Intelligent thermal management mini computer

Abstract

This utility model discloses an intelligent thermal management mini-computer, including a mini chassis, a front interface, side ventilation windows, a rear interface, a double-layer motherboard, a top cover, and a heat dissipation unit. The front interface is electrically connected to the front side of the mini chassis, side ventilation windows are installed on both sides of the mini chassis, and the rear interface is electrically connected to the rear side of the mini chassis. The double-layer motherboard and the heat dissipation unit are installed inside the mini chassis and the top cover is fixed with screws. This intelligent thermal management mini-computer is equipped with an intelligent thermal management system. The outer diameter of the heat dissipation fan of the heat dissipation unit is positioned with an annular anti-vibration washer, which has a certain vibration damping effect. The high-speed airflow drawn in by the heat dissipation unit blows directly onto the air duct support frame. The airflow is redirected by a triangular guide plate, and the arc-shaped air duct guides the cooling airflow so that the airflow blows directly onto the bottom electronic control board. The design and installation of the air duct can achieve synchronous, efficient and stable heat dissipation of the double-layer board of the motherboard and electronic control board.

Description

Technical Field

[0001] This utility model relates to an intelligent thermal control management mini computer, belonging to the field of mini host technology. Background Technology

[0002] A mini PC, as the name suggests, is a small computer. It is usually much smaller than a traditional desktop PC, and can even fit in the palm of your hand. Despite its small size, mini PCs are typically equipped with powerful processors, memory, and storage devices, capable of meeting the needs of daily office work, entertainment, and light gaming. Due to the limited size of the chassis, the motherboard is often designed with a stacked top-to-bottom profile, and traditional suction-type cooling fans have limited cooling efficiency for dual-layer motherboard designs. Utility Model Content

[0003] The purpose of this invention is to provide an intelligent thermal control management mini-computer to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: an intelligent thermal management mini computer, including a mini chassis, a front interface, side ventilation windows, a rear interface, a double-layer motherboard, a top cover, and a heat dissipation unit. The front interface is electrically connected and installed on the front side of the mini chassis. Side ventilation windows are installed on both sides of the mini chassis. The rear interface is electrically connected and installed on the rear side of the mini chassis. The double-layer motherboard and the heat dissipation unit are installed inside the mini chassis and the top cover is fixed with screws.

[0005] Preferably, the top cover is equipped with an air inlet.

[0006] Preferably, the cooling fan of the heat dissipation host is equipped with an annular vibration damping washer positioned on its outer diameter.

[0007] Preferably, the double-layer motherboard consists of a guide air duct, a motherboard, and an electronic control board. The motherboard and the electronic control board are installed vertically, and the guide air duct is installed on both sides of the motherboard.

[0008] Preferably, the air duct is composed of a mounting pad, an air duct support frame, a triangular guide plate, and an arc-shaped air duct. The mounting pad is installed inside the air duct support frame, the triangular guide plate is installed at the lower end of the air duct support frame, and the arc-shaped air duct is installed below the triangular guide plate.

[0009] Compared with the prior art, the beneficial effects of this utility model are: The cooling fan of the CPU cooler is fitted with an annular anti-vibration washer on its outer diameter, which provides a certain degree of vibration damping. The airflow duct consists of mounting pads, duct support frame, triangular guide plate and arc-shaped air duct. The high-speed airflow drawn in by the heat dissipation unit blows directly to the airflow support frame. The airflow is redirected by the triangular guide plate. The arc-shaped air duct guides the heat dissipation airflow so that the airflow blows directly to the bottom electronic control board. The design and installation of the airflow duct can achieve synchronous, efficient and stable heat dissipation of the motherboard and electronic control board. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of the intelligent thermal control management mini computer of this utility model; Figure 2 This is a schematic diagram of the installation structure of the air inlet of this utility model; Figure 3 This is a schematic diagram of the structure of the heat dissipation host of this utility model; Figure 4 This is a schematic diagram of the structure of the double-layer motherboard of this utility model; Figure 5 This is a schematic diagram of the airflow guiding duct of this utility model; In the diagram: 1. Mini PC case, 2. Front I / O ports, 3. Side ventilation window, 4. Rear I / O ports, 5. Dual-layer motherboard, 6. Top cover, 7. Cooling unit, 8. Air inlet, 9. Circular vibration damping pad, 10. Airflow duct, 11. Motherboard, 12. Control board, 13. Mounting pad, 14. Airflow support frame, 15. Triangular airflow guide plate, 16. Curved airflow duct. Detailed Implementation

[0011] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0012] like Figures 1-5 As shown, an intelligent thermal management mini PC includes a mini chassis 1, a front interface 2, side ventilation windows 3, a rear interface 4, a dual-layer motherboard 5, a top cover 6, and a cooling unit 7. The front interface 2 is electrically connected and installed on the front side of the mini chassis 1. Side ventilation windows 3 are installed on both sides of the mini chassis 1. The rear interface 4 is electrically connected and installed on the rear side of the mini chassis 1. The dual-layer motherboard 5 and the cooling unit 7 are installed inside the mini chassis 1 and the top cover 6 is fixed with screws.

[0013] The upper cover plate 6 is equipped with an air inlet 8 to achieve efficient air intake for the heat dissipation host 7.

[0014] The cooling host 7 has an annular anti-vibration washer 9 installed on the outer diameter of the cooling fan, which has a certain anti-vibration effect.

[0015] The double-layer mainboard 5 consists of a guide air duct 10, a mainboard 11, and an electronic control board 12. The mainboard 11 and the electronic control board 12 are installed vertically, and the guide air duct 10 is installed on both sides of the mainboard 11.

[0016] The airflow duct 10 consists of a mounting pad 13, an airflow support frame 14, a triangular guide plate 15, and an arc-shaped airflow duct 16. The mounting pad 13 is installed inside the airflow support frame 14. The triangular guide plate 15 is installed at the lower end of the airflow support frame 14, and the arc-shaped airflow duct 16 is installed below the triangular guide plate 15. The high-speed airflow drawn in by the heat dissipation host 7 blows directly onto the airflow support frame 14. The airflow is redirected by the triangular guide plate 15, and the arc-shaped airflow duct 16 guides the heat dissipation airflow so that the airflow blows directly onto the bottom electronic control board 12, achieving stable heat dissipation in both layers.

[0017] Specific usage: A smart thermal control management mini computer. This device is equipped with a smart thermal control management system. The cooling host's cooling fan has an annular anti-vibration washer installed on its outer diameter, which has a certain anti-vibration effect. The high-speed airflow drawn in by the cooling host blows directly onto the air duct support frame. The airflow is turned by the triangular guide plate. The arc-shaped air duct guides the cooling airflow so that it blows directly onto the bottom electronic control board. The design and installation of the air duct can achieve synchronous, efficient and stable heat dissipation of the motherboard and electronic control board on both layers.

[0018] The above description is a preferred embodiment of the present utility model. For those skilled in the art, any changes, modifications, substitutions and variations made to the implementation methods without departing from the principles and spirit of the present utility model, based on the teachings of the present utility model, still fall within the protection scope of the present utility model.

Claims

1. A smart thermal control management mini-computer, characterized in that, The mini-chassis includes a mini chassis (1), a front interface (2), a side heat dissipation window (3), a rear interface (4), a double-layer motherboard (5), a top cover (6), and a heat dissipation host (7). The front interface (2) is electrically connected to the front side of the mini chassis (1). The side heat dissipation windows (3) are installed on both sides of the mini chassis (1). The rear interface (4) is electrically connected to the rear side of the mini chassis (1). The double-layer motherboard (5) and the heat dissipation host (7) are installed inside the mini chassis (1) and the top cover (6) is fixed by screws. The double-layer motherboard (5) is composed of a guide air duct (10), a motherboard (11), and an electronic control board (12). The motherboard (11) and the electronic control board (12) are installed in an up-down position. The guide air duct (10) is installed on both sides of the motherboard (11).

2. The intelligent thermal control management mini-computer according to claim 1, characterized in that: The upper cover plate (6) is equipped with an air inlet (8).

3. The intelligent thermal control management mini-computer according to claim 1, characterized in that: The cooling host (7) has an annular anti-vibration washer (9) installed on the outer diameter of the cooling fan.

4. The intelligent thermal control management mini-computer according to claim 1, characterized in that: The air duct (10) consists of a mounting pad (13), an air duct support frame (14), a triangular guide plate (15), and an arc-shaped air duct (16). The mounting pad (13) is installed inside the air duct support frame (14). A triangular guide plate (15) is installed at the lower end of the air duct support frame (14), and an arc-shaped air duct (16) is installed below the triangular guide plate (15).

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