An optical module

Abstract

The utility model discloses a kind of optical modules, including first substrate, shell, electric chip, optical chip, optical fiber array assembly, elastic colloid;First substrate is PCB board;Shell is the box body of bottom opening, top openable, including main body, upper cover;The top of main body is detachably connected with upper cover;The bottom of main body is fixedly connected with first substrate, forms cavity;Electric chip is bonded on first substrate;Located in cavity;Optical chip is bonded on first substrate, located in cavity, and is electrically connected with electric chip;Optical fiber array assembly includes optical fiber array, with fiber;Optical fiber array is located in cavity, and is fixedly connected with first substrate, and with optical chip, with the end optical path connection of fiber;Elastic colloid is filled in cavity, and is connected with first substrate, shell, electric chip, optical chip, optical fiber array.The utility model improves the isolation protection effect of bare chip inside optical module, and further improves the reliability of optical module;In addition, the weight and cost of optical module are reduced.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, specifically to an optical module. Background Technology

[0002] With the development of optical communication, optical modules are being used in increasingly wider fields, and their design is trending towards miniaturization, lightweight design, high integration, and low cost. Because optical modules use both optical and electrical bare chips, and both circuitry and optical paths coexist, the difficulty of protection increases. In practical applications, bare chip failure and optical path contamination are the two main failure modes of optical modules due to environmental factors. When facing complex operating conditions or high reliability requirements, hermetic sealing technology is mainly used to isolate the bare chips and optical paths within the cavity from the external environment to protect them. Examples include laser welding, parallel seam welding, and high-frequency welding of sealing joints.

[0003] The biggest problem with hermetic packaging is its complex structure, heavy weight, and high cost. At the same time, the hydrogen gas released from the metal shell and plating of hermetic packaging can cause a performance degradation of the active area of ​​the bare chip inside the sealed cavity, which is also a problem that hermetic optical modules have not yet solved.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0005] To address the problems of complex structure, heavy weight, and impact on chip performance associated with using hermetic sealing technology to isolate bare chips within optical modules, as mentioned in the background art, this invention proposes an optical module that integrally encapsulates the bare chips and optical path within the module, forming a complete seal. This improves the isolation and protection effect of the bare chips within the optical module, thereby enhancing the reliability of the optical module; furthermore, it reduces the weight and cost of the optical module.

[0006] To achieve the above-mentioned objectives, the present invention employs the following technical solution: An optical module includes a first substrate, a housing, an electrical chip, an optical chip, a fiber array assembly, and an elastic colloid. The first substrate is a PCB board; The housing is a box with an open bottom and an openable top, including a main body and a top cover; the top of the main body is detachably connected to the top cover; the bottom of the main body is fixedly connected to the first substrate to form a cavity; The electrical chip is bonded to the first substrate and located within the cavity. The optical chip is bonded to the first substrate, located within the cavity, and electrically connected to the electrical chip. The fiber array assembly includes a fiber array and a ribbon; the fiber array is located within the cavity, fixedly connected to the first substrate, and connected to the optical chip and one end of the ribbon optical path; The elastic colloid fills the cavity and is connected to the first substrate, the housing, the electrical chip, the optical chip, and the fiber array.

[0007] In some specific embodiments, a second substrate is also included, which is located inside the cavity, above the first substrate, and is fixedly connected to the first substrate; The optical chip and the optical fiber array are located above the second substrate and are fixedly connected to the second substrate.

[0008] In some specific embodiments, the electrical chip and the optical chip are placed adjacent to each other in the horizontal direction; The electrical chip and the optical chip are electrically connected via a wire bonding process.

[0009] In some specific embodiments, one end of the fiber array is located above the optical chip, and the end face is a gold-plated bevel, which is set upwards.

[0010] In some specific embodiments, an optical adhesive is provided between the optical chip and one end of the optical fiber array.

[0011] In some specific embodiments, the elastic colloid is a silicone gel.

[0012] In some specific embodiments, the bottom of the housing is welded to the first substrate.

[0013] In some specific embodiments, a first through hole is formed on the side wall of the box body; The fiber array assembly also includes fiber optic connectors, which are multi-channel; The fiber optic cable passes through the first through-hole, with one end connected to the fiber optic array and the other end connected to the fiber optic connector.

[0014] In some specific embodiments, the first through hole opens towards the side of the upper cover; The fiber tape is installed in the first through hole using a curable colloid, and the first through hole is sealed.

[0015] In some specific embodiments, the curable colloid is made of silicone rubber.

[0016] The optical module of this invention uses an elastic colloid to encapsulate and protect the electrical chip, optical chip, and fiber optic array located within the cavity of the housing. The colloid encapsulates the optical chip, electrical chip, and optical path, and adheres to the surface of the first substrate, optical chip, electrical chip, circuit connection, and optical path system, forming an isolation and protection, thus improving the protection effect. The elastic colloid is elastic and has low stress, so it does not cause stress damage to the circuit connection and optical path system inside the housing, thereby improving the reliability and lifespan of the optical module.

[0017] Other features and advantages of this utility model will become clearer after reading the detailed embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the optical module according to an embodiment; Figure 2 This is a schematic diagram of the structure of the optical module with the top cover opened according to an embodiment; Figure 3 This is a schematic diagram of the structure of the optical module with the top cover opened according to an embodiment; Figure 4 This is a cross-sectional structural schematic diagram of the optical module according to an embodiment; Figure 5 for Figure 4 A magnified schematic diagram of the local structure at point A; Figure 6 for Figure 4 Schematic diagram of the optical path at point A; Figure 7 This is a schematic diagram of a partial structure of an optical module according to an embodiment; Figure 8 This is a schematic diagram of the connection structure between the electrical chip and the optical chip according to an embodiment; Figure 9 This is a schematic diagram of the connection structure between the housing and the first substrate according to an embodiment; Figure 10 This is a schematic diagram of the housing structure according to an embodiment.

[0020] Figure label, 1. First substrate; 2. Housing; 21. Main body; 211. First through hole; 212. Screw hole; 22. Top cover; 221. Second through hole; 23. Cavity; 24. Elastic colloid; 3. Fiber optic array assembly; 31. Fiber optic array; 32. Fiber ribbon; 33. Fiber optic connector; 4. Electrical chip; 5. Optical chip; 6. Second substrate; 7. Bonding wire; 8. Optical adhesive; 9. Solder; 10. Curable colloid. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0026] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0027] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 10 This utility model discloses an optical module, which includes a first substrate 1, a housing 2, an optical fiber array assembly 3, an electrical chip 4, an optical chip 5, and an elastic colloid 24.

[0028] The first substrate 1 is a PCB board with printed wiring for the optical module and solder pads around it for connecting to the application motherboard; the application motherboard is the main control board for the application optical module.

[0029] The housing 2 is a box with an open bottom and an openable top, including a main body 21 and a top cover 22; the top of the main body 21 and the top cover 22 are detachably connected; the shape of the main body 21 is adapted to the first substrate 1, and its bottom is fixedly connected to the first substrate 1 to form a cavity 23.

[0030] The electrical chip 4 is bonded to the first substrate 1, located in the cavity 23, and electrically connected to the printed wiring of the first substrate 1; the optical chip 5 is bonded to the first substrate 1, located in the cavity 23, and electrically connected to the electrical chip 4.

[0031] The fiber array assembly 3 includes a fiber array 31 and a fiber 32; the fiber array 31 is located in the cavity 23, fixedly connected to the first substrate 1, and connected to the optical chip 5 and one end of the fiber 32.

[0032] Elastic colloid 24 is filled in cavity 23 and connected to first substrate 1, shell 2, electrical chip 4, optical chip 5 and fiber array 31, and encapsulates electrical chip 4, optical chip 5 and fiber array 31; elastic colloid 24 is generated by filling and curing potting adhesive.

[0033] The optical module of this utility model uses an elastic colloid 24 to encapsulate and protect the electrical chip 4, optical chip 5, and fiber array 31 located in the cavity 23 of the housing 2. The colloid 24 encapsulates the optical chip 5, electrical chip 4, and optical path, and adheres to the surface of the first substrate 1, optical chip 5, electrical chip 4, circuit connection, and optical path system, forming an isolation and protection, thus improving the protection effect. The elastic colloid 24 is elastic and has low stress, so it does not cause stress damage to the circuit connection and optical path system inside the housing 2, thereby improving the reliability and lifespan of the optical module.

[0034] In addition, it also has the effect of reducing weight and cost compared to structures using hermetic sealing.

[0035] The specific structure and principle of the optical module of this utility model will be described in detail below through specific embodiments.

[0036] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 The optical module also includes a second substrate 6, which is located inside the cavity 23 above the first substrate 1 and is fixedly connected to the first substrate 1; the optical chip 5 and the fiber array 31 are located above the second substrate 6 and are fixedly connected to the second substrate 6.

[0037] In this embodiment, the optical module fixes the optical chip 5 onto the second substrate 6, so that the bonding pads of the optical chip 5 and the bonding pads of the electrical chip 4 are in the same horizontal plane. By reducing the vertical drop, the distance between the bonding pads of the electrical chip 4 and the bonding pads of the optoelectronic chip 4 is shortened, thereby shortening the circuit connection, improving the high-speed performance of the circuit, and enhancing the stability and reliability of the circuit connection.

[0038] In some specific embodiments, the second substrate 6 is made of ceramic material, which utilizes its advantages of high heat dissipation, high bending strength, high temperature resistance, high insulation and stability to improve the stability of the working environment of the optical chip 5 and the fiber array 31, thereby improving the stability and reliability of the optical module.

[0039] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 ,Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 Electrical chip 4 and optical chip 5 are placed adjacent to each other in the horizontal direction; electrical chip 4 and optical chip 5 are electrically connected by wire bonding process.

[0040] That is, the optical chip 5 and the electrical chip 4 are electrically connected by the bonding wire 7.

[0041] In this embodiment, the optical module uses electrical chip 4 and optical chip 5 placed horizontally adjacent to each other to minimize the spacing between the bonding pads of electrical chip 4 and optical chip 5, thereby meeting the high-speed transmission requirements of the module and improving the stability and reliability of the bonding wire 7 connection, thus improving the transmission efficiency, stability and reliability of the optical module.

[0042] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 One end of the fiber array 31 is located above the optical chip 5, and the end face is a gold-plated inclined surface. It is set upward to form an inclined reflective surface. By adjusting the angle of the inclined surface, the optical signal emitted vertically upward by the optical chip 5 is reflected by the gold-plated inclined surface and then transmitted horizontally in the optical fiber.

[0043] The optical module in this embodiment changes the direction of optical signal transmission by setting a reflective surface at one end of the optical fiber array 31, thereby enabling direct transmission along the length of the optical fiber within the optical fiber array and improving the efficiency of optical transmission.

[0044] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 An optical adhesive 8 is provided between one end of the optical chip 5 and the fiber array 31 to prevent the elastic adhesive 24 from flowing into the optical path and increasing optical path loss, thereby improving the efficiency and reliability of optical path transmission.

[0045] In some specific embodiments, the elastic colloid 24 is a silicone gel. Of course, other potting compounds with the same or similar properties can also be used.

[0046] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 7 , Figure 9 The bottom of the main body 21 is fixedly connected to the first substrate 1 by welding. The cavity 23 is sealed and isolated from the outside by solder 9 between the main body 21 and the first substrate 1.

[0047] In this embodiment, the optical module improves the stability and sealing of the connection between the housing 2 and the first substrate 1 by welding the housing 2 to the first substrate 1, thereby improving the sealing and stability of the optical module.

[0048] In some specific embodiments, refer to Figure 2 , Figure 3 , Figure 7 , Figure 9 , Figure 10 A first through hole 211 is formed on the side wall of the main body 21; the fiber array assembly 3 also includes a fiber connector 33, which is multi-channel; the fiber 32 passes through the first through hole 211, with one end connected to the fiber array 31 and the other end connected to the fiber connector 33.

[0049] In some specific embodiments, one end of the fiber 32 is integrated with the optical fiber in the fiber array 31.

[0050] In some specific embodiments, refer to Figure 2 , Figure 3 , Figure 7 , Figure 9 , Figure 10 The first through hole 211 opens to the side facing the upper cover 22; the fiber 32 is installed in the first through hole 211 through the curable adhesive 10; and the curable adhesive 10 seals the first through hole 211.

[0051] In this embodiment, the optical module has a first through hole 211 on the side wall of the main body 21, which facilitates the installation of the fiber array assembly 3 and improves the assembly efficiency of the optical module. The curable colloid 10 fixes the fiber tape 32 and seals the first through hole 211, thereby increasing the sealing of the cavity 23 and improving the dustproof and waterproof capabilities of the optical module.

[0052] In some specific embodiments, the curable colloid 10 is made of silicone rubber.

[0053] Of course, the curable colloid 10 can also be a type of adhesive with the same or similar properties as silicone rubber.

[0054] In some specific embodiments, refer to Figure 1 , Figure 2 , Figure 3 , Figure 10 The shell 2 is square, and screw holes 212 are formed at the four corners of the main body 21. Second through holes 221 are formed on the upper cover 22 at the corresponding positions of each screw hole 212. The main body 21 and the upper cover 22 are detachably fixedly connected by screws.

[0055] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0056] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An optical module, characterized in that, include: The first substrate is a PCB board; The housing is a box-shaped structure with an open bottom and an openable top, comprising a main body and a top cover; the top of the main body is detachably connected to the top cover; the bottom of the main body is fixedly connected to the first substrate to form a cavity; An electrical chip is bonded to the first substrate and located within the cavity. An optical chip is bonded to the first substrate, located within the cavity, and electrically connected to the electrical chip. A fiber optic array assembly includes a fiber optic array and a ribbon fiber; the fiber optic array is located within the cavity, fixedly connected to the first substrate, and connected to the optical chip and one end of the ribbon fiber via an optical path. An elastic colloid fills the cavity and is connected to the first substrate, the housing, the electrical chip, the optical chip, and the fiber array.

2. The optical module according to claim 1, characterized in that, It also includes a second substrate, which is located inside the cavity, above the first substrate, and is fixedly connected to the first substrate; The optical chip and the optical fiber array are located above the second substrate and are fixedly connected to the second substrate.

3. The optical module according to claim 2, characterized in that, The electrical chip and the optical chip are placed adjacent to each other in the horizontal direction; The electrical chip and the optical chip are electrically connected via a wire bonding process.

4. The optical module according to claim 3, characterized in that, One end of the fiber array is located above the optical chip, and the end face is a gold-plated bevel, which is set upwards.

5. The optical module according to claim 4, characterized in that, An optical adhesive is provided between the optical chip and one end of the optical fiber array.

6. The optical module according to any one of claims 1 to 5, characterized in that, The elastic colloid is a silicone gel.

7. The optical module according to any one of claims 1 to 5, characterized in that, The bottom of the box is welded to the first substrate.

8. The optical module according to any one of claims 1 to 5, characterized in that, A first through hole is formed on the side wall of the box body; The fiber array assembly also includes fiber optic connectors, which are multi-channel; The fiber optic cable passes through the first through-hole, with one end connected to the fiber optic array and the other end connected to the fiber optic connector.

9. The optical module according to claim 8, characterized in that, The first through hole opens towards the side of the upper cover; The fiber tape is installed in the first through hole using a curable colloid, and the first through hole is sealed.

10. The optical module according to claim 9, characterized in that, The curable colloid is made of silicone rubber.

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