Backlight module and display device
CN224696195UActive Publication Date: 2026-08-28BOE TECHNOLOGY GROUP CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202520976192.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-16
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-05-16
AI Technical Summary
Technical Problem
传统的背光模组厚度较大，无法满足现代显示设备轻薄化的发展趋势，因此，超薄背光模组应运而生
Benefits of technology
[0024]在本申请中，由于将发光芯片设在凹槽内部，通过设置第一反射部覆盖在凹槽的底部中未设置发光芯片的区域和凹槽侧壁的至少部分区域，透光填充部覆盖发光芯片，再设置第二反射部覆盖透光填充部的至少部分区域以及凹槽的开口边沿；这样，一方面，凹槽底部和侧壁上的第一反射部能够将发光芯片发射出的光线反射到第二反射部上，另一方面，第二反射部再将光线从第一反射部和第二反射部之间的第一间隙反射出去，进而光线从玻璃衬底中未设置凹槽的表面射出背光模组。在第一反射部和第二反射部的共同作用下，背光模组的出光效率有较大的提升，且可以省去了相关技术的背面模组中的多种光学膜片，从而可以在保证背光模组出光效率的情况下，很大程度上降低背光模组的整体厚度，以适用于轻薄显示装置的制备。
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224696195U_ABST
Abstract
The application provides a backlight module and a display device, and relates to the technical field of display. The backlight module comprises a glass substrate, a plurality of grooves arranged in an array on one side of the glass substrate, a plurality of light emitting chips, a plurality of first reflecting parts, a plurality of light-transmitting filling parts and a plurality of second reflecting parts. The light emitting chips are located in the grooves. The first reflecting parts cover at least part of the area of the bottom of the groove where the light emitting chips are not arranged and the sidewall of the groove. The light-transmitting filling parts cover the light emitting chips. The second reflecting parts cover at least part of the area of the light-transmitting filling parts and the opening edge of the groove, and the first reflecting parts and the second reflecting parts have a first gap therebetween. The backlight module has an ultrathin thickness and can be applied to the preparation of an ultrathin display device.
Need to check novelty before this filing date? Find Prior Art