Wafer edge overplating protection device for electroless nickel palladium gold plating

Abstract

The utility model discloses a kind of chemical nickel palladium gold's wafer edge anti overplating protection devices, it is related to semiconductor manufacturing technical field, it includes wafer basket, and wafer basket is provided with wafer box by hanging bracket, the inside of wafer box is provided with control mechanism, and control mechanism is used to drive wafer body rotation, control mechanism includes servo motor, and the output of servo motor is provided with rotating shaft, rotating shaft is provided with pulley assembly, and pulley assembly is provided with linkage shaft, linkage shaft and the rotating shaft are all provided with friction strip, and friction strip is used to drive wafer body rotation in wafer box inside.This chemical nickel palladium gold's wafer edge anti overplating protection device is driven by servo motor synchronous rotation mechanism and friction strip, so that wafer rotates at uniform speed in plating solution, effectively eliminates edge electric field and liquid flow concentration phenomenon, to inhibit plating layer edge overplating, improve plating layer uniformity and product yield.

Images