A rapid cooling mechanism in an ion implanter
CN224695093UActive Publication Date: 2026-08-28SUZHOU BERENS INTELLIGENT TECH CO LTD
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Patent Information
- Application Number
- CN202521876959.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-02
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-02
AI Technical Summary
Technical Problem
[0002]传统的冷却方式可能热传导路径不畅,热阻大,无法快速将离子注入机产生的巨大热量及时导出,导致设备温度居高不下
Benefits of technology
本实用新型通过导热板直接接触离子注入机热源,并结合内部折弯布置的吸热管与导热铜管组成的冷却回路,快速导出热量;避位孔的设置确保了导热板与吸热管充分接触,极大提升了热传导效率。
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Figure CN224695093U_ABST
Abstract
The utility model discloses a quick cooling mechanism in ion implanter, including cooling device casing and setting in the heat absorption pipe of cooling device casing inside four sides, cooling device casing bottom four sides all be provided with the mounting groove, and the mounting groove with cooling device casing four sides heat absorption pipe position corresponds, install the heat conduction plate who contacts with ion implanter in the mounting groove, export the heat of ion implanter through the heat conduction plate, and then play the function of quick cooling, the utility model discloses a heat conduction plate directly contacts ion implanter heat source, and combines the cooling circuit that the heat absorption pipe and heat conduction copper pipe of inside bending arrangement constitute, exports the heat quickly, the setting of the position hole has guaranteed that the heat conduction plate and heat absorption pipe contact fully, has improved the heat conduction efficiency greatly.
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