First connector; 26. Second connector; 3. Semiconductor cooling chip; 4. Thermal insulation pad; 5. Bolt; 6. Thermal insulation film. Detailed Implementation

[0028] The principles and features of this utility model are described below. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0029] Example 1 like Figures 1-7As shown, a thermal transfer printhead with a semiconductor cooling chip in this embodiment includes a printhead body 1 and a printhead back plate 2. An assembly slot 21 is formed on one side of the printhead back plate 2 along its length. A limiting slot extending along the length of the printhead back plate 2 is formed at the bottom of the assembly slot 21. A copper tube 22 is embedded in the limiting slot, and the copper tube 22 has a contact surface flush with the bottom of the assembly slot 21. A first connector 25 and a second connector 26 are respectively provided at both ends of the copper tube 22. A plurality of semiconductor cooling chips 3 are disposed within the assembly slot 21. The printhead body 1 is mounted on one side of the printhead back plate 2 and fixedly connected to it. The printhead body 1 covers the assembly slot 21 and contacts the semiconductor cooling chips 3.

[0030] In one specific embodiment, the cold side of the thermoelectric cooler 3 contacts the printhead body 1 via thermally conductive silicone grease, and the hot side of the thermoelectric cooler 3 contacts the bottom of the mounting slot 21 and the contact surface of the copper tube 22 via thermally conductive silicone grease. By applying thermally conductive silicone grease to both the cold and hot sides of the thermoelectric cooler, thermally conductive contact with the printhead body and the copper tube can be achieved, accelerating heat transfer.

[0031] like Figures 2-4 As shown, in a preferred embodiment, the bottom of the assembly slot 21 is provided with two parallel, spaced-apart limiting slots, and a copper tube 22 is embedded in each limiting slot. By setting two copper tubes, the heat from the hot surface can be effectively controlled between the two copper tubes. The two copper tubes can effectively control the heat from the hot surface between the two copper tubes, and a small amount of heat passing through the copper tubes can also be discharged through through holes set on the printhead backplate 2.

[0032] In this embodiment, the thermoelectric cooler 3 can be uniformly arranged along the length of the mounting slot 21. Since the thickness accuracy of the thermoelectric cooler 3 is limited, if the gap between the cold side of the thermoelectric cooler and the printhead body is too large, heat spreaders of different thicknesses can be placed on the thermoelectric cooler to fill the gap. If the cold side of the thermoelectric cooler is higher than one side of the printhead body, a heat-insulating film can also be used to fill the gap between the printhead body and the printhead backplate. The hot side of the thermoelectric cooler 3 is tightly bonded to the printhead backplate using thermal grease.

[0033] like Figures 2-4 As shown, the printhead body 1 of this embodiment has a heating wire 11 on the side away from the printhead back plate 2, which is used to cooperate with the printhead roller 12 for printing.

[0034] In this embodiment, a mounting slot 21 is opened on the printhead backplate 2, and the semiconductor cooling chip 3 is embedded in the mounting slot 21. Moreover, the printhead backplate 2 and the printhead body 1 can be tightly attached through the semiconductor cooling chip 3 to ensure rapid heat absorption and dissipation.

[0035] The thermal transfer printhead with a semiconductor cooling chip in this embodiment has the following advantages: (1) High-precision linear adjustment: The cooling capacity of the semiconductor cooling chip is strictly linearly related to the input current. By precisely controlling the current, an ultra-high temperature control accuracy of ±0.1℃ can be achieved, which meets the strict requirements of high-precision printing for temperature stability. (2) Inertia-free rapid adjustment: The semiconductor cooling chip has inertia-free dynamic adjustment characteristics. The cooling / heating state can be changed instantly by switching the current. The response time is <1 second, which is very suitable for special printing jobs that require rapid heating / cooling or temperature cycling. (3) Miniaturization and integration advantages: The semiconductor cooling chip is small in size, down to the millimeter level (e.g., 5mm×5mm), which is easy to integrate into small devices or space-constrained printing devices, providing the possibility for miniaturization and integration design of the equipment. (4) High reliability and long life: The semiconductor cooling chip used in this utility model only requires power supply and does not require easily worn mechanical moving parts such as fans and water pumps, which greatly reduces the risk of equipment failure. Its service life can reach more than 100,000 hours, which significantly improves the reliability and service life of the equipment.

[0036] Example 2 Based on Example 1, this example provides a preferred assembly scheme for a semiconductor cooling chip. For example... Figure 2 and Figure 5 As shown, a heat insulation pad 4 is also provided in the assembly slot 21, and at least one heat insulation pad 4 is provided between two adjacent semiconductor cooling chips 3. The heat insulation pad 4 is in contact with the printhead body 1 and the bottom of the assembly slot 21, respectively. By providing heat insulation pads, heat transfer between the printhead body and the printhead backplate can be reduced, and the heat transfer path can be blocked.

[0037] like Figure 2 and Figure 4 As shown, in one specific embodiment, the printhead body 1, the heat insulation pad 4, and the printhead back plate 2 are connected and fixed by bolts 5.

[0038] Specifically, such as Figure 5 As shown, in this embodiment, the assembly slot 21 of the printhead body 1 is provided with six semiconductor cooling chips 3, and a heat insulation pad 4 is provided between two adjacent semiconductor cooling chips 3. The height of the heat insulation pad 4 is the same as or higher than the height of the semiconductor cooling chip 3.

[0039] In this embodiment, to reduce heat conduction between the printhead body and the printhead backplate, proper heat insulation is required between the two. This can be achieved by using heat insulation pads 4 to block the heat transfer path. Furthermore, in conjunction with copper pipes, the copper pipes, as the core component of the liquid cooling system, can efficiently remove the heat generated by the hot surface of the semiconductor cooling chip.

[0040] Example 3 Based on Embodiment 1 or Embodiment 2, this embodiment provides a preferred solution for the printhead backplate 2. For example... Figures 2-4 As shown, a raised strip 23 is integrally connected to one side of the printhead back plate 2 near its edge. The raised strip 23 extends along the length of the printhead back plate 2 and is located on one side of the mounting slot 21. A through hole 24 for introducing cold water is provided in the printhead back plate 2 at a position corresponding to the raised strip 23. The through hole 24 is arranged parallel to the copper pipe 22. By providing a raised strip on one side of the printhead back plate and providing a through hole in the raised strip, a small amount of heat passing through the copper pipe can be carried away by the circulating water in the through hole.

[0041] The two ends of the through hole 24 pass through the two ends of the protrusion 23 and can be connected to the connector for connecting to the cold water outlet and return water outlet of the water chiller.

[0042] Example 4 Based on any of the above embodiments, this embodiment provides a preferred solution for the printhead body 1. For example... Figures 2-5 As shown, the middle portion of the printhead body 1 contacts the semiconductor cooling chip 3 and the heat insulation pad 4, respectively. The two sides of the printhead body 1 contact one side of the printhead backplate 2 and the protrusion 23 via heat insulation films 6. The heat insulation films reduce heat dissipation to both sides of the printhead body.

[0043] Specifically, such as Figures 2-5 As shown, in this embodiment, the heat insulation pad 4 and the semiconductor cooling chip 3 are both arranged above the bottom of the assembly slot 21. When the print head body 1 is placed on the heat insulation pad 4 and the semiconductor cooling chip 3, an assembly gap will be reserved between the print head body 1 and one side of the print head back plate 2 and between the side wall of the protrusion 23. The heat insulation film 6 can be placed or pasted in the assembly gap for heat insulation assembly between the print head body 1 and the print head back plate 2.

[0044] Specifically, the heat insulation film in this embodiment can be a heat insulation PTFE film.

[0045] Example 5 Based on any of the above embodiments, this embodiment provides a temperature control scheme for the printhead body 1, which can be implemented using existing technology. Optionally, the printhead body 1 integrates a temperature sensor electrically connected to a thermoelectric cooler 3. The temperature sensor and the thermoelectric cooler 3 are electrically connected via a PID controller. The temperature sensor detects the operating temperature of the printhead body 1 and feeds it back to the PID controller. The PID controller controls the start and stop of the thermoelectric cooler 3 according to the operating temperature, maintaining the operating temperature at 23℃±0.25℃. The temperature sensor can be integrated inside the printhead body, near the working area. One or multiple sensors can be integrated. When multiple temperature sensors are integrated, the highest value or the average value can be used for control. Combining the temperature sensor, the thermoelectric cooler 3, and the PID controller provides excellent constant temperature stability. The thermoelectric cooler can dynamically compensate for temperature fluctuations in real time, making it particularly suitable for complex printing scenarios requiring long-term stable temperature control, ensuring the consistency and stability of print quality.

[0046] In order to achieve precise control of the thermoelectric cooler, a high-precision temperature sensor is installed in a key part of the printhead body in this embodiment. The temperature sensor can monitor the printhead temperature in real time and accurately, and feed the collected temperature data back to the PID controller in real time. Based on the difference between the preset temperature value and the actual monitored temperature value, the PID controller uses the PID control algorithm to precisely adjust the current input to the thermoelectric cooler, thereby achieving precise control of the cooling capacity of the thermoelectric cooler and ensuring that the temperature of the printhead body is always stable within the set range.

[0047] Example 6 Based on any of the above embodiments, a further embodiment of the thermal transfer printhead is that the thermal transfer printhead further includes a chiller, and the two ends of the copper tube 22 are respectively connected to the chilled water outlet and the return water outlet of the chiller through a first connector 25 and a second connector 26.

[0048] Specifically, such as Figure 1 and Figure 6 As shown, the copper pipe 22 in this embodiment is provided with a first connector 25 and a second connector 26 at both ends, which are used to connect to the chilled water outlet and the return water outlet of the chiller, respectively.

[0049] This embodiment utilizes a through-hole in conjunction with two copper pipes as the core structure of the entire external water circulation cooling system, enabling rapid and precise temperature control.

[0050] Example 7 This embodiment provides a thermal transfer printer, including a thermal transfer printhead with a semiconductor cooling chip 3 as described in any of the above embodiments, and further including a printhead roller 12, a printhead connector 13, and a cylinder. The cylinder is connected to the printhead back plate 2 via the printhead connector 13. The printhead roller 12 is fixed to a wall panel and located below the printhead body 1. The printhead connector 13 can be connected and fixed to the printhead back plate 2 by a screw.

[0051] In this embodiment of the thermal transfer printer, the printhead roller 12 can be fixed to a wall panel. The printhead connector 13 can be connected to a cylinder, and the working pressure of the printhead body is applied by pressing down with the cylinder. The upper printhead connector 13 is used to connect and fix the printhead back plate with screws, and the printhead back plate is then connected to the lower parts to form a whole by bolts. The area of ​​the printhead body 1 corresponding to the printhead roller 12 is the printing working area. It is calculated that this area needs to withstand a pressure of about 70 kg. Therefore, the heat-insulating PTFE diaphragm needs to maintain good stability and heat insulation performance under 70 kg pressure. In this embodiment, one or more temperature sensors are evenly installed inside the printhead body, and the temperature is regulated by a PID control algorithm to accurately control the temperature of this area at 23℃±0.25℃. When the temperature rises, the PID controller immediately activates the semiconductor cooling chip to reduce the temperature; when the temperature drops, the PID controller can reverse the hot and cold sides of the semiconductor cooling chip by reversing the semiconductor current, or use the heat generated by the printhead body during the printing process to raise the temperature, ensuring that the printhead temperature is always stable within the set range.

[0052] The thermal transfer printer in this embodiment can ensure rapid heat dissipation, high heat dissipation efficiency, and good heat dissipation effect.

[0053] In the description of this utility model, it should be understood that the terms "length", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0054] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0055] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0056] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0057] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0058] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A thermal transfer printhead with a semiconductor cooling chip, characterized in that, The device includes a printhead body and a printhead backplate. One side of the printhead backplate has an assembly slot along its length. The bottom of the assembly slot has a limiting slot extending along the length of the printhead backplate. A copper tube is embedded in the limiting slot, and the copper tube has a contact surface flush with the bottom of the assembly slot. The two ends of the copper tube have a first connector and a second connector, respectively. Multiple thermoelectric coolers are disposed within the assembly slot. The printhead body is mounted on one side of the printhead backplate and fixedly connected to it. The printhead body covers the assembly slot and contacts the thermoelectric coolers.

2. The thermal transfer printhead with a semiconductor cooling chip according to claim 1, characterized in that, The cold side of the semiconductor cooling chip contacts the printhead body via thermally conductive silicone grease, while the hot side of the semiconductor cooling chip contacts the bottom of the mounting slot and the contact surface of the copper tube via thermally conductive silicone grease.

3. The thermal transfer printhead with a semiconductor cooling chip according to claim 1, characterized in that, The assembly channel is also provided with a heat insulation pad, and at least one heat insulation pad is provided between two adjacent semiconductor cooling chips. The heat insulation pad is in contact with the printhead body and the bottom of the assembly channel, respectively.

4. A thermal transfer printhead with a semiconductor cooling chip according to claim 3, characterized in that, The printhead body, heat insulation pad, and printhead back plate are fixed together by bolts.

5. A thermal transfer printhead with a semiconductor cooling chip according to claim 3, characterized in that, A raised strip is integrally connected to one side of the printhead back plate near the edge. The raised strip extends along the length of the printhead back plate and is located on one side of the mounting slot. A through hole for introducing cold water is opened in the printhead back plate at the position corresponding to the raised strip. The through hole is arranged parallel to the copper pipe.

6. A thermal transfer printhead with a semiconductor cooling chip according to claim 5, characterized in that, The middle part of the printhead body is in contact with the semiconductor cooling chip and the heat insulation pad, respectively, and the two sides of the printhead body are in contact with one side of the printhead back plate and the protrusion through heat insulation films.

7. A thermal transfer printhead with a semiconductor cooling chip according to claim 1, characterized in that, The printhead body integrates a temperature sensor that is electrically connected to a semiconductor cooling chip.

8. A thermal transfer printhead with a semiconductor cooling chip according to claim 1, characterized in that, The bottom of the assembly channel has two parallel, spaced-apart limiting channels, and each limiting channel is embedded with a copper tube.

9. A thermal transfer printhead with a semiconductor cooling chip according to claim 1, characterized in that, It also includes a chiller, and the two ends of the copper pipe are connected to the chilled water outlet and the return water outlet of the chiller through a first connector and a second connector, respectively.

10. A thermal transfer printer, characterized in that, The thermal transfer printhead with a semiconductor cooling chip as described in any one of claims 1 to 9 further includes a printhead roller, a printhead connector and a cylinder, wherein the cylinder is connected to the printhead back plate via the printhead connector, and the printhead roller is fixed to the wall plate and located below the printhead body.

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