MEMS chip with vertical direction buffering stop structure
CN224691846UActive Publication Date: 2026-08-28ANHUI BEIFANG XINDONG LIANKE MICROSYST TECH +1
Patent Information
- Application Number
- CN202522088201.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-28
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-28
AI Technical Summary
Technical Problem
[0004]现有技术尚未实现垂直方向+Z和-Z双向同时具备缓冲止挡作用的MEMS芯片设计,无法全面保护可动结构免受垂直双向冲击损伤
Benefits of technology
[0015]本实用新型具有垂直方向缓冲止挡结构的MEMS芯片通过在MEMS结构层的上、下两面分别设置含止挡弹簧的缓冲止挡结构,首次实现垂直方向+Z和-Z双向缓冲,止挡弹簧可通过弹性形变吸收冲击能量,避免Si材质的MEMS可动结构与止挡结构的刚性碰撞,有效防止MEMS结构碎裂或性能漂移;同时,无需改变垂直电极布局,避免了现有技术因工艺复杂导致的传感器灵敏度降低问题,且两个止挡层与MEMS结构层共同围成的密封腔还为MEMS可动结构及缓冲止挡结构提供稳定的活动空间,结合浅腔深度小于埋氧层厚度、止挡弹簧弹性系数高于MEMS弹簧等设计,进一步保障了MEMS芯片在垂直冲击下的工作可靠性,全面解决现有技术无法全面保护垂直方向可动结构的缺陷。
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Abstract
The utility model discloses a MEMS chip with vertical direction buffer stop structure belongs to the technical field of chip design and manufacture, MEMS chip including MEMS structure layer and melt bonding in the upper and lower two sides of MEMS structure layer two stop layers, two stop layers all are equipped with by the buffer stop structure that is composed of burying oxygen anchor point, stop anchor point, stop spring and stop block, and two stop layers and MEMS structure layer jointly enclose and form sealed cavity, and provide the activity space for MEMS movable structure and buffer stop structure. The utility model discloses a MEMS chip through the elastic deformation of stop spring absorption impact energy, has realized the two -way buffer of vertical direction, avoided the MEMS movable structure when receiving external force impact and exceeded displacement limit, led to structure to hit, even structure fracture, effectively guaranteed the work reliability of MEMS chip.
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Citation Information
Patent Citations
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