Structure for realizing automatic wake-up mouse by approaching through ultra-wideband chip

Abstract

The utility model discloses a structure is realized by approaching automatic wake -up mouse of ultra wide band chip, relates to mouse technical field, including lower shell, circuit board, optical sensor and MCU, optical sensor and MCU all are located inside the lower shell, the inside of lower shell is provided in the circuit board, the top of circuit board is connected with UWB chip 3, UWB chip 3 and optical sensor and MCU electric connection and are used to detect signal, in the utility model, under the action of UWB chip 3, let equipment can real -time detection user cell -phone, when the cell -phone of user approaches mouse, mouse can automatically wake up computer, and logs in computer, like this, the power consumption of mouse when hibernation is reduced, also make mouse become more intelligent, need not like traditional mouse that let MCU always scan and wait to wake up, after adding UWB chip 3, only need to let UWB chip 3 start to can, to reach the purpose of saving electricity.

Description

Technical Field

[0001] This utility model relates to the field of mouse technology, and in particular to a structure that enables automatic mouse wake-up upon proximity using an ultra-wideband chip. Background Technology

[0002] A mouse is an external input device for a computer and also an indicator for positioning on the computer's display system using the horizontal and vertical coordinates.

[0003] Currently available mice still have some shortcomings. They mainly rely on controlling the light refraction of the mouse's optical sensor to wake it up, requiring actual contact with the mouse to activate it. This results in a lack of intelligent proximity-based automatic wake-up capabilities. Furthermore, the continuous scanning of the MCU leads to high power consumption even when the mouse is in sleep mode. To address this, we propose a structure that uses an ultra-wideband chip to achieve automatic proximity-based mouse wake-up. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of existing technologies by proposing a structure that automatically wakes up a mouse when the user's mobile phone is near it. Its advantages include automatically waking the mouse when the user's phone is near it, while simultaneously reducing power consumption during sleep mode and achieving energy saving.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A structure for automatically waking up a mouse upon proximity using an ultra-wideband chip includes a lower housing, a circuit board, an optical sensor, and an MCU. The optical sensor and the MCU are both located inside the lower housing. The circuit board is also located inside the lower housing. A UWB chip 3 is connected to the top of the circuit board. The UWB chip 3 is electrically connected to the optical sensor and the MCU and is used to detect signals.

[0007] Through the above technical solution: First, the power supply pin of the power module can supply power to the UWB chip 3 through the output pin. Then, the UWB chip 3 emits ultra-low frequency short pulses to continuously monitor the user's mobile phone. In this mode, the overall power consumption of the UWB chip 3 is low. After the mobile phone's AIRTAG module receives the pulse signal emitted by the UWB chip 3, it will reflect back the corresponding response signal, so that the UWB chip 3 receives the reflected signal, converts it into an electrical signal and transmits it to the internal signal processing unit of the UWB chip 3. Then, it sends it to the MCU through the data transmission channel to trigger the mouse wake-up program, realizing the function of the mouse automatically waking up the computer and logging into the computer.

[0008] The present invention is further configured such that a power module is connected to the bottom of the inner wall of the lower housing, and an output pin is connected to the outside of the power module.

[0009] The above technical solutions enable the power module to continuously supply power to the UWB chip 3.

[0010] The present invention is further configured such that power supply pins are connected to all four sides of the UWB chip 3, and the power supply pins are electrically connected to the output pins.

[0011] The above technical solution enables the UWB chip 3 to be electrically connected to the power module by setting the power pins.

[0012] The present invention is further configured such that a first heat dissipation mechanism is provided on the top of the circuit board and the first heat dissipation mechanism is attached to the top of the circuit board, and a second heat dissipation mechanism is provided at the bottom of the inner wall of the lower housing and the second heat dissipation mechanism is attached to the top of the UWB chip 3.

[0013] The above technical solution achieves separate heat dissipation for the circuit board and the UWB chip 3 by absorbing the heat generated by the first heat dissipation mechanism and the second heat dissipation mechanism respectively, and dissipating the heat through two channels.

[0014] The present invention is further configured such that the first heat dissipation mechanism includes a first heat absorption plate, a first heat dissipation fin, and a first guide fin. The first heat absorption plate is connected to the top of the circuit board, the first heat dissipation fin is connected to the top of the first heat absorption plate, the first guide fin is connected to the top of the first heat absorption plate, and the first guide fin extends to the top of the plurality of first heat dissipation fins.

[0015] Through the above technical solution: after the heat generated by the circuit board is absorbed by the first heat-absorbing plate, the heat is discharged through the first heat dissipation fins, and the heat discharge direction is guided by the first guide fins, so as to achieve heat dissipation separation from the UWB chip 3.

[0016] The present invention is further configured such that the second heat dissipation mechanism includes an L-shaped frame, a second heat-absorbing plate, a second heat dissipation fin, and a second guide fin. The L-shaped frame is connected to the bottom of the inner wall of the lower housing, and one end of the L-shaped frame extends to the top of the UWB chip 3. The second heat-absorbing plate is connected to the bottom of one end of the L-shaped frame, and the bottom of the second heat-absorbing plate is in contact with the top of the UWB chip 3. The second heat dissipation fin is connected to the top of the L-shaped frame, and the second guide fin is connected to the top of the L-shaped frame, and one end of the second guide fin extends to the top of the second heat dissipation fin.

[0017] Through the above technical solution: after the heat generated by the UWB chip 3 is absorbed by the second heat-absorbing sheet, the heat is discharged through the second heat dissipation fins, and the heat discharge direction is guided by the second guide fins, so as to achieve separate heat dissipation from the first heat dissipation mechanism.

[0018] The present invention is further configured such that the bottom of the inner wall of the lower outer shell is connected to a plurality of threaded sleeves, and the inner surfaces of the plurality of threaded sleeves are all threaded with bolts.

[0019] The above technical solutions enable the separation of multiple threaded sleeves and multiple bolts, facilitating the disassembly and installation of the circuit board.

[0020] The present invention is further configured such that the circuit board has a circular groove inside that is adapted to the outer surface of multiple threaded sleeves, and the circuit board is fixedly installed inside the lower housing by multiple threaded sleeves and multiple bolts.

[0021] The above technical solution allows multiple circuit boards to be fitted onto the outer surfaces of multiple threaded sleeves, and then the circuit boards can be fixedly installed inside the lower housing using multiple bolts.

[0022] The beneficial effects of this utility model are as follows:

[0023] 1. In this utility model, the UWB chip 3 enables the device to detect the user's mobile phone in real time. When the user's mobile phone is close to the mouse, the mouse can automatically wake up the computer and log in. This reduces the power consumption of the mouse when it is in sleep mode and makes the mouse more intelligent. Unlike traditional mice, which require the MCU to scan and wait to wake up, the addition of the UWB chip 3 only requires the UWB chip 3 to be turned on, thereby achieving the purpose of saving power.

[0024] 2. In this utility model, under the action of the first heat dissipation mechanism and the second heat dissipation mechanism, not only can the heat generated by the circuit board and the UWB chip 3 be absorbed, but the heat generated by the circuit board and the UWB chip 3 can also be separated and dissipated, so that the two heat streams are discharged in opposite directions and discharged to the outside, thereby improving the heat dissipation effect of the circuit board and the UWB chip 3. Attached Figure Description

[0025] Figure 1 This is a front view of a structure that uses an ultra-wideband chip to achieve automatic mouse wake-up upon proximity, as proposed in this utility model.

[0026] Figure 2 This is a schematic diagram of a planar structure for automatically waking up a mouse by proximity using an ultra-wideband chip, as proposed in this utility model.

[0027] Figure 3 This is a diagram showing the location distribution of the threaded sleeves and bolts;

[0028] Figure 4 This is a schematic diagram showing the location of UWB chip 3;

[0029] Figure 5 This is a schematic diagram of the first heat dissipation mechanism of a device that uses an ultra-wideband chip to automatically wake up a mouse near the user.

[0030] Figure 6 This is a schematic diagram of the second heat dissipation mechanism for an automatic mouse wake-up mechanism achieved by using an ultra-wideband chip, as proposed in this utility model.

[0031] In the diagram: 1. Lower outer casing; 2. Circuit board; 3. UWB chip; 4. First heat dissipation mechanism; 401. First heat absorption plate; 402. First heat dissipation fin; 403. First guide fin; 5. Second heat dissipation mechanism; 501. L-shaped frame; 502. Second heat absorption plate; 503. Second heat dissipation fin; 504. Second guide fin; 6. Threaded sleeve; 7. Bolt. Detailed Implementation

[0032] The technical solution of this patent will be further described in detail below with reference to specific embodiments.

[0033] Example 1

[0034] Reference Figures 1-6 A structure for automatically waking a mouse upon proximity using an ultra-wideband (UWB) chip includes a lower housing 1, a circuit board 2, an optical sensor, and an MCU. The optical sensor and MCU are both located inside the lower housing 1. The circuit board 2 is also located inside the lower housing 1. A UWB chip 3 is connected to the top of the circuit board 2, and is electrically connected to the optical sensor and MCU for signal detection. A power module is connected to the bottom of the inner wall of the lower housing 1, and the power module has external output pins. Power pins are connected to all four sides of the UWB chip 3, and these power pins are electrically connected to the output pins. The module's power pins can supply power to the UWB chip 3 via the output pins. Then, the UWB chip 3 emits ultra-low frequency short pulses to continuously monitor the user's mobile phone. In this mode, the overall power consumption of the UWB chip 3 is low. After the mobile phone's AIRTAG module receives the pulse signal emitted by the UWB chip 3, it will reflect back the corresponding response signal, so that the UWB chip 3 will receive the reflected signal, convert it into an electrical signal, and transmit it to the internal signal processing unit of the UWB chip 3. It is then sent to the MCU through the data transmission channel to trigger the mouse's wake-up program, realizing the function of automatically waking up the computer and logging into the computer.

[0035] Example 2

[0036] To achieve separate heat dissipation for circuit board 2 and UWB chip 3, refer to Figure 5 Figure 6A first heat dissipation mechanism 4 is provided on the top of the circuit board 2, and the first heat dissipation mechanism 4 is attached to the top of the circuit board 2. A second heat dissipation mechanism 5 is provided on the bottom of the inner wall of the lower housing 1, and the second heat dissipation mechanism 5 is attached to the top of the UWB chip 3. The first heat dissipation mechanism 4 includes a first heat absorption plate 401, a first heat dissipation fin 402, and a first guide fin 403. The first heat absorption plate 401 is connected to the top of the circuit board 2, the first heat dissipation fin 402 is connected to the top of the first heat absorption plate 401, and the first guide fin 403 is connected to the top of the first heat absorption plate 401. The first guide fin 403 is connected to the top of the first heat absorption plate 401, and the first guide fin 403 extends to the top of a plurality of first heat dissipation fins 402. The second heat dissipation mechanism 5 includes an L-shaped frame 501, a second heat absorption plate 502, a second heat dissipation fin 503, and a second guide fin 504. The L-shaped frame 501 is connected to the bottom of the inner wall of the lower housing 1, and one end of the L-shaped frame 501 extends to the top of the UWB chip 3. The second heat absorption plate 502 is connected to the bottom of one end of the L-shaped frame 501, and the second heat absorption plate 502 extends to the top of a plurality of first heat dissipation fins 402. The bottom of the heat sink 502 is attached to the top of the UWB chip 3. The second heat sink fin 503 is connected to the top of the L-shaped frame 501, and the second guide fin 504 is connected to the top of the L-shaped frame 501, with one end of the second guide fin 504 extending to the top of the second heat sink fin 503. Firstly, under the action of the first heat dissipation mechanism 4 and the second heat dissipation mechanism 5, the heat generated by the circuit board 2 and the UWB chip 3 can be absorbed respectively, and the heat can be discharged from different directions, thereby achieving separate heat dissipation of the circuit board 2 and the UWB chip 3. The first heat absorption plate 401 and the second heat absorption fin 502 absorb the heat generated by the circuit board 2 and the UWB chip 3 respectively, and dissipate the heat from the first heat sink fin 402 and the second heat dissipation fin 503 respectively. Through the guidance of the first guide fin 403 and the second guide fin 504 on the heat dissipation direction, the two streams of heat can be dissipated from two directions, achieving separate heat dissipation, avoiding mutual interference of heat, and improving the heat dissipation effect.

[0037] Example 3

[0038] To achieve a fixed installation of circuit board 2, refer to Figure 3 The bottom of the inner wall of the lower outer casing 1 is connected to multiple threaded sleeves 6, and the inner surface of each threaded sleeve 6 is threaded with bolts 7. The circuit board 2 has a circular groove inside that matches the outer surface of the multiple threaded sleeves 6. The circuit board 2 is fixedly installed inside the lower outer casing 1 by the multiple threaded sleeves 6 and the multiple bolts 7. After aligning the circular hole on the circuit board 2 with the multiple threaded sleeves 6, the circuit board 2 is fitted onto the outer surface of the multiple threaded sleeves 6. At this time, the multiple bolts 7 rotate and descend inside the multiple threaded sleeves 6, which can press down and fix the circuit board 2, thus realizing the installation of the circuit board 2.

[0039] Working Principle: After the UWB chip 3 is installed on top of the circuit board 2, in the initial state, the UWB chip 3 and the MCU maintain low power consumption. At this time, the UWB chip 3 starts scanning at a preset frequency, emitting radio wave pulses of extremely short duration to the surrounding environment. It continuously monitors whether there are user mobile phone signals with the AIRTAG positioning function enabled in the surrounding environment. After the user's mobile phone's AIRTAG module receives the pulse signal emitted by the UWB chip 3, it will reflect back the corresponding response signal. The UWB chip 3 will receive this reflected signal, convert it into an electrical signal, and transmit it to the internal signal processing unit of the UWB chip 3. Then, it will be sent to the MCU through the data transmission channel to trigger the mouse wake-up program, realizing the mouse's wake-up function. The system automatically wakes up and logs into the computer. Due to the presence of the UWB chip 3, the MCU stops scanning when the mouse is in sleep mode, and only the UWB chip 3 scans, thus saving power. The circuit board 2 and the UWB chip 3 generate heat during operation. At this time, the first heat-absorbing plate 401 and the second heat-absorbing sheet 502 absorb the heat generated by the circuit board 2 and the UWB chip 3 respectively, and dissipate the heat through the first heat dissipation fins 402 and the second heat dissipation fins 503. The first guide fins 403 and the second guide fins 504 guide the heat dissipation direction, so that the two streams of heat are dissipated from two different directions, realizing separate heat dissipation, avoiding mutual interference of heat, and improving the heat dissipation effect.

[0040] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

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