Electronic component sintering jig
CN224695030UActive Publication Date: 2026-08-28SHENGRUI KANGZE (HEBEI XIONGAN) TECHNOLOGY CO LTD
Patent Information
- Application Number
- CN202521739215.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-15
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-08-15
AI Technical Summary
Technical Problem
[0005]本实用新型的目的在于：针对目前存在的无法将加热的热流均匀的分布在治具的表面，在加热过程中，热量会在高导热区域快速传递，导致这些区域温度迅速升高，而低导热区域升温较慢，这种温度差异会使电子元件在不同位置受到不同的热作用，靠近高导热区域的电子元件部分可能因温度过高而受损，影响电子元件的整体性能和质量的问题，提供一种电子元件烧结治具，以解决上述背景技术提出的问题
Benefits of technology
[0016]1.通过设置的固定组件，实现了对不同尺寸的电子元件进行均匀的加热，通过固定板和弹性压片的配合，对不同尺寸的电子元件进行稳定的固定，导流孔和第一导流板的配合，避免热流集中进入导致下石墨框表面局部过热，保证了下框架内部热流引入的均匀性和可控性，不仅确保电子元件在整个烧结过程中受热均匀，还提高烧结质量和产品的合格率；
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Figure CN224695030U_ABST
Abstract
The utility model provides a kind of electronic component sintering fixture, belong to sintering fixture technical field, including upper frame and the lower frame of upper frame bottom clamping, the inside of lower frame is provided with the fixed component that is uniformly heated and fixed to electronic component, the top of upper frame is provided with the guide component that is guided inert gas. The utility model is provided with fixed component, realize the uniform heating of different sizes electronic component, the cooperation of fixed plate and elastic pressing piece, the stable fixation of different sizes electronic component is carried out, the cooperation of flow guide hole and first flow guide plate, avoid the local overheating of lower graphite frame surface caused by the heat flow concentration, ensure the uniformity and controllability of heat flow introduction in lower frame inside, not only ensure that electronic component is evenly heated in whole sintering process, also improve sintering quality and product's qualified rate.
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Citation Information
Patent Citations
Electronic element sintering jig
CN222912376U