An integrated heat spreader for a computing system

Abstract

This utility model discloses an integrated heat sink for a computing system, including a water cooling head and a memory cooling module. The water cooling head has a water cooling cavity, a first inlet and a first outlet connected to the water cooling cavity. The memory cooling module is composed of frame-shaped heat dissipation pipes, with a clearance groove in the middle of the frame-shaped heat dissipation pipes. The water cooling head is disposed in the clearance groove, and the memory cooling module is mounted on the water cooling head. The frame-shaped heat dissipation pipes have a second inlet connected to the water cooling cavity and a second outlet connected to the first outlet. In the actual design, the water cooling head is used to cool the CPU, and the frame-shaped heat dissipation pipes of the memory cooling module are used to directly cool the memory modules. After entering through the first inlet, the water flows sequentially into the water cooling cavity, the second inlet, the frame-shaped heat dissipation pipes, the second outlet, and finally into the first outlet. The integrated design combines memory cooling and CPU cooling into a single unit.

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