Wafer defect detection device based on metal shielding

Abstract

The utility model relates to a kind of wafer defect detection devices based on metal shielding, comprising: switching power supply, for providing 24V direct current;High-speed pulse signal source, for providing high-speed pulse signal;Boosting plate metal shielding box, boosting circuit board is arranged in it, and boosting circuit board is electrically connected with switching power supply and high-speed pulse signal source respectively;Light source, connecting boosting circuit board;Camera, connecting light source, switching power supply and boosting circuit board.The utility model carries out signal amplification to high-speed pulse signal with boosting circuit board and switching power supply, matches the signal amplitude required by light source and camera, improves the carrying capacity;While configuring boosting plate metal shielding box forms Faraday cage, reduces external electromagnetic interference, avoids signal distortion influence sampling.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer defect detection, and specifically to a wafer defect detection device based on metal shielding. Background Technology

[0002] Currently, in the field of semiconductor wafer defect detection, during the movement of the motion stage, a motion controller generates high-speed pulse signals in real time, which are then transmitted to the light source and camera for image acquisition. This approach has the following key problems: First, the high-speed pulse signals are subject to electromagnetic interference during transmission, which can lead to signal distortion and affect image acquisition. Second, the high-speed pulse signals experience attenuation during transmission, thus reducing their load-bearing capacity. Utility Model Content

[0003] This invention provides a wafer defect detection device based on metal shielding to solve at least one of the above-mentioned technical problems.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A wafer defect detection device based on metal shielding, comprising: A switching power supply, used to provide 24V DC power; A high-speed pulse signal source, used to provide high-speed pulse signals; A metal shielded box for boosting the voltage plate contains a boosting circuit board. The boosting circuit board is electrically connected to the switching power supply and the high-speed pulse signal source. The boosting circuit board is used to amplify the high-speed pulse signal under the power supply of the 24V DC power to obtain an amplified signal. A light source, connected to the boost circuit board, is used to generate an optical signal based on the amplified signal; The camera, connected to the light source, the switching power supply, and the boost circuit board, is used to capture images of the wafer to be inspected based on the amplified signal and the light signal under the power supply of the 24V DC power supply, so as to obtain an image for defect detection.

[0005] Based on the above technical solution, the present invention can be further improved as follows.

[0006] Furthermore, the metal shielding box of the booster plate is inlaid with a first metal connector, a second metal connector, a third metal connector and a fourth metal connector; The first metal connector is electrically connected to the switching power supply at one end outside the metal shielding box of the boost board, and the first metal connector is connected to the power supply terminal of the boost circuit board at the other end inside the metal shielding box of the boost board. The end of the second metal connector located outside the metal shielding box of the boost board is electrically connected to the high-speed pulse signal source, and the end of the second metal connector located inside the metal shielding box of the boost board is electrically connected to the input terminal of the boost circuit board. The third metal connector is electrically connected at one end inside the metal shielding box of the boost plate to the end of the first metal connector inside the metal shielding box of the boost plate and the output end of the boost circuit board; the third metal connector is electrically connected at one end outside the metal shielding box of the boost plate to the light source. The end of the fourth metal connector located inside the metal shielding box of the boost plate is electrically connected to the end of the first metal connector located inside the metal shielding box of the boost plate and the output end of the boost circuit board. The end of the fourth metal connector located outside the metal shielding box of the boost plate is electrically connected to the camera.

[0007] Furthermore, the first metal connector, located outside the metal shielding box of the boost plate, is electrically connected to the switching power supply via a first shielded cable; the second metal connector, located outside the metal shielding box of the boost plate, is electrically connected to the high-speed pulse signal source via a second shielded cable; the third metal connector, located outside the metal shielding box of the boost plate, is electrically connected to the light source via a third shielded cable; and the fourth metal connector, located outside the metal shielding box of the boost plate, is electrically connected to the camera via a fourth shielded cable.

[0008] Furthermore, the first metal connector, the second metal connector, the third metal connector, and the fourth metal connector are all Harting connectors.

[0009] Furthermore, it also includes a light source metal shielding box; the light source is disposed inside the light source metal shielding box, and the camera is connected to the switching power supply and the boost circuit board through the light source metal shielding box.

[0010] Furthermore, the camera includes a first camera, a second camera, a third camera, and a fourth camera; the light source metal shielding box is inlaid with a fifth metal connector, a sixth metal connector, a seventh metal connector, an eighth metal connector, and a ninth metal connector; The fifth metal connector is electrically connected to the switching power supply at one end located outside the light source metal shielding box, and electrically connected to the third camera and the fourth camera at the other end located inside the light source metal shielding box. The end of the sixth metal connector located outside the metal shielding box of the light source is electrically connected to the end of the third metal connector located outside the metal shielding box of the boost plate, and the end of the sixth metal connector located inside the metal shielding box of the light source is electrically connected to the input end of the light source. The end of the seventh metal connector located outside the light source metal shielding box is electrically connected to the end of the fourth metal connector located outside the boost plate metal shielding box, and the end of the seventh metal connector located inside the light source metal shielding box is electrically connected to the third camera and the fourth camera respectively. The eighth metal connector is electrically connected at one end inside the light source metal shielding box to the fifth metal connector at one end inside the light source metal shielding box and to the output end of the light source; the eighth metal connector is electrically connected at one end outside the light source metal shielding box to the first camera. The ninth metal connector is electrically connected at one end inside the light source metal shielding box to the fifth metal connector at one end inside the light source metal shielding box and to the output end of the light source. The ninth metal connector is electrically connected at one end outside the light source metal shielding box to the second camera.

[0011] Furthermore, the end of the fifth metal connector located outside the light source metal shielding box is electrically connected to the switching power supply via a fifth shielded cable; the end of the fifth metal connector located inside the light source metal shielding box is electrically connected to the third camera and the fourth camera respectively via a sixth and a seventh shielded cable passing through the light source metal shielding box; the end of the sixth metal connector located outside the light source metal shielding box is electrically connected to the end of the third metal connector located outside the boost plate metal shielding box via a third shielded cable; the end of the seventh metal connector located outside the light source metal shielding box is electrically connected to the end of the fourth metal connector located outside the boost plate metal shielding box via a fourth shielded cable; the end of the seventh metal connector located inside the light source metal shielding box is electrically connected to the third camera and the fourth camera respectively via a tenth and an eleventh shielded cable passing through the light source metal shielding box; the end of the eighth metal connector located outside the light source metal shielding box is electrically connected to the first camera via an eighth shielded cable; and the end of the ninth metal connector located outside the light source metal shielding box is electrically connected to the second camera via a ninth shielded cable.

[0012] Furthermore, the fifth, sixth, seventh, eighth, and ninth metal connectors are all Lemo connectors.

[0013] Furthermore, the boost circuit board includes a PCB board and a signal amplification circuit, an optocoupler isolation element, and a digital filter circuit integrated on the PCB board; the input terminal of the signal amplification circuit is electrically connected to the high-speed pulse signal source, the output terminal of the signal amplification circuit is electrically connected to the input terminal of the digital filter circuit through the optocoupler isolation element, the power supply terminal of the digital filter circuit is electrically connected to the switching power supply, and the output terminal of the digital filter circuit outputs the amplified signal.

[0014] Furthermore, the switching power supply is specifically a switching power supply with over-temperature protection, overload protection, and over-voltage protection.

[0015] The beneficial effects of this utility model are: the wafer defect detection device based on metal shielding uses a boost circuit board and a switching power supply to amplify high-speed pulse signals, matching the signal amplitude required by the light source and camera, thus improving the load capacity; at the same time, the boost board metal shielding box is configured to form a Faraday cage, reducing external electromagnetic interference and avoiding signal distortion from affecting image acquisition. Attached Figure Description

[0016] Figure 1 This is a structural block diagram of a wafer defect detection device based on metal shielding according to the present invention; Figure 2 This is a schematic diagram of the metal shielding box for the booster plate. Figure 3 This is another structural block diagram of a wafer defect detection device based on metal shielding according to the present invention; Figure 4 This is a schematic diagram of the metal shielding box for the light source. Figure 5 The circuit block diagram of the boost circuit board; Figure 6 This is a circuit block diagram of a switching power supply. Detailed Implementation

[0017] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0018] like Figure 1 As shown, a wafer defect detection device based on metal shielding includes: Switching power supply 1, which is used to provide 24V DC power; High-speed pulse signal source 2, which is used to provide high-speed pulse signals; The boost board metal shielding box 3 contains a boost circuit board 4. The boost circuit board 4 is electrically connected to the switching power supply 1 and the high-speed pulse signal source. The boost circuit board 4 is used to amplify the high-speed pulse signal under the power supply of the 24V DC power to obtain an amplified signal. Light source 5 is connected to the boost circuit board 4 and is used to generate an optical signal based on the amplified signal; Camera 6, connected to the light source 5, the switching power supply 1 and the boost circuit board 4, is used to take pictures of the wafer to be inspected based on the amplified signal and the light signal under the power supply of the 24V DC power supply, so as to obtain an image for defect detection.

[0019] This utility model discloses a wafer defect detection device based on metal shielding. It uses a boost circuit board 4 and a switching power supply 1 to amplify high-speed pulse signals, matching the signal amplitude required by the light source 5 and the camera 6, thereby improving the load capacity. At the same time, the metal shielding box 3 of the boost circuit board is configured to form a Faraday cage, reducing external electromagnetic interference and avoiding signal distortion from affecting image acquisition.

[0020] In some embodiments, such as Figure 2 As shown, the booster plate metal shielding box 3 is inlaid with a first metal connector 31, a second metal connector 32, a third metal connector 33 and a fourth metal connector 34; One end of the first metal connector 31 located outside the metal shielding box 3 of the boost board is electrically connected to the switching power supply 1 via the first shielded cable 801, and the other end of the first metal connector 31 located inside the metal shielding box 3 of the boost board is connected to the power supply terminal of the boost circuit board 4. One end of the second metal connector 32 located outside the metal shielding box 3 of the boost board is electrically connected to the high-speed pulse signal source 2 via the second shielding cable 802, and the other end of the second metal connector 32 located inside the metal shielding box 3 of the boost board is electrically connected to the input terminal of the boost circuit board 4. One end of the third metal connector 33 located inside the boost plate metal shielding box 3 is electrically connected to one end of the first metal connector 31 located inside the boost plate metal shielding box 3 and the output end of the boost circuit board 4. The other end of the third metal connector 33 located outside the boost plate metal shielding box 3 is electrically connected to the light source 5 through the third shielded cable 803. One end of the fourth metal connector 34 located inside the boost plate metal shielding box 3 is electrically connected to one end of the first metal connector 31 located inside the boost plate metal shielding box 3 and the output end of the boost circuit board 4. The other end of the fourth metal connector 34 located outside the boost plate metal shielding box 3 is electrically connected to the camera 6 through the fourth shielded cable 804.

[0021] Specifically, the booster plate metal shielding box 3, together with the first metal connector 31, the second metal connector 32, the third metal connector 33, and the fourth metal connector 34, forms a Faraday cage, which can reduce external electromagnetic interference and avoid signal distortion affecting image acquisition. Furthermore, during the assembly of the shielded cable and the metal connectors, it must be ensured that the cable shielding layer is always connected to the metal shell of the metal connector, forming a strict Faraday cage.

[0022] Preferably, the first metal connector 31, the second metal connector 32, the third metal connector 33 and the fourth metal connector 34 are all Harting connectors.

[0023] Specifically, Harting connectors feature a perfect shielding design that ensures extremely low contact resistance and excellent housing electrical continuity, making them particularly suitable for applications with high electromagnetic compatibility (EMC) requirements.

[0024] In some embodiments, such as Figure 3 As shown, the wafer defect detection device based on metal shielding of this utility model also includes a light source metal shielding box 7; the light source 5 is disposed in the light source metal shielding box 7, and the camera 6 is connected to the switching power supply 1 and the boost circuit board 4 through the light source metal shielding box 7.

[0025] In some embodiments, such as Figure 4 As shown, the camera 6 includes a first camera 61, a second camera 62, a third camera 63, and a fourth camera 64; the light source metal shielding box 7 is inlaid with a fifth metal connector 71, a sixth metal connector 72, a seventh metal connector 73, an eighth metal connector 74, and a ninth metal connector 75. The fifth metal connector 71 is located outside the light source metal shielding box 7 and is electrically connected to the switching power supply 1 via the fifth shielding cable 805. The fifth metal connector 71 is located inside the light source metal shielding box 7 and is electrically connected to the third camera 63 and the fourth camera 64 via the sixth shielding cable 806 and the seventh shielding cable 807 passing through the light source metal shielding box 7, respectively. The end of the sixth metal connector 72 located outside the light source metal shielding box 7 is electrically connected to the end of the third metal connector 33 located outside the boost plate metal shielding box 3 via the third shielding cable 803. The end of the sixth metal connector 72 located inside the light source metal shielding box 7 is electrically connected to the input end of the light source 5. One end of the seventh metal connector 73 located outside the light source metal shielding box 7 is electrically connected to the other end of the fourth metal connector 34 located outside the boost plate metal shielding box 3 via the fourth shielding cable 804. The other end of the seventh metal connector 73 located inside the light source metal shielding box 7 is electrically connected to the third camera 63 and the fourth camera 64 via the tenth shielding cable 810 and the eleventh shielding cable 811 passing through the light source metal shielding box 7, respectively. One end of the eighth metal connector 74 located inside the light source metal shielding box 7 is electrically connected to one end of the fifth metal connector 71 located inside the light source metal shielding box 7 and the output end of the light source 5. The other end of the eighth metal connector 74 located outside the light source metal shielding box 7 is electrically connected to the first camera 61 through the eighth shielded cable 808. One end of the ninth metal connector 75 located inside the light source metal shielding box 7 is electrically connected to one end of the fifth metal connector 71 located inside the light source metal shielding box 7 and the output end of the light source 5. The other end of the ninth metal connector 75 located outside the light source metal shielding box 7 is electrically connected to the second camera 62 via the ninth shielded cable 809.

[0026] Specifically, the light source metal shielding box 7 and the fifth metal connector 71, sixth metal connector 72, seventh metal connector 73, eighth metal connector 74, and ninth metal connector 75 form a Faraday cage, which can reduce external electromagnetic interference and avoid signal distortion affecting image acquisition. In addition, during the assembly of the shielded cable and metal connectors, it must be ensured that the cable shielding layer is always connected to the metal shell of the metal connector to form a strict Faraday cage.

[0027] Preferably, the fifth metal connector 71, the sixth metal connector 72, the seventh metal connector 73, the eighth metal connector 74, and the ninth metal connector 75 are all Lemo connectors.

[0028] Specifically, Lemo connectors have a perfect shielding design that ensures extremely low contact resistance and excellent housing electrical continuity, making them particularly suitable for applications with high electromagnetic compatibility (EMC) requirements.

[0029] In some embodiments, such as Figure 5 As shown, the boost circuit board 4 includes a PCB board and a signal amplification circuit, an optocoupler isolation element, and a digital filter circuit integrated on the PCB board; the input terminal of the signal amplification circuit is electrically connected to the high-speed pulse signal source 2, the output terminal of the signal amplification circuit is electrically connected to the input terminal of the digital filter circuit through the optocoupler isolation element, the power supply terminal of the digital filter circuit is electrically connected to the switching power supply 1, and the output terminal of the digital filter circuit outputs the amplified signal.

[0030] Specifically, the boost circuit board 4 amplifies the high-speed pulse signal via an external 24V DC power supply, matching the signal amplitude required by the light source and camera to improve load capacity. Optical isolation components isolate the input and output signals, preventing noise from the input signal from entering the output signal. A digital filter circuit further filters the signal to suppress interference. In this embodiment, the digital filter circuit outputs two signals. Furthermore, the boost circuit board 4 uses a PCB board and integrated signal amplification circuit, optical isolation components, and digital filter circuit on the PCB board, replacing transformers, filters, signal isolators, and other components. This simplifies the circuit, shortens the signal transmission path, reduces signal transmission time, and thus lowers latency.

[0031] In some embodiments, the switching power supply 1 is specifically a switching power supply with over-temperature protection, overload protection and over-voltage protection.

[0032] Specifically, the circuit principle structure of switching power supply 1 is as follows: Figure 6 As shown, the switching power supply 1 provides external power to the boost circuit board and has built-in circuits for filtering, rectification, overload, overvoltage, and overtemperature.

[0033] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer defect detection device based on metal shielding, characterized in that, include: A switching power supply, used to provide 24V DC power; A high-speed pulse signal source, used to provide high-speed pulse signals; A metal shielded box for boosting the voltage plate contains a boosting circuit board. The boosting circuit board is electrically connected to the switching power supply and the high-speed pulse signal source. The boosting circuit board is used to amplify the high-speed pulse signal under the power supply of the 24V DC power to obtain an amplified signal. A light source, connected to the boost circuit board, is used to generate an optical signal based on the amplified signal; The camera, connected to the light source, the switching power supply, and the boost circuit board, is used to capture images of the wafer to be inspected based on the amplified signal and the light signal under the power supply of the 24V DC power supply, so as to obtain an image for defect detection.

2. The wafer defect detection device based on metal shielding according to claim 1, characterized in that, The metal shielding box of the booster plate is inlaid with a first metal connector, a second metal connector, a third metal connector and a fourth metal connector; The first metal connector is electrically connected to the switching power supply at one end outside the metal shielding box of the boost board, and the first metal connector is connected to the power supply terminal of the boost circuit board at the other end inside the metal shielding box of the boost board. The end of the second metal connector located outside the metal shielding box of the boost board is electrically connected to the high-speed pulse signal source, and the end of the second metal connector located inside the metal shielding box of the boost board is electrically connected to the input terminal of the boost circuit board. The third metal connector is electrically connected at one end inside the metal shielding box of the boost plate to the end of the first metal connector inside the metal shielding box of the boost plate and the output end of the boost circuit board; the third metal connector is electrically connected at one end outside the metal shielding box of the boost plate to the light source. The end of the fourth metal connector located inside the metal shielding box of the boost plate is electrically connected to the end of the first metal connector located inside the metal shielding box of the boost plate and the output end of the boost circuit board. The end of the fourth metal connector located outside the metal shielding box of the boost plate is electrically connected to the camera.

3. The wafer defect detection device based on metal shielding according to claim 2, characterized in that, The first metal connector, located outside the metal shielding box of the boost plate, is electrically connected to the switching power supply via a first shielded cable at one end; the second metal connector, located outside the metal shielding box of the boost plate, is electrically connected to the high-speed pulse signal source via a second shielded cable at one end; the third metal connector, located outside the metal shielding box of the boost plate, is electrically connected to the light source via a third shielded cable at one end; and the fourth metal connector, located outside the metal shielding box of the boost plate, is electrically connected to the camera via a fourth shielded cable at one end.

4. The wafer defect detection device based on metal shielding according to claim 2, characterized in that, The first metal connector, the second metal connector, the third metal connector, and the fourth metal connector are all Harting connectors.

5. The wafer defect detection device based on metal shielding according to claim 2, characterized in that, It also includes a light source metal shielding box; the light source is disposed inside the light source metal shielding box, and the camera is connected to the switching power supply and the boost circuit board through the light source metal shielding box.

6. The wafer defect detection device based on metal shielding according to claim 5, characterized in that, The camera includes a first camera, a second camera, a third camera, and a fourth camera; the light source metal shielding box is inlaid with a fifth metal connector, a sixth metal connector, a seventh metal connector, an eighth metal connector, and a ninth metal connector; The fifth metal connector is electrically connected to the switching power supply at one end located outside the light source metal shielding box, and electrically connected to the third camera and the fourth camera at the other end located inside the light source metal shielding box. The end of the sixth metal connector located outside the metal shielding box of the light source is electrically connected to the end of the third metal connector located outside the metal shielding box of the boost plate, and the end of the sixth metal connector located inside the metal shielding box of the light source is electrically connected to the input end of the light source. The end of the seventh metal connector located outside the light source metal shielding box is electrically connected to the end of the fourth metal connector located outside the boost plate metal shielding box, and the end of the seventh metal connector located inside the light source metal shielding box is electrically connected to the third camera and the fourth camera respectively. The eighth metal connector is electrically connected at one end inside the light source metal shielding box to the fifth metal connector at one end inside the light source metal shielding box and to the output end of the light source; the eighth metal connector is electrically connected at one end outside the light source metal shielding box to the first camera. The ninth metal connector is electrically connected at one end inside the light source metal shielding box to the fifth metal connector at one end inside the light source metal shielding box and to the output end of the light source. The ninth metal connector is electrically connected at one end outside the light source metal shielding box to the second camera.

7. The wafer defect detection device based on metal shielding according to claim 6, characterized in that, The fifth metal connector, located outside the light source metal shielding box, is electrically connected to the switching power supply via a fifth shielded cable. The fifth metal connector, located inside the light source metal shielding box, is electrically connected to the third camera and the fourth camera via sixth and seventh shielded cables passing through the light source metal shielding box, respectively. The sixth metal connector, located outside the light source metal shielding box, is electrically connected to the third metal connector, located outside the boost plate metal shielding box, via a third shielded cable. The seventh metal connector, located outside the light source metal shielding box, is electrically connected to the fourth metal connector, located outside the boost plate metal shielding box, via a fourth shielded cable. The seventh metal connector, located inside the light source metal shielding box, is electrically connected to the third camera and the fourth camera via tenth and eleventh shielded cables passing through the light source metal shielding box, respectively. The eighth metal connector, located outside the light source metal shielding box, is electrically connected to the first camera via an eighth shielded cable. The ninth metal connector, located outside the light source metal shielding box, is electrically connected to the second camera via a ninth shielded cable.

8. The wafer defect detection device based on metal shielding according to claim 6, characterized in that, The fifth, sixth, seventh, eighth, and ninth metal connectors are all Lemo connectors.

9. The wafer defect detection device based on metal shielding according to claim 1, characterized in that, The boost circuit board includes a PCB board and a signal amplification circuit, an optocoupler isolation element, and a digital filter circuit integrated on the PCB board; the input terminal of the signal amplification circuit is electrically connected to the high-speed pulse signal source, the output terminal of the signal amplification circuit is electrically connected to the input terminal of the digital filter circuit through the optocoupler isolation element, the power supply terminal of the digital filter circuit is electrically connected to the switching power supply, and the output terminal of the digital filter circuit outputs the amplified signal.

10. The wafer defect detection device based on metal shielding according to claim 1, characterized in that, The switching power supply is specifically a switching power supply with over-temperature protection, overload protection, and over-voltage protection.

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