Vaporizer for semiconductor process to improve vaporization efficiency

Abstract

The utility model provides a vaporizer for semiconductor process with improved vaporization efficiency, comprising: a vaporization cavity for vaporizing liquid raw material and carrier gas into raw material gas by heating; an atomization part for supplying the liquid raw material and the carrier gas in aerosol form by atomizing them through the vaporization cavity; a liquid raw material supply part for heating the liquid raw material through the atomization part; a carrier gas supply pipe for supplying the carrier gas through the atomization part; and a raw material discharge part for discharging the raw material gas at the lower part of the vaporization cavity. According to the utility model, the liquid raw material channel in the atomization part rotates and accelerates due to the difference in area, and the carrier gas is wrapped by the jet, thereby improving the atomization efficiency of the carrier gas and the heated liquid raw material, and forming uniform aerosol. The thus uniform aerosol moves along the multi-stage heat exchange channel in the vaporization cavity, and is vaporized by transferring heat through the internal heater and the external heater. Therefore, the utility model has no blockage, and the vaporization efficiency can be significantly improved.

Description

Technical Field

[0001] This utility model relates to a vaporizer for semiconductor engineering, and more specifically to a vaporizer for semiconductor engineering that can improve vaporization efficiency by reducing the occurrence of blockage. Background Technology

[0002] Semiconductor processing largely uses gaseous source materials for deposition and etching. When the raw materials are in a liquid state at room temperature, the source materials must be converted into a gaseous state before they can be used in the semiconductor processing. The source materials are vaporized in the vaporizer equipped in the substrate processing device and then supplied to the engineering chamber.

[0003] In addition, in a substrate processing apparatus that also includes a vaporizer to change the liquid source material into a gaseous state and supply the vaporized source material into the engineering cavity, the source material must be vaporized inside the vaporizer to prevent the vaporized source material from cooling down and to supply the gaseous source material to the engineering cavity.

[0004] At this point, if the vaporization efficiency of the source material in the vaporizer is low, unvaporized source material will adhere to the inner wall of the vaporizer, reducing its performance and lifespan. Furthermore, unvaporized source material may flow into the engineering cavity along with vaporized source material. If unvaporized source material flows into the engineering cavity, it could potentially cause defects in semiconductor manufacturing processes.

[0005] In addition, when the vaporization efficiency of the vaporizer is low, the time required for the deposition process increases, thereby reducing the productivity of the semiconductor manufacturing process and increasing the consumption of raw materials, thus increasing the production cost of semiconductors.

[0006] An example of a vaporizer that improves vaporization efficiency is disclosed in patent No. 10-2610173, “Steam Generator and Thin Film Deposition Apparatus and Method”. Figure 1 Figure 2 This is a cross-sectional example diagram showing the cross-sectional structure of the vaporizer (10) disclosed in Patent No. 10-2610173. As shown, in the conventional vaporizer 10, the source material in a liquid state and the carrier gas flow into the interior in the form of aerosol A, and come into contact with the heater 15 and are heated before being discharged into the raw material gas G2. In order to improve vaporization efficiency, the conventional vaporizer 10 has an upper heat exchanger 11 and a lower heat exchanger 13 arranged vertically, and by forming a channel 14 inside each through which the aerosol A moves vertically, the heat exchange time is increased and the vaporization efficiency is improved.

[0007] However, in conventional vaporizers 10, the heater 15 is located on the outer wall of the upper heat exchanger 11 and the lower heat exchanger 13. This results in insufficient heat exchange with the aerosol A in the central region of the vertical moving channels, leading to condensation of the vaporized gas and clumping in particulate form, causing blockage. This blockage, resulting in ion accumulation in the upper and lower channels 14, hinders gas flow and reduces vaporization efficiency.

[0008] Furthermore, the conventional vaporizer 10 is formed by a central inlet port 17a and an external inlet port 17b, wherein the gas moves from the upper heat exchanger 11 to the lower heat exchanger 13 through a passage, such as... Figure 1 The cross-sectional view of the enlarged AA line is shown. For the bottom surface 17, the external inlet hole 17b and the central inlet hole 17a are formed as a small-diameter circular passage. Therefore, if the gas does not flow directly into the external inlet hole 17a and the central inlet hole 17a, it collides with the bottom surface 17. When colliding with the bottom surface 17, heat is lost, resulting in blockage, and particulate particles block the external inlet hole 17b and the central inlet hole 17a.

[0009] In addition, the gas discharged to the external air inlet 17b and the central air inlet 17a does not move to a single channel. Part of it flows into the internal channel and part of it moves to the external channel. This may result in irregular fluid flow and a temperature drop zone, which can lead to condensation and blockage. Utility Model Content

[0010] The purpose of this invention is to solve the above-mentioned problems and provide a vaporizer that can improve vaporization efficiency by heating the source material flowing into the vaporization chamber.

[0011] Another objective of this invention is to provide a vaporizer that can improve the atomization efficiency of aerosols by improving the structure of the atomizing section of the mixed source material and carrier gas.

[0012] Another objective of this invention is to provide a vaporizer that has a heater both outside and inside the vaporization chamber, thereby reducing clogging.

[0013] Another objective of this invention is to provide a vaporizer that reduces clogging by forming an arc-shaped elongated orifice.

[0014] The objective of this invention can be achieved through a vaporizer used in semiconductor engineering.

[0015] The vaporizer for semiconductor engineering of this invention includes: a vaporization chamber that heats a liquid raw material and a carrier gas and vaporizes them into a raw material gas; an atomizing section that atomizes the liquid raw material and the carrier gas through the vaporization chamber and supplies them in aerosol form; a liquid raw material supply section that heats the liquid raw material through the atomizing section; a carrier gas supply pipe that supplies the carrier gas through the atomizing section; and a raw material discharge section that includes the discharge of raw material gas in the lower part of the vaporization chamber.

[0016] The aforementioned atomizing unit includes an outer block formed by a heated liquid raw material inlet located on the side, from which heated liquid raw material flows in from the aforementioned liquid raw material supply unit, and an atomizing space formed at the bottom, through which aerosol is discharged to the aforementioned vaporization chamber. A carrier gas supply pipe is vertically arranged inside the outer block and connected to the atomizing unit. An inner block with a carrier gas channel is formed inside the inner block. The lower part of the inner block is obliquely connected to the inner wall surface of the outer block and the lower part of the inner block. A mixing head, in the shape of a disc covering the atomizing space, is provided. In the central region of the mixing head, it connects to the carrier gas channel, forming a carrier gas discharge path for discharging carrier gas into the atomizing space. On the outer peripheral surface of the mixing head, a plurality of heated liquid material discharge holes are provided at regular intervals along the circumferential direction, with the aforementioned carrier gas discharge path as the center. Between the inner wall surface of the inner block and the outer block where the heated liquid material inlet is formed, there is a heated liquid material flow path that moves the heated liquid material flow path flowing into the heated liquid material inlet. The inner diameter of the aforementioned carrier gas outlet is formed to be narrower than the inner diameter of the aforementioned carrier gas channel, and the width of the aforementioned heated liquid material channel is formed to be in the range of 1 / 10 to 3 / 10 narrower than the inner diameter of the aforementioned heated liquid material inlet. The heated liquid material rotates and accelerates around the aforementioned inner block and is discharged to the aforementioned heated liquid material outlet.

[0017] According to one embodiment, the vaporization chamber has an open lower portion and an aerosol inflow pipe with an atomizing section forming at the upper portion into which "aerosol A" flows. It also includes an upper external heat exchanger with a first partition wall forming concentric circles facing downwards, and a lower portion of the upper external heat exchanger. A second partition wall with concentric circles forming upper multi-stage heat exchange channels for the movement and heat exchange of aerosol A is disposed between the inner wall of the upper external heat exchanger and the first partition wall. This second partition wall is provided between an upper internal heat exchanger with an upper arc hole forming at the lower portion for discharging the first heat-exchanged aerosol A downwards, and the lower portion of the upper internal heat exchanger. The upper portion is open, and the lower portion is connected to the raw material gas discharge section. A lower external heat exchanger with a third concentric partition wall forming inside is disposed between the upper internal heat exchanger and the lower external heat exchanger. An upper arc-shaped orifice is formed at the top, coaxial with the upper arc-shaped orifice, through which aerosol A undergoes a single heat exchange and flows into the lower arc-shaped orifice of the lower external heat exchanger. The aerosol A is arranged concentrically between the inner wall of the lower external heat exchanger and the third partition wall, allowing the aerosol A to move. A fourth partition wall, forming a lower multi-stage heat exchange channel for the movement and heat exchange of the aerosol A, includes a lower internal heat exchanger: an upper external heater and a lower external heater at the rear of the upper and lower external heat exchangers; and an upper internal heater and a lower internal heater, which can be heated by the aerosol moving through the upper and lower multi-stage heat exchange channels.

[0018] According to one embodiment, the upper arc-shaped elongated hole and the lower arc-shaped elongated hole can be formed by a circular arc shape with a certain length of penetration on the outer side of the second partition wall and the fourth partition wall.

[0019] According to this invention, the vaporizer rotates and accelerates through the area difference of the heated liquid raw material channel in the atomizing section, and improves the atomization efficiency of the carrier gas and the heated liquid raw material by spraying and wrapping the carrier gas, thereby forming a uniform aerosol.

[0020] The resulting uniform aerosol moves along multiple heat exchange channels within the vaporization chamber, vaporizing through heat transfer between internal and external heaters. Therefore, compared to traditional vaporizers, there is no clogging, and vaporization efficiency is significantly improved.

[0021] In addition, when moving from the upper heat exchanger to the lower heat exchanger, the movement is made through an arc-shaped elongated hole, which reduces clogging and improves vaporization efficiency compared to moving to a small-sized discharge hole in the past. Attached Figure Description

[0022] Figure 1 A cross-sectional example of the operation process of a conventional carburetor; Figure 2 for Figure 1 View from AA direction; Figure 3 These are four views illustrating the structure of the carburetor according to this utility model; Figure 4 It is based on Figure 3 The BB line diagram shows the cross-sectional view formed by the cross-section; Figure 5 This is a cross-sectional view of the atomizing section of the carburetor; Figure 6 for Figure 5 Enlarged cross-sectional view at point D; Figure 7 The figures show four views illustrating the vaporization chamber of the vaporizer according to this utility model. Figure 8 for Figure 7 C-section view; Figure 9 for Figure 7 Cross-sectional view of DD; Figure 10 This diagram shows the composition of the decomposition vaporization chamber, with four exploded views. Figure 11 This is a cross-sectional view showing the composition of the vaporization chamber.

[0023] 100: Carburetor 110: Outer casing 120: Liquid Raw Material Supply Department 121: Liquid Raw Material Supply Room 123: Internal channel forming block 123a: Liquid raw material channel 125: External heater; 125a: Internal heater 127: Liquid raw material supply pipe; 129: Heated liquid raw material discharge pipe 130: Carrier gas supply pipe; 140: Atomizing section 141: External block 141a: Heated liquid raw material inlet 141b: Heated liquid feed passage; 141c: Atomization space 142: Heating liquid raw material connecting pipe; 143: Internal block 143a: Carrier gas passage; 143b: Carrier gas exhaust passage 143c: Mixing head; 143d: Heated liquid raw material discharge port 150: Vaporization chamber; 151: Vaporization chamber outer shell 152: Upper external heat exchanger 152a: First partition wall 152b: Aerosol inflow pipe; 152c: Inflow channel forming block 152d: Aerosol inflow channel; 153: Upper internal heat exchanger 153a: Second partition wall; 153b: Upper arc hole 153c: Heater housing space; 155a: Upper external heater 155b: Upper internal heater; 156: Lower external heat exchanger 156a: Third partition wall; 156b: Lower arc hole 157: Lower internal heat exchanger 157a: Fourth partition wall 158a: Lower external heater; 158b: Bottom internal heater 160: Gas emission section; 161: Raw material gas emission pipe A: Aerosol B: Liquid raw material B': Heating liquid raw material G1: Carrier gas; G2: Raw material gas; a, b, c: Upper multi-stage heat exchange channels a: Upper central passage; b: Upper middle passage; c: Upper outer passage d, e, f: Lower multi-stage heat exchange channels d: Lower outer perimeter passage; e: Lower middle passage; f: Lower central passage Detailed Implementation

[0024] To fully understand this utility model, preferred embodiments are described with reference to the accompanying drawings. Embodiments of this utility model can take many forms, and the scope of this utility model should not be construed as limited to the embodiments described in the following detailed description. These embodiments are provided to provide a more complete explanation of this utility model to those skilled in the art. Therefore, for the purpose of clearer illustration, the elements in the drawings may be exaggerated. It should be noted that in cross-sections, the same component may sometimes be labeled with the same reference numeral. Detailed technical specifications and configurations that may unnecessarily obscure the essence of this utility model will be omitted.

[0025] like Figure 3 , Figure 4As shown, a semiconductor process vaporizer 100 for improving vaporization efficiency is used to mix and heat liquid feedstock B used in semiconductor engineering with carrier gas G1 to vaporize it into feedstock gas G2. The liquid feedstock B and carrier gas G1 used in the vaporizer 100 may vary depending on the type of semiconductor engineering, the type of semiconductor, and the deposition characteristics. For example, liquid feedstock B can be used for depositing silicon SiH4 (Silane), for depositing silicon oxide film SiH4 (Silicon Tetrachloride), for forming tungsten thin film WF6 (Tungsten Hexafluoride), and for forming aluminum oxide film (CH3)3 (Trimethylaluminum, TMA).

[0026] Carrier gas G1 is used to transport the source material to vaporizer 100 or to promote the reaction. Carrier gas G1 can be N2, Ar, H2, etc.

[0027] In the field of vaporizers for semiconductor engineering, a vaporization chamber 150 is used to heat liquid raw materials and carrier gas and vaporize them into a raw material gas. The vaporizer 100 according to this invention includes, as follows: Figure 3 and Figure 4 The diagram shows an outer casing 110, a vaporization chamber 150 for heating and vaporizing carrier gas G1 and liquid raw material B within the outer casing 110, an atomizing section 140 for supplying a mixed aerosol A of carrier gas G1 and liquid raw material B to the vaporization chamber 150, and a liquid raw material supply section 120 for heating and vaporizing the liquid raw material B and supplying it to the atomizing section. To improve vaporization efficiency and minimize clogging, the liquid raw material B is heated and supplied to the atomizing section 140. Then, the heated liquid raw material B is accelerated inside the atomizing section 140 and comes into contact with the carrier gas G1, improving atomization efficiency. Furthermore, an internal heater 125a is provided inside the vaporization chamber 150 to reduce clogging that occurs under irregular temperature gradients, thereby improving vaporization efficiency.

[0028] The outer casing 110 internally houses a liquid raw material supply unit 120, an atomizing unit 140, and a vaporization chamber 150. The outer casing 110 is formed of heat-insulating material. Figure 3 As shown, the carrier gas supply pipe 130 is disposed on the upper exterior of the outer housing 110, and the gas exhaust section 160 is disposed on the lower side of the outer housing 110. Each power cable connected to the heat sink extends to the exterior of the outer housing 110.

[0029] The liquid feedstock supply unit 120 is provided within the outer housing 110 along with the atomizing unit 140 and the vaporization chamber 150. The liquid feedstock supply unit 120 supplies heated liquid feedstock B' to the atomizing unit 140. The atomization efficiency of the heated liquid feedstock B' and the carrier gas G1 is higher than that of the liquid feedstock B and the carrier gas G1 at room temperature. If the liquid feedstock has already been heated, the heat energy required for vaporization will be transferred to the pre-heated state, thus reducing the additional energy required for vaporization in the vaporizer 100. Therefore, in this invention, the liquid feedstock supply unit 120 heats the liquid feedstock B before supplying it to the atomizing unit 140.

[0030] Liquid Raw Material Supply Department 120 Figure 4 As shown, it includes a cylindrical liquid raw material supply chamber 121 disposed inside the outer housing 110 and an internal channel forming block 123 disposed inside the liquid raw material supply chamber 121 to form a liquid raw material B movement channel.

[0031] The lower part of the liquid raw material supply chamber 121 is connected to a liquid raw material supply pipe 127 that supplies liquid raw material B from a liquid raw material tank (not shown), and the upper part of the liquid raw material supply chamber 121 is connected to a heated liquid raw material discharge pipe 129 that discharges heated liquid raw material B' to the atomizing section 140.

[0032] The internal channel forming block 123 includes a hollow cylindrical tube, and a spiral recess of a certain depth is formed on the outer wall surface to form a liquid raw material channel 123a for conveying liquid raw material B. An external heater 125 is disposed inside the liquid raw material channel 123a, and the external heater 125 heats the liquid raw material B moving along the liquid raw material channel 123a.

[0033] In addition, an internal heater 125a is provided on the inner wall surface of the internal channel forming block 123 to heat the inner wall surface of the internal channel forming block 123, thereby uniformly heating and moving the liquid raw material B.

[0034] The liquid raw material supply pipe 127 and the heated liquid raw material discharge pipe 129 are respectively connected to the lower and upper ends of the liquid raw material channel 123a. The liquid raw material B supplied to the raw material supply pipe 127 moves spirally from bottom to top along the outer wall of the internal channel forming block 123 of the liquid raw material channel 123a, and is heated by heat transfer from the external heater 125 and the internal heater 125a. The heated liquid raw material B' is then supplied to the atomizing section 140 through the heated liquid raw material discharge pipe 129.

[0035] The atomizing unit 140 atomizes the heated liquid raw material B' and the carrier gas G1 and supplies them to the vaporization chamber 150 in the form of aerosol A. Figure 5 Figure 6 This is an enlarged cross-sectional view illustrating the cross-sectional structure of the atomizing section 140.

[0036] The atomizing unit 140 includes: an outer block 141 disposed on the upper part of the vaporization chamber 150, an inner block 143 inserted into the outer block 141 and connected to the carrier gas supply pipe 130, and a heated liquid raw material connecting pipe 142 connected to the outer block 141, wherein the heated liquid raw material connecting pipe 142 is connected to the heated liquid raw material discharge pipe 129.

[0037] The outer block 141 is in the form of a hollow tube and is connected to the aerosol inflow pipe 152b of the vaporization chamber 150. The outer block 141 is welded to the upper part of the vaporization chamber 150. One side of the outer block 141 is combined with the heating liquid raw material connecting pipe 142 to form the heating liquid raw material inlet 141a into which the heating liquid raw material B' flows.

[0038] The inner block 143 is vertically inserted into the interior of the outer block 141, connecting the carrier gas supply pipe 130 and the aerosol inflow channel 152d of the vaporization chamber 150. The inner block 143 forms a moving space between the inner wall surfaces of the outer block 141 for the heated liquid raw material B' flowing in from the heated liquid raw material inlet 141a.

[0039] At the lower part of the inner block 143, there is a mixing head 143c that is connected to the inner wall of the outer block 141 in the form of a downwardly inclined disk. The interior of the inner block 143 is vertically open, forming a carrier gas channel 143a that connects the carrier gas supply pipe 130 and the mixing head 143c.

[0040] In the central region of the mixing head 143c, connected to the carrier gas channel 143a, a carrier gas discharge path 143b is formed to discharge the carrier gas G1 to the atomization space 141c at the bottom of the mixing head 143c. The plate surface of the mixing head 143c is provided with a heated liquid raw material discharge hole 143d. The hole is centered on the carrier gas discharge path 143b and passes through the circumference at certain angles to discharge the heated liquid raw material B' to the atomization space 141c.

[0041] The outer diameter of the inner block 143 is larger in the region forming the heated liquid raw material inlet 141a, and becomes smaller as it goes down, gradually increasing in size within the mixing head 143c.

[0042] In the region where the heated liquid feedstock inlet 141a is formed, the outer diameter of the inner block 143 is relatively large, therefore the width of the heated liquid feedstock channel 141b formed between the outer block 141 and the inner block 143 is relatively narrow. The width of the heated liquid feedstock channel 141b is formed to be within the range of 1 / 10 to 3 / 10 narrower than the width W1 of the heated liquid feedstock inlet 141a.

[0043] Heated liquid material B' flows into the relatively wide "heated liquid material inlet 141a", and rotates and moves downward along the circumference of the inner block 143 in the suddenly narrowed heated liquid material channel 141b. The heated liquid material B', rotating and moving downward, gradually accelerates and moves downward as it moves through the narrow channel.

[0044] The heated liquid feedstock B', moving to the bottom, is discharged into the atomization space 141c through heated liquid feedstock discharge holes 143d formed on the mixing head 143c. The inner diameter of the heated liquid feedstock discharge holes 143d matches the narrow cross-section of the heated liquid feedstock flow path 141b, and multiple such holes are formed along the plate surface of the mixing head 143c. The heated liquid feedstock B' moves along the annularly open heated liquid feedstock channel 141b, accelerating its discharge through the spaced penetrating heated liquid feedstock discharge holes 143d, and is sprayed into the atomization space 141c at a higher speed.

[0045] On the other hand, the width d2 of the carrier gas discharge path 143b is significantly narrower than the width d1 of the carrier gas channel 143a. Ideally, the range is d2 = 1 / 10 to 3 / 10d1. As the width d2 of the carrier gas discharge path 143b narrows, the speed of the carrier gas G1 moving along the carrier gas channel 143a increases as the carrier gas discharge path 143b moves.

[0046] Figure 6 For a magnified view, carrier gas G1 is rapidly discharged into the carrier gas discharge path 143b formed in the central region of the mixing head 143c. Centered on the carrier gas discharge path 143b, the heated liquid raw material B' is accelerated by the injection of multiple heated liquid discharge holes 143d arranged in a circumferential direction, enveloping the carrier gas G1 and mixing the heated liquid raw material B' with the carrier gas G1. The heated liquid raw material B' is decomposed into very small particles, dispersed in the carrier gas G1, and then undergoes an atomization process to form aerosol A. The heated liquid raw material B' is decomposed into very small particles, dispersed in the carrier gas G1 through an atomization process, and then undergoes aerosol A formation.

[0047] In the atomizing section 140 of this utility model, the carrier gas discharge path 143b and the heated liquid raw material discharge hole 143d are designed to be significantly narrower than the width of the carrier gas channel 143a and the heated liquid raw material inlet 141a, thereby accelerating the discharge speed of the carrier gas G1 and the heated liquid raw material B' according to Bernoulli's law, thereby improving the atomization efficiency.

[0048] Accelerating the emission rate of carrier gas G1 and heated liquid feedstock B' atomizes them, increasing the collision energy between the two media, and causing the liquid particles of heated liquid feedstock B' to decompose into smaller particles, which helps to form a uniform aerosol.

[0049] Furthermore, the rapid injection speed of the heated liquid feedstock B' results in a faster mixing rate with the carrier gas G1. This maximizes the warming effect generated during mixing, helping to maintain uniform particle size. Additionally, due to the accelerated heating of the liquid feedstock B', the surface tension within it is easily overcome, allowing it to be converted into smaller particles, which contributes to improved vaporization efficiency.

[0050] Furthermore, through multiple arc-shaped discharge holes 143d for the heated liquid feedstock, the heated liquid feedstock B' surrounds the carrier gas G1 as it exits the atomization space 141c, thus helping to uniformly mix the heated liquid feedstock B' and the carrier gas G1. Additionally, as the heated liquid feedstock B' diffuses uniformly around the carrier gas G1, the aerosol A particles can form a more uniform size. When flowing into the vaporization chamber 150, it can maintain a stable aerosol form, thereby improving vaporization efficiency.

[0051] Furthermore, since the mixing pressure is evenly distributed when the liquid raw material B' is heated and discharged in the form of a surrounding carrier gas, the carrier gas G1 injected from the center at high pressure mixes rapidly with the heated liquid raw material B', which helps to atomize the liquid raw material B' at high speed.

[0052] The vaporization chamber 150 heats the aerosol A flowing in from the atomization section 140, vaporizing it into raw material gas G2. Figure 7 This is a schematic diagram of the structure of the vaporization chamber 150. Figure 10 This is a schematic diagram of the structure of the decomposition vaporization chamber 150. Figure 11 This is a schematic diagram of the cross-sectional structure of the decomposition vaporization chamber 150.

[0053] like Figure 7 , Figure 8 , Figure 9 As shown, the vaporization chamber 150 includes: a vaporization chamber shell 151; an upper external heat exchanger 152 used inside the vaporization chamber shell 151 and connected to the atomizing section 140; an upper internal heat exchanger 153 connected to the upper external heat exchanger 152 and forming upper multi-stage heat exchange channels a, b, c; a lower internal heat exchanger 157 disposed at the lower part of the upper internal heat exchanger 153; and a lower external heat exchanger 156 connected to the lower part of the lower internal heat exchanger 157 and forming lower multi-stage heat exchange channels d, e, f.

[0054] The vaporization chamber 150 has an open structure at the bottom and an aerosol inflow pipe 152b at the top for introducing aerosol A from the atomizing section 140. The interior has a first concentric partition wall 152a, which extends downward to form an upper external heat exchanger 152.

[0055] The outer shell 151 of the vaporization chamber is made of heat-insulating material, such as... Figure 3 As shown, the interior houses an upper external heat exchanger 152, an upper internal heat exchanger 153, a lower internal heat exchanger 157, and a lower external heat exchanger 156.

[0056] The upper external heat exchanger 152 is connected to the atomizing section 140, allowing aerosol A to flow into its interior. The upper external heat exchanger 152 is a cylindrical shape with an open lower portion. The interior of the upper external heat exchanger 152 has a first partition wall 152a forming concentric circles downwards. At the upper part of the upper external heat exchanger 152, an aerosol inflow pipe 152b forms a protrusion of a certain length towards the atomizing section 140. An inflow channel forming block 152c, forming an aerosol inflow channel 152d, is inserted into the interior of the aerosol inflow pipe 152b. The aerosol inflow channel 152d has a trapezoidal shape, with its inner diameter gradually widening from top to bottom, allowing aerosol A formed in the atomizing space 141c to flow into the aerosol inflow channel 152d and be guided without vortex formation. The aerosol inflow channel 152d has a trapezoidal shape with an inclined angle corresponding to the diffusion area of ​​aerosol A, guiding aerosol A to move only into a single channel.

[0057] The lower end of the aerosol inflow channel 152d is aligned with the inner wall surface and inner diameter of the first partition wall 152a, so that all aerosol A passing through the aerosol inflow channel 152d moves to the upper central channel a inside the first partition wall 152a.

[0058] Thus, if aerosol A is directed to move only through a single channel, heat exchange can be effectively concentrated. Figure 1 Like the conventional vaporizer 10 shown, heat is dispersed when it moves along multiple paths. In contrast, as described in this invention, when aerosol A moves to only a single channel, it absorbs heat concentratedly along a specific path, resulting in faster and more uniform vaporization.

[0059] The upper internal heat exchanger 153 is connected between the upper external heat exchanger 152 and the lower internal heat exchanger 157, forming upper multi-stage heat exchange channels a, b, and c, so that aerosol A is heated and vaporized before being discharged into the lower internal heat exchanger 157.

[0060] The upper internal heat exchanger 153 has a cylindrical outer shell with the same outer diameter as the upper external heat exchanger 152. A first partition wall 152a and a second partition wall 153a with a concentric circle shape are provided on the upper surface of the upper internal heat exchanger 153.

[0061] The second partition wall 153a is disposed between the first partition wall 152a and the inner wall surface of the upper external heat exchanger 152. Therefore, as Figure 7 Cross-sectional view of the CC line in the figure Figure 8As shown, upper multi-stage heat exchange channels a, b, and c are formed. The upper multi-stage heat exchange channels a, b, and c are formed inside the first partition wall 152a and communicate with the aerosol inflow channel 152d. The upper central channel a of aerosol A moves from the top to the bottom, between the first partition wall 152a and the second partition wall 153a, the upper middle channel b of aerosol A moves from the bottom to the top, and the channels b move from the second partition wall 153a and from the inner surface 152c of the upper heat exchanger 152.

[0062] Here, an upper external heater 155a is provided on the outer wall of the upper external heat exchanger 152. Additionally, as... Figure 7 As shown in the DD cross-section, the interior of the upper internal heat exchanger 153 is provided with a heater housing space 153c that accommodates the upper internal heater 155b.

[0063] Upper internal heater 155b Figure 9 As shown, aerosol A moving from the upper central channel a to the upper middle channel b is heated, while the upper external heater 155a heats aerosol A moving from the upper middle channel b to the upper peripheral channel c.

[0064] The vaporization chamber 150 of this invention forms a multi-segment heat exchange channel that runs from top to bottom, then from bottom to top, and then from top to bottom. In this process, in order to prevent blockage of aerosol A due to heat loss during movement, the upper internal heater 155b is used to supplement heat in the central area, thereby reducing the occurrence of blockage, increasing heat exchange time, and improving vaporization efficiency.

[0065] At this time, since heat has the property of accumulating towards the central region, the temperature of the upper internal heater 155b is set lower than the temperature of the upper external heater 155a.

[0066] Additionally, a pair of upper arc holes 153b are formed on the outer peripheral surface of the upper internal heat exchanger 153 to enclose the second partition wall 153a. The pair of upper arc holes 153b guides the aerosol A moving towards the upper peripheral channel c to the lower arc hole 156b of the lower internal heat exchanger 157.

[0067] Figure 1 The conventional vaporizer 100 shown moves the aerosol A through the discharge port 17b of the upper heat exchanger 11 to the lower heat exchanger 13, forming a through-hole shape of a certain size in the circumferential direction, thereby increasing the movement of aerosol A along the discharge port 17b and the occurrence of blockage.

[0068] To address these issues, the vaporizer 100 of this invention is formed as an arc-shaped elongated hole of a certain length, through which aerosol moves from the upper heat exchanger to the lower heat exchanger. A pair of lower arc holes 156b are provided on both sides of the upper arc hole 153b to move aerosol A to the lower internal heat exchanger 157.

[0069] In conventional structures with multiple discharge holes 17b of a certain size, the temperature may not rise uniformly as aerosol A passes through the discharge holes 17b because the heat applied from the heater is dispersed to each discharge hole 17b. If the ambient temperature is not high enough when passing through the discharge holes 17b, some aerosol may not vaporize easily and may condense into particulate residues. Conversely, if an upper arc hole 153b in the shape of an electric arc is used as in this invention, the heat is concentrated in one path and uniformly transferred to the entire aerosol A, thereby reducing the possibility of condensation in particulate form.

[0070] Furthermore, if aerosol A flows through multiple outlet holes 17b, its flow will be interrupted multiple times in a short period, resulting in a dispersed movement path and potentially insufficient heat exchange time. Conversely, because aerosol A flows along a specific arc-shaped path through the upper arc hole 153b, it remains exposed to the heater's heat for an extended period. This provides ample time for aerosol A to vaporize, reducing the problem of unvaporized particles re-condensing.

[0071] The lower internal heat exchanger 157 has the same structure as the upper internal heat exchanger 153, and is arranged downwards to form a fourth partition wall 157a. The lower external heat exchanger 156 is arranged around the lower internal heat exchanger 157, forming a third partition wall 156a inside. The third partition wall 156a and the fourth partition wall 157a, together with the lower external heat exchanger 156, form the lower multi-stage heat exchange channels d, e, and f.

[0072] In the lower internal heat exchanger 157, a lower arc hole 156b is formed, which is coaxial with the upper arc hole 153b of the upper internal heat exchanger 153. Aerosol A flowing into the lower arc hole 156b flows into the lower multi-stage heat exchange channels d, e, and f.

[0073] Aerosol A introduced into the lower arc hole 156b moves from top to bottom along the lower outer channel d, from bottom to top along the lower middle channel e, and from top to bottom along the lower central channel f.

[0074] The lower part of the central channel f is connected to the raw material gas discharge pipe 161 of the gas discharge section 160, which discharges the vaporized raw material gas G2 to the outside.

[0075] According to the present invention having this structure, reference will be made to... Figures 3 to 11 To illustrate the operation of the carburetor 100.

[0076] like Figure 3 As shown, the liquid raw material supply pipe 127 of the liquid raw material supply section 120 supplies liquid raw material B. Liquid raw material B moves spirally from bottom to top along the liquid raw material channel 123a, located between the liquid raw material supply chamber 121 and the internal channel forming block 123, receiving heat transferred from the external heater 125 and the internal heater 125a. Heating liquid raw material B' is as follows: Figure 5 As shown, the liquid raw material enters the inlet 141a of the heating liquid raw material flow, rotates once along the outer wall of the narrow heating liquid raw material channel 141b between the outer block 141 and the inner block 143, accelerates once, and is discharged through the heating liquid raw material discharge hole 143d of the mixing head 143c. It is accelerated a second time and discharged into the atomization space 141c.

[0077] Carrier gas G1 flows into the carrier gas channel 143a of the internal block 143 through the carrier gas supply pipe 130, and is discharged into the atomization space 141c through the carrier gas discharge path 143b. In the atomization space 141c, carrier gas G1 and heated liquid raw material B' are atomized into aerosol A, and flow into the aerosol inflow channel 152d of the vaporization chamber 150.

[0078] Aerosol A flowing into aerosol inflow channel 152d moves sequentially along the upper central channel a, upper intermediate channel b, and upper peripheral channel c between the upper external heat exchanger 152 and the upper internal heat exchanger 153, receiving heat from the upper internal heater 155b and the upper external heater 155a and vaporizing.

[0079] Aerosol A, passing through the upper peripheral channel c, moves along the upper arc hole 153b and the lower arc hole 156b, and receives heat from the lower external heater 158a and the lower internal heater 158b along the lower peripheral channel d, the lower middle channel e, and the lower central channel f, thus vaporizing. The vaporized raw material gas G2 is discharged to the outside through the raw material gas discharge pipe 161 and the gas discharge section 160.

[0080] As described above, the vaporizer according to this invention rotates and accelerates by the area difference of the heated liquid raw material in the atomizing section, sprays and envelops the carrier gas to improve the atomization efficiency of the carrier gas and the heated liquid raw material, thereby uniformly forming an aerosol.

[0081] The uniformly formed aerosol moves along multi-stage heat exchange channels within the vaporization chamber and is vaporized by heat transfer through internal and external heaters. Therefore, compared to traditional vaporizers, there is no clogging, and vaporization efficiency can be significantly improved.

[0082] In addition, when moving from the upper heat exchanger to the lower heat exchanger, it moves through an arc-shaped elongated orifice, which reduces clogging and improves vaporization efficiency compared to moving to a smaller discharge orifice in the past.

[0083] The above description is only a preferred embodiment of the present utility model. It should be noted that those skilled in the art can make several changes and improvements without departing from the overall concept of the present utility model, and these should also be considered within the protection scope of the present utility model.

Claims

1. A vaporizer for semiconductor processes with improved vaporization efficiency, characterized in that: In the field of vaporizers for semiconductor engineering A vaporization chamber (150) for heating liquid raw materials and carrier gas and vaporizing them into raw material gas. The atomizing unit (140) atomizes the liquid raw material and the carrier gas using the vaporization chamber (150) and supplies them in the form of an aerosol. A liquid raw material supply unit (120) that heats the liquid raw material to the atomizing unit (140); Carrier gas supply pipe (130) for supplying carrier gas to atomizing section (140); The lower part of the vaporization chamber (150) includes a gas discharge section (160) for discharging raw material gas; the atomizing section (140) has a heated liquid raw material inlet (141a) on its side for flowing heated liquid raw material from the liquid raw material supply section (120), and an outer block (141) formed by the atomizing space (141c) for discharging aerosol from the vaporization chamber (150); The outer block (141) is provided with a carrier gas supply pipe (130) vertically inside, which communicates with the atomizing part (140), including an inner block (143) that forms a carrier gas channel (143a) inside; The lower part of the aforementioned inner block (143) is connected to the inner wall of the outer block (141) and the bottom of the inner block (143) in an inclined manner, and covers the atomization space (141c) to form a disc-shaped mixing head (143c). In the central region of the mixing head (143c), it is connected to the carrier gas channel (143a) to form a carrier gas discharge path (143b) that discharges carrier gas into the atomization space (141c). On the outer peripheral surface of the mixing head (143c), a plurality of heated liquid raw material discharge holes (143d) are provided at certain intervals along the circumferential direction with the carrier gas discharge path (143b) as the center. Between the inner wall of the aforementioned inner block (143) and the inner wall of the aforementioned outer block (141) forming the aforementioned heated liquid raw material inlet (141a), there is a heated liquid raw material channel (141b) for moving the heated liquid raw material (B') flowing into the aforementioned heated liquid raw material inlet (141a). The inner diameter of the aforementioned carrier gas discharge path (143b) is narrower than the inner diameter of the aforementioned carrier gas channel (143a), and the width of the heated liquid raw material channel (141b) is reduced to a range of 1 / 10 to 3 / 10 compared to the inner diameter of the heated liquid raw material inlet (141a). This is a vaporizer for semiconductor engineering characterized by the heated liquid raw material (B') rotating once around the inner block (143) and being accelerated out of the heated liquid raw material discharge hole (143d).

2. The vaporizer for semiconductor processes with improved vaporization efficiency according to claim 1, characterized in that: The vaporization chamber (150) is an open structure at the bottom and an aerosol inflow pipe (152b) at the top that introduces aerosol (A) from the atomizing section (140). The chamber has a first partition wall (152a) in a concentric circle shape inside and the first partition wall extends downward to form an upper external heat exchanger (152). The lower part of the above-mentioned upper external heat exchanger (152) forms a concentric circle between the inner wall surface of the above-mentioned upper external heat exchanger (152) and the above-mentioned first partition wall (152a), forming the movement of the above-mentioned aerosol (A), and has a second partition wall (153a) that forms an upper multi-stage heat exchange channel for heat exchange, and an upper internal heat exchanger (153) formed by the upper arc hole (153b) from which the aerosol (A) of the first heat exchange in the lower part is discharged downward. The lower part of the above-mentioned upper internal heat exchanger (153) is configured with an open upper part and a lower part connected to the above-mentioned gas exhaust section (160), and a lower external heat exchanger (156) with a concentric third partition wall (156a) formed inside. The lower arc hole (156b) is formed between the upper internal heat exchanger (153) and the lower external heat exchanger (156) on the upper part and coaxial with the upper arc hole (153b) to allow the aerosol (A) of the first heat exchange to flow into the lower external heat exchanger (156). The inner wall surface of the lower external heat exchanger (156) and the third partition wall (156a) are arranged in a concentric circle. The lower partition wall (157a) has a fourth partition wall (157a) that forms a lower multi-stage heat exchange channel for the movement and heat exchange of the aerosol (A). The lower internal heat exchanger (157) is also provided. The upper external heater (155a) and the lower external heater (158a) are provided outside the upper external heat exchanger (152) and the lower external heat exchanger (156). The aforementioned upper internal heat exchanger (153) and the aforementioned lower internal heat exchanger (157) are equipped with a vaporizer for semiconductor processes, characterized by an upper internal heater (155b) and a lower internal heater (158b) heated by aerosols that move to the upper and lower multi-stage heat exchange channels.

3. The vaporizer for semiconductor processes with improved vaporization efficiency according to claim 2, characterized in that: The upper arc hole (153b) and the lower arc hole (156b) are semiconductor engineering vaporizers characterized by an arc shape formed by a certain length of penetration through the outer side of the second partition wall (153a) and the fourth partition wall (157a).

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